KR102168236B1 - Display module and display device having the same - Google Patents

Abstract

The display device includes a heat dissipation member disposed on a lower surface of the display panel, a first circuit board overlapping the pad of the display panel and electrically connected to the pad, and being mounted on the first circuit board overlapping the heat dissipation member, And a driving chip disposed between the first circuit board and the heat dissipating member, and an adhesive member coupling the first circuit board and the heat dissipating member. The adhesive member defines an inner region in which the driving chip is disposed on a plane, and a passage region connecting the inner region and an outer space of the adhesive member.

Description

Display module and display device including the same {DISPLAY MODULE AND DISPLAY DEVICE HAVING THE SAME}

The present invention relates to a display module and a display device including the same.

Electronic devices such as smart phones, tablets, notebook computers, and smart televisions are being developed. These electronic devices include a display device to provide information. Electronic devices further include various electronic modules in addition to the display device.

Electronic devices are manufactured by assembling display devices and electronic modules. At this time, the electronic modules are organically arranged using the external case and bracket of the electronic device. The display device includes a display panel and electronic components coupled to the display panel.

Accordingly, an object of the present invention is to provide a display module having improved heat dissipation characteristics.

Another object of the present invention is to provide a display device including the display module.

A display device according to an embodiment of the present invention includes a window member and a display module disposed on a lower surface of the window member. The display module includes a display panel, a lower member, a radiating member, a first circuit board, a driving chip, and a first adhesive member. The display panel includes a display substrate including a base layer, a pixel disposed on the base layer, a signal line disposed on the base layer, and a pad connected to the signal line. The lower member may be disposed on a lower surface of the display panel, the heat dissipating member may be disposed on a lower surface of the lower member, and a thermal conductivity may be 200 W/mK or more. The first circuit board may overlap the pad and are electrically connected to the pad, and may overlap the heat dissipating member. The driving chip may be mounted on the first circuit board and disposed between the first circuit board and the heat dissipating member. The adhesive member couples the first circuit board and the heat dissipation member. The adhesive member may define an inner region in which the driving chip is disposed on a plane, and a passage region connecting the inner region and an outer space of the adhesive member.

The lower member may include at least one of a light blocking member and an elastic member.

The first circuit board includes a first portion overlapping the pad, a second portion extending from the first portion, a second portion having a curvature, and extending from the second portion, overlapping the lower member, and the driving chip It may include a mounted third part.

The adhesive member may include a plurality of stacked layers, and at least one of the plurality of layers may not be disposed in the passage area. The at least one layer may be an adhesive layer.

The heat dissipation member may include a metal layer.

A second circuit board including a first pad electrically connected to the first circuit board and a second pad overlapping the metal layer and electrically connected to the metal layer may be further included.

An input sensing unit disposed between the window member and the display panel and including a sensor electrode may further be included.

The display panel may further include an encapsulation substrate coupled to the display substrate.

The sensor electrode may be directly disposed on the encapsulation substrate.

An insulating layer disposed on the lower surface of the heat dissipating member and overlapping the driving chip may be further included.

The display substrate may include a first portion in which the pixels are disposed, a second portion extending from the first portion and having a curvature, and a third portion extending from the second portion and overlapping the lower member. have.

The display device according to an exemplary embodiment of the present invention may include a window member, a display module disposed on a lower surface of the window member, and a polarizing film disposed between the window member and the display module. The display module includes a display panel, a sensor electrode, a lower member, a radiating member, a first circuit board, a driving chip, and a first adhesive member. The display panel includes a display substrate including a signal line and a pad connected to the signal line, and an encapsulation substrate facing the display substrate. The sensor electrode is directly disposed on the upper surface of the encapsulation substrate. The lower member is It is disposed on the lower surface of the display panel.

The heat dissipation member may be disposed on a lower surface of the lower member and may have a thermal conductivity of 200 W/mK or more. The first circuit board may overlap the pad and are electrically connected to the pad, and may overlap the heat dissipating member. The driving chip may be mounted on the first circuit board, and may be disposed between the first circuit board and the lower member. The first adhesive member may include a first adhesive member that couples the first circuit board and the lower member. The first adhesive member may define an inner region in which the driving chip is disposed on a plane, and a passage region connecting the inner region and an outer space of the first adhesive member.

