CN216772697U - Display module and display device - Google Patents

Abstract

Some embodiments of the present disclosure provide a display module and a display device, which relate to the field of flexible display and are used for improving the heat dissipation effect of the display device. The display module comprises a display panel, a driving chip, a supporting assembly, a heat dissipation layer and a heat conduction spacer. The display panel includes consecutive display portion, kink and binding portion. The driving chip is arranged on one side of the binding part far away from the display part and is electrically connected with the binding part. The support assembly is arranged on the backlight side of the display part. The heat dissipation layer is arranged on one side of the support component far away from the display part. A heat conductive spacer positioned between the binding part and the heat dissipation layer in a state where the binding part is bent to a backlight side of the display part; the orthographic projection of the heat conducting spacer on the heat dissipation layer is at least partially overlapped with the orthographic projection of the driving chip on the heat dissipation layer. The display module and the display device provided by some embodiments of the disclosure are applied to image display.

Description

Display module and display device

Technical Field

The utility model relates to a flexible display field especially relates to a display module assembly and display device.

Background

With the development of display technology, display devices (such as mobile phones, tablets, wearable bracelets or televisions, etc.) are widely used. The heat dissipation problem is an important problem that the display device faces all the time, if the heat dissipation effect of the display device is poor, the internal temperature of the display device is high, and the high-temperature environment affects the normal operation of each electronic element in the display device, so that the display effect of the display device is affected. In addition, the high temperature environment also affects the service life of each electronic element, and reduces the service life of the display device.

SUMMERY OF THE UTILITY MODEL

An object of some embodiments of the present disclosure is to provide a display module and a display device, for improving the heat dissipation efficiency of the display module, and further improving the service life of the display device.

In order to achieve the above purpose, some embodiments of the present disclosure provide the following technical solutions:

in one aspect, a display module is provided. The display module comprises a display panel, a driving chip, a supporting assembly, a heat dissipation layer and a heat conduction spacer. The display panel comprises a display part, a bending part and a binding part which are sequentially connected; the display part is provided with a light emitting side and a backlight side; the bending part can be bent so that the binding part is bent to the backlight side of the display part. The support assembly is disposed on a backlight side of the display portion. The heat dissipation layer is arranged on one side of the support component far away from the display part. The driving chip is arranged on one side of the binding part far away from the display part and is electrically connected with the binding part under the condition that the binding part is bent to the backlight side of the display part; the heat-conducting spacer is located between the binding portion and the heat dissipation layer, and an orthographic projection of the heat-conducting spacer on the heat dissipation layer at least partially overlaps with an orthographic projection of the driving chip on the heat dissipation layer.

In some embodiments, the orthographic projection of the driving chip on the heat dissipation layer is within the range of the orthographic projection of the heat-conducting spacer on the heat dissipation layer.

In some embodiments, the thermally conductive spacer comprises a first thermally conductive layer. The first heat conduction layer is arranged between the heat dissipation layer and the binding portion and is configured to connect the heat dissipation layer with the binding portion.

In some embodiments, the thermally conductive spacer further comprises a first heat sink and a second thermally conductive layer. The first heat dissipation sheet is arranged on one side, away from the heat dissipation layer, of the first heat conduction layer. The second heat conduction layer is disposed between the first heat dissipation sheet and the binding portion to connect the first heat dissipation sheet with the binding portion.

In some embodiments, the material used for the first heat conduction layer comprises at least one of heat conduction glue, heat conduction paste and heat conduction grease; and/or the material adopted by the second heat conduction layer comprises at least one of heat conduction glue, heat conduction paste and heat conduction grease.

In some embodiments, the display portion comprises a first sub-display portion and a second sub-display portion; the first sub-display part can be bent; the second sub-display part is located between the first sub-display part and the bending part and is connected with the bending part. The orthographic projection of the heat dissipation layer on the plane of the display part is located in the range of the second sub-display part.

In some embodiments, the heat dissipation layer comprises a second heat sink and a first adhesive layer. The second radiating fin is arranged on one side, far away from the display part, of the supporting component. The first adhesive layer is disposed between the second heat sink and the support assembly and configured to connect the second heat sink with the support assembly.

In some embodiments, the material used for the second heat sink includes at least one of copper, silver, gold, graphite, and boron nitride.

In some embodiments, the support assembly includes a first support and a second support. The first supporting piece is arranged on the backlight side of the display part, and the orthographic projection of the first supporting piece on the plane of the display part is overlapped with the display part. The second supporting piece is arranged on one side, far away from the display part, of the first supporting piece, and the orthographic projection of the second supporting piece on the plane where the display part is located is overlapped with the second sub-display part. And the orthographic projection of the heat dissipation layer on the plane of the second supporting piece is positioned in the range of the second supporting piece.

In some embodiments, in a case that the display portion, the bending portion, and the binding portion are located on the same plane, the display module further includes a spacer layer. The spacer layer is arranged on one side, away from the display panel, of the support assembly and the heat dissipation layer, and the surface, away from the display panel, of the spacer layer is parallel to the display panel.

In some embodiments, the spacer layer includes a first protective layer, a second protective layer, and a buffer layer. The first protective layer is arranged on one side of the first support piece far away from the display panel, and the orthographic projection of the first protective layer on the display panel covers the part of the first support piece exposed by the second support piece; the surface of the first protection layer far away from the display panel is flush with the surface of the second support far away from the display panel. The second protective layer is arranged on one side, far away from the display panel, of the first protective layer, and orthographic projection of the second protective layer on the display panel covers the first protective layer and the part, exposed by the heat dissipation layer, of the second supporting piece; the surface of the second protection layer, which is far away from the display panel, is flush with the surface of the heat dissipation layer, which is far away from the display panel. The buffer layer is arranged on one side, far away from the display panel, of the second protection layer and the heat dissipation layer and covers the second protection layer and the heat dissipation layer.

