CN219577532U - Support plate and electronic equipment - Google Patents

Abstract

The application provides a supporting plate and electronic equipment, wherein the supporting plate comprises a main body and a first heat conduction member, the main body comprises a first supporting part, a second supporting part and a connecting part connected between the first supporting part and the second supporting part, and the connecting part is provided with a plurality of first through holes penetrating through the thickness direction of the connecting part. The first heat conduction piece is connected to at least one surface of the main body, the first heat conduction piece at least covers the connecting part, the thickness of the first heat conduction piece is smaller than that of the main body, and the heat conduction coefficient of the first heat conduction piece is larger than that of the main body. At least one surface of the main body is provided with the first heat conducting piece, so that heat transferred to the two supporting parts by the electronic equipment is mutually transferred through the connecting part and the first heat conducting piece, the heat transfer efficiency can be improved, and the main body is heated uniformly; and the first heat conduction piece has better heat conductivity, can make the heat conduct to two supporting parts fast through first heat conduction piece, make the heat that electronic equipment gives off evenly spread to whole backup pad fast, improve electronic equipment's radiating effect.

Description

Support plate and electronic equipment

Technical Field

The application relates to the field of terminal equipment, in particular to a supporting plate and electronic equipment.

Background

With the continuous development of intelligent terminal products, the traditional method of realizing product updating through hardware iterative upgrade has gradually developed to the bottleneck, and the use experience between new terminal products and old terminal products is little different, and with the gradual saturation of the intelligent terminal product market, the simple updating through hardware upgrade can not meet the demands of users. The appearance of the folding terminal equipment opens up a brand new use scene, improves the operability of the terminal, satisfies the pursuit of consumers for a large display screen, and is more popular with consumers, so the folding terminal is the main development direction of the next generation terminal equipment.

In the related art, main heating elements such as chips of the folding terminal equipment are often arranged on one side of the folding terminal, so that heat cannot be uniformly diffused, and the local temperature of the folding terminal is higher, so that the usability of the folding terminal and the use experience of a user are affected.

Disclosure of Invention

The utility model provides a supporting plate and electronic equipment, which are used for solving the problem of poor heat dissipation of the existing folding terminal equipment.

In a first aspect, the present utility model provides a support board for use in an electronic device, the electronic device comprising a flexible display screen, the support board for supporting the flexible display screen, the support board comprising:

The main body comprises a first supporting part, a second supporting part and a connecting part connected between the first supporting part and the second supporting part, wherein the connecting part is provided with a plurality of first through holes penetrating through the thickness direction of the connecting part so that the connecting part can be bent under stress; a kind of electronic device with high-pressure air-conditioning system

The first heat conduction piece is connected to at least one surface of the main body, the first heat conduction piece at least covers the connecting portion, the thickness of the first heat conduction piece is smaller than that of the main body, and the heat conduction coefficient of the first heat conduction piece is larger than that of the main body.

In a second aspect, the present application also provides a support board applied to an electronic device, the electronic device including a flexible display screen, the support board being for supporting the flexible display screen, the support board including:

the main body comprises a first supporting part, a second supporting part and a connecting part connected between the first supporting part and the second supporting part, wherein the connecting part is provided with a plurality of first through holes penetrating through the thickness direction of the connecting part so that the connecting part can be bent under stress; a kind of electronic device with high-pressure air-conditioning system

The second heat conduction piece is arranged in the first through hole, the second heat conduction piece is connected with the side wall of the first through hole formed by the connecting part, and the heat conduction coefficient of the second heat conduction piece is larger than that of the main body.

In a third aspect, the application also provides an electronic device comprising a flexible display screen and a support plate as described above, the support plate being connected to the flexible display screen.

According to the electronic equipment, the first heat conducting piece is arranged on at least one surface of the main body, and is connected with the main body and at least covers the connecting part of the first heat conducting piece, so that heat transferred from a heat source of the electronic equipment to the first supporting part or the second supporting part can be mutually transferred through the connecting part and can be mutually transferred through the first heat conducting piece, the heat transfer efficiency between the first supporting part and the second supporting part can be improved, and the main body can be heated uniformly; and the heat conductivity of the first heat conduction piece is higher than that of the main body, the first heat conduction piece has better heat conductivity, and the heat emitted by the heat source of the electronic equipment can be quickly conducted to the first supporting part and the second supporting part through the first heat conduction piece, so that the heat emitted by the heat source of the electronic equipment can be quickly and uniformly diffused to the whole supporting plate, the heat radiation effect of the electronic equipment can be improved, the use performance of the electronic equipment is prevented from being influenced due to the fact that the local temperature of the electronic equipment is too high, and the use experience of a user is improved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the description of the embodiments will be briefly described below. It is evident that the drawings in the following description are only some embodiments of the application and that other drawings may be obtained from these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a first schematic diagram of an electronic device according to an embodiment of the present application.

Fig. 2 is a schematic view of a first structure of a support plate according to an embodiment of the present application.

Fig. 3 is a schematic cross-sectional view of a main body of a support plate according to an embodiment of the present application.

Fig. 4 is a second structural schematic diagram of the support plate according to the embodiment of the present application.

Fig. 5 is a schematic view of a third structure of a support plate according to an embodiment of the present application.

Fig. 6 is a fourth structural schematic diagram of the support plate according to the embodiment of the present application.

Fig. 7 is a fifth structural schematic diagram of the support plate according to the embodiment of the present application.

Fig. 8 is a sixth structural schematic diagram of a support plate according to an embodiment of the present application.

Fig. 9 is a seventh structural schematic diagram of the support plate according to the embodiment of the present application.

Fig. 10 is a cross-sectional view of the support plate of fig. 9 taken along section A-A.

Fig. 11 is an eighth structural schematic view of a support plate according to an embodiment of the present application.

Fig. 12 is an assembly schematic of a support plate and flexible display screen connection according to an embodiment of the present application.

Fig. 13 is a schematic view of a manufacturing step of a support plate according to an embodiment of the application.

Fig. 14 is a ninth structural schematic view of a support plate according to an embodiment of the present application.

Fig. 15 is a schematic view showing a tenth structure of the support plate according to the embodiment of the present application.

