CN118019232A - Circuit board two-fluid spraying device with recycling and atomizing functions - Google Patents
Circuit board two-fluid spraying device with recycling and atomizing functions Download PDFInfo
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- CN118019232A CN118019232A CN202410420427.0A CN202410420427A CN118019232A CN 118019232 A CN118019232 A CN 118019232A CN 202410420427 A CN202410420427 A CN 202410420427A CN 118019232 A CN118019232 A CN 118019232A
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- 239000012530 fluid Substances 0.000 title claims abstract description 164
- 238000005507 spraying Methods 0.000 title claims abstract description 13
- 238000004064 recycling Methods 0.000 title abstract description 11
- 238000005530 etching Methods 0.000 claims abstract description 248
- 238000011084 recovery Methods 0.000 claims abstract description 21
- 238000001514 detection method Methods 0.000 claims abstract description 20
- 238000000889 atomisation Methods 0.000 claims abstract description 17
- 238000009833 condensation Methods 0.000 claims abstract description 17
- 230000005494 condensation Effects 0.000 claims abstract description 17
- 238000012544 monitoring process Methods 0.000 claims abstract description 14
- 230000007246 mechanism Effects 0.000 claims abstract description 11
- 206010010904 Convulsion Diseases 0.000 claims abstract description 5
- 230000036461 convulsion Effects 0.000 claims abstract description 5
- 238000007599 discharging Methods 0.000 claims abstract description 3
- 238000010438 heat treatment Methods 0.000 claims description 128
- 239000007788 liquid Substances 0.000 claims description 73
- 238000011161 development Methods 0.000 claims description 60
- 238000012545 processing Methods 0.000 claims description 40
- 239000007921 spray Substances 0.000 claims description 31
- 238000000034 method Methods 0.000 claims description 28
- 230000008569 process Effects 0.000 claims description 28
- 238000003756 stirring Methods 0.000 claims description 24
- 238000005485 electric heating Methods 0.000 claims description 21
- 238000003860 storage Methods 0.000 claims description 14
- 239000003507 refrigerant Substances 0.000 claims description 10
- 239000003595 mist Substances 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 239000007789 gas Substances 0.000 description 80
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- 238000000605 extraction Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 230000003749 cleanliness Effects 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000004134 energy conservation Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000002918 waste heat Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000001694 spray drying Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/068—Apparatus for etching printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0736—Methods for applying liquids, e.g. spraying
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/163—Monitoring a manufacturing process
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- ing And Chemical Polishing (AREA)
Abstract
The invention belongs to the technical field of circuit board manufacturing, and discloses a circuit board two-fluid spraying device with recovery atomization, which comprises a developing etching treatment chamber and a condensation recovery mechanism, wherein the condensation recovery mechanism comprises: a controller module; the air draft condensing module is electrically connected with the controller module and is used for extracting air in the developing and etching treatment chamber, condensing the extracted air, recycling and discharging condensate; the compressed gas flow detection module is electrically connected with the controller module and is used for detecting the input flow Q1 of the compressed gas input into the two-fluid nozzle and transmitting the detection value to the controller module; the exhaust flow monitoring module is electrically connected with the controller module and is used for detecting the exhaust flow Q2 of the exhaust condensing module and transmitting the detection value to the controller module; the controller module compares flow input flow Q1 and exhaust flow Q2, adjusts the amount of wind of convulsions condensation module according to the comparison result for exhaust flow Q2 is greater than flow Q1, and Q2: q1 is between 1.05:1 and 1.15:1.
Description
Technical Field
The invention belongs to the technical field of circuit board development and etching treatment, and particularly relates to a circuit board two-fluid spraying device with recycling atomization.
Background
Along with the high-speed development of the current electronic industry, electronic integrated components are finer, thinner and finer, so that the arrangement lines of the circuit board are finer, and the traditional developing/etching device can only meet the requirement of line widths/line distances of more than 45um/45um, and the line widths/line distances of less than 45um are required to be used for the two-fluid precise developing/etching device.
In the prior art, china patent publication No. CN220254793U discloses a circuit board etching spray device, the main classification No. H05K3/06, the spray device comprises an etching spray box and a liquid outlet pipe, a uniform spray drying mechanism is arranged in the etching spray box and comprises a motor fixedly arranged at the top of the etching spray box, an output shaft of the motor is fixedly provided with a rotating shaft through a coupler, the bottom of the rotating shaft is fixedly provided with driving conical teeth, a screw rod is rotatably arranged between the left side wall and the right side wall of an inner cavity of the etching spray box, and driven conical teeth are fixedly arranged on the outer surface of the screw rod; according to the circuit board etching spray device, the purpose of uniformly etching, spraying and drying after spraying the circuit board is achieved by the uniform spraying and drying mechanism, so that the etching effect of the circuit board is better, excessive etching caused by the residual etching liquid of the etched and sprayed circuit board is avoided, and the circuit board etching spray device is improved; another Chinese patent with publication number CN219437264U discloses a spray device, the main classification number is H05K3/26, the spray device comprises a base, a fixed seat, a first guide rod, a connecting plate, a water pump, a first water pipe, a spray head and the like; a fixed seat is symmetrically arranged on one side of the base, a first guide rod is arranged between the fixed seats, a connecting plate is slidably arranged on the first guide rod, a water pump is fixedly arranged on the connecting plate, a water outlet end of the water pump is connected with a first water pipe, a plurality of spray heads are uniformly arranged on one side of the connecting plate, facing the base, at intervals, and the top of each spray head is connected with the first water pipe; the water pump pumps cleaning liquid to the spray head through the first water pipe and sprays the cleaning liquid to the circuit board through the spray head, and the fixing seat slides back and forth along the first guide rod, so that the function of omnibearing spraying of the circuit board is realized.
