CN219592725U - Two fluid etching spraying system - Google Patents
Two fluid etching spraying system Download PDFInfo
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- CN219592725U CN219592725U CN202320203274.5U CN202320203274U CN219592725U CN 219592725 U CN219592725 U CN 219592725U CN 202320203274 U CN202320203274 U CN 202320203274U CN 219592725 U CN219592725 U CN 219592725U
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Abstract
The utility model relates to the technical field of PCB etching, in particular to a two-fluid etching spraying system, which comprises: a gas system, a liquid system and a two fluid mixing head; the two-fluid mixing nozzle is provided with a gas inlet, a liquid inlet and a nozzle; the gas system is connected with the gas inlet and is used for providing power gas required by spraying; the liquid system is connected with the liquid inlet and is used for providing etching liquid required by spraying; the power gas and the etching liquid are mixed in the two-fluid mixing nozzle and then sprayed out from the nozzle, and the gas system is provided with a gas heating system. The problem of spray temperature drop after gas-liquid mixing caused by temperature difference between gas-liquid and liquid-liquid is solved. The temperature of the etching liquid after atomization is not greatly disturbed by the gas fluid, so that the etching quality and the etching rate are effectively improved. Compared with the traditional two-fluid etching technology, the control of the temperature of the gas fluid is greatly improved in the manufacturing capability and yield of the precise circuit.
Description
Technical Field
The utility model relates to the technical field of PCB etching, in particular to a two-fluid etching spraying system.
Background
PCBs, also known as printed wiring boards, are important influencing elements in the electronics industry for fine and highly integrated designs. Along with the continuous development of PCB processing and manufacturing technology to the high density and high precision, besides the multilayer integrated design, the etching requirement of each layer of circuit is gradually increased. In the face of high precision, high density line etching, two fluid vacuum etching line techniques are typically used to etch the circuit. The conventional general two-fluid etching technology generally mixes liquid fluid and gas-liquid fluid to a certain extent, utilizes pressure to spray out the gas-liquid mixture for etching, atomizes the liquid fluid under the action of the gas-liquid, and converts the original large-particle liquid fluid into small-particle spray so as to meet the requirement of high-precision etching.
In the actual production process, when the PCB is subjected to two-fluid etching, more factors are required to be controlled besides the size of etching particles, and in order to further improve the etching effect, besides the control of atomized particles, the adaptive temperature of the etching liquid is required to be further considered. Different etching solutions have different temperature activities, for example, the existing etching solution is usually the best in activity at 50 ℃ and the etching effect is the best, so that the etching solution is usually heated to the best activity temperature before atomization, but the temperature of the air flow after final atomization is greatly reduced due to lack of control on the temperature of the air flow in the subsequent air flow atomization process, so that the activity of the etching solution is low, and the quality and quality of precise circuit etching cannot be truly improved from the temperature control.
Disclosure of Invention
The utility model aims to overcome at least one defect of the prior art, and provides a two-fluid etching spray system which is used for solving the problem of poor etching effect after atomization in the prior two-fluid etching.
The technical scheme adopted by the utility model is that the two-fluid etching spraying system comprises: a gas system, a liquid system and a two fluid mixing head; the two-fluid mixing nozzle is provided with a gas inlet, a liquid inlet and a nozzle; the gas system is connected with the gas inlet and is used for providing power gas required by spraying; the liquid system is connected with the liquid inlet and is used for providing etching liquid required by spraying; the power gas and the etching liquid are mixed in the two-fluid mixing nozzle and then sprayed out from the nozzle, and the gas system is provided with a gas heating system.
The gas system comprises a gas source, a pressurized gas input port, a filtering system and a pressurized heating gas output port which are sequentially arranged; the gas heating system is disposed between the pressurized gas input port and the filtration system.
The gas heating system comprises a gas heating device and a temperature regulation and control monitoring system, and the temperature regulation and control monitoring system is used for controlling the temperature of the power gas output by the gas heating device.
The temperature regulation and control monitoring system comprises: a temperature sensor, a controller and an output valve; the temperature sensor is used for detecting the temperature of the power gas heated by the gas heating device, is connected with the controller and inputs the detected temperature value into the controller; and the controller controls the on-off of the output valve according to whether the temperature value meets the set temperature.
The temperature regulation and control monitoring system further comprises a temperature setting input device, wherein the temperature setting input device is connected with the controller and used for inputting set temperature requirements.
And a gas flow monitoring system is further arranged between the filtering system and the pressurized heating gas outlet.
The gas flow monitoring system comprises a gas pressure flow regulating valve, a gas pressure detecting valve and a gas flow regulating valve which are connected in sequence; the air pressure flow regulating valve is connected with the filtering system; the gas flow regulating valve is connected with the pressurized heating gas output port.