In some embodiments, the material used for the first protective layer and the second protective layer is a rigid material.

The display module assembly that this disclosed embodiment provided includes display panel. The display panel is provided with a bendable bending part, namely the display panel is a flexible display panel, and the display panel can be bent. This display panel includes consecutive display portion, kink and binding portion. The bending part is bent, the binding part is bent to the backlight side of the display part, the driving chip is arranged on one side of the binding part, which is far away from the display part, and the heat conduction spacer is arranged on one side of the binding part, which is close to the display part, namely the driving chip and the heat conduction spacer are respectively arranged on two opposite sides of the binding part. In this way, heat generated from the driving chip may be transferred to the thermal conductive spacer through the bonding portion of the display panel. Moreover, since the orthographic projection of the heat-conducting spacer on the heat dissipation layer is at least partially overlapped with the orthographic projection of the driving chip on the heat dissipation layer, the efficiency of transferring the heat generated by the driving chip to the heat-conducting spacer can be improved. Furthermore, the heat conducting spacer is connected with the heat dissipation layer, and heat transferred to the heat conducting spacer can be transferred to the heat dissipation layer and dissipated by the heat dissipation layer. Based on the process, the heat generated by the driving chip can be efficiently transmitted to the heat dissipation layer for heat dissipation, so that the heat dissipation efficiency of the driving chip is improved, and the heat dissipation effect of the display module is improved.

The display module provided by any of the above embodiments can be applied to a rollable display device (such as a ring watch and a sliding and rolling mobile phone). In the rollable display device, the display module comprises a display panel, a first support member and a second support member, wherein the first support member is used for supporting the display panel, and the second support member is used for defining a non-sliding rolling area. The non-sliding rolling area comprises a first supporting piece and a second supporting piece which are arranged in a stacked mode, the sliding rolling area only comprises the first supporting piece, namely the area, in the display module, of the first supporting piece and the second supporting piece is the non-sliding rolling area, and the area, in which the first supporting piece is arranged, of the display module is the sliding rolling area. There is a step difference between the first support and the second support, which step difference depends on the thickness of the second support layer. Based on this, the in-process of adopting the roller roll extrusion to increase adhesive force between each rete of display module, the regional this section difference of roller roll extrusion can produce great stress, and this stress can lead to the corresponding region of display panel to produce the membrane seal, influences the roughness on display panel surface, and then reduces the product yield of display module.

In order to solve the above problem, an embodiment of the present disclosure further provides an assembly method of a display module. The assembling method comprises the following steps: sequentially bonding a first supporting piece, a second supporting piece and a heat dissipation layer on the backlight side of the display panel; the display panel comprises a first sub-display part, a second sub-display part, a bending part and a binding part which are sequentially connected; an orthographic projection of the first support on the display panel overlaps with a display portion including the first display panel and the second display portion. An orthographic projection of the second support on the display panel overlaps with the second sub-display portion. The heat dissipation layer is arranged on one side of the second supporting piece far away from the display panel. Providing a first protective layer at an area of the first support exposed by the second support; wherein the first protection layer abuts against the second support near the side wall of the second support, and the surface of the first protection layer away from the display panel is flush with the surface of the second support away from the display panel. Arranging a second protective layer on one side of the first protective layer far away from the display panel and in the area of the second supporting piece exposed by the heat dissipation layer; the second protection layer is close to the side wall of the heat dissipation layer and is abutted against the heat dissipation layer, and the surface of the display panel far away from the second protection layer is flush with the surface of the display panel far away from the heat dissipation layer. And arranging buffer layers on one side of the second protective layer, which is far away from the display panel, and one side of the heat dissipation layer, which is far away from the display panel. And rolling the surface of one side of the buffer layer, which is far away from the display panel, by using a rolling shaft.

In some embodiments, after the rolling the surface of the buffer layer on the side away from the display part by using the roller, the assembling method further includes: and a heat conduction spacer is arranged on one side of the binding part, which is far away from the plane where the light-emitting side of the display part is located. Binding a driving chip on one side of the binding part away from the heat conduction spacer; wherein an orthographic projection of the driver chip on the binding portion at least partially overlaps an orthographic projection of the thermally conductive spacer on the binding portion. And removing the buffer layer, the second protective layer and the first protective layer in sequence. And bending the bending part, and connecting the binding part with the heat dissipation layer through the heat conduction spacer.

According to the assembling method of the display module, the first protective layer is bonded on the basis of the structure that the display panel is bonded with the first supporting piece and the second supporting piece, so that the step difference generated at the junction of the sliding rolling area and the non-sliding rolling area by the second supporting piece is eliminated. Furthermore, a heat dissipation layer is bonded on one side, far away from the display panel, of the second support member, and the orthographic projection of the heat dissipation layer on the plane where the second support member is located in the range of the second support member, namely, the coverage range of the heat dissipation layer is smaller than that of the second support member, so that a section difference exists between the heat dissipation layer and the second support member, and the section difference depends on the thickness of the heat dissipation layer. Therefore, after the first protective layer is bonded, the second protective layer is bonded to eliminate a step difference generated by a portion of the heat dissipation layer exposing the second supporting member and the first protective layer. Then, the buffer layer is bonded, and the buffer layer can provide a buffer effect for rolling of the rolling shaft, so that the rolling shaft is prevented from being in rigid contact with the second protective layer and the heat dissipation layer, and the adverse effect on the surface flatness of the display panel caused by poor surface flatness of the second protective layer and/or the heat dissipation layer is reduced.