The etching device provided by the patent does not control the air draft condensation, lacks intelligent control on a condensation mechanism, causes unstable condensation displacement, cannot guarantee that the etching process is carried out at reasonable process temperature, and can effectively guarantee etching quality.
Disclosure of Invention
The invention aims to provide a circuit board two-fluid spray device with recycling atomization, and aims to solve the technical problems.
In order to achieve the above object, the present invention provides a two-fluid spray device for a circuit board with recovery atomization, comprising a developing and etching processing chamber, wherein a fluid nozzle for spraying etching liquid fluid and a two-fluid nozzle for spraying gas-liquid mixed etching fluid are arranged in the developing and etching processing chamber,
Still include condensation recovery mechanism, condensation recovery mechanism includes:
A controller module;
The air draft condensing module is electrically connected with the controller module and is used for extracting air in the developing and etching treatment chamber, condensing the extracted air, recycling and discharging condensate;
The compressed gas flow detection module is electrically connected with the controller module and is used for detecting the input flow Q1 of the compressed gas input into the two-fluid nozzle and transmitting the detection value to the controller module;
The exhaust flow monitoring module is electrically connected with the controller module and is used for detecting the exhaust flow Q2 of the exhaust condensing module and transmitting the detection value to the controller module;
The controller module compares flow input flow Q1 with exhaust flow Q2, adjusts the air extraction volume of the air extraction condensing module according to the comparison result, so that the exhaust flow Q2 is greater than flow Q1, and Q2 is as follows: q1 is between 1.05:1 and 1.15:1.
The etching liquid heating module is used for heating the etching liquid conveyed to one fluid nozzle and the two fluid nozzles to the required process temperature; the compressed gas heating module is used for heating the compressed gas which is delivered to the two-fluid nozzle, so that the temperature of the gas-liquid mixed etching fluid obtained after the compressed gas which enters the two-fluid nozzle is mixed with the etching liquid reaches the required process temperature.
Further, the developing and etching processing chamber comprises a fluid developing and etching processing chamber and a two-fluid developing and etching processing chamber, wherein the fluid nozzle and the two-fluid nozzle are respectively positioned in the fluid developing and etching processing chamber and the two-fluid developing and etching processing chamber; the fluid development etching treatment chamber is communicated with the two fluid development etching treatment chambers through sealed conveying channels, and etching object conveying devices are arranged among the fluid development etching treatment chamber, the two fluid development etching treatment chambers and the conveying channels;
the etching liquid storage area of the fluid development etching processing chamber is connected with the etching liquid storage area of the two fluid development etching processing chambers through a communicating pipe, so that the fluid development etching processing chamber and the two fluid development etching processing chambers have the same etching liquid level.
Further, the etching solution heating module comprises a first etching solution heating module and a second etching solution heating module, wherein the first etching solution heating module comprises a first electric heating disc, a first thermometer, a first stirring pump and a first filter, and the first electric heating disc is arranged at the bottom of a fluid development etching treatment chamber and is used for heating etching solution in the fluid development etching treatment chamber; the first thermometer is arranged on the side wall of the fluid development etching processing chamber and is used for detecting the temperature of etching liquid in the fluid development etching processing chamber and transmitting the detected value to the controller module; the suction inlet of the first stirring pump is connected with an etching liquid storage area of a fluid development etching treatment chamber through a pipeline, the discharge outlet of the first stirring pump is connected with a first filter, and the first filter is connected with the fluid development etching treatment chamber through a pipeline;
The second etching solution heating module comprises a second electric heating disc, a second thermometer, a second stirring pump and a second filter, wherein the second electric heating disc is arranged at the bottom of the two-fluid developing and etching treatment chamber and is used for heating etching solution in the two-fluid developing and etching treatment chamber; the second thermometer is arranged on the side wall of the two-fluid development etching treatment chamber and is used for detecting the temperature of the etching solution in the two-fluid development etching treatment chamber and transmitting the detected value to the controller module; the suction inlet of the second stirring pump is connected with the etching liquid storage area of the two-fluid developing and etching treatment chamber through a pipeline, the discharge outlet of the second stirring pump is connected with a second filter, and the second filter is connected with the two-fluid developing and etching treatment chamber through a pipeline.
Further, the compressed gas heating module comprises a heating element, a temperature sensor, and a compressed gas delivery tube having a heating zone section located outside of the developing etch process chamber; the heating area section is a metal pipeline, a plurality of heating elements are arranged on the heating area section along the conveying direction of compressed gas, a first temperature sensor and a second temperature sensor are respectively arranged at two ends of the heating area section, the first temperature sensor is located at one end, close to a compressed gas source, of the heating area section, the second temperature sensor is located at one end, close to a developing and etching treatment chamber, of the heating area section, and the first temperature sensor, the second temperature sensor and the heating elements are electrically connected with the controller module.
