CN219577764U - Adsorption component and chip mounter - Google Patents
Adsorption component and chip mounter Download PDFInfo
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- CN219577764U CN219577764U CN202320149627.8U CN202320149627U CN219577764U CN 219577764 U CN219577764 U CN 219577764U CN 202320149627 U CN202320149627 U CN 202320149627U CN 219577764 U CN219577764 U CN 219577764U
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- suction nozzle
- suction
- lifting mechanism
- adsorption
- pressure value
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The utility model provides an adsorption component and a chip mounter, wherein the adsorption component comprises a plurality of adsorption structures, and the adsorption structures are arranged at intervals; each adsorption structure comprises a suction nozzle, a lifting mechanism and a control mechanism; the control mechanism can compare the pressure values received by a plurality of suction nozzles, when the pressure value received by any one or a plurality of suction nozzles is smaller than the pressure value received by other suction nozzles, the position of the suction nozzle with the smaller received pressure value is provided with a low recess, the control mechanism can calculate the difference value of the pressure values according to the pressure value received by the suction nozzle and the pressure value received by other suction nozzles, and calculate the distance needed to be lowered by the lifting mechanism according to the difference value of the pressure values, and the control mechanism controls the distance needed to be lowered by the lifting mechanism corresponding to the suction nozzle to enable the suction nozzle to pressurize the low recess, so that the welding of the position point is in close contact, the blank welding is prevented from being generated, the encapsulation welding void rate is reduced, the encapsulation reliability, the product yield are improved, and the material scrapping cost is reduced.
Description
Technical Field
The utility model relates to the technical field of semiconductor packaging, in particular to an adsorption component and a chip mounter.
Background
The chip mounter is a device for accurately bonding a mounted component to a PCB bonding pad after sucking the material through a mobile suction nozzle.
The chip mounter comprises an air source, a suction nozzle, a heating platform and other components. The current suction nozzle is made of tungsten steel or ceramic, and the bottom surface of the suction nozzle is of a planar structure and is used for being contacted with the surface-mounted components so as to adsorb the surface-mounted components.
However, when the surface of the mounted component or a part of the area of the heating platform is concave, the suction nozzle is difficult to press against the concave, and the concave is empty-soldered, so that the heat dissipation of the PCB bonding pad is abnormal and then fails.
Disclosure of Invention
The utility model aims to provide an adsorption component so as to solve the technical problem that a chip mounter in the prior art is easy to empty weld.
The adsorption component provided by the utility model comprises a plurality of adsorption structures, wherein the adsorption structures are arranged at intervals;
each adsorption structure comprises a suction nozzle, a lifting mechanism and a control mechanism;
the suction nozzle is connected with the lifting mechanism, and the lifting mechanism can drive the suction nozzle to lift;
the control mechanism can acquire the pressure value received by the suction nozzle and adjust the lifting mechanism to lift according to the pressure value received by the suction nozzle.
Further, the suction nozzle is made of piezoelectric ceramics;
the control mechanism is connected with the suction nozzle, and the control mechanism can acquire the current value of the suction nozzle.
Further, the lifting mechanism comprises an electric telescopic rod.
Further, a plurality of the adsorption structures are distributed in a rectangular array shape.
Further, the adsorption structure further comprises a first telescopic mechanism and a second telescopic mechanism;
the first telescopic mechanism can be telescopic along a first direction, and the second telescopic mechanism can be telescopic along a second direction; the first direction is perpendicular to the second direction, and the first direction and the second direction are parallel to the horizontal direction;
one end of the lifting mechanism is connected with one end of the first telescopic mechanism, and the other end of the first telescopic mechanism is connected with one end of the second telescopic mechanism.
Further, the first telescopic mechanism and the second telescopic mechanism respectively comprise electric telescopic rods.
Further, the adsorption assembly further comprises a vacuum mechanism; the vacuum mechanism is connected with the suction nozzle.
Further, a through hole is formed in the suction nozzle and is connected with the vacuum mechanism.
Further, the outer contour of the suction nozzle is rectangular.
The utility model further aims at providing a chip mounter, which comprises the adsorption component provided by the utility model.