The first circuit board is a first portion overlapping the pad, extending from the first portion, extending from a second portion having a curvature and the second portion, overlapping the lower member, and mounting the driving chip May include a third part.

A second circuit board electrically connected to the first circuit board and overlapping the heat dissipating member, and a second adhesive member coupling the second circuit board and the lower member may be further included.

The first adhesive member may be thicker than the second adhesive member.

The heat dissipation member includes a metal layer, and the second circuit board includes a first pad electrically connected to the first circuit board and a second pad overlapping the metal layer and electrically connected to the metal layer, and the second bonding The member may include an anisotropic conductive film.

Another display module according to an exemplary embodiment of the present invention may include a display substrate, an encapsulation substrate, a sealing member, a heat dissipation member, a first circuit board, a driving chip, and an adhesive member. The display substrate may include a base layer, a light emitting diode disposed on the base layer, and a signal line disposed on the base layer. The encapsulation substrate may face the display substrate, and the sealing member may couple the display substrate and the encapsulation substrate. The heat dissipation member may be disposed on a lower surface of the display substrate and may have a thermal conductivity of 200 W/mK or more. The first circuit board may overlap and be electrically connected to an end portion of the signal line, and may overlap the heat dissipating member. The driving chip may be mounted on the first circuit board and disposed between the first circuit board and the heat dissipating member. The adhesive member may couple the first circuit board and the heat dissipation member, and may surround the driving chip on a plane.

The adhesive member includes a first portion having a first thickness and a second portion having a second thickness smaller than the first thickness, and the length of the second portion is 5% to 20% of the length of the driving chip Can be

The adhesive member includes a base film corresponding to the first portion and the second portion, a first adhesive layer corresponding to the base film, and a second adhesive layer disposed on the first portion and not disposed on the second portion. can do.

The display device according to an exemplary embodiment of the present invention may include a window member, a display module disposed on a lower surface of the window member, and a polarizing film disposed between the window member and the display module. The display module includes a display panel, a lower member, a radiating member, a circuit board, a driving chip, and a spacer. The display panel may include a pad connected to a signal line. The lower member is disposed on a lower surface of the display panel, and the radiating member is disposed on a lower surface of the lower member. The circuit board is electrically connected to the pad, and a part of the circuit board is disposed under the heat dissipating member.

The driving chip is mounted on the circuit board and disposed between the circuit board and the heat dissipating member. The insulating layer is disposed on a lower surface of the heat dissipating member and overlaps the driving chip. The spacer is disposed between the circuit board and the radiating member. The spacer includes a first portion having a first thickness and a second portion having a second thickness less than the first thickness, wherein the first portion and the second portion define a closed line on a plane, and The driving chip is disposed in the inner region of the closed line.

According to the above, the heat generated from the driving chip can be efficiently discharged by forming the heat dissipation passage in the adhesive member.

A heat dissipation member such as a metal layer is disposed on the lower member to absorb heat generated from the driving chip and then disperse it. Therefore, the heat dissipation efficiency is improved. The ground pattern of the circuit board is electrically connected to the metal layer, so that the metal layer may function as a ground layer of the circuit board.

By disposing an insulating layer between the conductive layer and the driving chip, it is possible to prevent an electrical short-circuit between the conductive layer and the driving chip.

1A is a perspective view of an electronic device according to an embodiment of the present invention.
1B is an exploded perspective view of an electronic device according to an embodiment of the present invention.
2 is a block diagram of an electronic device according to an embodiment of the present invention.
3A is an exploded perspective view of a display device according to an exemplary embodiment of the present invention.
3B is a rear view of a display device according to an exemplary embodiment of the present invention.
3C is a cross-sectional view of a lower member according to an embodiment of the present invention.
3D and 3E are cross-sectional views of a display device according to an exemplary embodiment of the present invention.
3F is a plan view of a circuit board according to an embodiment of the present invention.
3G and 3H are cross-sectional views of an adhesive member according to an embodiment of the present invention.
3I is a plan view of a circuit board according to an embodiment of the present invention.
3J is an enlarged cross-sectional view of a portion of a display device according to an exemplary embodiment of the present invention.
4A is a cross-sectional view of a display panel according to an exemplary embodiment of the present invention.
4B is a cross-sectional view of an input sensing unit according to an embodiment of the present invention.
5A and 5B are plan views of a circuit board according to an embodiment of the present invention.
6A is a rear view of a display device according to an exemplary embodiment of the present invention.
6B is a cross-sectional view of a display device according to an exemplary embodiment of the present invention.
7A is an exploded perspective view of a display device according to an exemplary embodiment of the present invention.
7B and 7C are cross-sectional views of a display device according to an exemplary embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In this specification, when a component (or region, layer, part, etc.) is referred to as “on”, “connected”, or “coupled” to another component, it is placed directly on the other component/ It means that it may be connected/coupled or a third component may be disposed between them.