Further, the heating element is an electric heating ring wrapped on the heating area section, the etching process temperature T is preset in the controller module, and the first temperature sensor transmits the first temperature T1 when the compressed air enters the heating area section to the controller module; the controller module calculates the total power W required by heating through a formula W=a×C×Q1×ρ× (T-T1), wherein a is a compensation coefficient, C is the specific heat capacity of the compressed gas, ρ is the density of the compressed gas, and a is between 1.2 and 1.5; the controller module selects proper number of electric heating coils according to the total heating power W, and the power of the selected electric heating coils is W1, W2, W3, … and Wn respectively, so that the formula set is satisfied: W1+W2+W3+ … +Wn is not less than W, and W2+W3+ … … +Wn is not less than W, wherein W1 is the minimum value of W1, W2, W3, … and Wn.
Further, the second temperature sensor communicates a second temperature T2 of the compressed air leaving the heating zone segment to the controller module, which adjusts the compensation factor a by:
S100, comparing the etching process temperature T with a second temperature T2;
S200, when the absolute value T-T2/T is less than or equal to 5%, a is kept unchanged, and when T is more than T2 and the absolute value T-T2/T is more than 5%, a is increased by 0.1; when T is less than T2 and |T-T2|/T is greater than 5%, then a is reduced by 0.1;
S300, repeating S100 and S200 every t time, wherein t is between 20 seconds and 30 seconds.
Further, the exhaust condensing module comprises an exhaust fan and a condenser, wherein a driving motor of the exhaust fan is a variable frequency motor, and the variable frequency motor is electrically connected with the controller module; the condenser is provided with a condensed gas inlet, a condensed gas outlet, a refrigerant inlet, a refrigerant outlet and a condensate outlet; the exhaust fan is provided with an air suction port and an exhaust port, the air suction port of the exhaust fan is connected with the developing etching treatment chamber through an air suction pipeline, and the exhaust port of the exhaust fan is connected with a condensed gas inlet of the condenser; the heating area section of the compressed gas conveying pipe is provided with a heating wrapping pipe close to one side of the compressed gas source, the heating wrapping pipe is sleeved on the compressed gas conveying pipe and is provided with an air inlet port and an air outlet port, and a condensed gas outlet and/or a refrigerant outlet of the condenser is connected with the air inlet port of the heating wrapping pipe through a pipeline.
Further, a condensed gas outlet of the condenser is connected with a condensed gas exhaust pipe, the exhaust flow monitoring module is a gas flowmeter, and the exhaust flow monitoring module is arranged on the condensed gas exhaust pipe; the condensate outlet of the condenser is connected with a condensate return pipe, and the outlet of the condensate return pipe is positioned in the developing and etching treatment chamber.
Further, an oil mist separator and an air filter are arranged on the compressed gas conveying pipe, the oil mist separator and the air filter are arranged on one side of the heating wrapping pipe, which is close to the compressed gas source, and the aperture of a filter element of the air filter is smaller than 10um;
And a check valve is also arranged on the compressed gas conveying pipe, and the check valve is positioned at one side of the heating area section of the compressed gas conveying pipe, which is close to the developing and etching treatment chamber.
Compared with the prior art, the invention has the following beneficial effects:
1. According to the invention, the air in the developing and etching treatment chamber is extracted through the air extraction condensing module, the extracted air is condensed, condensate is recovered and flows back to the developing and etching treatment chamber, so that the recycling of etching liquid is effectively ensured, and the long-time stable operation of the assembly line production can be ensured.
The compressed gas flow detection module is used for detecting the input flow Q1 of the compressed gas input into the two-fluid nozzle and transmitting the detection value to the controller module; detecting the exhaust flow of the exhaust condensing module through an exhaust flow monitoring module, and transmitting the detection value to a controller module; the controller module compares flow input flow Q1 and exhaust flow Q2, adjusts the power of convulsions condensation module according to the comparison result, and then reaches the purpose of adjusting convulsions condensation module and take out the amount of wind for exhaust flow Q2 is greater than flow Q1, and makes Q2: q1 is between 1.05:1 and 1.15:1, so that the atomized etching liquid in the air of the developing etching treatment chamber can be fully recovered, the power of the air draft condensing module can be reduced as much as possible, and the purpose of energy conservation is achieved.
The invention is provided with an etching liquid heating module and a compressed gas heating module, wherein the etching liquid heating module is used for heating the etching liquid conveyed to a fluid nozzle and a two-fluid nozzle to the required process temperature; the compressed gas heating module is used for heating the compressed gas delivered to the two-fluid nozzle, so that the temperature of the gas-liquid mixed etching fluid obtained after the compressed gas entering the two-fluid nozzle is mixed with the etching liquid reaches the required process temperature; therefore, the etching process can be carried out at reasonable process temperature, and the etching quality can be effectively ensured.