The adsorption component provided by the utility model comprises a plurality of adsorption structures, wherein the adsorption structures are arranged at intervals; each adsorption structure comprises a suction nozzle, a lifting mechanism and a control mechanism; the suction nozzle is connected with the lifting mechanism, and the lifting mechanism can drive the suction nozzle to lift; the control mechanism can acquire the pressure value received by the suction nozzle and adjust the lifting mechanism to lift according to the pressure value received by the suction nozzle. When the patch is welded, the plurality of suction nozzles adsorb different position points on the patch respectively, and the control mechanism can acquire the pressure value received by the suction nozzle on each position point, so that the contact force between the suction nozzle on different position points on the patch and the patch is acquired. The control mechanism can compare the pressure values received by the plurality of suction nozzles, when the pressure value received by any one or more suction nozzles is smaller than the pressure value received by other suction nozzles, the position of the suction nozzle with the smaller received pressure value is provided with a low recess, the control mechanism can calculate the difference value of the pressure values according to the pressure value received by the suction nozzle and the pressure value received by other suction nozzles, and calculate the distance needed to be lowered by the lifting mechanism according to the difference value of the pressure values, and the control mechanism controls the distance needed to be lowered by the lifting mechanism corresponding to the suction nozzle to be lowered, so that the suction nozzle pressurizes the low recess, thereby enabling the welding of the position point to be in close contact, preventing the occurrence of blank welding, improving the product qualification rate and reducing the cost; or alternatively; the control mechanism can compare the pressure value received by each suction nozzle with a pressure preset value, when the pressure value received by any one or more suction nozzles is smaller than the pressure preset value, the control mechanism can calculate the difference value of the pressure values according to the pressure value received by the suction nozzles and the pressure preset value, and calculate the distance that the lifting mechanism needs to descend according to the difference value of the pressure values, and the control mechanism controls the lifting mechanism corresponding to the suction nozzles to descend by the distance that the lifting mechanism needs to descend, so that the suction nozzles pressurize the position points, and the contact force between the suction nozzles and the patches on the position points reaches the pressure preset value, thereby ensuring that the welding of the position points is in close contact, preventing the generation of blank welding, reducing the welding void rate of the encapsulation, improving the encapsulation reliability, the product yield and reducing the material scrappage cost.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present utility model, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic view of an adsorption module according to an embodiment of the present utility model;
fig. 2 is a schematic structural diagram of a first telescopic mechanism and a second telescopic mechanism in an adsorption assembly according to an embodiment of the present utility model.
Icon: 1-a box body; 2-a lifting mechanism; 3-suction nozzle; 4-sticking; 5-a first telescopic mechanism; 6-a second telescopic mechanism.
Detailed Description
The following description of the embodiments of the present utility model will be made apparent and fully in view of the accompanying drawings, in which some, but not all embodiments of the utility model are shown. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
The utility model provides an adsorption component and a chip mounter, and a plurality of embodiments are provided below to describe the adsorption component and the chip mounter in detail.
Example 1
The adsorption component provided in this embodiment, as shown in fig. 1 to 2, includes a plurality of adsorption structures, and the plurality of adsorption structures are arranged at intervals; each adsorption structure comprises a suction nozzle 3, a lifting mechanism 2 and a control mechanism; the suction nozzle 3 is connected with the lifting mechanism 2, and the lifting mechanism 2 can drive the suction nozzle 3 to lift; the control mechanism can acquire the pressure value received by the suction nozzle 3 and adjust the lifting mechanism 2 to lift according to the pressure value received by the suction nozzle 3.
When the patch 4 is welded, the plurality of suction nozzles 3 adsorb different position points on the patch 4 respectively, and the control mechanism can acquire the pressure value received by the suction nozzle 3 on each position point, so as to acquire the contact force between the suction nozzle 3 and the patch 4 on different position points on the patch 4.
The control mechanism can compare the pressure values received by a plurality of suction nozzles 3, when the pressure value received by any one or a plurality of suction nozzles 3 is smaller than the pressure value received by other suction nozzles 3, the position of the suction nozzle 3 with the smaller received pressure value is provided with a low recess, the control mechanism can calculate the difference value of the pressure value according to the pressure value received by the suction nozzle 3 and the pressure value received by other suction nozzles 3, and calculate the distance needed to be lowered by the lifting mechanism 2 according to the difference value of the pressure value, and the control mechanism controls the distance needed to be lowered by the lifting mechanism 2 corresponding to the suction nozzle 3, so that the suction nozzle 3 pressurizes the low recess, thereby the welding of the position point is tightly contacted, the blank welding is prevented, the packaging welding void rate is reduced, the packaging reliability and the product yield are improved, and the material scrapping cost is reduced.