Fig. 16 is a second schematic diagram of an electronic device according to an embodiment of the application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to fig. 1 to 16 in the embodiments of the present application. It will be apparent that the described embodiments are only some, but not all, embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to fall within the scope of the application.

In the related art, with the gradual saturation of the market of intelligent terminal products, the user's demands cannot be met through simple updating of hardware upgrade. The appearance of the folding terminal equipment opens up a brand new use scene, improves the operability of the terminal, meets the pursuit of consumers for a large display screen, and is increasingly favored by the consumers. The heat dissipation problem of the folding terminal equipment is a non-negligible important aspect in the developing process of the folding terminal, and the heat dissipation effect is an important factor affecting whether the folding terminal equipment has excellent use performance. For a folding terminal, as main heating elements such as chips are often arranged on one side of the folding terminal, heat cannot be uniformly diffused, so that the local temperature of the folding terminal is higher, and the usability of the folding terminal and the use experience of a user are affected.

In order to improve the heat dissipation problem of a folding terminal product, the embodiment of the application provides a supporting plate and electronic equipment.

The support plate is applied to the electronic device. Specifically, the electronic device may be an end product or device having a folding function, such as a folding screen mobile phone, a foldable tablet computer, a foldable electronic book, a notebook computer, or the like.

Referring to fig. 1, fig. 1 is a first schematic diagram of an electronic device according to an embodiment of the application. The electronic device 10 includes a flexible display screen 200, the flexible display screen 200 being used to display information such as images, text, and the like. The flexible display 200 has a certain flexibility, so that it can be folded in some use cases and unfolded in some use cases. For example, when a user needs to take in, the flexible display screen 200 may be folded; the flexible display screen 200 may be deployed when a user desires a large screen display.

The flexible display screen 200 may be a screen in which the entire area may be bent, or may be a screen in which a portion of the area may be bent. For example, when the electronic device 10 is a folding screen phone, the flexible display screen 200 may include a first region, a second region, and a third region connected in sequence, the first region and the third region being a rigid screen, and the second region being a flexible screen, such that the flexible display screen 200 is capable of bending at the second region.

In order to bend the flexible display screen 200 according to a bending state required by a design, the support plate 100 is used to be disposed at one side of the flexible display screen 200 of the electronic device 10 to support the flexible display screen 200.

Referring to fig. 2 and 3, fig. 2 is a first structural schematic diagram of a support plate according to an embodiment of the present application, and fig. 3 is a cross-sectional schematic diagram of a main body of the support plate according to an embodiment of the present application. In an embodiment of the present application, the support plate 100 includes a main body 110 and a first heat conductive member 120. The main body 110 includes a first supporting portion 111, a second supporting portion 112, and a connecting portion 113 connected between the first supporting portion 111 and the second supporting portion 112, wherein the connecting portion 113 is provided with a plurality of first through holes 110a penetrating through the thickness direction of the connecting portion 113, so that the connecting portion 113 can be bent under force. The first heat conducting member 120 is connected to at least one surface of the main body 110, the first heat conducting member 120 at least covers the connecting portion 113, the thickness of the first heat conducting member 120 is smaller than that of the main body 110, and the heat conductivity of the first heat conducting member 120 is larger than that of the main body 110.

The first supporting portion 111 and the second supporting portion 112 need to have sufficient rigidity and strength to better support the flexible display screen 200, so that the flexible display screen 200 cannot be bent in the area corresponding to the first supporting portion 111 and the second supporting portion 112 when the electronic device 10 is folded. And the connection portion 113 is provided with the first through hole 110a, so that the rigidity of the connection portion 113 is reduced, and the connection portion 113 has better flexibility and is easy to bend and deform, so that the region of the flexible display screen 200 corresponding to the connection portion 113 is bent, and the whole flexible display screen 200 is bent to be in a shape required by design.

Because the connecting portion 113 is provided with the first through hole 110a, the heat conduction area of the connecting portion 113 is reduced, so that the heat transfer efficiency between the first supporting portion 111 and the second supporting portion 112 is low, and the heat emitted from the heat source of the electronic device 10 to the main body 110 cannot be uniformly diffused, so that in the embodiment of the application, the first heat conducting member 120 is further arranged on at least one surface of the main body 110, and the first heat conducting member 120 is connected with the main body 110 and at least covers the connecting portion 113, so that the heat transferred from the heat source of the electronic device 10 to the first supporting portion 111 or the second supporting portion 112 can be mutually transferred through the connecting portion 113, and the heat transfer efficiency between the first supporting portion 111 and the second supporting portion 112 can be improved, and the main body 110 can be uniformly heated; and the heat conductivity of the first heat conducting element 120 is higher than that of the main body 110, that is, the first heat conducting element 120 has better heat conductivity, so that heat emitted by a heat source of the electronic device 10 can be rapidly conducted to the first supporting portion 111 and the second supporting portion 112 through the first heat conducting element 120, and thus, the heat emitted by the heat source of the electronic device 10 can be rapidly and uniformly diffused to the whole supporting plate 100, the heat dissipation effect of the electronic device 10 can be improved, the influence on the usability of the electronic device 10 due to the fact that the local temperature of the electronic device 10 is too high is prevented, and the use experience of a user is improved.

In addition, in the embodiment of the present application, the thickness of the first heat conducting member 120 is smaller than that of the main body 110, so that the first heat conducting member 120 has smaller rigidity, and the first heat conducting member 120 can be easily bent and deformed, so that the first heat conducting member 120 can be bent by being matched with the stress bending of the connecting portion 113, and the folding effect of the electronic device 10 is prevented from being affected.

In order to ensure that the first support portion 111 and the second support portion 112 have sufficient rigidity and strength to better support the flexible display screen 200, to achieve better effective control of the bending posture of the flexible display screen 200, the main body 110 may be of a stainless steel structure, a titanium structure or a carbon fiber structure. That is, the body 110 may be made of one of stainless steel, titanium, or carbon fiber.

It can be appreciated that the stainless steel, titanium, carbon fiber materials have high hardness and high rigidity, and can meet the support requirement of the flexible display screen 200.