The condensed gas outlet and/or the refrigerant outlet of the condenser are/is connected with the air inlet port of the heating wrapping pipe through the pipeline, and the heating wrapping pipe comprises the compressed gas conveying pipe, so that the recovered waste heat can be utilized to heat the compressed air conveyed to the two-fluid nozzle before entering the heating area section, the full utilization of energy is realized, and the invention is more energy-saving.
Drawings
FIG. 1 is a schematic diagram of a circuit board two-fluid spray device with recovery atomization according to the present invention;
FIG. 2 is a block diagram of the electrical control architecture of the circuit board two-fluid spray device with recovery atomization of the present invention;
Fig. 3 is a schematic diagram of the connection between the suction condensing module, the compressed gas delivery pipe, the compressed gas heating module and the heating wrap pipe of the circuit board two-fluid spray device with recovery atomization according to the present invention.
In the figure: 1. a fluid nozzle; 2. a two-fluid nozzle; 3. a fluid developing etching chamber; 4. a two-fluid development etching process chamber; 5. an etching liquid delivery pump; 6. an air draft condensing module; 601. an exhaust fan; 602. a condenser; 7. an air suction pipe; 8. a condensate return pipe; 9. a compressed gas flow detection module; 10. an exhaust flow monitoring module; 11. a heating element; 12. a first temperature sensor; 13. a second temperature sensor; 14. a compressed gas delivery tube; 15. an etching target conveying device; 16. a communicating pipe; 17. a first thermometer; 18. a first stirring pump; 19. a first filter; 20. a second thermometer; 21. a second stirring pump; 22. a second filter; 23. heating the wrapping tube; 24. a condensed gas exhaust pipe; 25. a non-return valve; 26. an air filter; 27. an oil mist separator.
Detailed Description
The following is further described with reference to the accompanying drawings and specific examples:
The circuit board two-fluid spraying device with recycling atomization, as shown in fig. 1 and 2, comprises a developing etching treatment chamber, a condensation recycling mechanism, an etching solution heating module and a compressed gas heating module; the developing and etching treatment chamber comprises a fluid developing and etching treatment chamber 3 and a fluid developing and etching treatment chamber 4, and a fluid nozzle 1 and a fluid nozzle 2 are respectively arranged in the fluid developing and etching treatment chamber 3 and the fluid developing and etching treatment chamber 4; a fluid nozzle 1 for injecting etching liquid fluid, and a two-fluid nozzle 2 for injecting gas-liquid mixed etching fluid; a fluid development etching processing chamber 3 and a two-fluid development etching processing chamber 4 are communicated through a sealed conveying channel, and an etching object conveying device 15 is arranged among the fluid development etching processing chamber 3, the two-fluid development etching processing chamber 4 and the conveying channel; the lower ends of the fluid development etching treatment chamber 3 and the two fluid development etching treatment chamber 4 are etching solution storage areas, and the etching solution storage areas of the fluid development etching treatment chamber 3 and the two fluid development etching treatment chamber 4 are connected through a communicating pipe 16, so that the fluid development etching treatment chamber 3 and the two fluid development etching treatment chamber 4 have the same etching solution liquid level; an etching liquid storage area of the fluid development etching processing chamber 3 or an etching liquid storage area of the two-fluid development etching processing chamber 4 is connected with an etching liquid delivery pump 5, and the etching liquid delivery pump 5 is connected with each of the fluid nozzles 1 and the two-fluid nozzles 2 for delivering the etching liquid to each of the fluid nozzles 1 and the two-fluid nozzles 2.
As shown in fig. 1 and 2, the etching liquid heating module includes a first etching liquid heating module including a first electric heating plate provided at the bottom of a fluid developing etching processing chamber 3 for heating the etching liquid in the fluid developing etching processing chamber 3, a first thermometer 17, a first stirring pump 18, and a first filter 19, and a second etching liquid heating module; the first thermometer 17 is disposed on a sidewall of a fluid development etching processing chamber 3, and is used for detecting a temperature of an etching solution in the fluid development etching processing chamber 3 and transmitting the detected value to the controller module; the controller module is preset with an etching process temperature T, compares the detection value transmitted by the first thermometer 17 with the etching process temperature T, and controls the start and stop of the first electric heating disc according to the comparison result so that the detection value transmitted by the first thermometer 17 tends to be the same as the etching process temperature T; the suction inlet of the first stirring pump 18 is connected with the etching liquid storage area of the fluid development etching processing chamber 3 through a pipeline, the discharge outlet of the first stirring pump 18 is connected with the first filter 19, and the first filter 19 is connected with the fluid development etching processing chamber 3 through a pipeline; the first stirring pump 18 sucks the etching liquid in the fluid development etching processing chamber 3 and conveys the etching liquid back to the fluid development etching processing chamber 3, so that stirring of the etching liquid in the fluid development etching processing chamber 3 can be realized, the temperature of the etching liquid at each position in the fluid development etching processing chamber 3 is more uniform, and the accuracy of the detection result of the first thermometer 17 is effectively improved; while the first stirring pump 18 stirs the etching liquid in the fluid development etching processing chamber 3, impurities are filtered by the first filter 19, so that the cleanliness of the etching liquid in the development etching processing chamber can be effectively ensured, and the long-time stable operation of the etching process can be ensured.
