CN216037336U - Ceramic plate transfer equipment - Google Patents
Ceramic plate transfer equipment Download PDFInfo
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- CN216037336U CN216037336U CN202122168391.6U CN202122168391U CN216037336U CN 216037336 U CN216037336 U CN 216037336U CN 202122168391 U CN202122168391 U CN 202122168391U CN 216037336 U CN216037336 U CN 216037336U
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Abstract
The utility model discloses ceramic disc transferring equipment, relates to the technical field of semiconductor material processing, and aims to provide ceramic disc transferring equipment which is convenient to operate, simple to operate and greatly improved in processing efficiency, and is technically characterized in that an operating area is arranged at the top of a workbench and comprises a connecting seat, the bottom of the connecting seat is fixedly connected with the top of the workbench, a transferring table is rotatably installed at the top of the connecting seat through a driving motor, a transmission part is arranged on the bottom surface of the transferring table and comprises an electric cylinder, a connecting block is fixedly installed at the telescopic end of the electric cylinder, a ceramic disc is fixedly installed at the bottom of the connecting block, the technical effect is that the connecting block of the transmission part is electrified to drive the connecting block and the ceramic disc to descend, pressure is applied to the wafer after gluing and drying, the wafer is fixedly adhered to the ceramic disc, and then the driving motor is operated to drive the equipment to rotate, and driving the adhered wafer to move to a rough polishing area and a fine polishing area for processing.
Description
Technical Field
The utility model relates to the technical field of semiconductor material processing, in particular to ceramic disc transfer equipment.
Background
In the field of semiconductor materials, a semiconductor silicon single crystal wafer needs to be polished for multiple times to achieve the required effect, before polishing, wax is smeared on the surface of the silicon wafer, then the silicon wafer is dried, the silicon wafer is placed on a ceramic disc in a turnover mode through a manipulator and loaded, the ceramic disc is bonded with the silicon wafer, then the ceramic disc bonded with the silicon wafer is placed on a polishing machine to roughly polish the silicon wafer, and after rough polishing is completed, the ceramic disc and the silicon wafer are conveyed to the next polishing machine through the manipulator.
In the prior art, a wafer operation method is troublesome, a manipulator is required to turn over the wafer, and the ceramic disc and the silicon wafer are conveyed to different polishing areas by using a single-arm manipulator to be roughly polished and finely polished, so that the polishing efficiency is seriously influenced, the production time is wasted, the operation is difficult, and the misoperation is easy to occur.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
Aiming at the defects of the prior art, the utility model provides the ceramic disc transferring equipment which is convenient to operate, simple to operate and greatly improved in processing efficiency.
(II) technical scheme
In order to achieve the purpose, the utility model provides the following technical scheme: the ceramic disc transfer equipment comprises a workbench, wherein a transfer area is arranged at the top of the workbench;
the operating area comprises a connecting seat, the bottom of the connecting seat is fixedly connected with the top of the workbench, a conveying table is rotatably mounted at the top of the connecting seat through a driving motor, a transmission part is arranged on the bottom surface of the conveying table, the transmission part comprises an electric cylinder, the electric cylinder is fixedly mounted at the top of the conveying table, a connecting block is fixedly mounted at the telescopic end of the electric cylinder, and a ceramic disc is fixedly mounted at the bottom of the connecting block;
the quantity of driving medium is equipped with a plurality ofly, the below in operation district is equipped with loading district, rough polishing district and accurate polishing district, rough polishing district includes the polisher, the polisher is used for carrying out rough polishing to the wafer, accurate polishing district includes the polisher, the polisher is used for carrying out the accurate polishing to the wafer, and loading district, rough polishing district and accurate polishing district are located one respectively under the driving medium.
Preferably, the top surface of workstation still is equipped with the transmission area, the transmission area includes the drive belt, the drive belt passes through the axis of rotation and is in the top transmission installation of workstation inner chamber, and the top in transmission area is equipped with gluing case and stoving case, the drive belt drives the wafer and passes gluing case and stoving case, gluing case and stoving case are scribbled wax and are dried wafer top surface respectively, the loading area is close to one side setting of drive belt transmission end, the drive belt carry the wafer extremely the top in loading area.
Preferably, a retaining block is fixedly mounted at the top of the loading area, and the height of the retaining block is matched with the height of the wafer.
Preferably, two relative inboards of workstation are equipped with arc portion, two arc portion is located two transmission ends of drive belt respectively, and the radian of arc portion with the outside laminating of drive belt, the drive belt with the wall laminating of arc portion slides.
