CN219585304U - Chip taking and placing device and automatic burning equipment - Google Patents
Chip taking and placing device and automatic burning equipment Download PDFInfo
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- CN219585304U CN219585304U CN202320276586.9U CN202320276586U CN219585304U CN 219585304 U CN219585304 U CN 219585304U CN 202320276586 U CN202320276586 U CN 202320276586U CN 219585304 U CN219585304 U CN 219585304U
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- rotating motor
- chip
- motor
- assembly
- lifting assembly
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The utility model provides a chip taking and placing device and automatic burning equipment, which comprises a base, a lifting assembly, a rotating motor and an adsorption assembly for adsorbing chips, wherein the lifting assembly is arranged on the base; the lifting assembly is arranged on the base, the rotating motor is connected with the lifting assembly, so that the lifting assembly can be driven to move, the adsorption assembly is connected with the output end of the rotating motor, so that the lifting assembly can lift along with the rotating motor, and the lifting assembly is driven to rotate by the rotating motor. This device is got to chip utilizes lifting unit to drive rotating electrical machines and adsorption component and carries out elevating movement, utilizes the rotating electrical machines to drive the rotatory required angle of adsorption component, and the output and the adsorption component lug connection of rotating electrical machines have saved the transmission link in the middle, simple structure, and the regulation precision is higher.
Description
Technical Field
The utility model relates to the technical field of chip production equipment, in particular to a chip taking and placing device and automatic burning equipment.
Background
With the advancement of technology, various types of electronic products are becoming more popular, and thus, the demand for integrated circuit (Integrate Circuit, IC) chips in electronic products is increasing. Before the integrated circuit chip is disposed in the electronic product, a burning (burning) process is necessary. The burning process is to place the integrated circuit chip in a burner, and write the predefined program into the integrated circuit chip to make the integrated circuit chip have the function of controlling the components of the electronic product. In order to reduce the operation time of the integrated circuit chip programming, the current integrated circuit chip programming is generally completed by adopting automatic programming equipment, which can reduce the overall programming time of the integrated circuit chip and further improve the production speed of the integrated circuit chip.
In the burning process, the integrated circuit chip is taken from the material preparation area to the burner through a taking and placing device. When the integrated circuit chip is burnt, the pick-and-place device places the burnt integrated circuit chip into a next workstation, for example, places the burnt integrated circuit chip into a chip slot of an electronic product or a test unit through the pick-and-place device. Because of the directional restrictions of the placement of the integrated circuit chips in the chip pocket, it is often necessary to rotate the integrated circuit chips in order to properly place the integrated circuit chips in the chip pocket. At present, the scheme of rotary adsorption assembly often utilizes motor drive belt pulley assembly, and belt pulley assembly drives adsorption assembly rotation, but this kind of scheme structure is comparatively complicated, and has increased a transmission process when rotary adsorption assembly, therefore rotatory precision is lower, is difficult to reach the increasingly machining precision requirement.
Disclosure of Invention
The embodiment of the utility model provides a chip taking and placing device and automatic burning equipment, which are used for solving the problems that in the prior art, the structure of a chip taking and placing device for a rotary adsorption assembly is complex and the precision is low.
According to a first aspect, an embodiment of the present utility model provides a chip pick-and-place apparatus, including a base, a lifting assembly, a rotating motor, and an adsorption assembly for adsorbing a chip;
the lifting assembly is arranged on the base, the rotating motor is connected with the lifting assembly, so that the lifting assembly can move along the surface of the base under the driving of the lifting assembly, the adsorption assembly is connected with the output end of the rotating motor, so that the lifting assembly can move along with the rotating motor and rotate under the driving of the rotating motor.
As a further alternative of the chip taking and placing device, the rotating motor is configured as a dual-output shaft motor, the dual-output shaft motor includes a motor main body and an output shaft rotatably connected to the motor main body, the output shaft passes through the motor main body and exposes the first output end and the second output end, a through hole is formed in the output shaft, the adsorption component includes a suction nozzle portion for adsorbing the chip and a pipe portion connected between the suction nozzle portion and the external vacuumizing device, the suction nozzle portion is connected with the first output end, the pipe portion is connected with the second output end, and the suction nozzle portion is communicated with the pipe portion through the through hole.