The same reference numerals refer to the same elements. In addition, in the drawings, thicknesses, ratios, and dimensions of components are exaggerated for effective description of technical content. “And/or” includes all combinations of one or more that the associated configurations may be defined.

Terms such as first and second may be used to describe various components, but the components should not be limited by the terms. These terms are used only for the purpose of distinguishing one component from another component. For example, without departing from the scope of the present invention, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element. Singular expressions include plural expressions unless the context clearly indicates otherwise.

In addition, terms such as "below", "bottom", "above", "upper", and the like are used to describe the relationship between components shown in the drawings. The terms are relative concepts and are described based on the directions indicated in the drawings.

Terms such as "comprise" or "have" are intended to designate the presence of a feature, number, step, action, component, part, or combination thereof described in the specification, and one or more other features, numbers, or steps. It is to be understood that it does not preclude the possibility of addition or presence of, operations, components, parts, or combinations thereof.

1A is a perspective view of an electronic device ED according to an embodiment of the present invention. 1B is an exploded perspective view of an electronic device ED according to an embodiment of the present invention. 2 is a block diagram of an electronic device ED according to an embodiment of the present invention.

In this embodiment, a smart phone is illustrated as an example of the electronic device ED, but the present invention is not limited thereto. In an embodiment of the present invention, the electronic device ED may be a tablet, a notebook computer, or a smart TV.

As illustrated in FIG. 1A, the display surface on which the image IM is displayed is parallel to a plane defined by the first direction axis DR1 and the second direction axis DR2. The display surface includes a display area DA and a bezel area BZA adjacent to the display area DA. In FIG. 1A, an Internet search window is shown as an example of the image IM. As an example, the display area DA may have a rectangular shape. The bezel area BZA may surround the display area DA. In other words, the bezel area BZA forms the edge of the display surface. In an embodiment of the present invention, the bezel area BZA may be disposed only in two areas facing from the first direction axis DR1, or may be disposed only in two areas facing each other in the second direction axis DR2.

The third direction axis DR3 indicates the normal direction of the display surface, that is, the thickness direction of the electronic device ED. The front (or upper surface, or first surface) and rear surface (or lower surface, or second surface) of each member are defined based on the direction in which the image IM is displayed. However, the directions indicated by the first to third direction axes DR1, DR3, and DR3 are relative concepts and may be converted to other directions. Hereinafter, the first to third directions refer to the same reference numerals as directions indicated by the first to third direction axes DR1, DR2, and DR3, respectively.

As shown in FIGS. 1A and 1B, the electronic device ED includes a display device DD, an electronic module EM, a power supply module PM, a bracket BRK, and an external case EDC. . In Figs. 1A and 1B, the configurations are shown for simplicity.

The display device DD includes a window member WM and a display module DM. The window member WM provides the front surface of the electronic device ED. The display module DM is disposed on the rear surface of the window member WM to generate an image. In addition, the display module DM may detect a user input (eg, a user's touch and/or a user's pressure application). The display module DM may be electrically connected to the electronic module EM through a flexible circuit board or an electronic component connector.

In the present embodiment, the display module DM providing a flat display surface is illustrated as an example, but the shape of the display module DM may be changed. Edges facing in the first direction DR1 of the display module DM may be bent from the center portions to provide a curved surface.

The power supply module PM supplies power necessary for the overall operation of the electronic device ED. The power supply module PM may include a conventional battery module.