In yet another aspect, a display device is provided. In the above embodiments, the display device includes the display module in the bent state, that is, the display module includes a display panel, a driving chip, a supporting structure, a heat dissipation layer, and a heat conductive spacer, and does not include a spacer layer.

The display device that this disclosed embodiment provided, owing to adopted the display module assembly in above-mentioned embodiment, can improve the radiating efficiency of display module assembly, and then reduce the inside temperature of display device, improve each electronic components's of display device operational environment, improve display device's life.

Drawings

The accompanying drawings, which are included to provide a further understanding of the embodiments of the disclosure and are incorporated in and constitute a part of this disclosure, illustrate embodiments of the disclosure and together with the description serve to explain the disclosure and not to limit the disclosure. In the drawings:

fig. 1A is a structural diagram of a display device according to an embodiment of the disclosure;

fig. 1B is a top view of a display device provided in an embodiment of the disclosure in a normal use state;

fig. 2 is a structural diagram of a display module according to an embodiment of the disclosure;

fig. 3 is a structural diagram of a display module provided in an unbent state according to an embodiment of the present disclosure;

FIG. 4 is a cross-sectional view of the display module shown in FIG. 2 along section line A-A;

FIG. 5 is another cross-sectional view of the display module shown in FIG. 2 along section line A-A;

FIG. 6 is another cross-sectional view of the display module shown in FIG. 2 along section line A-A;

fig. 7 is a structural diagram of another display module provided in the embodiment of the present disclosure in an unbent state;

fig. 8 is a step diagram of an assembly method of a display module according to an embodiment of the disclosure;

fig. 9 is a flowchart of an assembly method of a display module according to an embodiment of the disclosure.

Detailed Description

For the convenience of understanding, the technical solutions provided by some embodiments of the present disclosure are described in detail below with reference to the accompanying drawings. It is obvious that the described embodiments are only some, not all embodiments of the proposed solution. All other embodiments, which would be apparent to one skilled in the art based on some of the embodiments of the disclosure, are within the scope of the disclosure.

Unless the context requires otherwise, throughout the description and the claims, the term "comprise" and its other forms, such as the third person's singular form "comprising" and the present participle form "comprising" are to be interpreted in an open, inclusive sense, i.e. as "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "example", "specific example" or "some examples" and the like are intended to indicate that a particular feature, structure, material, or characteristic associated with the embodiment or example is included in at least one embodiment or example of the present disclosure. The schematic representations of the above terms are not necessarily referring to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be included in any suitable manner in any one or more embodiments or examples.

In the following, the terms "first", "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of the present disclosure, "a plurality" means two or more unless otherwise specified.

"at least one of A, B and C" has the same meaning as "A, B or at least one of C", both including the following combination of A, B and C: a alone, B alone, C alone, a and B in combination, a and C in combination, B and C in combination, and A, B and C in combination. "A and/or B" includes the following three combinations: a alone, B alone, and a combination of A and B.

Additionally, the use of "based on" means open and inclusive, as a process, step, calculation, or other action that is "based on" one or more stated conditions or values may in practice be based on additional conditions or values beyond those stated.

The use of "adapted to" or "configured to" herein is meant to be an open and inclusive language that does not exclude devices adapted to or configured to perform additional tasks or steps.

As used herein, "about," "approximately," or "approximately" includes the stated values as well as average values that are within an acceptable range of deviation for the particular value, as determined by one of ordinary skill in the art in view of the measurement in question and the error associated with measurement of the particular quantity (i.e., the limitations of the measurement system).

Example embodiments are described herein with reference to cross-sectional and/or plan views as idealized example figures. In the drawings, the thickness of layers and regions are exaggerated for clarity. Variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and/or tolerances, are to be expected. Thus, the exemplary embodiments should not be construed as limited to the shapes of regions illustrated herein but are to include deviations in shapes that result, for example, from manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Thus, the regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the actual shape of a region of a device and are not intended to limit the scope of exemplary embodiments.

It should be noted that, in the present disclosure, the embodiments and features of the embodiments may be combined with each other without conflict. The present disclosure will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.

As shown in fig. 1A and 1B, some embodiments of the present disclosure provide a display device 1000. The display apparatus 1000 is an apparatus or device for visually displaying electronic information. The display device 1000 may be any product or component with a display function, such as a smart phone, a tablet computer, a television, a display, a notebook computer, and other wearable electronic devices (e.g., a watch).

In some embodiments, the display device 1000 may be a flexible OLED display device, which may be applied to a folding screen display device and a roll-to-roll display device. Illustratively, as shown in fig. 1A and 1B, the flexible OLED display device is a roll-to-roll display device, which includes a roll-to-roll area 1001 and a non-roll-to-roll area 1002; the slider area 1001 may be bent or crimped; the non-slip roll region 1002 is not bendable.

The display device 1000 includes a display module 100, as shown in fig. 3, the display module 100 includes a display panel 1, a driving chip 11, a supporting member 101, a heat dissipation layer 102 and a thermal conductive spacer 103.

The display panel 1 includes a pixel driving circuit (not shown in the figures), which is coupled to the driving chip 11 and configured to transmit signals under the control of the driving chip 11, so that the display panel 1 performs image display. The display panel 1 included in the display module 100 is a flexible display panel. Exemplarily, as shown in fig. 3, in the case that the display panel 1 is a flexible display panel, the flexible display panel 1 includes a display portion 01, a bending portion 02, and a binding portion 03, which are connected in sequence. The display section 01 has a light exit side 001 and a backlight side 002, and the display section 01 is arranged to display an image. The bending portion 02 may be bent such that the binding portion 03 is bent to the backlight side 002 of the display portion 01. The binding part 03 binds the driver chip 11 at a side away from the display part 01.

