CN219597175U

CN219597175U - Emulsion source recovery device and system

Info

Publication number: CN219597175U
Application number: CN202320417613.XU
Authority: CN
Inventors: 李晓锋; 招景丰
Original assignee: Zhejiang Liyang Semiconductor Co ltd
Current assignee: Zhejiang Liyang Semiconductor Co ltd
Priority date: 2023-02-28
Filing date: 2023-02-28
Publication date: 2023-08-29
Anticipated expiration: 2033-02-28

Abstract

An emulsion source recovery apparatus and system, the recovery apparatus comprising: the bearing table is provided with a plurality of circumferentially distributed mounting positions, the mounting positions are used for fixing flower baskets, the flower baskets are detachably fixed at the mounting positions, and the bottoms of the flower baskets are hollowed out; the flower basket is used for containing silicon wafers coated with emulsion sources; the collecting units are arranged corresponding to one installation position and are relatively fixed on the bearing table; the collecting unit is used for collecting the thrown latex source in the silicon wafer; and the rotating mechanism is used for driving the bearing table to rotate so as to throw off part of emulsion sources on the silicon wafers in the flower basket fixed in the installation position, and the thrown-off emulsion sources are collected by the collecting unit. Can install the basket of flowers through the plummer to through the rotation mechanism drive plummer rotation, the silicon chip realizes centrifugal rotation along with the plummer in the basket of flowers, and the emulsion source part on the silicon chip is got rid of and falls and be collected by collecting element, in order to realize the recycle to unnecessary emulsion source.

Description

Emulsion source recovery device and system

Technical Field

The utility model relates to the technical field of semiconductor manufacturing, in particular to a latex source recovery device and a latex source recovery system.

Background

In semiconductor manufacturing, silicon wafers need to be doped, wherein coating with a latex source is a common way, for example, the latex source may be a boron-containing or phosphorous-containing latex source. The existing latex source coating mode is to coat excessive latex sources on the surface of a silicon wafer, adsorb the silicon wafer to rotate through a sucker machine, throw off the excessive latex sources, and the thrown off latex sources are not recovered, so that more than 1/3 of the latex sources are wasted, and the overall coating efficiency is lower.

Disclosure of Invention

The utility model mainly solves the technical problem that the silicon wafer coating emulsion source has the problems of waste caused by the fact that the redundant emulsion source is not recovered.

According to a first aspect of the present utility model, there is provided in one embodiment a latex source recovery device comprising:

the bearing table is provided with a plurality of circumferentially distributed mounting positions, the mounting positions are used for fixing flower baskets, the flower baskets are detachably fixed at the mounting positions, and the bottoms of the flower baskets are hollowed out; the flower basket is used for containing silicon wafers coated with emulsion sources;

the collecting units are arranged corresponding to one installation position and are relatively fixed on the bearing table; the collecting unit is used for collecting the thrown latex source in the silicon wafer;

and the rotating mechanism is used for driving the bearing table to rotate so as to throw off part of emulsion sources on the silicon wafers in the flower basket fixed in the installation position, and the thrown-off emulsion sources are collected by the collecting unit.

In one embodiment, the collection unit comprises a first collection portion, a collection channel and a collection container, wherein the first collection portion is communicated with the bottom of the flower basket and is used for receiving the latex source thrown off in the silicon wafer and flowing to the collection container through the collection channel.

In one embodiment, the rotating mechanism comprises a rotating part and a driving part, wherein the driving part is used for driving the rotating part to rotate, the bearing table is fixedly connected with the rotating part, and the bearing table rotates along with the rotating part;

the collecting container is detachably fixed on the rotating part, and the first collecting part is detachably fixed on the bearing table.

In one embodiment, the flower basket comprises a plurality of locking components, wherein the locking components are used for detachably fixing the flower basket on the bearing table.

In one embodiment, the plurality of mounting locations on a corresponding circumferential distribution of the same radial dimension are symmetrically disposed about the center of the circumference.