(III) advantageous effects
Compared with the prior art, the utility model provides ceramic disc transferring equipment which has the following beneficial effects:
1. utilize driving medium connecting block circular telegram to drive connecting block and ceramic dish decline, exert pressure to the wafer after the rubber coating is dried, make wafer and ceramic dish paste fixedly, reuse driving motor operation drive equipment rotation again, drive the good wafer of pasting and remove to the rough polishing district, continue to remove to the fine polishing district and polish after the rough polishing district is polished, outside complementary unit is abandoned to whole device, direct operation drives the wafer and removes, and the wafer moves in different processing intervals in step, the processing is in step, greatly improve work efficiency, and this structure need not to overturn the wafer, the operation is simple, avoid misoperation, prevent that the wafer from dropping the damage in the operation.
2. The wafer conveying device is characterized in that a transmission area is added, a wafer is conveyed by a transmission belt, the wafer is waxed and dried in the conveying process of the wafer, the wafer is automatically moved to a loading area after the drying is finished, the automation degree of the whole device is improved, and the continuous running processing of the wafer is realized.
Drawings
FIG. 1 is a schematic front view of one embodiment of the present invention;
FIG. 2 is a schematic front view of another embodiment of the present invention;
fig. 3 is a schematic front view of another embodiment of the present invention.
In the figure: 1. a work table; 2. a transmission belt; 3. a rotating shaft; 4. gluing boxes; 5. a drying box; 6. a connecting seat; 7. a drive motor; 8. a transfer table; 9. an electric cylinder; 10. connecting blocks; 11. a ceramic pan; 12. a sander; 13. polishing the machine; 14. a retention block; 15. an arc-shaped portion.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Embodiment 1, referring to fig. 1, a ceramic disk transfer apparatus includes a table 1, and is characterized in that: the top of the working table 1 is provided with a running area;
the operation area comprises a connecting seat 6, the bottom of the connecting seat 6 is fixedly connected with the top of the workbench 1, the top of the connecting seat 6 is rotatably provided with a transmission platform 8 through a driving motor 7, the bottom surface of the transmission platform 8 is provided with a transmission part, the transmission part comprises an electric cylinder 9, the electric cylinder 9 is fixedly arranged at the top of the operation platform 8, a connecting block 10 is fixedly arranged at the telescopic end of the electric cylinder 9, and a ceramic disc 11 is fixedly arranged at the bottom of the connecting block 10;
the number of the transmission parts is multiple, a loading area, a rough polishing area and a fine polishing area are arranged below the operation area, the rough polishing area comprises a polisher 12, the polisher 12 is used for roughly polishing wafers, the fine polishing area comprises a polisher 13, the polisher 13 is used for finely polishing wafers, and the loading area, the rough polishing area and the fine polishing area are respectively located under one transmission part.
In the embodiment, the driving motor 7 is used for driving the conveying table 8 to rotate, the transmission part is arranged at the bottom of the conveying table 8, the connecting block 10 and the ceramic disc 11 are installed by the transmission part, the ceramic disc 11 is driven to descend to apply pressure to the wafer after being coated with glue and dried, the wafer is pasted and fixed with the ceramic disc 11, the driving motor 7 is used for driving the equipment to rotate, the pasted wafer is driven to move to a rough polishing area, the wafer is continuously moved to a fine polishing area for polishing after being polished in the rough polishing area, an external auxiliary mechanism is abandoned in the whole device, the wafer is directly driven to move by operation, the wafer moves synchronously in different processing areas, the processing is synchronous, the working efficiency is greatly improved, the structure does not need to turn over the wafer, the operation is simple, the misoperation is avoided, and the wafer is prevented from falling and being damaged in the operation.
In this embodiment, increased the drive region, the use of drive region can carry the wafer automatically, scribble wax and dry it in wafer transportation process, automatic movement to the loading district after the stoving is accomplished, at this moment, the electric power cylinder 9 circular telegram operation in operation district drives ceramic dish 11 and descends and applys pressure to the wafer after the rubber coating is dried for the wafer pastes fixedly with ceramic dish 11, whole device, and is automatic to be improved, realizes the continuous incessant operation processing of wafer, further improves wafer machining efficiency.
Example 3, referring to fig. 3, a retention block 14 is fixedly mounted on the top of the loading area, and the height of the retention block 14 is matched with the height of the wafer.