Likewise, the second etching liquid heating module includes a second electric heating plate, a second thermometer 20, a second stirring pump 21 and a second filter 22, the second electric heating plate being provided at the bottom of the two-fluid developing etching processing chamber 4 for heating the etching liquid in the two-fluid developing etching processing chamber 4; the second thermometer 20 is disposed on a sidewall of the two-fluid developing and etching chamber 4, and is used for detecting a temperature of the etching solution in the two-fluid developing and etching chamber 4 and transmitting the detected value to the controller module; the suction inlet of the second stirring pump 21 is connected with the etching solution storage area of the two-fluid development etching treatment chamber 4 through a pipeline, the discharge outlet of the second stirring pump 21 is connected with the second filter 22, and the second filter 22 is connected with the two-fluid development etching treatment chamber 4 through a pipeline; the second etching solution heating module has the same structure and function as those of the first etching solution heating module, and will not be described.
As shown in fig. 1, 2 and 3, the compressed gas heating module includes a heating element 11, a temperature sensor and a compressed gas delivery pipe 14, the compressed gas delivery pipe 14 having a heating region section, the heating region section being located outside the developing etching processing chamber; the heating area section is a metal pipeline, a plurality of heating elements 11 are arranged on the heating area section along the compressed gas conveying direction, and a first temperature sensor 12 and a second temperature sensor 13 are respectively arranged at two ends of the heating area section; the first temperature sensor 12 is positioned at one end of the heating area section close to the compressed air source, and the second temperature sensor 13 is positioned at one end of the heating area section close to the developing etching treatment chamber; the first temperature sensor 12, the second temperature sensor 13 and the heating elements 11 are electrically connected with the controller module; the heating element 11 is an electric heating ring wrapped on the heating area section, the etching process temperature T is preset in the controller module, and the first temperature sensor 12 transmits the first temperature T1 when the compressed air enters the heating area section to the controller module; the controller module calculates the total heating power W required by a formula W=a×C×Q1×ρ×T-T1, wherein a is a compensation coefficient, C is the specific heat capacity of the compressed gas, ρ is the density of the compressed gas, and a is between 1.2 and 1.5; the controller module selects proper number of electric heating coils according to the total heating power W, and the power of the selected electric heating coils is W1, W2, W3, … and Wn respectively, so that the formula set is satisfied: the W1+W2+W3+ … +Wn is larger than or equal to W, and the W2+W3+, … and +Wn are smaller than or equal to W, wherein W1 is the minimum value of W1, W2, W3, … and Wn, so that the W1+W2+W3+, … and +Wn are slightly larger than W, and the excessive temperature of the gas-liquid mixed etching fluid caused by too much exceeding W of W1+W2+W3, … and +Wn can be avoided.
The second temperature sensor 13 transmits a second temperature T2 of the compressed air leaving the heating zone segment to the controller module, which adjusts the compensation factor a by:
S100, comparing the etching process temperature T with a second temperature T2;
S200, when the absolute value T-T2/T is less than or equal to 5%, a is kept unchanged, and when T is more than T2 and the absolute value T-T2/T is more than 5%, a is increased by 0.1; when T is less than T2 and |T-T2|/T is greater than 5%, then a is reduced by 0.1;
S300, repeating S100 and S200 every t time, wherein t is between 20 seconds and 30 seconds.
Therefore, the dynamic adjustment of the final heated temperature of the compressed gas can be realized, the final heated temperature of the compressed gas always tends to be the same as the etching process temperature T, and the dynamic adjustment of the temperature of the gas-liquid mixed etching fluid is further realized, so that the temperature of the gas-liquid mixed etching fluid always tends to be the same as the etching process temperature T.
As shown in fig. 1, 2 and 3, the condensation recovery mechanism comprises a controller module, an induced draft condensing module 6, a compressed gas flow detection module 9 and an exhaust gas flow monitoring module 10, wherein the induced draft condensing module 6, the compressed gas flow detection module 9 and the exhaust gas flow monitoring module 10 are electrically connected with the controller module; the exhaust condensing module 6 comprises an exhaust fan 601 and a condenser 602, wherein a driving motor of the exhaust fan 601 is a variable frequency motor, and the variable frequency motor is electrically connected with the controller module; the condenser 602 has a condensed gas inlet, a condensed gas outlet, a refrigerant inlet, a refrigerant outlet, and a condensate drain; the exhaust fan 601 is provided with an air suction port and an exhaust port, the air suction port of the exhaust fan 601 is connected with the developing etching treatment chamber through an air suction pipeline 7, and the exhaust port of the exhaust fan 601 is connected with a condensed gas inlet of the condenser 602; the heating area section of the compressed gas conveying pipe 14 is provided with a heating wrapping pipe 23 near the compressed gas source, the heating wrapping pipe 23 is sleeved on the compressed gas conveying pipe 14, the heating wrapping pipe 23 is provided with an air inlet port and an air outlet port, a condensed gas outlet and/or a refrigerant outlet of the condenser 602 is connected with the air inlet port of the heating wrapping pipe 23 through pipelines, so that the recycled waste heat can be utilized to heat the compressed air conveyed to the two-fluid nozzle 2 before entering the heating area section, the full utilization of energy is realized, and the invention is more energy-saving.