In one embodiment, the plurality of mounting locations are circumferentially distributed according to at least two circumferences of different radius sizes, and the plurality of mounting locations are disposed on the circumferential distribution corresponding to each radius size.

In one embodiment, the material of the collection channel is polytetrafluoroethylene; and/or the material of the collecting container is silicon dioxide.

According to a second aspect of the present utility model, there is provided in one embodiment a latex source recovery system comprising: a plurality of baskets and the emulsion source recovery apparatus described in the first aspect, the baskets having a plurality of clamping grooves arranged in a first direction, one clamping groove for placing a piece of silicon wafer.

In one embodiment, the card slot has a plurality of positioning projections for point contact with the surface of the silicon wafer.

In one embodiment, when the basket is mounted at the mounting position of the bearing table, the connecting line direction between the center of the basket and the rotation center of the bearing table is a second direction, and the first direction is perpendicular to the second direction.

According to the emulsion source recovery device and the emulsion source recovery system, the basket of flowers can be installed through the bearing table, the bearing table is driven to rotate through the rotating mechanism, the silicon chips in the basket of flowers follow the bearing table to realize centrifugal rotation, and the emulsion source part on the silicon chips is thrown off and collected by the collection unit, so that the recovery and utilization of the redundant emulsion source are realized.

Drawings

FIG. 1 is a schematic illustration of a conventional spin-on coating scheme;

FIG. 2 is a schematic illustration of a silicon wafer coated by dip coating in one embodiment;

FIG. 3 is a schematic diagram of an apparatus and a system for recycling latex sources according to an embodiment (I);

FIG. 4 is a schematic diagram of an embodiment of a latex source recycling apparatus and system (II);

FIG. 5 is a schematic view of a carrying platform and a basket according to an embodiment;

FIG. 6 is a schematic diagram of a structure of a carrying platform and a mounting position according to an embodiment;

FIG. 7 is a schematic view of a basket and collection unit according to one embodiment;

fig. 8 is a schematic structural view of a flower basket according to an embodiment.

Reference numerals: 10-silicon wafer; 20-flower basket; 21-a clamping groove; 22-positioning protrusions; 30-bearing table; 31-mounting position; 40-a collection unit; 41-a first collection section; 42-collecting channel; 43-a collection container; 50-a rotating mechanism; 60-first container.

Detailed Description

The utility model will be described in further detail below with reference to the drawings by means of specific embodiments. Wherein like elements in different embodiments are numbered alike in association. In the following embodiments, numerous specific details are set forth in order to provide a better understanding of the present utility model. However, one skilled in the art will readily recognize that some of the features may be omitted, or replaced by other elements, materials, or methods in different situations. In some instances, related operations of the present utility model have not been shown or described in the specification in order to avoid obscuring the core portions of the present utility model, and may be unnecessary to persons skilled in the art from a detailed description of the related operations, which may be presented in the description and general knowledge of one skilled in the art.

Furthermore, the features, operations, or characteristics described in the specification may be combined in any suitable manner to form various embodiments, and the operational steps involved in the embodiments may be sequentially exchanged or adjusted in a manner apparent to those skilled in the art. Accordingly, the description and drawings are merely for clarity of describing certain embodiments and are not necessarily intended to imply a required composition and/or order.

The numbering of the components itself, e.g. "first", "second", etc., is used herein merely to distinguish between the described objects and does not have any sequential or technical meaning. The term "coupled" as used herein includes both direct and indirect coupling (coupling), unless otherwise indicated.

As shown in FIG. 1, the existing emulsion source throwing source coating mode is mostly single-chip coating, such as coating by adopting a sucking disc type spin coater matched with an emulsion drip nozzle, the throwing source coating mode can only coat one piece at a time, excessive emulsion sources need to be dripped at a time, the thrown emulsion sources cannot be recycled, more than 1/3 of emulsion source loss is wasted, and the overall coating efficiency is low.