Referring to fig. 4, fig. 4 is a second structural schematic diagram of the support plate according to the embodiment of the application. Optionally, the support plate 100 further includes a second heat conducting member 130, where the second heat conducting member 130 is disposed in the first through hole 110a, and the second heat conducting member 130 is connected to a side wall of the connecting portion 113 forming the first through hole 110 a.

It can be appreciated that the second heat conducting member 130 needs to have better heat conductivity, and the second heat conducting member is made of a flexible material, so that heat can be better conducted, and flexible deformation can be generated, so that the folding effect of the electronic device 10 is prevented from being affected due to the stress bending of the connecting portion 113.

In this way, by arranging the second heat conducting member 130 in the first through hole 110a, the heat transfer is realized by the cavity where the heat cannot be transferred at the first through hole 110a originally, and then, for the main body 110, the heat of the first supporting portion 111 can be transferred to the second supporting portion 112 through the connecting portion 113 and the second heat conducting member 130, so that the heat exchange between the first supporting portion 111 and the second supporting portion 112 is enhanced, and then, the heat transfer of the first heat conducting member 120 is matched, so that the heat emitted by the heat source of the electronic device 10 is more rapidly and uniformly diffused to the whole supporting plate 100, the uniform heat dissipation of the electronic device 10 is further promoted, and the heat dissipation effect of the electronic device 10 is improved.

Optionally, referring to fig. 5, fig. 5 is a schematic view of a third structure of a support plate according to an embodiment of the application. The first heat conductive member 120 is provided with a plurality of second through holes 120a penetrating through the thickness direction of the first heat conductive member 120, and the plurality of second through holes 120a are in one-to-one correspondence with the plurality of first through holes 110 a.

The plurality of second through holes 120a are in one-to-one correspondence with the plurality of first through holes 110a, which means that each second through hole 120a is communicated with one first through hole 110a, and each first through hole 110a is communicated with one second through hole 120 a.

It can be appreciated that by providing the second through-hole 120a penetrating the thickness direction of the first heat conductive member 120 in the first heat conductive member 120, the rigidity of the first heat conductive member 120 at the position corresponding to the connection portion 113 can be reduced, so that the first heat conductive member 120 is more likely to be bent and deformed at the position corresponding to the connection portion 113, and the second through-hole 120a can release the stress generated when the first heat conductive member 120 is bent and deformed, thereby preventing the first heat conductive member 120 from being broken.

Wherein, in order to make the portion where the first heat conductive member 120 and the main body 110 are connected integrally at the corresponding connection portion 113 more easily bendable, the profile shape of the second through hole 120a is the same as that of the first through hole 110a, and the size of the second through hole 120a is greater than or equal to that of the first through hole 110 a. In practical applications, the size of the second through hole 120a is equal to the size of the first through hole 110a in view of convenience of processing, cost control, and the like.

It will be appreciated that the body 110 is in the form of a thin plate to control the overall thickness of the folding screen phone. As shown in fig. 5, the main body 110 has opposite first and second faces 110b and 110c, the second face 110c being for connection with the flexible display screen 200.

It should be noted that the second surface 110c of the main body 110 may be connected to the flexible display screen 200, for example, the second surface 110c may be directly connected to the flexible display screen 200, for example, the second surface 110c may be adhered to the flexible display screen 200 by glue, or the second surface 110c may be indirectly connected to the flexible display screen 200 by another bedding layer, for example, a protective layer may be further disposed between the second surface 110c and the flexible display screen 200.

The first surface 110b is close to a heat source of the electronic device 10, and heat released from the heat source of the electronic device 10 is transferred to various portions of the main body 110 through the first surface 110 b.

Optionally, referring to fig. 6, fig. 6 is a schematic diagram of a fourth structure of a support plate according to an embodiment of the application. The first heat conductive member 120 may include a first sub heat conductive member 121, the first sub heat conductive member 121 being connected to and entirely covering the first surface 110b, the first sub heat conductive member 121 being provided with a plurality of first sub through holes 121a penetrating through a thickness direction of the first sub heat conductive member 121, the plurality of first sub through holes 121a being in one-to-one correspondence with the plurality of first through holes 110 a. Wherein the second through hole 120a includes a first sub-through hole 121a.

The first sub-heat-conducting member 121 is connected to the first surface 110b of the main body 110, and then the first sub-heat-conducting member 121 is close to the heat source of the electronic device 10, so that the heat released by the heat source of the electronic device 10 is firstly transferred to the first sub-heat-conducting member 121, and the heat can be quickly transferred to each part of the first sub-heat-conducting member 121 due to the better heat conductivity of the first sub-heat-conducting member 121, so that the first sub-heat-conducting member 121 is heated uniformly, and each part of the first sub-heat-conducting member 121 transfers the heat to the main body 110, so that the main body 110 is heated uniformly, thereby realizing uniform heat dissipation of the electronic device 10.

Optionally, please refer to fig. 7, fig. 7 is a fifth structural diagram of the support plate according to an embodiment of the present application. The first heat conductive member 120 may include a second sub heat conductive member 122, where the second sub heat conductive member 122 is connected to and completely covers the second surface 110c, and the second sub heat conductive member 122 is provided with a plurality of second sub through holes 122a penetrating through a thickness direction of the second sub heat conductive member 122, and the plurality of second sub through holes 122a are in one-to-one correspondence with the plurality of first through holes 110 a. Wherein the second via 120a includes a second sub-via 122a.

The second sub-heat-conducting member 122 is connected to the second surface 110c of the main body 110, and then the second sub-heat-conducting member 122 is close to the flexible display screen 200, so that heat released by the heat source of the electronic device 10 is firstly transferred to the main body 110 and transferred to the second sub-heat-conducting member 122 through the main body 110, and since the second sub-heat-conducting member 122 has better heat conductivity, the heat received by the second sub-heat-conducting member 122 can be transferred to each part of the second sub-heat-conducting member 122, so that the second sub-heat-conducting member 122 is heated uniformly, and each part of the second sub-heat-conducting member 122 transfers heat to the main body 110 again, so that the main body 110 is heated uniformly, thereby realizing uniform heat dissipation of the electronic device 10.