As shown in fig. 1 and 3, a condensed gas exhaust pipe 24 is connected to a condensed gas outlet of the condenser 602, the exhaust gas flow rate monitoring module 10 is a gas flow meter, and the exhaust gas flow rate monitoring module 10 is mounted on the condensed gas exhaust pipe 24; the condensate outlet of the condenser 602 is connected with a condensate return pipe 8, and the outlet of the condensate return pipe 8 is positioned in the two-fluid development etching treatment chamber 4; the etching liquid condensed and recovered by the condenser 602 flows back to the two-fluid developing etching treatment chamber 4 through the condensate return pipe 8, so that the recycling of the etching liquid is effectively ensured, and the long-time stable operation of the pipeline production can be ensured.
As shown in fig. 1, the compressed gas conveying pipe 14 is provided with an oil mist separator 27 and an air filter 26, the oil mist separator 27 and the air filter 26 are arranged on one side of the heating wrapping pipe 23 close to the compressed gas source, the oil mist separator 27 and the air filter 26 are used for guaranteeing cleanliness of the compressed gas, the oil mist separator 27 is used for removing oil from the compressed gas before heating, and the air filter 26 is used for filtering the compressed gas before heating; the pore size of the filter element of the air filter 26 is less than 10um, preferably less than 5um; the compressed gas conveying pipe 14 is also provided with a check valve 25, the check valve 25 is positioned on one side of the heating area section of the compressed gas conveying pipe 14, which is close to the developing and etching treatment chamber, and the check valve 25 can prevent air in the developing and etching treatment chamber from reversely leaking, and prevent the gas containing etching solution from entering the gas pipe to cause crystallization and blockage.
The working principle of the invention is as follows: according to the invention, the air in the developing and etching treatment chamber is extracted through the air extraction condensing module 6, the extracted air is condensed, condensate is recovered and flows back to the developing and etching treatment chamber, so that the recycling of etching liquid is effectively ensured, and the long-time stable operation of the assembly line production can be ensured; the invention detects the input flow Q1 of the compressed gas input into the two-fluid nozzle 2 through the compressed gas flow detection module 9, and transmits the detection value to the controller module; detecting the exhaust flow Q2 of the exhaust condensing module 6 by the exhaust flow monitoring module 10, and transmitting the detected value to the controller module; the controller module compares flow input flow Q1 and exhaust flow Q2, adjusts the power of driving motor of the air exhauster 601 of air exhauster condensation module 6 according to the comparison result, and then reaches the purpose of adjusting the air exhauster of air exhauster condensation module 6 and take out the amount of wind for exhaust flow Q2 is greater than flow Q1, and makes Q2: q1 is between 1.05:1 and 1.15:1, so that the atomized etching liquid in the air of the developing etching treatment chamber can be fully recovered, the power of the air draft condensing module 6 can be reduced as much as possible, and the purpose of energy conservation is achieved.
In addition, the invention is provided with an etching liquid heating module and a compressed gas heating module, wherein the etching liquid heating module is used for heating the etching liquid conveyed to one fluid nozzle 1 and two fluid nozzles 2 to the required process temperature; the compressed gas heating module is used for heating the compressed gas delivered to the two-fluid nozzle 2, so that the temperature of the gas-liquid mixed etching fluid obtained after the compressed gas entering the two-fluid nozzle 2 is mixed with the etching liquid reaches the required process temperature; therefore, the etching process can be carried out at reasonable process temperature, and the etching quality can be effectively ensured.
The above is only a preferred embodiment of the present invention, and is not intended to limit the present invention, but various modifications and variations can be made to the present invention by those skilled in the art; any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. The utility model provides a two fluid spray device of circuit board with retrieve atomizing, includes development etching treatment room, be provided with a fluid nozzle (1) and two fluid nozzle (2) in the development etching treatment room, a fluid nozzle (1) is used for spraying etching liquid fluid, two fluid nozzle (2) are used for spraying gas-liquid mixture etching fluid, its characterized in that:
Still include condensation recovery mechanism, condensation recovery mechanism includes:
A controller module;
The air draft condensing module (6) is electrically connected with the controller module and is used for extracting air in the developing and etching treatment chamber, condensing the extracted air, and recovering and discharging condensate;
the compressed gas flow detection module (9) is electrically connected with the controller module and is used for detecting the input flow Q1 of the compressed gas input into the two-fluid nozzle (2) and transmitting the detection value to the controller module;
The exhaust flow monitoring module (10) is electrically connected with the controller module and is used for detecting the exhaust flow Q2 of the exhaust condensing module (6) and transmitting the detection value to the controller module;
The controller module compares flow input flow Q1 and exhaust flow Q2, adjusts the convulsions volume of convulsions condensation module (6) according to the comparison result for exhaust flow Q2 is greater than flow Q1, and Q2: q1 is between 1.05:1 and 1.15:1.