It is understood that the driving chip 11 includes at least one of a source driving chip, a timing controller, a gamma circuit, and the like. The embodiment of the present disclosure does not limit the driving chip 11. In an example, the driving chip 11 is a source driving chip, and the driving chip 11 is disposed on the backlight side 002 of the display panel 1 to reduce the width of the peripheral area of the display panel 1, thereby achieving a narrow frame of the display device 1000.

In some embodiments, as shown in fig. 4, the display part 01 includes a first sub display part 011 and a second sub display part 012 connected in sequence. The first sub-display portion 011 is bendable. The second sub-display portion 012 is located between the first sub-display portion 011 and the bent portion 02, and is connected to the bent portion 02.

For example, the first sub-display portion 011 is rollable, and the second sub-display portion 012 is not rollable. That is, the first sub-display portion 011 corresponds to the scrolling area 1001 of the display module 100, and the second sub-display portion 012 corresponds to the non-scrolling area 1002 of the display module 100.

In some embodiments, as shown in fig. 3, the above-mentioned support assembly 101 is disposed on the backlight side 002 of the display panel 1, and is configured to support the flexible display panel 1.

In some examples, as shown in fig. 4, the support assembly 101 includes a first support 3 and a second support 5. The first support 3 is disposed on the backlight side 002 of the display portion 01, and an orthographic projection of the first support 3 on a plane where the display portion 01 is located overlaps the display portion 01, and is configured to support the display panel 1. The first supporting member 3 may be bonded to the display portion 01 by the second adhesive layer 2. The material of the second Adhesive layer 2 includes Optical Clear Adhesive (OCA) or Pressure Sensitive Adhesive (PSA). For example, the second adhesive layer 2 is made of OCA adhesive.

The second supporting member 5 is disposed on a side of the first supporting member 3 away from the display portion 01, and an orthographic projection of the second supporting member 5 on a plane where the display portion 01 is located overlaps with the second sub-display portion 012. The second supporting member 5 is bonded to the display portion 01 by a third adhesive layer 4. The material used for the third adhesive layer 4 includes OCA adhesive or PSA adhesive. Illustratively, the second supporting member 5 and the second sub-display part 012 have the same area and completely overlap. The third adhesive layer 4 is made of OCA adhesive.

The first support 3 and the second support 5 may be made of stainless steel. In the case of a thin thickness of stainless steel, the stainless steel has a certain flexibility. Illustratively, the first supporting member 3 covers the surface of the backlight side 002 of the display portion 01 in a whole layer, and provides a supporting function for the display panel 1. The thickness H1 of the first support 3 is approximately 0.1mm ± 0.05 mm. For example, the thickness H1 of the first support 3 is 0.1mm, so that the display panel 1 disposed on the first support 3 still has flexibility to ensure that the first sub-display portion 011 of the display portion 01 can be bent.

And, the second supporter 5 is provided on the backlight side 002 of the second sub-display part 012 of the display part 01, and the thickness H2 of the second supporter 5 is substantially 0.2mm ± 0.05 mm. For example, the thickness H2 of the second support 5 is 0.2 mm. In this way, the total thickness H1+ H2 of the first stay 3 and the second stay 5 provided on the backlight side 002 of the second sub-display unit 012 is 0.3mm, so that the second sub-display unit 012 of the display panel 1 cannot be bent.

In some embodiments, as shown in fig. 4 to 6, in a case where the bonding portion 03 is bent to the backlight side 002 of the display portion 01, the above-mentioned heat conductive spacer 103 is located between the bonding portion 03 and the second support 5, and the heat conductive spacer 103 is configured to connect the bonding portion 03 and the second support 5 to transfer heat generated from the driving chip 11 to the second support 5. In this way, in the case where the second support 5 is made of a stainless material, heat can be dissipated for the driving chip 11 through the second support 5.

Illustratively, as shown in fig. 3, the thermally conductive spacer 103 includes a first thermally conductive layer 6. The material adopted by the first heat conduction layer 6 comprises at least one of heat conduction glue, heat conduction paste and heat conduction grease. For example, the material used for the first heat conducting layer 6 includes a heat conducting glue. In this way, in the case where the binding portion 03 is bent to the backlight side 002 of the display portion 01, the binding portion 03 is connected to the second support 5 through the first heat conductive layer 6.

In some embodiments, as shown in fig. 5 and fig. 6, the heat dissipation layer 102 is disposed on a side of the supporting component 101 away from the display part 01, and an orthographic projection of the heat dissipation layer 102 on a plane of the display part 01 is located within the range of the second sub-display part 012.

It can be understood that, in a case where an orthogonal projection of the second support member 5 on the plane of the display part 01 overlaps the second sub-display part 012, that is, in a case where an area of the second support member 5 is equal to an area of the second sub-display part 012, an orthogonal projection of the heat dissipation layer 102 on the plane of the second support member 5 is located within the range of the second support member 5.

The area of the heat dissipation layer 102 is approximately 80% to 100% of the area of the second supporting member 5. For example, as shown in fig. 2, the area of the heat dissipation layer 102 is smaller than the area of the second support 5, and the area of the heat dissipation layer 102 is 80% of the area of the second support 5. Thus, a larger area of the heat dissipation layer 102 is beneficial to improve heat dissipation efficiency.