Applicants have found that the overall coating efficiency can be improved by dip coating the silicon wafer emulsion source as shown in fig. 2. Based on the thought, the applicant further develops the recovery of the redundant latex source in the coating process, and the embodiment of the utility model provides a device and a system for recovering the latex source, so that the latex source is recovered, and the loss and the waste are reduced. The emulsion source may be a boron-containing emulsion source or a phosphorous-containing emulsion source or an emulsion source of other elements, and the embodiment of the present utility model is exemplified by a boron-containing emulsion source (referred to as emulsion boron source or boron source for short).

As shown in fig. 3, the latex source recycling system provided in the embodiment of the utility model may include a plurality of baskets 20 and a latex source recycling device, where the baskets 20 have a plurality of slots 21 arranged along a first direction (corresponding to a length direction of the baskets 20), and one slot 21 is used for placing a piece of silicon wafer 10.

First, describing the dip-coating manner, the emulsion source recycling system may further include a first motion mechanism and a first container 60, as shown in fig. 2, where the first container 60 is used for accommodating the emulsion source, and the first motion mechanism is used for performing a shaking process on the basket 20 to primarily remove the excessive emulsion source on the silicon wafer 10, and the excessive emulsion source is shaken off into the first container 60, where the first step recycling may be implemented. In some embodiments, as shown in FIG. 2, the entire basket of silicon wafers 10 may be coated in a single dip coating process by immersing the entire basket of silicon wafers 10 in a latex source in a first container 60. The first movement mechanism can lift the flower basket 20, can lower the flower basket 20 into the first container 60, can lift the flower basket 20 from the first container 60, and can shake the upper part of the first container 60, so that the redundant emulsion source on the silicon wafer 10 is primarily shaken off to the first container 60, and the first-step recovery is realized. In some embodiments, the material of the first container 60 may be quartz or teflon. After the dip coating and dithering process is completed, the emulsion source on the wafer 10 is still in excess, and the applicant has found that the emulsion source on the wafer 10 can be partially thrown off in a centrifugal rotation manner and further recovered by the collection unit 40. In order to achieve the above object, the applicant has further studied to provide a latex source recovery device and system of an embodiment of the present utility model.

The latex source recovery device and system are described below.

As shown in fig. 3 and 4, the latex source recycling apparatus provided in the embodiment of the utility model may include a carrying table 30, a plurality of collecting units 40, and a rotating mechanism 50.

As shown in fig. 5 and 6, the bearing table 30 is provided with a plurality of circumferentially distributed mounting positions 31, the mounting positions 31 are used for fixing the flower basket 20, the flower basket 20 is detachably fixed at the mounting positions 31, and the bottom of the flower basket 20 is hollowed out; the basket 20 is used for containing the silicon wafer 10 coated with the emulsion source, and the emulsion source on the silicon wafer 10 is excessive.

In some embodiments, as shown in fig. 5, to improve the stability of the recovery device during rotation, a plurality of mounting locations 31 located on a circumferential distribution corresponding to the same radius size are symmetrically disposed about the center of the circumference. When the flower baskets 20 are installed on the installation position 31, the flower baskets are installed in a mode of being symmetrical about the center of the bearing table 30, so that the bearing table 30 cannot deviate from the center after bearing, the bearing table 30 cannot shake in the rotating process, and the rotating shaft of the rotating mechanism 50 cannot receive radial acting force.

In some embodiments, as shown in fig. 6, the plurality of mounting locations 31 are circumferentially distributed according to at least two circumferences of different radius sizes, and a plurality of mounting locations 31 are disposed on the circumferential distribution corresponding to each radius size. When the angular speed of the rotation of the carrying table 30 is fixed at the mounting positions 31 with different radius dimensions, different linear speeds can be obtained, and different rotation speeds can be realized without depending on the speed regulation of the rotation mechanism 50. After the basket 20 is installed on the corresponding installation position 31 with different radius sizes, latex sources with different amounts can be thrown off. For example, the baskets 20 placed on different radius sizes may be used to place different sized wafers, or wafers of different coating thickness requirements, so that one centrifugal rotation may be performed, and the two wafers of thickness requirements may be subjected to an overall centrifugal rotation, each removing excess latex source.