The bracket BRK is combined with the display device DD and/or the outer case EDC to divide the inner space of the electronic device ED. The bracket (BRK) provides a space for other components to be placed. In addition, the bracket BRK may support the display device DD so that the display device DD is fixed without shaking. In the bracket BRK, a coupling groove corresponding to the shape of the electronic module EM may be defined so that the electronic module EM is fixed. The bracket BRK includes a metal or plastic member. Although one bracket BRK is illustrated as an example, the electronic device ED may include a plurality of brackets BRK.

The outer case EDC may be coupled to the bracket BRK and/or the display device DD. The outer case EDC provides an outer surface of the electronic device ED. Although the outer case EDC made of one body is illustrated as an example, the outer case EDC may include a plurality of bodies assembled with each other. The outer case EDC may include a plurality of frames and/or plates made of glass, plastic, and metal.

The electronic module EM is mounted on the motherboard and the motherboard, and includes various functional modules for operating the electronic device ED. The motherboard may be electrically connected to the display device DD through a conventional electronic component connector. Here, the motherboard may include a rigid circuit board.

As shown in FIG. 2, the electronic module EM includes a control module 10, a wireless communication module 20, an image input module 30, an audio input module 40, an audio output module 50, and a memory ( 60), an external interface 70, a light emitting module 80, a light receiving module 90, a camera module 100, and the like. Some of the modules are not mounted on the motherboard, but may be electrically connected to the motherboard through a flexible circuit board or an electronic component connector.

The control module 10 controls the overall operation of the electronic device ED. The control module 10 may be a microprocessor. For example, the control module 10 activates or deactivates the display device DD. The control module 10 may control the image input module 30, the sound input module 40, the sound output module 50, and the like based on a user's input signal received from the display device DD.

The wireless communication module 20 may transmit/receive wireless signals to and from other terminals using a Bluetooth or Wi-Fi line. The wireless communication module 20 may transmit/receive a voice signal using a general communication line. The wireless communication module 20 includes a transmission unit 22 that modulates and transmits a signal to be transmitted, and a reception unit 24 that demodulates a received signal.

The image input module 30 processes an image signal and converts it into image data that can be displayed on the display device DD. The sound input module 40 receives an external sound signal by a microphone in a recording mode, a voice recognition mode, etc. and converts it into electrical voice data. The sound output module 50 converts sound data received from the wireless communication module 20 or the sound data stored in the memory 60 and outputs it to the outside.

The external interface 70 serves as an interface connected to an external charger, a wired/wireless data port, a card socket (eg, a memory card, a SIM/UIM card), and the like.

The light emitting module 80 generates and outputs light. The light emitting module 80 may output infrared rays. The light emitting module 80 may include an LED device. The light-receiving module 90 may detect infrared rays. The light-receiving module 90 may be activated when infrared rays above a predetermined level are sensed. The light receiving module 90 may include a CMOS sensor. After the infrared light generated by the light emitting module 80 is output, it is reflected by an external object (eg, a user's finger or face), and the reflected infrared light may be incident on the light receiving module 90. The light emitting module 80 and the light receiving module 90 may be provided in plural according to the purpose. The camera module 100 photographs an external image. A plurality of camera modules 100 may be provided according to a purpose and a position mounted on the electronic device ED.

3A is an exploded perspective view of a display device DD according to an exemplary embodiment of the present invention. 3B is a rear view of the display device DD according to an exemplary embodiment of the present invention. 3C is a cross-sectional view of a lower member LM according to an embodiment of the present invention. 3D and 3E are cross-sectional views of a display device DD according to an exemplary embodiment of the present invention. 3F is a plan view of a circuit board (FPCB) according to an embodiment of the present invention. 3G and 3H are cross-sectional views of the adhesive member AM1 according to an embodiment of the present invention. 3I is an enlarged cross-sectional view of a portion of the display device DD according to the exemplary embodiment of the present invention. 3J is an enlarged cross-sectional view of a portion of a display device according to an exemplary embodiment of the present invention.

3A to 3J, the display device DD includes a window member WM and a display module DM. The window member WM includes a base member BS and a bezel layer BZL disposed on a rear surface of the base member BS. The area in which the bezel layer BZL is disposed may be defined as the bezel area BZA shown in FIGS. 1A and 1B. In the present exemplary embodiment, the window member WM in a flat shape in the display area DA is illustrated, but the shape of the window member WM may be modified. Edge regions facing in the first direction DR1 of the window member WM may provide curved surfaces.