In order to ensure that the wafer moves to a position right below a ceramic disc 11 after leaving the belt 2, the force of the belt 2 on the wafer is increased, the loading area is close to the belt 2, and meanwhile, in order to prevent the wafer from moving and transiting, in the embodiment, the wafer is blocked by a retaining block 14, so that the initial speed of the belt 2 on the wafer is increased, and the ceramic disc 11 can be adhered to the wafer after descending.
Wherein, two relative inboards of workstation 1 are equipped with arc portion 15, and two arc portions 15 are located two transmission ends of drive belt 2 respectively, and the radian of arc portion 15 and the outside laminating of drive belt 2, and drive belt 2 slides with the wall laminating of arc portion 15.
In order to prevent the clamping phenomenon when the wafer moves from the top surface of the transmission belt 2 to the top surface of the workbench 1, the arc-shaped part 15 is arranged on the inner side of the workbench 1, so that the gap between the transmission belt 2 and the workbench 1 is reduced, the smoothness of wafer movement is improved, and smooth flowing of equipment is ensured
The working principle is as follows: when the device is used, the wafer after being coated with glue and dried is enabled to appear in the loading area, at the moment, the electric cylinder 9 is electrified to operate to drive the connecting block 10 and the ceramic disc 11 to descend, pressure is applied to the wafer, the wafer and the ceramic disc 11 are adhered and fixed, the driving motor 7 is then utilized to operate and drive the device to rotate, the adhered wafer is driven to move to the rough polishing area, and after the rough polishing area is polished, the wafer is continuously moved to the fine polishing area for polishing.
The above is only a specific embodiment of the present invention, but the technical features of the present invention are not limited thereto. Any simple changes, equivalent substitutions or modifications made based on the present invention to solve the same technical problems and achieve the same technical effects are within the scope of the present invention.
Claims (4)
1. A ceramic disc transfer apparatus comprising a table (1), characterized in that: the top of the workbench (1) is provided with an operation area;
the operation area comprises a connecting seat (6), the bottom of the connecting seat (6) is fixedly connected with the top of the workbench (1), a transmission platform (8) is rotatably installed at the top of the connecting seat (6) through a driving motor (7), a transmission part is arranged on the bottom surface of the transmission platform (8), the transmission part comprises an electric cylinder (9), the electric cylinder (9) is fixedly installed at the top of the transmission platform (8), a connecting block (10) is fixedly installed at the telescopic end of the electric cylinder (9), and a ceramic disc (11) is fixedly installed at the bottom of the connecting block (10);
the quantity of driving medium is equipped with a plurality ofly, the below in operation district is equipped with loading district, rough polishing district and fine polishing district, rough polishing district includes polisher (12), polisher (12) are used for carrying out rough polishing to the wafer, fine polishing district includes burnishing machine (13), burnishing machine (13) are used for carrying out the fine polishing to the wafer, and loading district, rough polishing district and fine polishing district are located one respectively under the driving medium.
2. A ceramic disk transfer apparatus according to claim 1, wherein: the top surface of workstation (1) still is equipped with the transmission district, the transmission district includes drive belt (2), drive belt (2) are in through axis of rotation (3) the top transmission installation of workstation (1) inner chamber, and the top in transmission district is equipped with gluing case (4) and stoving case (5), drive belt (2) drive wafer passes gluing case (4) and stoving case (5), gluing case (4) and stoving case (5) are to wafer top surface waxing and stoving respectively, the loading district is close to one side setting of drive belt (2) transmission end, drive belt (2) carry the wafer extremely the top in loading district.
3. A ceramic disk transfer apparatus according to claim 2, wherein: and a retaining block (14) is fixedly arranged at the top of the loading area, and the height of the retaining block (14) is matched with that of the wafer.
4. A ceramic disk transfer apparatus according to claim 2, wherein: two relative inboards of workstation (1) are equipped with arc portion (15), two arc portion (15) are located two transmission ends of drive belt (2) respectively, and the radian of arc portion (15) with the outside laminating of drive belt (2), drive belt (2) with the wall laminating of arc portion (15) slides.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122168391.6U CN216037336U (en) | 2021-09-08 | 2021-09-08 | Ceramic plate transfer equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122168391.6U CN216037336U (en) | 2021-09-08 | 2021-09-08 | Ceramic plate transfer equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216037336U true CN216037336U (en) | 2022-03-15 |
Family
ID=80597919
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122168391.6U Active CN216037336U (en) | 2021-09-08 | 2021-09-08 | Ceramic plate transfer equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216037336U (en) |
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2021
- 2021-09-08 CN CN202122168391.6U patent/CN216037336U/en active Active
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