The collecting unit 40 is used for collecting the latex source thrown off in the silicon wafer 10; a collecting unit 40 is disposed corresponding to one of the mounting locations 31, and the collecting unit 40 is relatively fixed to the carrying platform 30.

In some embodiments, as shown in fig. 4, in some embodiments, the collecting unit 40 includes a first collecting portion 41, a collecting channel 42, and a collecting container 43, where the first collecting portion 41 is in communication with the bottom of the basket 20, and the first collecting portion 41 is configured to receive the latex source thrown off in the silicon wafer 10 and flow to the collecting container 43 through the collecting channel 42. After each or a fixed number of recycles, the latex source from the collection vessel 43 is returned to the first vessel 60 for recycling.

In some embodiments, the material of the collection channel 42 is engraved as polytetrafluoroethylene; and/or the material of the collection container 43 may be silica or polytetrafluoroethylene. The collecting channel 42 may be made of teflon material, the collecting container 43 may be made of the same material as the first container 60, and the first collecting part 41 may be correspondingly arranged according to the specific structure of the basket 20.

In some embodiments, the collection unit 40 may include a collection container 43 alone, and the collection container 43 may be mounted directly below the mounting location 31 in communication with the bottom of the basket 20, with the silicon wafer 10 being collected by the collection container 43 directly from the spun-off emulsion source.

The rotating mechanism 50 is used for driving the bearing table 30 to rotate so as to throw off part of the emulsion sources on the silicon wafers 10 in the basket 20 fixed by the mounting position 31, and the thrown-off emulsion sources are collected by the collecting unit 40. The rotation mechanism 50 may include a motor connected to the carrier 30 through a transmission assembly, which may include a synchronizing wheel or gear, etc. The carrying platform 30 may be directly connected to the rotation shaft of the motor.

In some embodiments, the rotating mechanism 50 includes a rotating portion and a driving portion, the driving portion is used for driving the rotating portion to rotate, the carrying platform 30 is fixedly connected with the rotating portion, and the carrying platform 30 follows the rotating portion to rotate; the collection container 43 is detachably fixed to the rotating portion, and the first collection portion 41 is detachably fixed to the carrying table 30. By the above-described mounting manner, the entire collecting unit 40 can rotate following the rotation portions of the loading table 30 and the rotation mechanism 50, and the problems of structural and movement interference do not occur.

In some embodiments, the apparatus may further comprise a plurality of locking members for removably securing the basket 20 to the carrier 30. For example, the mounting location 31 may be provided with a structure such as a buckle, a mounting hole, etc. that matches the basket 20, and the basket 20 is locked to the mounting location 31 by means of a buckle, a pin, a bolt, etc. This is because after the silicon wafer is rotated by dip coating and centrifugation, the subsequent drying and diffusion processes are required to be transferred to other clean baskets or boats, the basket 20 in the system of the present utility model is detached from the carrier 30, the uncoated silicon wafer is loaded again, and after the dip coating process shown in fig. 2 is performed, the basket 20 on which the dip coated silicon wafer is placed is mounted on the carrier 30 after the dip coating is completed, and thus the cycle is performed.

In some embodiments, as shown in fig. 8, the groove wall of the clamping groove 21 has a plurality of positioning protrusions 22 for point contact with the surface of the silicon wafer 10.

In order to avoid the situation that the emulsion boron source is uneven due to the large contact area of the silicon wafer 10 and the clamping groove 21 of the flower basket 20 when the emulsion boron source is soaked in the preamble and dried in the postamble, and the silicon wafer 10 and the flower basket 20 are tightly adhered and cannot be taken out when the emulsion boron source is baked, the flower basket 20 is a special flower basket 20, wherein symmetrical pointed projections are designed on the upper side and the lower side of the clamping groove 21 of the flower basket 20 as positioning projections 22, as shown in fig. 8, and the contact area of the silicon wafer 10 and the clamping groove 21 of the flower basket 20 is reduced. In some embodiments, as shown in fig. 8 (B), the slot wall spacing D of the clamping slot 21 may be 500 μm, the spacing D of the positioning protrusions 22 may be 380 μm, and the number of the placement pieces per basket 20 may be 25.