The base member BS may include a glass substrate, a sapphire substrate, a plastic substrate, or the like. The base member BS may have a multilayer or single layer structure. For example, the base member BS may include a plurality of plastic films bonded with an adhesive. The base member BS may include a glass substrate and a plastic film bonded to the glass substrate by an adhesive member.

The bezel layer BZL may have a single layer or multilayer structure. The multilayer bezel layer BZL may include a buffer layer that improves adhesion, a pattern layer that provides a predetermined pattern, and an achromatic layer. The pattern layer may provide a pattern referred to as a hairline. The achromatic layer may include an organic mixture including a black pigment or dye. The layers may be formed by deposition, printing, coating, or the like. Although not shown separately, the window member WM may further include a functional coating layer disposed on the front surface of the base member BS. The functional coating layer may include an anti-fingerprint layer, an anti-reflection layer, and a hard coating layer.

3A to 3J, the display module DM comprises a display panel DP, an anti-reflect unit (ARU), an input sensing unit (ISU), and a lower member (LM). ), a driving control module (DCM) and a heat dissipating member (HRL). In FIG. 3A, a transparent adhesive member that may be disposed between the members (for example, a transparent adhesive member that may be disposed between the antireflection unit (ARU) and the input sensing unit (ISU)) is not shown. The transparent adhesive member may be a pressure sensitive adhesive film (PSA), an optically clear adhesive film (OCA), or an optically clear adhesive (OCR) resin.

As shown in FIG. 3A, the display panel DP may include a display substrate AP and an encapsulation substrate EP. The display panel DP may be an organic light emitting display panel. The display panel DP includes a pixel area PXA in which the pixel PX is disposed on a plane, and a non-pixel area NPXA adjacent to the pixel area PXA. The pixel PX is not disposed in the non-pixel area NPXA, and peripheral components such as signal lines and banks are disposed. The pixel area PXA and the non-pixel area NPXA may correspond to a display area DA (see FIG. 1A) and a bezel area (BZA see FIG. 1A ), respectively. However, the corresponding regions (eg, shape/area, etc.) need not be completely identical.

The pixel PX is disposed in the pixel area PXA. A plurality of pixels PX may be provided and may be respectively connected to corresponding signal lines. The pixel PX may include a first thin film transistor TR1, a second thin film transistor TR2, a capacitor CP, and a light emitting device ELD.

The first thin film transistor TR1 is connected to the gate line GL and the data line DL. The light emitting device ELD receives a power voltage provided by the power line PL. Pads PDD connected to signal lines such as data line DL and power line PL are disposed in non-pixel area NPXA. The pad PDD may have an integral shape with the signal line, or may be disposed on a layer different from the signal line to be connected to an end portion of the signal line through a contact hole penetrating through the insulating layer. The pads PDD may be non-overlapping on the encapsulation substrate EP.

The antireflection unit (ARU) may include a polarizer and a phase delay. The antireflection unit (ARU) may include a polarizer and/or a phase retarder of a stretchable film type. The number of phase delay films and the phase delay length (λ/4 or λ/2) of the phase delay film may be determined according to the principle of operation of the antireflection unit (ARU). The antireflection unit (ARU) may include a base film and a liquid crystal layer coated on the base film. Depending on the optical properties of the liquid crystal layer, the anti-reflection unit (ARU) may be determined as a polarizer or a phase delay. The antireflection unit ARU may include color filters.

The input sensing unit (ISU) acquires coordinate information of an external input. The input sensing unit ISU may detect various types of inputs provided from the outside of the electronic device ED. For example, the input sensing unit ISU may detect an input by a user's body and may recognize various types of external inputs such as light, heat, or pressure. In addition, the input sensing unit ISU may sense not only an input contacting the sensing surface, but also an input close to the sensing surface.