In addition, since the area of the heat dissipation layer 102 is 80% of the area of the second support 5, a small amount of space is left to facilitate the connection of the display panel 1 with other components in the display device 1000, for example, enough space is left to facilitate the clamping connection of the display panel 1 with a housing in the display device 1000; or frame sealing glue is arranged to fix other components on the display panel 1. In addition, the area of the heat dissipation layer 102 is also related to the size of the battery in the display device 1000, so as to dissipate the heat generated by the battery. Illustratively, the battery is in contact with the area of the heat spreading layer 102 exposed by the thermally conductive spacer 103, and the orthographic projection of the battery on the plane of the heat spreading layer 102 is located within the heat spreading layer 102.

In some embodiments, as shown in fig. 5, the heat dissipation layer 102 comprises the second heat sink 7 and the first adhesive layer 8. The second heat sink 7 is disposed on a side of the supporting component 101 away from the display part 01, and an orthogonal projection of the second heat sink 7 on a plane where the display part 01 is located within a range of the second sub-display part 012. The material used for the second heat sink 7 includes at least one of copper, silver, gold, graphite, and boron nitride. For example, the material used for the second heat sink 7 includes graphite. The heat dissipation coefficient of the graphite is high, which is beneficial to improving the heat dissipation efficiency of the driving chip 11.

The first adhesive layer 8 is disposed between the second heat sink 7 and the supporting member 101, and configured to connect the second heat sink 7 and the supporting member 101. The material used for the first adhesive layer 8 includes Pressure Sensitive Adhesive (PSA) or optical adhesive (OCA). For example, the first adhesive layer 8 is made of PSA adhesive.

In some embodiments, as shown in fig. 5 and 6, in the case where the bonding portion 03 is bent to the backlight side 002 of the display portion 01, the heat conductive spacer 103 is located between the bonding portion 03 and the heat dissipation layer 102, and an orthogonal projection of the heat conductive spacer 103 on the heat dissipation layer 102 at least partially overlaps an orthogonal projection of the driving chip 11 on the heat dissipation layer 102. The thermal conductive spacer 103 is configured to connect the bonding portion 03 with the heat dissipation layer 102 to transfer heat generated from the driving chip 11 located on the bonding portion 03 to the heat dissipation layer 102 and dissipate the heat from the heat dissipation layer 102. Moreover, at least a portion of the heat on the heat dissipation layer 102 is also transferred to the supporting component 101 (e.g., the second supporting component 5) and dissipated by the supporting component 101, so that the display module 100 dissipates heat through the heat dissipation layer 102 and the supporting component 101 together, which is beneficial to improving the heat dissipation efficiency.

Illustratively, as shown in fig. 2 and 5, the orthographic projection of the driver chip 11 on the heat dissipation layer 102 is located within the range of the orthographic projection of the thermal conductive spacer 103 on the heat dissipation layer 102, so as to transfer almost all of the heat generated by the driver chip 11 to the heat dissipation layer 102, thereby improving the heat dissipation efficiency of the driver chip 11.

In some examples, as shown in fig. 5, the thermally conductive spacer 103 includes a first thermally conductive layer 6. In the case where the binding portion 03 is bent to the backlight side 002 of the display portion 01, the first heat conduction layer 6 is provided between the second heat sink 7 and the binding portion 03 and is configured to connect the second heat sink 7 and the binding portion 03.

In other examples, as shown in fig. 6, the thermally conductive spacer 103 includes a first thermally conductive layer 6, a first heat sink 9, and a second thermally conductive layer 10. In the case where the bonding portion 03 is bent to the backlight side 002 of the display portion 01, the first heat sink 9 is disposed on the side of the first heat conductive layer 6 away from the second heat sink 7. The material used for the first heat sink 9 includes at least one of copper, silver, gold, and boron nitride. For example, the material used for the first heat sink 9 includes copper. The copper has higher heat conductivity coefficient, which is beneficial to improving the heat conduction efficiency.

In a case where the binding portion 03 is bent to the backlight side 002 of the display portion 01, the second heat conductive layer 10 is disposed between the second heat sink 9 and the binding portion 03 to connect the first heat sink 9 and the binding portion 03. The material used for the second heat conduction layer 10 includes at least one of heat conduction glue, heat conduction paste and heat conduction grease. For example, the material used for the second heat conducting layer 10 includes a heat conducting glue.

The material of the first heat sink 9 includes copper. Copper's compactness is higher, is difficult for taking place splitting or layering problem under the stress effect to, through coating the viscose in the both sides of copper to fix binding portion 03 in the side 002 in a poor light of display part 01, be favorable to stably bonding binding portion 03 in the side 002 in a poor light of display part 01, prevent to appear warping or the problem of layering in first fin 9 department.

The number of layers of the thermal conductive spacer 103 is related to the degree of bending of the bent portion 02 of the display panel 1. For example, as shown in fig. 6, the diameter D of the bending curved surface of the bending portion 02 is 6mm, and the thickness of the thermal conductive spacer 103 is set based on the total thickness of the supporting member 101 and the heat dissipation layer 102, so as to ensure that the total thickness of the supporting member 101, the heat dissipation layer 102, and the thermal conductive spacer 103 stacked in the thickness direction of the display portion 01 is approximately 6 mm.