Or, the control mechanism can compare the pressure value received by each suction nozzle 3 with a pressure preset value, when the pressure value received by any one or more suction nozzles 3 is smaller than the pressure preset value, the control mechanism can calculate the difference value of the pressure values according to the pressure value received by the suction nozzles 3 and the pressure preset value, calculate the distance that the lifting mechanism 2 needs to descend according to the difference value of the pressure values, and control the lifting mechanism 2 corresponding to the suction nozzles 3 to descend by the distance that the lifting mechanism 2 needs to descend, so that the suction nozzles 3 pressurize the position point, and further the contact force between the suction nozzles 3 and the patches 4 at the position point reaches the pressure preset value, thereby welding close contact of the position point is prevented, the yield of products is improved, and the cost is reduced. The preset pressure value can be set according to the experience value of welding different patches 4.
In addition, when the size of the patch 4 is different, the number of required suction nozzles 3 can be calculated according to the size of the patch 4, the lifting mechanism 2 descends the required suction nozzles 3 to be adsorbed with the patch 4, and other unnecessary suction nozzles 3 are driven by the lifting mechanism 2 to ascend so as to be far away from the patch 4, so that the adsorption component is applicable to the patches 4 with different sizes, and the adsorption component with corresponding sizes is not required to be specially arranged for the patches 4 with each size, so that the cost can be saved.
The pressure value received by the suction nozzle 3 may be obtained by a pressure detector, for example, a pressure detector is provided on the lifting mechanism 2, the pressure value received by the suction nozzle 3 is the same as the pressure value received by the lifting mechanism 2, and the pressure value received by the suction nozzle 3 can be obtained by detecting the pressure value received by the lifting mechanism 2.
Preferably, the mouthpiece 3 is made of piezoelectric ceramics; the control mechanism is connected with the suction nozzle 3, and the control mechanism can acquire the current value of the suction nozzle 3.
Specifically, the suction nozzle 3 is made of piezoelectric ceramics, and the pressure to which the suction nozzle 3 is subjected can be fed back by detecting the current value of the suction nozzle 3 made of piezoelectric ceramics.
For example, when the solder is melted soon during the soldering of the chip 4, the control mechanism may compare the current values of the plurality of suction nozzles 3, and when the current value of any one or more suction nozzles 3 is smaller than the current value of the other suction nozzles 3, a recess exists in the position of the suction nozzle 3 with the smaller current value, the control mechanism may calculate the difference value of the current value according to the current value of the suction nozzle 3 and the current value of the other suction nozzle 3, and calculate the distance that the lifting mechanism 2 needs to descend according to the difference value of the current value, and the control mechanism controls the distance that the lifting mechanism 2 corresponding to the suction nozzle 3 descends and needs to descend, so that the suction nozzle 3 pressurizes the recess.
Or when the solder is melted when the patch 4 is welded, the control mechanism can compare the current value of each suction nozzle 3 with the current preset value, and when the current value of any one or more suction nozzles 3 is smaller than the current preset value, the control mechanism can calculate the difference value of the current values according to the current value of the suction nozzles 3 and the current preset value, and calculate the distance that the lifting mechanism 2 needs to descend according to the difference value of the current values, and the control mechanism controls the distance that the lifting mechanism 2 corresponding to the suction nozzle 3 descends and needs to descend, so that the suction nozzle 3 pressurizes the position point. The current preset value can be set according to experience values when welding different patches 4.
The lifting mechanism 2 may be an air cylinder, a hydraulic cylinder, or any suitable member such as an electric telescopic rod.
In this embodiment, the lifting mechanism 2 includes an electric telescopic rod, one end of which is fixedly connected with the suction nozzle 3, and the electric telescopic rod can drive the suction nozzle 3 to lift. The electric telescopic rod is connected with the control mechanism, and the control mechanism can control the electric telescopic rod to stretch and retract.
The adsorption structures are arranged at intervals, and the adsorption structures can be distributed in a circular array shape or in any suitable form such as rectangular array shape.
In this embodiment, the plurality of adsorption structures are distributed in a rectangular array.
Because the outline of many patches 4 is the rectangle, or is approximately the rectangle, consequently set up a plurality of adsorption structures to be rectangle array form distribution, can be convenient for a plurality of adsorption structures and the shape assorted of patch 4, the convenience of using is higher.
The adsorption assembly further comprises a fixed base. In one embodiment, the top end of each lifting mechanism 2 is connected to the fixed base, and the connection manner may be fixed connection or detachable connection, and the bottom end of each lifting mechanism 2 is connected to the suction nozzle 3, and the connection manner may be fixed connection or detachable connection.