As a further alternative of the chip picking and placing device, the rotating motor is set to be a stepping motor, the chip picking and placing device further comprises a change sensor, the change sensor is connected with the lifting assembly, so that the chip picking and placing device can synchronously lift with the rotating motor, and the change sensor is used for detecting whether the rotating motor is in a reference zero position or not.
As a further alternative of the chip picking and placing device, the change sensor is set as a correlation sensor, the correlation sensor includes a transmitter and a receiver, the receiver is capable of receiving an optical signal sent by the transmitter, a baffle is formed on an output end of the adsorption assembly or the rotating motor, and when the adsorption assembly is in a reference zero position, the baffle is blocked between the transmitter and the receiver.
As a further alternative scheme of the chip picking and placing device, the lifting assembly comprises a driving motor, a driving wheel, a driven wheel and a synchronous belt, wherein the output end of the driving motor is connected with the driving wheel, the synchronous belt is in tensioning connection between the driving wheel and the driven wheel and is used for transmitting rotation of the driving wheel to the driven wheel, and the rotating motor is connected with the synchronous belt so as to move along the surface of the base under the drive of the synchronous belt.
As a further alternative of the chip picking and placing device, the base includes a first surface and a second surface opposite to the first surface, the driving motor is disposed on the first surface, and the driving wheel, the driven wheel and the synchronous belt are disposed on the second surface.
As a further alternative of the chip picking and placing device, the chip picking and placing device further comprises a guiding assembly, wherein the guiding assembly comprises a sliding rail formed on the surface of the base and a sliding block slidingly connected with the sliding rail, and the sliding block is fixedly connected with the synchronous belt and the rotating motor respectively, so that the movement of the synchronous belt can be transmitted to the rotating motor.
As a further alternative scheme of the chip picking and placing device, the chip picking and placing device further comprises a vision module, wherein the vision module comprises a camera and a connecting support, the camera is used for identifying position and angle information of a chip, and the camera is connected with the base through the connecting support.
As a further alternative of the chip picking and placing device, a buffer structure is arranged between the output end of the rotating motor and the adsorption component, and the buffer structure is used for providing buffer when the adsorption component contacts with the chip.
According to a second aspect, an embodiment of the present utility model provides an automatic recording apparatus, which includes a chip pick-and-place device according to any one of the foregoing embodiments.
The implementation of the embodiment of the utility model has the following beneficial effects:
this device is got to chip utilizes lifting unit to drive rotating electrical machines and adsorption component and carries out elevating movement, utilizes the rotating electrical machines to drive the rotatory required angle of adsorption component, and the output and the adsorption component lug connection of rotating electrical machines have saved the transmission link in the middle, simple structure, and the regulation precision is higher.
Drawings
In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Wherein:
FIG. 1 is a schematic diagram of an overall structure of a chip pick-and-place apparatus according to an embodiment of the present utility model;
description of main reference numerals:
10-a base;
20-vision module, 21-camera, 22-connection bracket, 221-first connector, 222-second connector, 223-third connector;
30-lifting components, 31-driving motors, 32-driving wheels, 33-driven wheels and 34-synchronous belts;
40-a rotating motor, 41-a motor body, 42-an output shaft;
50-adsorption assembly, 51-suction port part, 52-pipeline part;
60-a change sensor;
70-guiding component, 71-slide rail and 72-slide block.
Detailed Description
In order that the utility model may be readily understood, a more complete description of the utility model will be rendered by reference to the appended drawings. Preferred embodiments of the present utility model are shown in the drawings. This utility model may, however, be embodied in many other different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used herein in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.
The embodiment of the utility model provides a chip taking and placing device which is used for solving the problems that in the prior art, the structure of a chip taking and placing device for a rotary adsorption assembly is complex and the precision is low.