Alternatively, as shown in fig. 5, the first heat conductive member 120 may include a first sub heat conductive member 121 and a second sub heat conductive member 122, and the second through hole 120a includes a first sub through hole 121a and a second sub through hole 122a. Then, the heat released by the heat source of the electronic device 10 is firstly transferred to the first sub-heat-conducting member 121, the heat can be quickly transferred to each part of the first sub-heat-conducting member 121, so that the first sub-heat-conducting member 121 is heated uniformly, each part of the first sub-heat-conducting member 121 transfers the heat to the main body 110, so that the main body 110 is heated uniformly, the main body 110 can also transfer the heat to the second sub-heat-conducting member 122, the heat received by the second sub-heat-conducting member 122 can be transferred to each part of the main body, so that the second sub-heat-conducting member 122 is heated uniformly, and the heat received by the second sub-heat-conducting member 122 can also be reversely transferred to the main body 110, so that the whole of the connection of the main body 110 with the first sub-heat-conducting member 121 and the second sub-heat-conducting member 122 is heated uniformly, thereby realizing uniform heat dissipation of the electronic device 10.

The body 110 includes an outer surface. The outer surface of the main body 110, i.e., the surface of the main body 110 facing the outside, does not include the surface of the main body 110 where the first through hole 110a is formed. As shown in fig. 5, the body 110 has opposite first and second faces 110b (top and bottom faces) 110c and a plurality of fifth faces 110d (side faces) connected between the first and second faces 110b and 110c, and the body 110 is provided with a plurality of sixth faces 110e penetrating the first and second faces 110b and 110c, the plurality of sixth faces 110e enclosing a first through hole 110a. The outer surfaces herein refer to the first face 110b, the second face 110c, and all the fifth faces 110d.

Optionally, referring to fig. 8, fig. 8 is a schematic view of a sixth structure of a support plate according to an embodiment of the application. The first heat conductive member 120 entirely covers the outer surface.

Wherein the first heat conductive member 120 completely covers the outer surface, i.e., the first heat conductive member 120 covers the first face 110b, the second face 110c, and all the fifth faces 110d of the main body 110, the first heat conductive member 120 includes a first layer 1201 and a second layer 1202 located at opposite sides of the main body 110, and an intermediate layer 1203 located between the first layer 1201 and the second layer 1202. Then, the heat released from the heat source of the electronic device 10 is first transferred to the portion of the first layer 1201 near the heat source, and since the first heat conductive member 120 has better heat conductivity, the heat can be quickly transferred to each portion of the first layer 1201, and the first layer 1201 transfers the heat to the intermediate layer 1203 and through the intermediate layer 1203 to the second layer 1202, the heat transfer direction is as the arrow direction in fig. 12, so that the heat is transferred to the entire first heat conductive member 120, and the first heat conductive member 120 transfers the heat to the main body 110, so that the main body 110 is heated uniformly, thereby realizing uniform heat dissipation of the electronic device 10.

Alternatively, the first heat conductive member 120 may be a copper foil.

Wherein, the heat conductivity coefficient of copper is 401W/m.k, the heat conductivity coefficient of steel is 45W/m.k, the heat conductivity coefficient of titanium is 15.24W/m.k, the heat conductivity coefficient of carbon fiber is between 0.6 and 6.0W/m.k, and the heat conductivity coefficient of copper is far higher than that of stainless steel, titanium or carbon fiber, namely, copper has very high heat conductivity, so that the heat emitted by a heat source of the electronic equipment 10 can be rapidly transferred. Moreover, copper has good ductility, relatively low rigidity, and is easy to bend and deform, so that the folding requirement of the electronic device 10 can be met.

Specifically, the copper foil may be plated on the surface of the main body 110 through an electroplating process, so that the first heat conducting member 120 (copper foil) is fully contacted with the surface of the main body 110, and the adhesion between the first heat conducting member 120 (copper foil) and the main body 110 is enhanced, on one hand, heat exchange between the first heat conducting member 120 and the main body 110 can be fully performed, and the heat exchange efficiency is improved; on the other hand, compared with other connection methods, the portion of the first heat conducting member 120 corresponding to the connection portion 113 can be prevented from being layered with the main body 110 due to frequent bending, and the first heat conducting member 120 can be prevented from being easily separated from the main body 110.

Alternatively, referring to fig. 9 and 10, fig. 9 is a schematic view of a seventh structure of a support plate according to an embodiment of the present application, and fig. 10 is a cross-sectional view of the support plate along a section A-A in fig. 9. The support plate 100 further includes a second heat conductive member 130, the second heat conductive member 130 is disposed in the first through hole 110a and the second through hole 120a, and the second heat conductive member 130 is connected with the main body 110 and the first heat conductive member 120.

It can be appreciated that the second heat conducting member 130 has better heat conductivity, and can better conduct heat, and the second heat conducting member 130 is made of flexible material, and can be flexibly deformed to cooperate with the stress bending of the connecting portion 113, so as to avoid affecting the bending effect of the electronic device 10.

In this way, by arranging the second heat conducting member 130 in the first through hole 110a and the second through hole 120a, the heat transfer is realized by the cavity where the heat cannot be transferred at the first through hole 110a and the second through hole 120a, so that the heat of the first supporting portion 111 can be transferred to the second supporting portion 112 through the connecting portion 113, the second heat conducting member 130 and the first heat conducting member 120, the heat exchange between the first supporting portion 111 and the second supporting portion 112 is enhanced, the heat emitted by the heat source of the electronic device 10 is more uniformly diffused to the whole supporting plate 100, the uniform heat dissipation of the electronic device 10 is further promoted, and the heat dissipation effect of the electronic device 10 is improved.

Optionally, the second heat conductive member 130 includes a heat conductive silicone grease structure. Specifically, the second heat conductive member 130 may be a structure formed by filling the first and second through holes 110a and 120a with heat conductive silicone grease. The heat conduction silicone grease has good heat conductivity and certain heat transfer capacity, and in addition, the heat conduction silicone grease is in a grease state, is easy to flexibly deform, can be bent by being matched with the stress of the connecting part 113, and can meet the requirements of heat conduction and deformation.