In another embodiment, the adsorption structure further comprises a first telescopic mechanism 5 and a second telescopic mechanism 6; the first telescopic mechanism 5 can be telescopic along a first direction, and the second telescopic mechanism 6 can be telescopic along a second direction; the first direction is perpendicular to the second direction, and the first direction and the second direction are parallel to the horizontal direction; one end of the lifting mechanism 2 is connected with one end of the first telescopic mechanism 5, and the other end of the first telescopic mechanism 5 is connected with one end of the second telescopic mechanism 6.
The first direction is the direction indicated by arrow ab in fig. 1 and 2, and the second direction is the direction indicated by arrow cd in fig. 1.
Specifically, one end of the lifting mechanism 2 is fixedly connected with one end of the first telescopic mechanism 5, and the other end of the lifting mechanism 2 is fixedly connected with the suction nozzle 3; the other end of the first telescopic mechanism 5 is fixedly connected with one end of the second telescopic mechanism 6, and the other end of the second telescopic mechanism 6 is fixedly connected with the fixed base. The fixed base may be a bracket, may be in any suitable form such as a support plate. In this embodiment, the fixed base is a case 1 of a vacuum mechanism.
The first telescopic machanism 5 can drive suction nozzle 3 and remove along first direction, and the second telescopic machanism 6 can drive suction nozzle 3 and remove along the second direction, and it removes along first direction and second direction respectively to drive suction nozzle 3 through first telescopic machanism 5 and second telescopic machanism 6, can adjust the position of a plurality of suction nozzles 3 along first direction and second direction, makes a plurality of suction nozzles 3 can be applicable to not unidimensional paster 4, improves the suitability of adsorption component, reduce cost.
The first telescopic mechanism 5 may be an air cylinder, a hydraulic cylinder, or an electric telescopic rod.
The second telescopic mechanism 6 may be an air cylinder, a hydraulic cylinder, or an electric telescopic rod.
In the present embodiment, the first telescopic mechanism 5 and the second telescopic mechanism 6 each include an electric telescopic rod.
Further, the adsorption assembly further comprises a vacuum mechanism; the vacuum mechanism is connected with the suction nozzle 3.
Specifically, the vacuum mechanism comprises a box body 1, a vacuum generating device and an air pipe are arranged in the box body 1, one end of the air pipe is connected with the vacuum generating device, and the other end of the air pipe extends out of the box body 1 and is connected with a suction nozzle 3, so that the suction nozzle 3 is vacuumized, and the suction nozzle 3 can suck a patch 4. The air pipe is provided with a switch, when the patch 4 is required to be sucked, the suction nozzle 3 can suck the patch 4 by opening the switch.
In this embodiment, the case 1 is disposed above the suction nozzle 3, the lifting mechanism 2, the first telescopic mechanism 5 and the second telescopic mechanism 6, and one end of the second telescopic mechanism 6 is fixedly connected with the case 1.
The air pipe can be directly connected with the suction nozzle 3, and also can set the electric telescopic rod of the lifting mechanism 2 into a hollow structure, one end of the hollow structure of the electric telescopic rod is connected with the suction nozzle 3, and the other end of the hollow structure of the electric telescopic rod is connected with the air pipe, so that the number of the air pipes outside the box body 1 is reduced, and the air pipes are prevented from interfering the movement of the suction nozzle 3.
Further, a through hole is arranged on the suction nozzle 3, and the through hole is connected with a vacuum mechanism.
Specifically, the middle part of suction nozzle 3 is equipped with the through-hole, and tracheal one end is connected with vacuum generating device, and tracheal other end is connected with the through-hole, makes suction nozzle 3 can adsorb paster 4.
The suction nozzle 3 may be in any suitable form, such as a sheet, a block, or the like. The outer contour of the suction nozzle 3 may be circular or any suitable shape such as rectangular.
In this embodiment, the external contour of the suction nozzle 3 is rectangular, so that the suction nozzle can be well adapted to the rectangular patch 4. Wherein the length of the suction nozzle 3 can be 0.5mm-1mm, and the width of the suction nozzle 3 can be 0.5mm-1mm.
Example 2
The chip mounter provided by this embodiment includes the adsorption component provided by embodiment 1.
When the patch 4 is welded, the plurality of suction nozzles 3 adsorb different position points on the patch 4 respectively, and the control mechanism can acquire the pressure value received by the suction nozzle 3 on each position point, so as to acquire the contact force between the suction nozzle 3 and the patch 4 on different position points on the patch 4.