In an embodiment of the present utility model, referring to fig. 1, the chip pick-and-place apparatus includes a base 10, a lifting assembly 30, a rotating motor 40, and an adsorption assembly 50 for adsorbing chips. The lifting assembly 30 is disposed on the base 10, the rotating motor 40 is connected with the lifting assembly 30, so as to move along the surface of the base 10 under the driving of the lifting assembly 30, and the adsorption assembly 50 is connected with the output end of the rotating motor 40, so as to move along with the rotating motor 40 and rotate under the driving of the rotating motor 40. It should be noted that, the lifting assembly 30, the rotating motor 40 and the adsorption assembly 50 may be correspondingly arranged in multiple groups, so as to implement picking, placing and rotating operations on multiple chips in one working process.
The chip taking and placing device drives the rotating motor 40 and the adsorption assembly 50 to do lifting motion by utilizing the lifting assembly 30, drives the adsorption assembly 50 to rotate by utilizing the rotating motor 40, and the output end of the rotating motor 40 is directly connected with the adsorption assembly 50, so that a transmission link in the middle is omitted, the structure is simple, and the adjustment precision is higher.
For connection between the rotary motor 40 and the adsorption assembly 50, a dual output shaft motor may be generally used to connect with the adsorption assembly 50 or a single output shaft motor may be used to connect with the adsorption assembly 50.
In one embodiment, the rotary electric machine 40 is configured as a dual-output shaft motor including a motor main body 41 and an output shaft 42 rotatably connected to the motor main body 41, the output shaft 42 passing through the motor main body 41 and exposing a first output end and a second output end, a through hole being formed in the output shaft 42, the suction assembly 50 including a suction nozzle portion 51 for sucking a chip and a pipe portion 52 connected between the suction nozzle portion 51 and an external vacuum device, the suction nozzle portion 51 being connected to the first output end, the pipe portion 52 being connected to the second output end, the suction nozzle portion 51 being in communication with the pipe portion 52 through the through hole in the output shaft 42. In this embodiment, the external evacuating device may evacuate the gas in the suction nozzle portion 51 through the pipe portion 52 and the output shaft 42, thereby providing the suction nozzle portion 51 with the capability of sucking chips.
The advantage of this embodiment is that the suction nozzle portion 51 and the duct portion 52 are connected to both ends of the output shaft 42, respectively, and the structure is compact.
In a specific embodiment, the suction nozzle 51 is sleeved outside the first output end, and the suction nozzle 51 is connected with the first output end by using a jackscrew.
In another embodiment, the rotary motor 40 is a single output shaft motor, and in this case, a connection port may be opened at a side surface of the suction nozzle portion 51, and the duct portion 52 connects the suction nozzle portion 51 to an external vacuum device through the connection port. However, in this embodiment, the pipe portion 52 may be limited by the rotating motor 40 or the base 10 during the rotation, thereby increasing difficulty in layout of the structure, and thus the scheme using the dual output shaft motor is a preferred scheme in practice.
For the selection of the rotary motor 40, generally, both types of stepping motor and servo motor can be employed.
In one embodiment, the rotating motor 40 is configured as a stepper motor, the chip pick-and-place device further includes a change sensor 60, and the change sensor 60 is connected to the lifting assembly 30, so as to be capable of lifting synchronously with the rotating motor 40, and the change sensor 60 is used for detecting whether the rotating motor 40 is in a reference zero position.
In this embodiment, the basis for controlling the rotation angle of the stepper motor is the reference zero position, and in the prior art, the technology of detecting the reference zero position of the stepper motor by using the change sensor 60 is well known, and commonly used sensors include position sensors such as a hall switch and a photoelectric sensor.
In one particular embodiment, the change sensor 60 is configured as a correlation sensor that includes a transmitter and a receiver that is capable of receiving an optical signal emitted by the transmitter, and a baffle is formed on the output of the suction assembly 50 or the rotating electric machine 40 that is shielded between the transmitter and the receiver when the suction assembly 50 is in the reference zero position. The baffle is used for blocking the light signal emitted by the transmitter from reaching the receiver, and the correlation sensor detects that the stepping motor is at a reference zero point.