In addition, when the thickness of the heat conductive spacer 103 to be provided is small, for example, as shown in fig. 5, the thickness of the heat conductive spacer 103 is in the range of 0.08mm to 0.1mm, and only one first heat conductive layer 6 may be provided. When the thickness of the thermal conductive spacer 103 to be disposed is relatively thick, for example, as shown in fig. 6, the thickness of the thermal conductive spacer 103 is in the range of 0.1mm to 0.15mm, a multi-layer stacked structure of the first thermal conductive layer 6, the first heat dissipation sheet 9, and the second thermal conductive layer 10 may be disposed, wherein the first heat dissipation sheet 9 is added, so that the support stability of the thermal conductive spacer 103 can be improved on the basis of realizing the thermal conductive effect.

In some embodiments, as shown in fig. 7, in a case that the display portion 01, the bending portion 02 and the binding portion 03 are located on the same plane, the display module 100 further includes a spacer layer 104. The spacer layer 104 is disposed on a side of the supporting member 101 and the heat dissipation layer 102 away from the display panel 1, and a surface of the spacer layer 104 away from the display panel 1 is parallel to the display panel 1.

Illustratively, as shown in fig. 7, the spacer layer 104 includes a first protective layer 12, a second protective layer 13, and a buffer layer 14, which are sequentially stacked. The first protection layer 12 is disposed on a side of the first support 2 away from the display panel 1, and an orthographic projection of the first support 2 on the display panel 1 covers a portion of the first support 2 exposed by the second support 5. And the surface of the first protection layer 12 far away from the display panel 1 is flush with the surface of the second support 5 far away from the display panel 1, so as to level up the level difference H2 generated at the side wall of the second support 5 far away from the bending part 02.

The second passivation layer 13 is disposed on a side of the first passivation layer 2 away from the display panel 1, and an orthographic projection on the display panel 1 covers the first passivation layer 12 and a portion of the second supporting member 5 exposed by the heat dissipation layer 102. The surface of the second protection layer 13 away from the display panel 1 is flush with the surface of the heat dissipation layer 102 away from the display panel 1. Based on the structure of the first protection layer 12, the second protection layer 13 fills up the level difference H3 generated at the side wall of the heat dissipation layer 102 away from the bending portion 02.

The buffer layer 14 is disposed on a side of the second passivation layer 12 and the heat dissipation layer 102 away from the display panel 1, and covers the second passivation layer 12 and the heat dissipation layer 102. The buffer layer 14 is made of an elastic material to provide a buffering effect, so that rigid contact between the roller and the second protection layer 12 and the heat dissipation layer 102 is avoided in a subsequent process of rolling the buffer layer 14 by using the roller, and adverse effects on the surface flatness of the display panel 1 due to poor surface flatness of the second protection layer 12 and/or the heat dissipation layer 102 are reduced. As an example, the cushioning layer 14 is made of foam.

The materials used for the first protective layer 12 and the second protective layer 13 are rigid materials to provide a supporting function for the buffer layer 14. Exemplary rigid materials include thermoplastic polyesters, such as pet (polyethylene terephthalate) plastic or pbt (polybutylene terephthalate) plastic. Thus, in the subsequent process of rolling the buffer layer 14 by using the roller, the rigid first protective layer 12 and the rigid second protective layer 13 can play a supporting role, so that the roller can smoothly roll from the first sub-display part 011 to the second sub-display part 012, thereby solving the problem that the corresponding area of the display panel 1 generates a film print under the action of extrusion force due to the areas where the roller extrusion section differences H1 and H2 are located, and the flatness of the surface of the display panel 1 is affected, and further improving the flatness of the display panel 1 and the product yield of the display module 100.

It is to be explained that the spacer layer 104 needs to be removed before the bonding portion 03 of the display panel 1 is bent to the backlight side 002 of the display portion 01. The spacer layer 104 is configured to protect the surface flatness of the display panel 1 and improve the yield of the display module. After the spacer layer 104 is removed, the bonding portion 03 of the display panel 1 is bent to the backlight side 002 of the display portion 01, and the heat generated by the driving chip 11 is transferred to the heat dissipation layer 102 through the heat conductive spacer 103 to dissipate the heat.

The embodiment of the present disclosure further provides an assembling method of a display module, which is used for assembling the display module 100 provided in any of the above embodiments. As shown in FIGS. 8 to 9, the assembling method includes S10 to S80.

S10, bonding the first support member 3, the second support member 5 and the heat dissipation layer 102 in sequence on the backlight side of the display panel 1. The display panel 1 includes a display portion 01, a bending portion 02, and a binding portion 03, which are connected in sequence. The display portion 01 includes a first sub-display portion 011 and a second sub-display portion 012; the second sub-display portion 012 is located between the first sub-display portion 011 and the bent portion 02, and is connected to the bent portion 02.

The S10 includes S11-S12.

S11, as shown in fig. 8 (a), the supporting member 101 is provided on the backlight side of the display section 01. As shown in fig. 6, the support assembly 101 includes a first support 3 and a second support 5. Wherein S11 includes S111-S114.

S111, a second adhesive layer 2 is formed by applying an adhesive to the backlight side 002 of the display section 01.

S112, adhering the first supporting member 3 to the side of the second adhesive layer 2 away from the display portion 01, so as to fix the first supporting member 3 on the backlight side 002 of the display portion 01. The orthographic projection of the first support member 3 on the display panel 1 is overlapped with the display part 01, and provides a support function for the display part 01.

S113, coating adhesive on a side of the first supporting member 3 away from the display portion 01 to form a third adhesive layer 4.

S114, adhering the second supporting member 5 to a side of the third adhesive layer 4 away from the first supporting member 3, so as to fix the second supporting member 5 to a side of the first supporting member 3 away from the display portion 01. An orthogonal projection of the second support 5 on the display panel 1 overlaps the second sub-display part 012. In this way, the second supporting member 5 is only disposed on the backlight side 002 of the second sub-display portion 012, and the first supporting member 3 and the second supporting member 5 cooperate to provide a rigid supporting function for the second sub-display portion 012, so as to subsequently adhere and bind the portion 03 to the backlight side 002 of the second sub-display portion 012.