The input sensing unit ISU may be, for example, a capacitive touch panel, an electromagnetic induction touch panel, or the like. Such a touch panel may include a base layer, touch sensor electrodes, and signal lines connected to the touch sensor electrodes. The touch panel may include an area in which the touch sensor electrodes are disposed and an area in which the touch sensor electrodes are not disposed on a plane. The area in which the touch sensor electrodes are disposed may correspond to the pixel area PXA. The input detection unit ISU may be connected to a second circuit board MPCB, which will be described later, through a flexible circuit board I-PCB. A driving chip of the input sensing unit ISU, not shown, may be mounted on the flexible circuit board I-PCB.

As illustrated in FIGS. 3A to 3C, the lower member LM is disposed on the rear surface of the display panel DP to support the display panel DP. As shown in FIG. 3C, the lower member LM may have a multilayer structure. The lower member LM may include a light blocking member LBL and an elastic member EL. The light blocking member LBL prevents external light from penetrating into the display panel DP through the rear surface of the display panel DP. The light blocking member LBL may be a black synthetic resin, such as a PET film.

The light blocking member LBL may have a form of a double-sided adhesive tape further including an adhesive layer L-AM disposed on both sides. Accordingly, the light blocking member LBL has a function of an adhesive tape for attaching the elastic member EL to the lower surface of the display panel DP. Fine patterns (protrusions and/or grooves) may be disposed on the surface of the light blocking member LBL. Bubbles that may be generated between the elastic member EL and the display panel DP may be moved along a fine pattern to escape to the outside. Accordingly, air bubbles may be prevented from being collected between the elastic member EL and the display panel DP by the fine pattern.

The elastic member EL absorbs an external shock and protects the display panel DP from the external shock. The elastic member EL may include a foamed synthetic resin, such as a foamed urethane sheet.

In addition, the lower member LM may further include a metal plate having a rigidity greater than or equal to the standard. The lower member LM may be a stainless steel plate. In an embodiment of the present invention, the lower member LM may be omitted.

The driving control module DCM is mounted on a first circuit board (FPCB) connected to the display panel (DP), a second circuit board (MPCB) connected to the first circuit board (FPCB), and the first circuit board (FPCB). It may include a driving chip (F-IC). The driving chip F-IC may provide a data signal and/or a gate signal to the display panel DP, and may provide other control signals.

Although not shown separately, a plurality of passive elements and active elements may be mounted on the second circuit board MPCB. For example, the second circuit board MPCB may be a rigid circuit board or a flexible circuit board, and the first circuit board FPCB may be a flexible circuit board.

Although not shown separately, the second circuit board MPCB may be electrically connected to the motherboard of the electronic module EM (see FIG. 1B) through an electronic component connector.

The heat dissipation member HRL may absorb heat generated from the silver driving chip D-IC and then disperse it outward on a plane. Therefore, the heat dissipation efficiency is improved. The heat dissipation member HRL may include a layer or material having a thermal conductivity of 200 W/mK or more. As shown in FIGS. 3A and 3B, the heat dissipation member HRL may overlap a part of the lower member LM.

In this embodiment, the heat dissipation member HRL may include a metal layer. The metal layer may include copper, gold, silver, or aluminum. However, the material of the heat dissipation member HRL is not limited thereto. For example, the heat dissipation member HRL may include a graphite layer rather than a metal layer.

Separately provided input sensing unit (ISU) and anti-reflection unit (ARU) is illustrated as an example, but at least one of the input sensing unit (ISU) and anti-reflection unit (ARU) may be omitted. At least one of the input sensing unit ISU and the anti-reflection unit ARU may be integrated into the display panel DP through a continuous process.

Although not shown separately, the display module DM may further include a pressure sensing unit disposed on a lower surface of the lower member LM. The pressure sensing unit is disposed on the rear surface to detect external pressure applied to the display module. The pressure sensing unit may include a base layer, piezoelectric elements, and signal lines connected to the piezoelectric elements.