Further, there is provided a method of manufacturing a two-fluid etching spray system comprising: a gas system, two or more liquid systems and a two fluid mixing head; the filtering system is connected with a plurality of gas flow monitoring systems through a one-to-multiple system, and is provided with a plurality of pressurized heating gas outlets which are connected with gas inlets of different two-fluid mixing spray heads.
The liquid system includes: a thermostatic vessel and a liquid supply pump; the etching liquid is stored in a constant temperature container and maintained at a constant temperature value, and is supplied to the liquid inlet by a liquid supply pump.
The temperature regulation and control monitoring system is used for controlling the temperature of the power gas output by the gas heating device to be 1-3 ℃ lower than the constant temperature maintained in the constant temperature container.
Compared with the prior art, the utility model has the beneficial effects that: the gas heating system and the plurality of detection and control systems are additionally arranged, so that the problem that the spraying temperature is reduced after gas-liquid mixing caused by the temperature difference between the gas-liquid and the liquid is solved. The temperature of the etching liquid after atomization is not greatly disturbed by the gas fluid, so that the etching quality and the etching rate are effectively improved. Compared with the traditional two-fluid etching technology, the control of the temperature of the gas fluid is greatly improved in the manufacturing capability and yield of the precise circuit. Through further setting for the gas temperature for the temperature of gas fluid is slightly less than the temperature of etching solution, in order to offset the etching solution because carry out the liquid medicine circulation through motor blade in the transmission process, the heat that produces when the motor She Pianduan beats the tumbling liquid medicine. Thus, the actual temperature of the etching liquid that is actually circulated may be slightly higher than the set level, so that the gas fluid of which the temperature is slightly lowered is combined therewith, so that the temperature of the ejected gas-liquid mixture may be closer to the target temperature in practice.
Drawings
Fig. 1 is an overall schematic of the present utility model.
Fig. 2 is a schematic view of a two-fluid mixing head according to the present utility model.
Reference numerals illustrate: the gas supply 100, the pressurized gas input 101, the pressurized heating gas output 102, the gas heating device 200, the temperature sensor 300, the controller 301, the output valve 302, the gas inlet 310, the liquid inlet 320, the nozzle 330, the temperature setting input device 400, the gas pressure flow rate adjusting valve 500, the gas pressure detecting valve 501, the gas flow rate adjusting valve 502, the thermostatic vessel 600, and the liquid supply pump 601.
Detailed Description
The drawings are for illustrative purposes only and are not to be construed as limiting the utility model. For better illustration of the following embodiments, some parts of the drawings may be omitted, enlarged or reduced, and do not represent the actual product dimensions; it will be appreciated by those skilled in the art that certain well-known structures in the drawings and descriptions thereof may be omitted.
Example 1
As shown in fig. 1, the present embodiment is a two-fluid etching spray system, comprising: a gas system, a liquid system and a two fluid mixing head; as shown in fig. 2, the two-fluid mixing nozzle is provided with a gas inlet 310, a liquid inlet 320 and a nozzle 330; the gas system is connected to a gas inlet 310 for providing the motive gas required for spraying; the liquid system is connected to a liquid inlet 320 for supplying the etching liquid required for spraying; the motive gas and the etching liquid are mixed in the two-fluid mixing nozzle and then ejected from the nozzle 330, wherein the gas system is provided with a gas heating system. The gas heating system is used for heating the power gas;
by adding the gas heating system into the two-fluid etching spray system, flexible control of the temperature of the power gas is realized, so that the problems that the spray temperature is unstable and difficult to regulate due to the temperature difference between the power gas and the etching liquid are avoided when the gas and the liquid are mixed in the two-fluid mixing spray nozzle, the etching temperature of the gas-liquid mixture after atomization can be effectively maintained, the required activity of the etching liquid can be fully exerted, the quality of the two-fluid etching in the production of a precise circuit is improved, and the problem that the production quality is affected due to the insufficient activity of the etching liquid is solved.
The gas system comprises a gas source 100, a pressurized gas input port 101, a filtering system and a pressurized heating gas output port 102 which are sequentially arranged; the gas heating system is disposed between the pressurized gas input port 101 and the filtration system. The gas source 100 is used for providing a power gas with a certain pressure; the pressurized gas input port 101 is used for the motive gas to enter the gas heating system; the filtering system is used for filtering the power gas, removing impurities and drying; the pressurized heating gas output port 102 is used for outputting the power gas after the pressure and temperature are regulated to a gas system.