Referring to fig. 11 and 12, fig. 11 is an eighth structural schematic diagram of a support plate according to an embodiment of the application, and fig. 12 is an assembly schematic diagram of a connection between the support plate and a flexible display screen according to an embodiment of the application. Since the heat conductive silicone grease is in a grease state, the support plate 100 further includes a first film layer 140 and a second film layer 150 in order to restrict the heat conductive silicone grease within the first through hole 110a and the second through hole 120 a. The first film layer 140 is disposed between the flexible display screen 200 and the first heat conducting member 120, and the first film layer 140 is connected to the first heat conducting member 120, and the first film layer 140 covers at least the connection portion 113 and the second heat conducting member 130. The second film layer 150 is connected to a side of the first heat conducting member 120 facing away from the first film layer 140, and the second film layer 150 covers at least the connection portion 113 and the second heat conducting member 130.

It can be appreciated that the first film 140 and the second film 150 are made of flexible materials, so as to bend and deform in cooperation with the bending of the connecting portion 113. The materials of the first film layer 140 and the second film layer 150 may be the same or different.

Referring to fig. 11 and 12 in combination, the first heat conductive member 120 has a third surface 120b and a fourth surface 120c opposite to each other, and the third surface 120b is located between the flexible display screen 200 and the fourth surface 120c. The first film layer 140 is disposed between the flexible display screen 200 and the first heat conductive member 120, and the first film layer 140 is connected to the first heat conductive member 120, i.e. the first film layer 140 is connected to the third surface 120b. The second film layer 150 is connected to a side of the first heat conducting member 120 facing away from the first film layer 140, i.e. the second film layer 150 is connected to the fourth surface 120c. In this way, the first film layer 140 and the second film layer 150 are respectively connected to two opposite surfaces of the first heat conductive member 120, and the first film layer 140 and the second film layer 150 close the cavity formed by the first through hole 110a and the second through hole 120 a.

Then, by providing the first film layer 140 and the second film layer 150, the thermal silicone grease is sealed in the first through hole 110a and the second through hole 120a, and leakage of the thermal silicone grease can be prevented; furthermore, the first and second film layers 140 and 150 isolate the heat conductive silicone grease from the outside, preventing external dust or particles from entering to affect the heat conductive effect. In addition, the first film layer 140 and the second film layer 150 may be bent in response to the connection portion 113 being forced to bend, and thus the first film layer 140 and the second film layer 150 may define the heat-conductive silicone grease to be flexibly deformed in a shape as required by design.

Optionally, the first film layer 140 completely covers the third face 120b.

It can be appreciated that, since the first film layer 140 is disposed between the flexible display screen 200 and the first heat conducting member 120, the first film layer 140 is further used for being connected with the flexible display screen 200, and the third surface 120b is completely covered by the first film layer 140, so that the surface of the whole support plate 100 facing one side of the flexible display screen 200 is flat, and then the support plate 100 is convenient to be connected with the flexible display screen 200, so that one side of the support plate 100 facing the flexible display screen 200 can be fully attached to the flexible display screen 200, and the bending of the flexible display screen 200 can be better matched.

As shown in fig. 12, the first film layer 140 includes a first connection layer 141 and a pad film layer 142 which are sequentially stacked and connected. The first connection layer 141 is used to connect the pad film layer 142 with the third surface 120b of the first heat conductive member 120, and the first connection layer 141 may be a pressure sensitive adhesive (Pressure Sensitive Adhesive, PSA). The pad film layer 142 may be a PI film (Polyimide), and the pad film layer 142 plays a role in isolation and padding, on one hand, the pad film layer can cooperate with the second film layer 150 to encapsulate the heat-conducting silicone grease in the first through hole 110a and the second through hole 120a, on the other hand, the first heat-conducting member 120 can be separated from the flexible display screen 200, and direct contact between the first heat-conducting member and the flexible display screen 200 is avoided, so that the flexible display screen 200 is protected.

It is understood that the first film layer 140 may further include a second connection layer 143, where the second connection layer 143 is connected to a side of the cushion film layer 142 facing away from the first connection layer 141, and the second connection layer 143 is used to connect the whole support plate 100 with the flexible display screen 200, and the second connection layer 143 may also be a pressure sensitive adhesive.

Optionally, the pad film layer 142 may be one of a thermally conductive graphite layer, a graphene layer, or a copper foil. The heat conduction graphite layer, the graphene layer and the copper foil have good heat conduction, and the cushion film layer 142 is made of the materials, so that the cushion film layer 142 also has certain heat conduction capacity, the uniform heat dissipation capacity of the support plate 100 is further enhanced, the uniform heat dissipation of the electronic equipment 10 is further promoted, and the heat dissipation effect of the electronic equipment 10 is improved.

Referring to fig. 13, fig. 13 is a schematic view illustrating a manufacturing step of a support plate according to an embodiment of the application. The specific manufacturing steps of the support plate 100 provided in the above embodiment include:

a: first, the first heat conductive member 120 (copper foil) is formed on the body 110 by electroplating using an electroplating process. As shown in the drawing, in this step, copper foil is plated on the entire outer surface of the body 110 so that the first heat conductive member 120 wraps the entire body 110.

b: the second through holes 120a are formed on the first heat conductive member 120 by etching to remove portions of the copper foil on both upper and lower surfaces of the middle region (i.e., the region of the connection portion 113) integrally formed with the body 110 by an etching process according to a shape required for design.

c: a portion of the body 110 located in the middle region is then etched away at a position corresponding to the second through hole 120a, and a first through hole 110a is formed in the body 110, the first through hole 110a communicating with the second through hole 120a.

d: the first film 140 is attached to one side of the body 110 integrally formed with the first heat conductive member 120.

e: the second heat conductive member 130 is formed by filling the first and second through holes 110a and 120a with a heat conductive silicone grease using a printing process or a printing process.

f: a second film layer 150 is attached to a side, which is formed by the main body 110 and the first heat conducting member 120 and is away from the first film layer 140, so as to seal the heat conducting silicone grease in the first through hole 110a and the second through hole 120a.