2. A circuit board two-fluid spray device with recovery atomization as set forth in claim 1, wherein: the etching liquid heating device comprises a controller module, a fluid nozzle (1) and a two-fluid nozzle (2), and is characterized by further comprising an etching liquid heating module and a compressed gas heating module, wherein the etching liquid heating module and the compressed gas heating module are electrically connected with the controller module and are used for heating etching liquid conveyed to the fluid nozzle (1) and the two-fluid nozzle (2) to a required process temperature; the compressed gas heating module is used for heating the compressed gas which is delivered to the two-fluid nozzle (2) so that the temperature of the gas-liquid mixed etching fluid obtained after the compressed gas which enters the two-fluid nozzle (2) is mixed with the etching liquid reaches the required process temperature.
3. A circuit board two-fluid spray device with recovery atomization as set forth in claim 2, wherein: the developing and etching treatment chamber comprises a fluid developing and etching treatment chamber (3) and a fluid developing and etching treatment chamber (4), and the fluid nozzle (1) and the fluid nozzle (2) are respectively arranged in the fluid developing and etching treatment chamber (3) and the fluid developing and etching treatment chamber (4); the fluid development etching treatment chamber (3) is communicated with the two fluid development etching treatment chambers (4) through sealed conveying channels, and etching object conveying devices (15) are arranged among the fluid development etching treatment chamber (3), the two fluid development etching treatment chambers (4) and the conveying channels;
The etching liquid storage area of the fluid development etching processing chamber (3) and the etching liquid storage area of the two fluid development etching processing chamber (4) are connected through a communicating pipe (16), so that the etching liquid level of the fluid development etching processing chamber (3) and the etching liquid level of the two fluid development etching processing chamber (4) are the same.
4. A circuit board two-fluid spray device with recovery atomization as set forth in claim 3, wherein: the etching solution heating module comprises a first etching solution heating module and a second etching solution heating module, the first etching solution heating module comprises a first electric heating disc, a first thermometer (17), a first stirring pump (18) and a first filter (19), and the first electric heating disc is arranged at the bottom of a fluid development etching treatment chamber (3) and is used for heating etching solution in the fluid development etching treatment chamber (3); the first thermometer (17) is arranged on the side wall of the fluid development etching processing chamber (3) and is used for detecting the temperature of etching liquid in the fluid development etching processing chamber (3) and transmitting the detected value to the controller module; the suction inlet of the first stirring pump (18) is connected with an etching liquid storage area of the fluid development etching treatment chamber (3) through a pipeline, the discharge outlet of the first stirring pump (18) is connected with a first filter (19), and the first filter (19) is connected with the fluid development etching treatment chamber (3) through a pipeline;
The second etching solution heating module comprises a second electric heating disc, a second thermometer (20), a second stirring pump (21) and a second filter (22), wherein the second electric heating disc is arranged at the bottom of the two-fluid developing and etching treatment chamber (4) and is used for heating etching solution in the two-fluid developing and etching treatment chamber (4); the second thermometer (20) is arranged on the side wall of the two-fluid developing and etching treatment chamber (4) and is used for detecting the temperature of etching liquid in the two-fluid developing and etching treatment chamber (4) and transmitting the detected value to the controller module; the suction inlet of the second stirring pump (21) is connected with the etching liquid storage area of the two-fluid developing and etching treatment chamber (4) through a pipeline, the discharge outlet of the second stirring pump (21) is connected with the second filter (22), and the second filter (22) is connected with the two-fluid developing and etching treatment chamber (4) through a pipeline.
5. A circuit board two-fluid spray device with recovery atomization as set forth in claim 2, wherein: the compressed gas heating module comprises a heating element (11), a temperature sensor and a compressed gas delivery pipe (14), wherein the compressed gas delivery pipe (14) is provided with a heating area section, and the heating area section is positioned outside the developing etching treatment chamber; the heating area section is a metal pipeline, a plurality of heating elements (11) are arranged on the heating area section along the conveying direction of compressed gas, a first temperature sensor (12) and a second temperature sensor (13) are respectively arranged at two ends of the heating area section, the first temperature sensor (12) is located at one end, close to a compressed gas source, of the heating area section, the second temperature sensor (13) is located at one end, close to a developing and etching treatment chamber, of the heating area section, and the first temperature sensor (12), the second temperature sensor (13) and the heating elements (11) are electrically connected with a controller module.
6. A circuit board two-fluid spray device with recovery atomization as set forth in claim 5, wherein: the heating element (11) is an electric heating ring wrapped on the heating area section, the etching process temperature T is preset in the controller module, and the first temperature sensor (12) transmits a first temperature T1 when compressed air enters the heating area section to the controller module; the controller module calculates the total power W required by heating through a formula W=a×C×Q1×ρ× (T-T1), wherein a is a compensation coefficient, C is the specific heat capacity of the compressed gas, ρ is the density of the compressed gas, and a is between 1.2 and 1.5; the controller module selects proper number of electric heating coils according to the total heating power W, and the power of the selected electric heating coils is W1, W2, W3, … and Wn respectively, so that the formula set is satisfied: W1+W2+W3+ … … +Wn is not less than W, and W2+W3+ … … +Wn is not less than W, wherein W1 is the minimum value of W1, W2, W3, … and Wn.