Through the power gas input gas heating system with pressure, after heating and filtration for power gas is fully purified, thereby avoids impurity to cause pollution and the interference to etching solution, improves etching gas-liquid mixture's quality. The gas heating system is arranged between the pressurized gas input port 101 and the filtering system, so that the heating process of the power gas is ensured to be beneficial to stabilizing the pressure, reasonably separating impurities and stabilizing the temperature before filtering.
The gas heating system comprises a gas heating device 200 and a temperature regulation and control monitoring system, wherein the temperature regulation and control monitoring system is used for controlling the temperature of power gas output by the gas heating device 200. The gas heating device 200 is used for heating the power gas;
the temperature regulation and control detection system is used for directly controlling the switch and the temperature of the gas heating device 200, so that the output temperature of the power gas can be efficiently and accurately controlled, and the pressure is balanced.
The temperature regulation and control monitoring system comprises: a temperature sensor 300, a controller 301 and an output valve 302; the temperature sensor 300 is used for detecting the temperature of the power gas heated by the gas heating device 200, is connected with the controller 301, and inputs the detected temperature value into the controller 301; the controller 301 controls the on-off of the output valve 302 according to whether the temperature value satisfies the set temperature.
The detection of the temperature sensor 300 and the control of the output valve 302 simply and efficiently realize the core functions required by the temperature regulation and control detection system, so that the stability of the system is good.
The temperature regulation and control monitoring system further comprises a temperature setting input device 400, wherein the temperature setting input device 400 is connected with the controller 301 and is used for inputting a set temperature requirement.
By the temperature setting input device 400, heat generation of the heat generating device can be accurately adjusted, thereby achieving good temperature control.
A gas flow monitoring system is also provided between the filtration system and the pressurized heated gas outlet 102. The gas flow monitoring system is used for detecting the gas flow of the power gas in the transmission pipeline;
the monitoring of the flow improves the control reference of the pressure of the power gas, and is helpful for stably and accurately controlling the pressure of the power gas in the pipeline, thereby controlling the ratio of the atomized gas and liquid.
The gas flow monitoring system comprises a gas pressure flow regulating valve 500, a gas pressure detecting valve 501 and a gas flow regulating valve 502 which are connected in sequence; the air pressure flow regulating valve 500 is connected with a filtering system; the gas flow regulating valve 502 is connected to the pressurized heated gas outlet 102. The pneumatic flow rate regulating valve 500 is used for controlling the pressure flow rate of the power gas; the air pressure detection valve 501 is used for detecting the pressure of the power air in the pipeline; the gas flow regulating valve 502 is used to further detect and regulate the flow of gas on the other side of the pipe.
The control and the detection provided by the mutual matching of the air pressure flow and the air flow at the two sides of the transmission pipeline are realized, the accurate control of the air flow in the pipelines is realized, the flow of output air is ensured, the middle air pressure detection supplements the defect of middle detection, and the multipoint uniform detection control of the pipelines is realized.
The liquid system includes: a thermostatic vessel 600 and a liquid supply pump 601; etching liquid is stored in the thermostatic vessel 600 and maintained at a constant temperature value, and is supplied to the liquid inlet 320 by the liquid supply pump 601.
By providing the thermostatic vessel 600, the temperature of the etching liquid is maintained more stable, and the temperature fluctuation is reduced, thereby ensuring that the etching liquid is in the temperature range with the best activity. The independent liquid supply pump 601 is matched, so that the driving power source of etching liquid is close, the pressure loss is reduced, and the output pressure and the temperature loss are accurately controlled.
The temperature regulation and control monitoring system is used for controlling the temperature of the power gas output by the gas heating device 200 to be 1-3 ℃ lower than the constant temperature maintained in the thermostatic vessel 600.
By controlling the temperature difference of the two components, the loss of the respective temperature in the pipeline transmission process is eliminated, so that the suitability is improved, and the required mixing temperature can be obtained immediately after the gas and the liquid are combined.
Example 2
This embodiment is a two fluid etching spray system comprising: a gas system, a liquid system and a two fluid mixing head; the two-fluid mixing nozzle is provided with a gas inlet 310, a liquid inlet 320 and a nozzle 330; a gas system is connected to the gas inlet 310 for providing the motive gas required for spraying; a liquid system is connected to the liquid inlet 320 for providing the etching liquid required for spraying; the power gas and the etching liquid are mixed in the two-fluid mixing nozzle and then ejected from the nozzle 330, wherein the gas system is provided with a gas heating system. The gas heating system is used for heating the power gas; the gas heating system comprises a gas heating device, wherein the gas heating device comprises a strip round tubular main body, and the two ends of the gas heating device are respectively provided with a gas inlet and a gas outlet.