Referring to fig. 14, fig. 14 is a schematic diagram of a ninth structure of a support plate according to an embodiment of the application. In the present embodiment, the support plate 100 includes a main body 110 and a second heat conductive member 130. The main body 110 includes a first supporting portion 111, a second supporting portion 112, and a connecting portion 113 connected between the first supporting portion 111 and the second supporting portion 112, and the connecting portion 113 is provided with a plurality of first through holes 110a penetrating through the thickness direction of the connecting portion 113, so that the connecting portion 113 can be bent by force. The second heat conductive member 130 is disposed in the first through hole 110a, and the second heat conductive member 130 is connected to the side wall of the connecting portion 113 forming the first through hole 110a, and the heat conductivity of the second heat conductive member 130 is greater than that of the main body 110.

The first supporting portion 111 and the second supporting portion 112 need to have sufficient rigidity and strength to better support the flexible display screen 200, and when the electronic device 10 is folded, the flexible display screen 200 will not bend in the area corresponding to the first supporting portion 111 and the second supporting portion 112. And the connection portion 113 is provided with the first through hole 110a, so that the rigidity of the connection portion 113 is reduced, and the connection portion 113 has better flexibility and is easy to bend and deform, so that the area of the flexible display screen 200 corresponding to the connection portion 113 is bent, and the whole flexible display screen 200 is bent to be in a shape required by design.

Because the connecting portion 113 is provided with the first through hole 110a, the heat conduction area of the connecting portion 113 is reduced, and therefore the heat transfer efficiency between the first supporting portion 111 and the second supporting portion 112 is low, the heat emitted from the heat source of the electronic device 10 to the main body 110 cannot be uniformly diffused, so in this embodiment, the second heat conducting member 130 is disposed in the first through hole 110a, and the second heat conducting member 130 is connected with the side wall of the connecting portion 113 forming the first through hole 110a, so that the heat transfer is realized by the cavity where the heat cannot be transferred at the first through hole 110a, the heat transferred from the heat source of the electronic device 10 to the first supporting portion 111 or the heat transferred from the second supporting portion 112 can be mutually transferred through the second heat conducting member 130 and the connecting portion 113, the heat exchange between the first supporting portion 111 and the second supporting portion 112 is enhanced, the heat emitted from the heat source of the whole electronic device 10 is more uniformly diffused to the whole supporting plate 100, the uniform heat dissipation effect of the electronic device 10 is promoted, the use performance of the electronic device 10 is prevented from being influenced, and the use experience of the user is promoted.

Optionally, the second heat conductive member 130 includes a heat conductive silicone grease structure. Specifically, the second heat conductive member 130 is formed by filling the first through hole 110a with heat conductive silicone grease. The heat conduction silicone grease has good heat conductivity and certain heat transfer capacity, is in a grease state, is easy to flexibly deform, can be bent by being matched with the stress of the connecting part 113, and meets the requirements of heat conduction and deformation.

It will be appreciated that the body 110 is in the form of a thin plate to control the overall thickness of the folding screen phone. As shown in fig. 14, the main body 110 has opposite first and second faces 110b and 110c, the second face 110c being for connection with the flexible display screen 200.

It should be noted that the second surface 110c of the main body 110 may be connected to the flexible display screen 200, for example, the second surface 110c may be directly connected to the flexible display screen 200, for example, the second surface 110c may be adhered to the flexible display screen 200 by glue, or the second surface 110c may be indirectly connected to the flexible display screen 200 by another bedding layer, for example, a protective layer may be further disposed between the second surface 110c and the flexible display screen 200.

The first surface 110b is close to a heat source of the electronic device 10, and heat released from the heat source of the electronic device 10 is transferred to various portions of the main body 110 through the first surface 110 b.

Referring to fig. 15, fig. 15 is a schematic view of a tenth structure of a support plate according to an embodiment of the application. Since the heat conductive silicone grease is in a grease state, the support plate 100 further includes a first film layer 140 and a second film layer 150 in order to confine the heat conductive silicone grease within the first through hole 110 a. The first film layer 140 is disposed between the flexible display screen 200 and the main body 110, and the first film layer 140 is connected to the main body 110, and the first film layer 140 covers at least the connection portion 113 and the second heat conductive member 130. The second film layer 150 is connected to a side of the main body 110 facing away from the first film layer 140, and the second film layer 150 covers at least the connection portion 113 and the second heat conductive member 130.

It can be appreciated that the first film 140 and the second film 150 are made of flexible materials, so as to bend and deform in cooperation with the bending of the connecting portion 113. The materials of the first film layer 140 and the second film layer 150 may be the same or different.

The first film layer 140 is disposed between the flexible display 200 and the main body 110, and the first film layer 140 is connected to the main body 110, i.e. the first film layer 140 is connected to the second surface 110c. The second film layer 150 is connected to a side of the main body 110 facing away from the first film layer 140, i.e. the second film layer 150 is connected to the first surface 110b. In this way, the first film layer 140 and the second film layer 150 are respectively connected to two opposite sides of the main body 110, and the first film layer 140 and the second film layer 150 close the cavity formed by the first through hole 110 a.

Then, by providing the first and second film layers 140 and 150, the thermal silicone grease is sealed in the first through hole 110a, and leakage of the thermal silicone grease can be prevented, and the first and second film layers 140 and 150 isolate the thermal silicone grease from the outside, preventing external dust or particles from entering to affect the thermal conductive effect. In addition, the first film layer 140 and the second film layer 150 may be bent in response to the connection portion 113 being forced to bend, and thus the first film layer 140 and the second film layer 150 may define the heat-conductive silicone grease to be flexibly deformed in a shape as required by design.

Optionally, the first film layer 140 completely covers a side of the main body 110 facing the flexible display screen 200. I.e., the first film layer 140 completely covers the second face 110c.

It can be appreciated that, since the first film layer 140 is disposed between the flexible display screen 200 and the main body 110, the first film layer 140 is further used for being connected with the flexible display screen 200, and the second surface 110c is completely covered by the first film layer 140, so that the surface of the whole support plate 100 facing one side of the flexible display screen 200 is flat, and then the support plate 100 is convenient to be connected with the flexible display screen 200, so that the side of the support plate 100 facing the flexible display screen 200 can be fully attached to the flexible display screen 200, and the bending of the flexible display screen 200 can be better matched.