S12, as shown in (b) of fig. 8, the heat dissipation layer 102 is disposed on a side of the second support 5 away from the display panel 1. The heat dissipation layer 102 includes a second heat sink 7 and a first adhesive layer 8. Wherein S12 includes S121-S122.

And S121, coating adhesive on one side, away from the display panel 1, of the second supporting piece 5 to form a first adhesive layer 8.

And S122, adhering a second cooling fin 7 on the side, away from the support assembly 101, of the first adhesive layer 8. The orthographic projection of the second heat sink 7 on the display panel 1 is located within the orthographic projection range of the second support 5 on the display panel 1.

The area of the second heat sink 7 is related to the area of the second supporting member 5 and the area of the battery in the display device 1000, so as to ensure good heat dissipation effect of the display panel 1.

S20, as shown in (c) of fig. 8, the first protective layer 12 is provided in the region of the first support 3 exposed by the second support 5. Wherein, the sidewall of the first protection layer 12 close to the second support 5 abuts against the second support 5, and the surface of the first protection layer 12 far from the display panel 1 is flush with the surface of the second support 5 far from the display panel 1. Thus, based on the thickness H2 of the second support 5, the first protection layer 12 fills up the step H2 generated at the side wall of the second support 5 away from the bending portion 02. Wherein the thickness of the second adhesive layer 4 is negligible.

S30, as shown in fig. 8 (c), the second protective layer 13 is provided on the side of the first protective layer 12 away from the display panel 1 and in the region of the second support 5 exposed by the heat dissipation layer 102. The sidewall of the second protection layer 13 close to the heat dissipation layer 102 abuts against the heat dissipation layer 102, and the surface of the second protection layer 13 away from the display panel 1 is flush with the surface of the heat dissipation layer 102 away from the display panel 1. Thus, based on the thickness H3 of the heat dissipation layer 102, the second protection layer 13 fills up the level difference H3 generated at the side wall of the heat dissipation layer 102 away from the bending portion 02. Wherein the thickness of the first adhesive layer 8 is negligible.

S40, as shown in fig. 8 (c), the buffer layer 14 is provided on the side of the second protective layer 13 away from the display panel 1 and on the side of the heat dissipation layer 102 away from the display panel 1. The buffer layer 14 has elasticity and provides a buffer function for subsequent processes.

S50, as shown in fig. 8 (c), rolling the surface of the buffer layer 14 away from the display panel 1 by using a roller 15 to firmly adhere the display panel 1, the supporting member 101 and the heat dissipation layer 102, which are stacked and covered by the buffer layer 14, to each other. Moreover, based on the leveling effect of the first protective layer 12 and the second protective layer 13 on the step differences H2 and H3, the stress of the roller 15 rolling the buffer layer 14 corresponding to the step difference area is reduced, and the flatness of the display panel 1 is improved.

S60, as shown in FIG. 8 (d), a heat conducting spacer 103 is disposed on one side of the binding portion 03 away from the plane where the light-emitting side 001 of the display portion 01 is located, including S61-S63.

S61, coating an adhesive on the side of the bonding portion 03 away from the plane of the light exit side 001 of the display portion 01 to form the first heat conducting layer 6.

S62, the first heat sink 9 is bonded to the first heat conduction layer 6 on the side away from the binding portion 03.

S63, coating adhesive on the side of the first heat sink 9 away from the binding portion 03 to form the second heat conductive layer 10. A release film is attached to one side of the second heat conduction layer 10 away from the first heat dissipation sheet 9. The release film protects the second heat conducting layer 10 from environmental pollution.

S70, as shown in fig. 8 (e), the driver chip 11 is bonded to the side of the bonding portion 03 away from the thermal conductive spacer 103. Wherein, the orthographic projection of the driving chip 11 on the binding portion 03 at least partially overlaps with the orthographic projection of the heat-conducting spacer 103 on the binding portion 03. Illustratively, the orthographic projection of the driver chip 11 on the bonding portion 03 is within the range of the orthographic projection of the heat-conducting spacer 103 on the bonding portion 03.

It is understood that the driving chip 11 is coupled to the pixel driving circuit in the display panel 1 for signal transmission to realize image display. The driving chip 11 includes at least one of a source driving chip, a timing controller, a gamma circuit, and other micro chips. For example, the orthographic projection of all the microchips on the bonding portion 03 is located within the range of the orthographic projection of the heat-conducting spacer 103 on the bonding portion 03, so that the heat generated by all the microchips is transferred to the heat-conducting spacer 103, and the heat-conducting efficiency is improved.

S80, as shown in fig. 8 (f), the buffer layer 14, the second protective layer 13, and the first protective layer 12 are removed in this order. And, remove the release liner on the second heat conduction layer 10. Then, the bent portion 02 is bent, and the bonding portion 03 and the heat dissipation layer 102 are connected by the heat conductive spacer 103. Wherein, the second heat conduction layer 10 is bonded with the second heat sink 7. In this way, the heat generated by all the microchips is transferred to the second heat sink 7 through the thermal conductive spacer 103, thereby improving the thermal conductivity.

It should be noted that, the order of the steps of the assembly method provided in the foregoing embodiments may be adaptively adjusted according to actual situations, and the disclosure does not limit this.