As shown in fig. 8 (a), the basket 20 has a plurality of first clamping grooves 21, the groove shape of the first clamping grooves 21 is matched with the shape of the silicon wafer 10 to be placed, and a plurality of positioning projections 22 are provided at the parts where the groove walls of the clamping grooves 21 contact the front and back surfaces of the silicon wafer 10. Further, as shown in (B) of fig. 8, the plurality of first protrusions may be symmetrically disposed on both sides of the card slot 21 with respect to the silicon wafer 10, and two slot walls; as shown in fig. 8 (a), the plurality of positioning projections 22 on the same surface are circumferentially distributed. For example, the end of the positioning protrusion 22 may have a circular arc structure, be made of teflon material, or be integrally made of the same material as the basket 20.

In some embodiments, when the basket 20 is mounted on the mounting location 31 of the carrying platform 30, the direction of the line connecting the center of the basket 20 and the rotation center of the carrying platform 30 is the second direction, and the first direction is perpendicular to the second direction.

For example, as shown in fig. 5 and 7, the basket 20 is then horizontally and symmetrically arranged in parallel, the silicon wafers 10 are longitudinally and symmetrically arranged on the bearing table 30, four basket silicon wafers 10 can be symmetrically arranged on the bearing table 30 every two by two, and the two basket silicon wafers 10 are rotated at a high speed for 2 minutes, so that more latex boron sources on the silicon wafers 10 and the basket 20 are thrown away, the thrown-away latex boron sources are collected into the boron source collecting container 43 through the collecting channel 42 (such as a teflon catheter), and the latex sources recovered by the collecting container 43 can be poured into the first container 60 for repeated use.

In some embodiments, the emulsion source recovery system may further include a controller by which a user controls the rotational speed and rotational time of one centrifugation of the rotating mechanism 50, and the user may pre-measure the viscosity of the emulsion source, and determine the rotational speed and rotational time based on the viscosity and the desired thickness to be maintained. The relation between the viscosity and the thickness to be reserved, the rotation speed and the rotation time can be fitted through experiments in advance, the corresponding relation can be obtained through the experiments, and the corresponding rotation speed and the rotation time can be obtained after the viscosity of the current emulsion source is measured.

According to the latex source recovery device and system provided by the embodiment of the utility model, the basket 20 can be installed through the bearing table 30, the bearing table 30 is driven to rotate through the rotating mechanism 50, the silicon wafer 10 in the basket 20 is centrifugally rotated along with the bearing table 30, and the latex source part on the silicon wafer 10 is thrown off and collected by the collecting unit 40, so that the recovery and utilization of the redundant latex source are realized, the recovery of the latex source of one basket or multiple baskets of silicon wafers can be realized, and the recovery efficiency is high. By controlling the rotational speed and time of rotation of the rotation unit 50, the thickness of the silicon wafer 10 including the emulsion source can be controlled so that it satisfies the need of the subsequent diffusion process.

Reference is made to various exemplary embodiments herein. However, those skilled in the art will recognize that changes and modifications may be made to the exemplary embodiments without departing from the scope herein. For example, the various operational steps and components used to perform the operational steps may be implemented in different ways (e.g., one or more steps may be deleted, modified, or combined into other steps) depending on the particular application or taking into account any number of cost functions associated with the operation of the system.

While the principles herein have been shown in various embodiments, many modifications of structure, arrangement, proportions, elements, materials, and components, which are particularly adapted to specific environments and operative requirements, may be used without departing from the principles and scope of the present disclosure. The above modifications and other changes or modifications are intended to be included within the scope of this document.