The stepping motor has the advantages that the precision error of each step of the stepping motor is three to five percent, and the error of one step cannot be accumulated to the next step, so that the stepping motor has better position precision and motion repeatability, and the service life of the stepping motor is longer, and the stepping motor can reliably operate for a long time.
In another embodiment, the rotary motor 40 is configured as a servo motor, and the encoder in the servo motor has a zero magnetic pole position, so that the encoder is provided with a zero setting function, and therefore, a sensor is not required to be arranged for changing.
In one embodiment, the lifting assembly 30 includes a driving motor 31, a driving wheel 32, a driven wheel 33, and a synchronous belt 34, wherein an output end of the driving motor 31 is connected with the driving wheel 32, the synchronous belt 34 is in tensioning connection between the driving wheel 32 and the driven wheel 33, and is used for transmitting rotation of the driving wheel 32 to the driven wheel 33, and the rotating motor 40 is connected with the synchronous belt 34, so that the lifting assembly can move along the surface of the base 10 under the driving of the synchronous belt 34.
In a specific embodiment, the base 10 includes a first surface and a second surface opposite to the first surface, the driving motor 31 is disposed on the first surface, and the driving pulley 32, the driven pulley 33, and the timing belt 34 are disposed on the second surface.
In a specific embodiment, the chip picking and placing device further includes a guide assembly 70, where the guide assembly 70 includes a sliding rail 71 formed on a surface of the base 10 and a sliding block 72 slidably connected to the sliding rail 71, and the sliding block 72 is fixedly connected to the synchronous belt 34 and the rotating motor 40, respectively, so that the movement of the synchronous belt 34 can be transferred to the rotating motor 40.
The guide assembly 70 is provided for the purpose of making the movement of the rotary electric machine 40 smoother.
In one embodiment, the chip picking and placing device further includes a vision module 20, the vision module 20 includes a camera 21 and a connection bracket 22, the camera 21 is used for identifying position and angle information of the chip, and the camera 21 is connected with the base 10 through the connection bracket 22.
The purpose of the vision module 20 is that it can automatically recognize the position and angle information of the chip, thereby realizing the automatic control of the pick-and-place and rotation of the chip.
In a specific embodiment, the connection bracket 22 includes a first connection member 221, a second connection member 222, and a third connection member 223, where the first connection member 221 and the second connection member 222 are disposed on the surface of the base 10 at intervals, and the third connection member 223 is disposed between the first connection member 221 and the second connection member 222, and the camera 21 is connected to the third connection member 223, so that the setting position of the camera 21 is higher than the surface of the base 10.
In this embodiment, the camera 21 is positioned higher than the surface of the base 10, and blocking of the camera 21 by other structures on the base 10 can be avoided.
In one embodiment, a buffer structure is provided between the output of the rotary electric machine 40 and the suction assembly 50 for providing a buffer when the suction assembly 50 contacts the chip.
In a specific embodiment, the suction nozzle portion 51 of the suction assembly 50 includes a first tube body and a second tube body, the first tube body is disposed outside the second tube body, and the first tube body and the second tube body can slide relatively, the first tube body is connected with the output end of the rotating electrical machine 40, and a buffer structure formed by a spring is disposed between the second tube body and the output end of the rotating electrical machine 40. When the suction part 51 contacts the chip and is extruded with the chip, the spring can be stressed and compressed, and the second pipe body is retracted for a certain distance relative to the first pipe body, so that the chip is prevented from being crushed.
The embodiment of the utility model also provides an automatic burning device, which comprises the chip taking and placing device mentioned in any embodiment, and other components of the automatic burning device can be designed by adopting the prior art, and the details are not repeated here.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples illustrate only a few embodiments of the utility model, which are described in detail and are not to be construed as limiting the scope of the claims. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of protection of the present utility model is to be determined by the appended claims.