Based on this, as shown in fig. 7, in the assembling method of the display module 100 according to the embodiment of the present disclosure, the first protective layer 12 is bonded on the structure that the first supporting member 3 and the second supporting member 5 are bonded on the backlight side 002 of the display panel 1, so as to eliminate the step H2 generated at the boundary between the first sub-display portion 011 and the second sub-display portion 012 by the second supporting member 5. Further, the heat dissipation layer 102 is adhered to the side of the second support 5 away from the display panel 1, and the heat dissipation layer 102 is located within the range of the second support 5 due to the orthographic projection of the heat dissipation layer 102 on the plane of the second support 5, that is, the coverage range of the heat dissipation layer 102 is smaller than that of the second support 5, so that a step H3 exists between the heat dissipation layer 102 and the second support 5, and the step H3 depends on the thickness of the heat dissipation layer 102. Therefore, after the first protective layer 12 is bonded, the second protective layer 13 is bonded to eliminate a step H3 generated by the heat dissipation layer 102 exposing the second supporter 5 and a portion of the first protective layer 12. Then, the buffer layer 14 is adhered, and the buffer layer 14 can provide a buffer effect for rolling a roller, so that the roller is prevented from being in rigid contact with the second protection layer 13 and the heat dissipation layer 102, and adverse effects on the surface flatness of the display panel 1 due to poor surface flatness of the second protection layer 13 and/or the heat dissipation layer 102 are reduced.

The above description is only for the specific embodiments of the present disclosure, but the scope of the present disclosure is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present disclosure, and all the changes or substitutions should be covered within the scope of the present disclosure. Therefore, the protection scope of the present disclosure should be subject to the protection scope of the claims.

Claims (13)

1. A display module, comprising:

the display panel comprises a display part, a bending part and a binding part which are sequentially connected; the display part is provided with a light-emitting side and a backlight side; the bending part can be bent so that the binding part is bent to the backlight side of the display part;

the driving chip is arranged on one side of the binding part, which is far away from the display part, and is electrically connected with the binding part;

a support assembly disposed at a backlight side of the display part;

the heat dissipation layer is arranged on one side of the support assembly, which is far away from the display part;

a heat conductive spacer positioned between the binding portion and the heat dissipation layer in a state where the binding portion is bent to a backlight side of the display portion; the orthographic projection of the heat conducting spacer on the heat dissipation layer is at least partially overlapped with the orthographic projection of the driving chip on the heat dissipation layer.

2. The display module of claim 1, wherein an orthographic projection of the driving chip on the heat dissipation layer is within a range of the orthographic projection of the thermal conductive spacer on the heat dissipation layer.

3. The display module of claim 1, wherein the thermally conductive spacer comprises:

a first thermally conductive layer disposed between the heat dissipation layer and the binding portion, configured to connect the heat dissipation layer with the binding portion.

4. The display module of claim 3, wherein the thermally conductive spacer further comprises:

the first heat radiating fin is arranged on one side, away from the heat radiating layer, of the first heat conducting layer;

a second heat conductive layer disposed between the first heat sink and the binding portion to connect the first heat sink with the binding portion.

5. The display module of claim 4,

the first heat conduction layer is made of heat conduction glue, heat conduction paste or heat conduction grease; and/or the presence of a gas in the gas,

the second heat conduction layer is made of heat conduction glue, heat conduction paste or heat conduction grease.

6. The display module according to any one of claims 1 to 5, wherein the display part comprises a first sub-display part and a second sub-display part; the first sub-display part can be bent; the second sub-display part is positioned between the first sub-display part and the bending part and is connected with the bending part;

the orthographic projection of the heat dissipation layer on the plane of the display part is located in the range of the second sub-display part.

7. The display module according to claim 6, wherein the heat dissipation layer comprises:

the second radiating fin is arranged on one side, far away from the display part, of the supporting component;

a first adhesive layer disposed between the second heat sink and the support component configured to connect the second heat sink with the support component.

8. The display module of claim 7,

the second heat sink is made of copper, silver, gold, graphite or boron nitride.

9. The display module of claim 6, wherein the support assembly comprises:

the first supporting piece is arranged on the backlight side of the display part, and the orthographic projection of the first supporting piece on the plane of the display part is overlapped with the display part;

the second support piece is arranged on one side, far away from the display part, of the first support piece, and the orthographic projection of the second support piece on the plane where the display part is located is overlapped with the second sub-display part;

and the orthographic projection of the heat dissipation layer on the plane of the second supporting piece is positioned in the range of the second supporting piece.

10. The display module according to claim 9, wherein when the display portion, the bending portion, and the binding portion are located on a same plane, the display module further comprises:

the spacer layer is arranged on one side, away from the display panel, of the support assembly and the heat dissipation layer, and the surface, away from the display panel, of the spacer layer is parallel to the display panel.

11. The display module of claim 10, wherein the spacer layer comprises:

the first protective layer is arranged on one side of the first support piece far away from the display panel, and the orthographic projection of the first protective layer on the display panel covers the part of the first support piece exposed by the second support piece; the surface of the first protection layer far away from the display panel is flush with the surface of the second support far away from the display panel;

the second protective layer is arranged on one side, away from the display panel, of the first protective layer, and orthographic projection of the second protective layer on the display panel covers the first protective layer and the part, exposed by the heat dissipation layer, of the second supporting piece; the surface of the second protective layer far away from the display panel is flush with the surface of the heat dissipation layer far away from the display panel;

the buffer layer is arranged on one side, far away from the display panel, of the second protection layer and the heat dissipation layer and covers the second protection layer and the heat dissipation layer.

12. The display module of claim 11, wherein the first protective layer and the second protective layer are made of rigid materials.

13. A display device, comprising the display module according to any one of claims 1 to 12.

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