The control mechanism can compare the pressure values received by a plurality of suction nozzles 3, when the pressure value received by any one or a plurality of suction nozzles 3 is smaller than the pressure value received by other suction nozzles 3, the position of the suction nozzle 3 with the smaller received pressure value is provided with a low recess, the control mechanism can calculate the difference value of the pressure value according to the pressure value received by the suction nozzle 3 and the pressure value received by other suction nozzles 3, and calculate the distance needed to be lowered by the lifting mechanism 2 according to the difference value of the pressure value, and the control mechanism controls the distance needed to be lowered by the lifting mechanism 2 corresponding to the suction nozzle 3, so that the suction nozzle 3 pressurizes the low recess, the welding of the position point is in close contact, the blank welding is prevented, the product percent of pass is improved, and the cost is reduced.
Or, the control mechanism can compare the pressure value received by each suction nozzle 3 with a pressure preset value, when the pressure value received by any one or more suction nozzles 3 is smaller than the pressure preset value, the control mechanism can calculate the difference value of the pressure values according to the pressure value received by the suction nozzles 3 and the pressure preset value, calculate the distance that the lifting mechanism 2 needs to descend according to the difference value of the pressure values, and control the lifting mechanism 2 corresponding to the suction nozzles 3 to descend by the distance that the lifting mechanism 2 needs to descend, so that the suction nozzles 3 pressurize the position point, and further the contact force between the suction nozzles 3 and the patches 4 at the position point reaches the pressure preset value, thereby welding close contact of the position point is prevented, the yield of products is improved, and the cost is reduced. The preset pressure value can be set according to the experience value of welding different patches 4.
In addition, when the size of the patch 4 is different, the number of required suction nozzles 3 can be calculated according to the size of the patch 4, the lifting mechanism 2 descends the required suction nozzles 3 to be adsorbed with the patch 4, and other unnecessary suction nozzles 3 are driven by the lifting mechanism 2 to ascend so as to be far away from the patch 4, so that the adsorption component is suitable for the patches 4 with different sizes, and a corresponding adsorption component is not required to be specially arranged for the patches 4 with each size, so that the cost can be saved.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present utility model, and not for limiting the same; although the utility model has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the utility model.
Claims (10)
1. An adsorption assembly is characterized by comprising a plurality of adsorption structures, wherein the adsorption structures are arranged at intervals;
each adsorption structure comprises a suction nozzle, a lifting mechanism and a control mechanism;
the suction nozzle is connected with the lifting mechanism, and the lifting mechanism can drive the suction nozzle to lift;
the control mechanism can acquire the pressure value received by the suction nozzle and adjust the lifting mechanism to lift according to the pressure value received by the suction nozzle.
2. The suction assembly of claim 1, wherein the suction nozzle is made of piezoelectric ceramic;
the control mechanism is connected with the suction nozzle, and the control mechanism can acquire the current value of the suction nozzle.
3. The suction assembly of claim 1, wherein the lifting mechanism comprises an electric telescopic rod.
4. The adsorbent assembly of claim 1 wherein a plurality of said adsorbent structures are distributed in a rectangular array.
5. The adsorbent assembly of claim 1 wherein the adsorbent structure further comprises a first telescoping mechanism and a second telescoping mechanism;
the first telescopic mechanism can be telescopic along a first direction, and the second telescopic mechanism can be telescopic along a second direction; the first direction is perpendicular to the second direction, and the first direction and the second direction are parallel to the horizontal direction;
one end of the lifting mechanism is connected with one end of the first telescopic mechanism, and the other end of the first telescopic mechanism is connected with one end of the second telescopic mechanism.
6. The suction assembly of claim 5, wherein the first telescoping mechanism and the second telescoping mechanism each comprise an electric telescoping rod.
7. The adsorbent assembly of claim 1, further comprising a vacuum mechanism; the vacuum mechanism is connected with the suction nozzle.
8. The suction assembly of claim 7, wherein the suction nozzle is provided with a through hole, and wherein the through hole is connected to the vacuum mechanism.
9. The suction assembly of claim 1, wherein the suction nozzle has a rectangular outer contour.
10. A chip mounter comprising the adsorption assembly of any of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320149627.8U CN219577764U (en) | 2023-02-03 | 2023-02-03 | Adsorption component and chip mounter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320149627.8U CN219577764U (en) | 2023-02-03 | 2023-02-03 | Adsorption component and chip mounter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219577764U true CN219577764U (en) | 2023-08-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320149627.8U Active CN219577764U (en) | 2023-02-03 | 2023-02-03 | Adsorption component and chip mounter |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219577764U (en) |
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2023
- 2023-02-03 CN CN202320149627.8U patent/CN219577764U/en active Active
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