Claims (10)
1. The chip taking and placing device is characterized by comprising a base, a lifting assembly, a rotating motor and an adsorption assembly for adsorbing chips;
the lifting assembly is arranged on the base, the rotating motor is connected with the lifting assembly, so that the lifting assembly can be driven to move, the adsorption assembly is connected with the output end of the rotating motor, so that the adsorption assembly can move along with the rotating motor and rotate under the driving of the rotating motor.
2. The chip pick-and-place device according to claim 1, wherein the rotating motor is configured as a dual-output shaft motor, the dual-output shaft motor includes a motor body and an output shaft rotatably connected to the motor body, the output shaft penetrates through the motor body and exposes a first output end and a second output end, a through hole is formed in the output shaft, the adsorption assembly includes a suction nozzle portion for adsorbing the chip and a pipe portion connected between the suction nozzle portion and an external vacuum device, the suction nozzle portion is connected to the first output end, the pipe portion is connected to the second output end, and the suction nozzle portion is communicated with the pipe portion through the through hole.
3. The chip pick-and-place device according to claim 1 or 2, wherein the rotating motor is configured as a stepper motor, and the chip pick-and-place device further comprises a change sensor, wherein the change sensor is connected with the lifting assembly so as to be capable of lifting synchronously with the rotating motor, and the change sensor is used for detecting whether the rotating motor is at a reference zero position.
4. A chip pick-and-place device according to claim 3, wherein the change sensor is configured as a correlation sensor, the correlation sensor comprising a transmitter and a receiver, the receiver being capable of receiving an optical signal emitted by the transmitter, a baffle being formed on an output of the suction assembly or the rotating electrical machine, the baffle being shielded between the transmitter and the receiver when the suction assembly is in a reference zero position.
5. The chip picking and placing device according to claim 1, wherein the lifting assembly comprises a driving motor, a driving wheel, a driven wheel and a synchronous belt, the output end of the driving motor is connected with the driving wheel, the synchronous belt is connected between the driving wheel and the driven wheel in a tensioning manner and used for transmitting rotation of the driving wheel to the driven wheel, and the rotating motor is connected with the synchronous belt so as to be capable of moving along the surface of the base under the driving of the synchronous belt.
6. The chip pick-and-place device according to claim 5, wherein the base includes a first surface and a second surface opposite to the first surface, the driving motor is disposed on the first surface, and the driving wheel, the driven wheel, and the timing belt are disposed on the second surface.
7. The chip pick-and-place device according to claim 5, further comprising a guide assembly, wherein the guide assembly comprises a slide rail formed on the surface of the base and a slide block slidingly connected with the slide rail, and the slide block is fixedly connected with the synchronous belt and the rotating motor respectively, so that the movement of the synchronous belt can be transmitted to the rotating motor.
8. The chip pick-and-place device according to claim 1, further comprising a vision module, wherein the vision module comprises a camera and a connecting bracket, the camera is used for identifying position and angle information of a chip, and the camera is connected with the base through the connecting bracket.
9. The chip pick-and-place device according to claim 1, wherein a buffer structure is provided between the output end of the rotating motor and the adsorption assembly, the buffer structure being used for providing a buffer when the adsorption assembly contacts the chip.
10. An automatic burning apparatus comprising the chip pick-and-place device according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320276586.9U CN219585304U (en) | 2023-02-08 | 2023-02-08 | Chip taking and placing device and automatic burning equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320276586.9U CN219585304U (en) | 2023-02-08 | 2023-02-08 | Chip taking and placing device and automatic burning equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219585304U true CN219585304U (en) | 2023-08-25 |
Family
ID=87694539
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320276586.9U Active CN219585304U (en) | 2023-02-08 | 2023-02-08 | Chip taking and placing device and automatic burning equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219585304U (en) |
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2023
- 2023-02-08 CN CN202320276586.9U patent/CN219585304U/en active Active
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