7. A circuit board two-fluid spray device with recovery atomization as set forth in claim 6, wherein: the second temperature sensor (13) transmits a second temperature T2 of the compressed air leaving the heating zone section to the controller module, which adjusts the compensation factor a by:
S100, comparing the etching process temperature T with a second temperature T2;
S200, when the absolute value T-T2/T is less than or equal to 5%, a is kept unchanged, and when T is more than T2 and the absolute value T-T2/T is more than 5%, a is increased by 0.1; when T is less than T2 and |T-T2|/T is greater than 5%, then a is reduced by 0.1;
S300, repeating S100 and S200 every t time, wherein t is between 20 seconds and 30 seconds.
8. A circuit board two-fluid spray device with recovery atomization as set forth in claim 5, wherein: the exhaust condensing module (6) comprises an exhaust fan (601) and a condenser (602), wherein a driving motor of the exhaust fan (601) is a variable frequency motor, and the variable frequency motor is electrically connected with the controller module; the condenser (602) is provided with a condensed gas inlet, a condensed gas outlet, a refrigerant inlet, a refrigerant outlet and a condensate outlet; the exhaust fan (601) is provided with an air suction port and an exhaust port, the air suction port of the exhaust fan (601) is connected with the developing etching treatment chamber through an air suction pipeline (7), and the exhaust port of the exhaust fan (601) is connected with a condensed gas inlet of the condenser (602); the heating area section of the compressed gas conveying pipe (14) is provided with a heating wrapping pipe (23) on one side close to a compressed gas source, the heating wrapping pipe (23) is sleeved on the compressed gas conveying pipe (14), the heating wrapping pipe (23) is provided with an air inlet port and an air outlet port, and a condensed gas outlet and/or a refrigerant outlet of the condenser (602) is connected with the air inlet port of the heating wrapping pipe (23) through a pipeline.
9. A circuit board two-fluid spray device with recovery atomization as set forth in claim 8, wherein: a condensed gas outlet of the condenser (602) is connected with a condensed gas exhaust pipe (24), the exhaust flow monitoring module (10) is a gas flowmeter, and the exhaust flow monitoring module (10) is arranged on the condensed gas exhaust pipe (24); the condensate outlet of the condenser (602) is connected with a condensate return pipe (8), and the outlet of the condensate return pipe (8) is positioned in the developing etching treatment chamber.
10. A circuit board two-fluid spray device with recovery atomization as set forth in claim 9, wherein: an oil mist separator (27) and an air filter (26) are arranged on the compressed gas conveying pipe (14), the oil mist separator (27) and the air filter (26) are arranged on one side of the heating wrapping pipe (23) close to a compressed gas source, and the aperture of a filter element of the air filter (26) is smaller than 10um;
A check valve (25) is further arranged on the compressed gas conveying pipe (14), and the check valve (25) is positioned on one side, close to the developing etching treatment chamber, of the heating area section of the compressed gas conveying pipe (14).
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| Application Number | Priority Date | Filing Date | Title |
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| CN202410420427.0A CN118019232B (en) | 2024-04-09 | 2024-04-09 | Circuit board two-fluid spraying device with recycling and atomizing functions |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202410420427.0A CN118019232B (en) | 2024-04-09 | 2024-04-09 | Circuit board two-fluid spraying device with recycling and atomizing functions |
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| CN118019232B CN118019232B (en) | 2024-06-21 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN203834017U (en) * | 2013-12-13 | 2014-09-17 | 陶克（苏州）机械设备有限公司 | Gas circulating device |
| CN213447306U (en) * | 2019-08-21 | 2021-06-15 | 叶涛 | Liquid-free ammonia treatment device for circuit board alkaline etching solution |
| CN216123043U (en) * | 2021-09-07 | 2022-03-22 | 惠州美锐电子科技有限公司 | Etching two-fluid temperature adjusting system |
| CN219592725U (en) * | 2023-02-10 | 2023-08-25 | 广州添利电子科技有限公司 | Two fluid etching spraying system |
| CN117535666A (en) * | 2023-11-22 | 2024-02-09 | 深圳市京中康科技有限公司 | Etching line tail gas recycling device and recycling process |
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2024
- 2024-04-09 CN CN202410420427.0A patent/CN118019232B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203834017U (en) * | 2013-12-13 | 2014-09-17 | 陶克（苏州）机械设备有限公司 | Gas circulating device |
| CN213447306U (en) * | 2019-08-21 | 2021-06-15 | 叶涛 | Liquid-free ammonia treatment device for circuit board alkaline etching solution |
| CN216123043U (en) * | 2021-09-07 | 2022-03-22 | 惠州美锐电子科技有限公司 | Etching two-fluid temperature adjusting system |
| CN219592725U (en) * | 2023-02-10 | 2023-08-25 | 广州添利电子科技有限公司 | Two fluid etching spraying system |
| CN117535666A (en) * | 2023-11-22 | 2024-02-09 | 深圳市京中康科技有限公司 | Etching line tail gas recycling device and recycling process |
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| CN118019232B (en) | 2024-06-21 |
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