The foregoing detailed description has been described with reference to various embodiments. However, those skilled in the art will recognize that various modifications and changes may be made without departing from the scope of the present disclosure. Accordingly, the present disclosure is to be considered as illustrative and not restrictive in character, and all such modifications are intended to be included within the scope thereof. Also, advantages, other advantages, and solutions to problems have been described above with regard to various embodiments. The benefits, advantages, solutions to problems, and any element(s) that may cause any benefit, advantage, or solution to occur or become more pronounced are not to be construed as a critical, required, or essential feature. The terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, system, article, or apparatus. Furthermore, the term "couple" and any other variants thereof are used herein to refer to physical connections, electrical connections, magnetic connections, optical connections, communication connections, functional connections, and/or any other connection.

Those skilled in the art will recognize that many changes may be made to the details of the above-described embodiments without departing from the underlying principles of the utility model. Accordingly, the scope of the utility model should be determined only by the following claims.

Claims

1. A latex source recovery device, comprising:

the bearing table (30) is provided with a plurality of circumferentially distributed mounting positions (31), the mounting positions (31) are used for fixing the flower basket (20), the flower basket (20) is detachably fixed at the mounting positions (31), and the bottom of the flower basket (20) is hollowed out; the flower basket (20) is used for containing silicon wafers (10) coated with emulsion sources;

the collecting units (40) are arranged corresponding to one mounting position (31), and the collecting units (40) are relatively fixed on the bearing table (30); the collecting unit (40) is used for collecting the latex source thrown off in the silicon wafer (10);

and the rotating mechanism (50) is used for driving the bearing table (30) to rotate so as to throw off part of emulsion sources on the silicon wafer (10) in the basket (20) fixed by the mounting position (31), and the thrown-off emulsion sources are collected by the collecting unit (40).

2. The emulsion source recovery apparatus as recited in claim 1, wherein the collection unit (40) includes a first collection portion (41), a collection channel (42), and a collection container (43), the first collection portion (41) being in communication with the bottom of the basket (20), the first collection portion (41) being configured to receive the emulsion source thrown off in the silicon wafer (10) and flow to the collection container (43) through the collection channel (42).

3. The emulsion source recovery apparatus as recited in claim 2 wherein the rotation mechanism (50) includes a rotation portion and a driving portion, the driving portion is configured to drive the rotation portion to rotate, the carrying table (30) is fixedly connected to the rotation portion, and the carrying table (30) follows the rotation portion to rotate;

the collecting container (43) is detachably fixed on the rotating part, and the first collecting part (41) is detachably fixed on the bearing table (30).

4. The emulsion source recovery apparatus as recited in claim 1 further comprising a plurality of locking members for detachably securing said basket (20) to said carrying platform (30).

5. The emulsion source recovery apparatus as recited in claim 1 wherein a plurality of mounting locations (31) located on a circumferential distribution corresponding to the same radial dimension are symmetrically disposed about the center of the circumference.

6. A latex source recovery device according to any one of claims 1-5, wherein a plurality of said mounting locations (31) are circumferentially distributed according to at least two circumferences of different radial dimensions, each radial dimension corresponding to a circumferential distribution provided with a plurality of mounting locations (31).

7. The emulsion source recovery apparatus as recited in claim 2 wherein a material of said collection channel (42) is polytetrafluoroethylene; and/or the material of the collecting container (43) is silicon dioxide.

8. A latex source recovery system, comprising: a plurality of flower baskets (20) and the emulsion source recovering device as claimed in claim 1, wherein the flower baskets (20) are provided with a plurality of clamping grooves (21) arranged along a first direction, and one clamping groove (21) is used for placing one silicon wafer (10).

9. The emulsion source recovery system as recited in claim 8 wherein said clamping groove (21) has a plurality of positioning projections (22) for point contact with a surface of said silicon wafer (10).

10. The emulsion source recovery system as recited in claim 8 wherein when said basket (20) is mounted at a mounting location (31) of a carrying platform (30), a direction of a line connecting a center of said basket (20) and a center of rotation of said carrying platform (30) is a second direction, said first direction being perpendicular to said second direction.