As shown in fig. 15, the first film layer 140 includes a first connection layer 141 and a pad film layer 142 which are sequentially stacked and connected. The first connection layer 141 is used to connect the pad film layer 142 with the third surface 120b of the first heat conductive member 120, and the first connection layer 141 may be a pressure sensitive adhesive (Pressure Sensitive Adhesive, PSA). The pad film layer 142 may be a PI film (Polyimide), and the pad film layer 142 plays a role in isolation and padding, on one hand, the pad film layer can cooperate with the second film layer 150 to encapsulate the heat-conducting silicone grease in the first through hole 110a and the second through hole 120a, on the other hand, the first heat-conducting member 120 can be separated from the flexible display screen 200, and direct contact between the first heat-conducting member and the flexible display screen 200 is avoided, so that the flexible display screen 200 is protected.

The first film layer 140 may further include a second connection layer (not shown) connected to a side of the pad film layer 142 facing away from the first connection layer 141, where the second connection layer is used to connect the whole support plate 100 with the flexible display screen 200, and the second connection layer may also be a pressure sensitive adhesive.

Optionally, the pad film layer 142 may be one of a thermally conductive graphite layer, a graphene layer, or a copper foil. The heat-conducting graphite, the graphene and the copper foil have good heat conductivity, and the cushion film layer 142 is made of the materials, so that the cushion film layer 142 also has certain heat conducting capacity, the uniform heat radiating capacity of the support plate 100 is further enhanced, the uniform heat radiation of the electronic equipment 10 is further promoted, and the heat radiating effect of the electronic equipment 10 is improved.

The embodiment of the application also provides the electronic equipment 10. In particular, the electronic device 10 may include an end product or device having a folding function, such as a folding screen cell phone, a foldable tablet computer, a foldable electronic book, a notebook computer, or the like.

Referring to fig. 1 and fig. 16 in combination, fig. 16 is a second schematic diagram of an electronic device according to an embodiment of the application. In an embodiment of the present application, the electronic device 10 includes a support plate 100, a flexible display 200, a housing 300, and the like. The support plate 100 is a support plate 100 based on the above design concept.

Wherein the flexible display screen 200 is disposed on the housing 300 to form a display surface of the electronic device 10 for displaying information such as images, text, and the like. The flexible display 200 has a certain flexibility, so that it can be folded in some use cases and unfolded in some use cases. For example, when a user needs to take in, the flexible display screen 200 may be folded; the flexible display screen 200 may be deployed when a user desires a large screen display. Wherein the flexible display screen 200 includes a first portion, a second portion, and a bent portion between the first portion and the second portion.

The housing 300 is used to form the exterior contour of the electronic device 10 so as to house the electronics, functional components, etc. of the electronic device 10 while providing a seal and protection for the electronics and functional components within the electronic device 10. For example, the motherboard, battery, sensor, etc. electronics and functional components of the electronic device 10 may all be disposed within the housing 300. It is understood that the housing 300 may include a middle frame 310 and a cover 320.

The middle frame 310 may have a thin plate-like or sheet-like structure, or may have a hollow frame structure. The center 310 is used to provide support for the electronics or functional components in the electronic device 10 to mount the electronics, functional components of the electronic device 10 together. The cover 320 is used to seal the electronic devices and functional components of the electronic device 10 inside the electronic device 10 together with the middle frame 310 and the flexible display screen 200, so as to protect the electronic devices and functional components of the electronic device 10.

Taking the electronic device 10 as an example of a folding screen mobile phone, the middle frame 310 may include a first middle frame 311 and a second middle frame 312, and the cover 320 may include a first cover 321 and a second cover 322. The first middle frame 311 may rotate relative to the second middle frame 312 such that at least a portion of the first middle frame 311 overlaps the second middle frame 312. The flexible display screen 200 is located on the same side of the first middle frame 311 and the second middle frame 312. The first support portion 111 of the support plate 100 is disposed and connected between the first middle frame 311 and the flexible display screen 200 (first portion), the second support portion 112 of the support plate 100 is disposed and connected between the second middle frame 312 and the flexible display screen 200 (second portion), the first cover 321 is disposed to cover the first middle frame 311, and the second cover 322 is disposed to cover the second middle frame 312. The flexible display screen 200 and the support plate 100 may move with the rotation of the first and second middle frames 311 and 312, and the support plate 100 serves to support the flexible display screen 200.

Illustratively, the first middle frame 311 and the second middle frame 312 may be connected by a rotation shaft 330 (hinge), such that the first middle frame 311 and the second middle frame 312 may rotate relative to each other by the rotation shaft 330, thereby implementing the folding function of the electronic device 10. Specifically, when the first middle frame 311 and the second middle frame 312 rotate with each other, the first support portion 111 and the second support portion 112 of the support plate 100 are driven to rotate relatively, so that the portion of the support plate 100 corresponding to the connection portion 113 is bent.

Accordingly, the support plate 100 is used for supporting the flexible display screen 200, the first support portion 111 drives the first portion of the flexible display screen 200 to move, the second support portion 112 drives the second portion of the flexible display screen 200 to move, and the bending portion of the flexible display screen 200 bends along with the bending of the support plate 100, so that the flexible display screen 200 is folded.

Specifically, the first support portion 111 and the second support portion 112 have sufficient rigidity and strength to support the flexible display screen 200 well, and when the electronic device 10 is folded, the flexible display screen 200 does not bend in the areas corresponding to the first support portion 111 and the second support portion 112. And the connection portion 113 is provided with the first through hole 110a, so that the rigidity of the connection portion 113 is reduced, and the connection portion 113 has better flexibility and is easy to bend and deform, so that the area of the flexible display screen 200 corresponding to the connection portion 113 is bent, and the whole flexible display screen 200 is bent to be in a shape required by design.