Wherein a gas heating device 200 is provided at the gas outlet side. And a support for elevating the body is provided below the body. Specifically, the two fluid etching spray system includes: a gas system, two or more liquid systems and a two fluid mixing head; the filtration system is connected to a plurality of gas flow monitoring systems by a one-to-many system and is provided with a plurality of pressurized heated gas outlets 102 connected to gas inlets 310 of different two-fluid mixing nozzles. In a two-fluid etching spray system, one gas system and one filtering system can form the combined use of multiple paths of gas supply, and simultaneously meet the gas supply requirements of a plurality of two-fluid mixing spray heads. The gas system comprises a gas source 100, a pressurized gas input port 101, a filtering system and a pressurized heating gas output port 102 which are sequentially arranged; the gas heating system is disposed between the pressurized gas input port 101 and the filtration system.
The gas source 100 is used for providing a power gas with a certain pressure; the pressurized gas input port 101 is used for the motive gas to enter the gas heating system; the filtering system is used for filtering the power gas, removing impurities and drying; the pressurized heating gas output port 102 is used for outputting the power gas after the pressure and temperature are regulated to a gas system. The air source 100 is generally arranged outside, after the power air enters the air heating system, the air heating system can be used for heating, certain pressure change exists in the heating process, and the volume of the air changes. After the belt temperature stabilized, the pressure in the gas heating system was again stabilized and was further filtered. The gas heating system comprises a gas heating device 200 and a temperature regulation and control monitoring system, wherein the temperature regulation and control monitoring system is used for controlling the temperature of power gas output by the gas heating device 200.
The gas heating device 200 is used for heating the power gas; specifically, the gas heating device 200 can be a heating tube, in which a heating element enters the main body from one side of the main body, and the end is fixed to the main body and connected to the outside. The temperature regulation and control detecting system is connected with the heating tube, and the detecting end is arranged at the air outlet of the tube body and directly detects the temperature of the output port, so that the temperature of the output power gas is accurately reflected. The temperature regulation and control monitoring system comprises: a temperature sensor 300, a controller 301 and an output valve 302; the temperature sensor 300 is used for detecting the temperature of the power gas heated by the gas heating device 200, is connected with the controller 301, and inputs the detected temperature value into the controller 301; the controller 301 controls the on-off of the output valve 302 according to whether the temperature value satisfies the set temperature.
The air outlet is positioned above one side of the main body close to the heating device, and is connected with the filtering system through a hard pipeline and a flange, and the temperature sensor 300 is arranged on a pipeline of which the air outlet is communicated with the filtering system; the filtration system is further divided into multiple passes by hard tubing, each of which is provided with an output valve 302. The temperature regulation and control monitoring system further comprises a temperature setting input device 400, wherein the temperature setting input device 400 is connected with the controller 301 and is used for inputting a set temperature requirement. A gas flow monitoring system is also provided between the filtration system and the pressurized heated gas outlet 102. The gas flow monitoring system is used for detecting the gas flow of the power gas in the transmission pipeline; the gas flow monitoring system comprises a gas pressure flow regulating valve 500, a gas pressure detecting valve 501 and a gas flow regulating valve 502 which are connected in sequence; the air pressure flow regulating valve 500 is connected with a filtering system; the gas flow regulating valve 502 is connected to the pressurized heated gas outlet 102.
The pneumatic flow rate regulating valve 500 is used for controlling the pressure flow rate of the power gas; the air pressure detection valve 501 is used for detecting the pressure of the power air in the pipeline; the gas flow regulating valve 502 is used to further detect and regulate the flow of gas on the other side of the pipe. And each pipeline output after the filter is sequentially provided with an air pressure flow regulating valve 500, an air pressure detecting valve 501 and an air flow regulating valve 502, wherein the air pressure flow regulating valve 500 and the air flow regulating valve 502 are respectively close to an air inlet end and an air outlet end of the pipeline, and the air pressure detecting valve 501 is arranged between the air pressure flow regulating valve 500 and the air flow regulating valve 502. The liquid system comprises: a thermostatic vessel 600 and a liquid supply pump 601; etching liquid is stored in the thermostatic vessel 600 and maintained at a constant temperature value, and is supplied to the liquid inlet 320 by the liquid supply pump 601. The temperature regulation and control monitoring system is used for controlling the temperature of the power gas output by the gas heating device 200 to be 1-3 ℃ lower than the constant temperature maintained in the thermostatic vessel 600.