Hereinafter, the display module DM will be described in more detail with reference to FIGS. 3D to 3J. The first circuit board (FPCB) unfolded as shown in FIGS. 3D and 3E is bent and coupled to the heat dissipation member HRL. The first circuit board FPCB and the adhesive member AM1 shown in FIG. 3E correspond to the cross section of the line I-I' shown in FIG. 3F. The first circuit board FPCB may be coupled to the heat dissipation member HRL by the first adhesive member AM1. The second circuit board MPCB may be coupled to the heat dissipation member HRL by the second adhesive member AM2. The first adhesive member (AM1) and the second adhesive member (AM2) is a pressure sensitive adhesive film (PSA), an optically clear adhesive film (OCA), or an optically clear adhesive (OCR). Resin) can be a transparent adhesive member. The first adhesive member AM1 and the second adhesive member AM2 may include a conventional adhesive sheet. A typical adhesive sheet may include a base film and an adhesive layer disposed on both sides of the base film. The first adhesive member AM1 and the second adhesive member AM2 may include a conductive adhesive sheet.

The first adhesive member AM1 may be thicker than the second adhesive member AM2. In plan view, the first adhesive member AM1 may have a smaller area than the second adhesive member AM2.

3D to 3F, the first circuit board FPCB extends from the first portion P1 and the first portion P1 overlapping the pads PDD of the signal line (see FIG. 3A) and has a curvature. And a second portion P2 having a and a third portion P3 extending from the second portion P2. The driving chip D-IC is mounted on the third portion P3 overlapping the lower member LM. The first adhesive member AM1 is also disposed on the third portion P3.

The first circuit board FPCB includes at least one insulating layer and at least one conductive layer. The conductive layer includes a conductive pattern such as a signal line. The signal line of the circuit board and the signal line of the display panel DP may be connected through a conductive connecting member, for example, an anisotropic conductive film. In an embodiment of the present invention, the anisotropic conductive film may be replaced with a solder paste, a solder ball, or a solder bump.

3F shows the first circuit board (FPCB) in an unfolded state. On one surface of the first circuit board FPCB, the input pads P-I and the output pads P-O of the first circuit board FPCB are exposed to the outside.

The first adhesive member AM1 on one surface of the first circuit board FPCB may surround most of the driving chip D-IC. The first adhesive member AM1 defines an inner region IA in which the driving chip D-IC is disposed, and a passage region PA connecting the inner region IA with the outer space of the first adhesive member AM1. do.

As shown in FIG. 3E, the first adhesive member AM1 maintains the distance between the first circuit board FPCB and the heat dissipation member HRL, and the bonding force between the first circuit board FPCB and the heat dissipation member HRL Keep The adhesive member AM1 provides the passage area PA so that the driving chip D-IC is not completely sealed by the first circuit board FPCB, the heat dissipation member HRL, and the first adhesive member AM1. . Heat generated from the driving chip D-IC may be discharged to the outer space of the first adhesive member AM1 through the passage area PA. By efficiently dissipating heat generated from the driving chip, it is possible to prevent thermal damage to the driving chip. The width of the passage area PA in the first direction DR1 may be 5% to 20% of the length of the first direction DR1 of the driving chip D-IC. If the width of the passage area PA is too wide, cracks may occur in the first circuit board FPCB when pressure is applied to the corresponding area.

If the width of the passage area PA is too large, the area of the area in which the first adhesive member AM1 is disposed on the upper surface of the narrow area of the first circuit board FPCB decreases, thereby dissipating heat from the first circuit board (FPCB). The coupling force of the member HRL may be reduced. If the width of the passage area PA is too small, the heat dissipation passage may be reduced, thereby causing thermal damage to the driving chip D-IC.

As illustrated in FIGS. 3F and 3G, the first adhesive member AM1 may include a first portion AP1 and a second portion AP2 having different thicknesses. The second portion AP2 is an area corresponding to the passage area PA and has a second thickness TH2 smaller than the first thickness TH1 of the first portion AP1. The thickness of the second portion AP2 may not necessarily be uniform. The continuous first portion AP1 and the second portion AP2 may define a closed line on a plane.