Because the support plate 100 adopts the support plate 100 based on the design concept, at least one surface of the main body 110 is provided with the first heat conducting piece 120, and the first heat conducting piece 120 is connected with the main body 110 and at least covers the connecting part 113, so that heat transferred from a heat source of the electronic device 10 to the first support part 111 or the second support part 112 can be mutually transferred through the connecting part 113, and also can be mutually transferred through the first heat conducting piece 120, the heat transfer efficiency between the first support part 111 and the second support part 112 can be improved, and the main body 110 can be heated uniformly; and the heat conductivity of the first heat conducting element 120 is higher than that of the main body 110, that is, the first heat conducting element 120 has better heat conductivity, so that heat emitted by a heat source of the electronic device 10 can be rapidly conducted to the first supporting portion 111 and the second supporting portion 112 through the first heat conducting element 120, and thus, the heat emitted by the heat source of the electronic device 10 can be rapidly and uniformly diffused to the whole supporting plate 100, the heat dissipation effect of the electronic device 10 can be improved, the influence on the usability of the electronic device 10 due to the fact that the local temperature of the electronic device 10 is too high is prevented, and the use experience of a user is improved.

In addition, the thickness of the first heat conducting member 120 is smaller than that of the main body 110, so that the first heat conducting member 120 has smaller rigidity, and can be easily bent and deformed, so that the first heat conducting member 120 can be bent by being matched with the connecting portion 113 to be bent, and the folding effect of the electronic device 10 is prevented from being affected.

In the description of the present application, it should be understood that terms such as "first," "second," and the like are used merely to distinguish between similar objects and should not be construed to indicate or imply relative importance or implying any particular order of magnitude of the technical features indicated.

The supporting plate and the electronic device provided by the embodiment of the application are described in detail. Specific examples are set forth herein to illustrate the principles and embodiments of the present application and are provided to aid in the understanding of the present application. Meanwhile, as those skilled in the art will have variations in the specific embodiments and application scope in light of the ideas of the present application, the present description should not be construed as limiting the present application.

Claims (16)

1. A support plate for use in an electronic device, the electronic device including a flexible display screen, the support plate for supporting the flexible display screen, the support plate comprising:

The main body comprises a first supporting part, a second supporting part and a connecting part connected between the first supporting part and the second supporting part, wherein the connecting part is provided with a plurality of first through holes penetrating through the thickness direction of the connecting part so that the connecting part can be bent under stress; a kind of electronic device with high-pressure air-conditioning system

The first heat conduction piece is connected to at least one surface of the main body, the first heat conduction piece at least covers the connecting portion, the thickness of the first heat conduction piece is smaller than that of the main body, and the heat conduction coefficient of the first heat conduction piece is larger than that of the main body.

2. The support plate according to claim 1, wherein the first heat conductive member is provided with a plurality of second through holes penetrating through a thickness direction of the first heat conductive member, the plurality of second through holes being in one-to-one correspondence with the plurality of first through holes.

3. The support plate of claim 2, wherein the body has opposed first and second faces, the second face for connection with the flexible display screen; the first heat conductive member includes:

the first sub heat-conducting piece is connected with and completely covers the first surface, a plurality of first sub through holes penetrating through the thickness direction of the first sub heat-conducting piece are formed in the first sub heat-conducting piece, the plurality of first sub through holes correspond to the plurality of first through holes one by one, and the second through holes comprise the first sub through holes; and/or

The second heat conduction piece is connected with and completely covers the second surface, the second heat conduction piece is provided with a plurality of second sub through holes penetrating through the thickness direction of the second heat conduction piece, the second sub through holes are in one-to-one correspondence with the first through holes, and the second through holes comprise the second sub through holes.

4. The support plate of claim 2, wherein the body includes an outer surface; the first heat conductive member entirely covers the outer surface.

5. The support plate of claim 4, further comprising a second thermally conductive member disposed within the first and second through holes, and wherein the second thermally conductive member is coupled to the body and the first thermally conductive member.

6. The support plate of claim 5, further comprising:

the first film layer is arranged between the flexible display screen and the first heat conduction piece and is connected with the first heat conduction piece, and the first film layer at least covers the connecting part and the second heat conduction piece;

and/or the number of the groups of groups,

the second film layer is connected to one side, away from the first film layer, of the first heat conducting piece, and the second film layer at least covers the connecting portion and the second heat conducting piece.

7. The support plate of claim 6, wherein the first thermally conductive member has opposed third and fourth faces, the third face being located between the flexible display screen and the fourth face;

the first film layer completely covers the third face.

8. The support plate of claim 5, wherein the second thermally conductive member comprises a thermally conductive silicone structure.

9. The support plate of claim 1, wherein the support plate further comprises:

the second heat conduction piece is arranged in the first through hole, and the second heat conduction piece is connected with the side wall of the first through hole formed by the connecting part.

10. The support plate of any one of claims 1 to 9, wherein the first thermally conductive member is copper foil.

11. The support plate according to any one of claims 1 to 9, wherein the body comprises a stainless steel structure, a titanium structure or a carbon fiber structure.

12. A support plate for use in an electronic device, the electronic device including a flexible display screen, the support plate for supporting the flexible display screen, the support plate comprising:

The main body comprises a first supporting part, a second supporting part and a connecting part connected between the first supporting part and the second supporting part, wherein the connecting part is provided with a plurality of first through holes penetrating through the thickness direction of the connecting part so that the connecting part can be bent under stress; a kind of electronic device with high-pressure air-conditioning system

The second heat conduction piece is arranged in the first through hole, the second heat conduction piece is connected with the side wall of the first through hole formed by the connecting part, and the heat conduction coefficient of the second heat conduction piece is larger than that of the main body.

13. The support plate of claim 12, wherein the second thermally conductive member comprises a thermally conductive silicone structure.

14. The support plate of claim 12, wherein the support plate further comprises:

the first film layer is arranged between the flexible display screen and the main body and is connected with the main body, and the first film layer at least covers the connecting part and the second heat conduction piece; a kind of electronic device with high-pressure air-conditioning system

The second membrane layer is connected to one side of the main body, which is away from the first membrane layer, and at least covers the connecting part and the second heat conducting piece.

15. The support plate of claim 14, wherein the first film layer completely covers a side of the body facing the flexible display screen.

16. An electronic device comprising a flexible display screen and a support plate according to any one of claims 1 to 15, the support plate being connected to the flexible display screen.