Taking the optimum active temperature of the etching solution as 50 ℃ as an example, the air source 100 supplies compressed air at normal temperature as a motive gas, and the compressed air is heated to 48 ℃ after being introduced into a gas heating system with pressure resistance. And then the mixture is determined by the temperature sensor 300 and then is output to a gas pipe in the two-fluid nozzle 330, and then the mixture is mixed with the circulating etching solution with the temperature kept at 50 ℃ to spray the gas-liquid mixture under pressure, so that the atomization of the etching solution is realized. Therefore, the problem of too low temperature of the sprayed gas-liquid mixture caused by too large temperature difference between the liquid fluid and the air flow can be avoided, and the etching effect and the etching quality are improved.
It should be understood that the foregoing examples of the present utility model are merely illustrative of the present utility model and are not intended to limit the present utility model to the specific embodiments thereof. Any modification, equivalent replacement, improvement, etc. that comes within the spirit and principle of the claims of the present utility model should be included in the protection scope of the claims of the present utility model.
Claims (10)
1. A two-fluid etching spray system,
comprising the following steps: a gas system, a liquid system and a two fluid mixing head;
the two-fluid mixing nozzle is provided with a gas inlet, a liquid inlet and a nozzle;
the gas system is connected with the gas inlet and is used for providing power gas required by spraying;
the liquid system is connected with the liquid inlet and is used for providing etching liquid required by spraying;
the power gas and the etching liquid are mixed in the two-fluid mixing nozzle and then sprayed out of the nozzle, and the etching liquid is characterized in that the gas system is provided with a gas heating system.
2. The two-fluid etching spray system of claim 1, wherein the gas system comprises a gas source, a pressurized gas input, a filtration system, and a pressurized heated gas output arranged in sequence; the gas heating system is disposed between the pressurized gas input port and the filtration system.
3. The two-fluid etching spray system of claim 1, wherein the gas heating system comprises a gas heating device and a temperature regulation monitoring system for controlling the temperature of the motive gas output by the gas heating device.
4. The two fluid etching spray system of claim 3 wherein the temperature regulation monitoring system comprises: a temperature sensor, a controller and an output valve; the temperature sensor is used for detecting the temperature of the power gas heated by the gas heating device, is connected with the controller and inputs the detected temperature value into the controller; and the controller controls the on-off of the output valve according to whether the temperature value meets the set temperature.
5. The two fluid etching spray system of claim 4, wherein the temperature regulation monitoring system further comprises a temperature setting input device, the temperature setting input device being coupled to the controller for inputting a set temperature requirement.
6. The two-fluid etching spray system of claim 2, wherein a gas flow monitoring system is further provided between the filtration system and the pressurized heated gas outlet.
7. The two-fluid etching spray system of claim 6, wherein the gas flow monitoring system comprises a gas pressure flow regulating valve, a gas pressure detection valve, and a gas flow regulating valve connected in sequence; the air pressure flow regulating valve is connected with the filtering system; the gas flow regulating valve is connected with the pressurized heating gas output port.
8. The two-fluid etching spray system of claim 6, wherein the two-fluid etching spray system comprises: a gas system, two or more liquid systems and a two fluid mixing head; the filtering system is connected with a plurality of gas flow monitoring systems through a one-to-multiple system, and is provided with a plurality of pressurized heating gas outlets which are connected with gas inlets of different two-fluid mixing spray heads.
9. The two fluid etching spray system of any of claims 3-5 wherein the liquid system comprises: a thermostatic vessel and a liquid supply pump; the etching liquid is stored in a constant temperature container and maintained at a constant temperature value, and is supplied to the liquid inlet by a liquid supply pump.
10. The two-fluid etching spray system of claim 9, wherein the temperature regulation and control monitoring system is configured to control the temperature of the motive gas output from the gas heating device to be 1 ℃ to 3 ℃ lower than the temperature maintained constant in the thermostatic vessel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320203274.5U CN219592725U (en) | 2023-02-10 | 2023-02-10 | Two fluid etching spraying system |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320203274.5U CN219592725U (en) | 2023-02-10 | 2023-02-10 | Two fluid etching spraying system |
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| CN219592725U true CN219592725U (en) | 2023-08-25 |
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| CN202320203274.5U Active CN219592725U (en) | 2023-02-10 | 2023-02-10 | Two fluid etching spraying system |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118019232A (en) * | 2024-04-09 | 2024-05-10 | 广州市巨龙印制板设备有限公司 | Circuit board two-fluid spraying device with recycling and atomizing functions |
-
2023
- 2023-02-10 CN CN202320203274.5U patent/CN219592725U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118019232A (en) * | 2024-04-09 | 2024-05-10 | 广州市巨龙印制板设备有限公司 | Circuit board two-fluid spraying device with recycling and atomizing functions |
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