The second thickness TH2 may be 92% to 70% of the first thickness TH1. In this embodiment, the length of the first direction DR1 of the second portion AP2 may be 5% to 20% of the length of the first direction DR1 of the driving chip D-IC. The difference between the first thickness TH1 and the second thickness TH2 is too large. If the length of the second part AP2 is too large, when pressure is applied to the passage area PA, a crack may occur in the first circuit board FPCB. As shown in FIG. 3H, the first adhesive member AM1 may have a multilayer structure. The first adhesive member AM1 may include a base film A-10 and adhesive layers A-11 and A-12 disposed on both surfaces of the base film A-10. The base film (A-10) may be a conventional synthetic resin film, and the adhesive layers (A-11, A-12) may include a conventional binder. A part of the upper adhesive layer A-12 may be removed from the passage area PA. The thickness of the upper adhesive layer A-12 may be 8% to 30% of the thickness of the first adhesive member AM1. In this embodiment, the length of the portion corresponding to the passage area PA in the first direction DR1 may be 5% to 20% of the length in the first direction DR1 of the driving chip D-IC. In an embodiment of the present invention, the lower adhesive layer A-11 may be removed corresponding to the passage area PA, or the lower adhesive layer A-11 may be further removed corresponding to the passage area PA.

As shown in FIG. 3I, the passage area PA may be defined as an area in which the first adhesive member AM1 is not disposed.

3J illustrates a connection structure (hereinafter, a first connection structure) between the second circuit board MPCB and the heat dissipation member HRL. Also, a connection structure (hereinafter, a second connection structure) between the first circuit board FPCB and the second circuit board MPCB is shown. For convenience of explanation, the first connection structure and the second connection structure are shown in FIG. 3J showing one cross-section, but the first connection structure and the second connection structure are disposed in different regions on a plane.

In this embodiment, the heat dissipation member HRL may include a metal layer H-CL. The heat dissipation member HRL may be a metal adhesive sheet including a metal layer H-CL and an adhesive layer H-AM. The metal layer H-CL is electrically connected to the ground pad GP of the second circuit board MPCB through the second adhesive member AM2. The ground pad GP may be connected through a signal line and a ground pattern of an electronic component mounted on the second circuit board MPCB. In this embodiment, the second adhesive member AM2 may be an anisotropic conductive film. The metal layer H-CL functions as a ground layer of the second circuit board MPCB.

In this embodiment, a second circuit board (MPCB) including four insulating layers (M-IL), signal lines (M-CL), connection pads (M-PD), and solder resist layers (M-SL) Although illustrated by way of example, the structure of the second circuit board MPCB is not limited thereto.

The input pads P-I of the first circuit board FPCB and the connection pads M-PD of the second circuit board MPCB may also be connected by the anisotropic conductive film ACF. In this embodiment, a first circuit board (FPCB) including a two-layer insulating layer (F-IL), a signal line (F-CL), an input pad (PI), and a solder resist layer (F-SL) is exemplary. Although illustrated as, the structure of the first circuit board (FPCB) is not limited thereto.

In describing the display device DD of FIGS. 3A to 3J, the heat dissipation passage PA is provided by the first adhesive member AM1 for bonding the first circuit board FPCB and the heat dissipation member HRL. Although described, the present invention is not limited thereto. The first adhesive member AM1 may be replaced with a spacer that maintains a distance between the heat dissipation member HRL and the first circuit board FPCB. The spacer may be adhered to only one of the heat dissipation member HRL and the first circuit board FPCB. In this case, the first circuit board FPCB may be fixed to the rear surface of the display panel DP by the second circuit board MPCB and the second adhesive member AM2.

4A is a cross-sectional view of a display panel DP according to an exemplary embodiment of the present invention. 4B is a cross-sectional view of an input sensing unit (ISU) according to an embodiment of the present invention.

As shown in FIG. 4A, the display panel DP may include a display substrate AP, an encapsulation substrate EP, and a sealing member SM that couples them. In this embodiment, the display panel DP may be a rigid type display panel.

The display substrate AP includes a base layer BL, a circuit device layer DP-CL disposed on the base layer BL, and a display device layer DP-OLED. Although not shown separately, the display panel DP may further include functional layers such as a refractive index control layer.

The base layer BL may include a synthetic resin substrate or a glass substrate. In addition, the base layer BL may include a metal substrate or an organic/inorganic composite material substrate.

The circuit element layer DP-CL includes at least one insulating layer and a circuit element. The insulating layer includes at least one intermediate inorganic layer and at least one intermediate organic layer. Circuit elements include signal lines, pixel driving circuits, and the like. The driving circuit of the pixel may include the transistors TR and TR2 and the capacitor CP described with reference to FIG. 3A. The circuit device layer DP-CL may be formed through a process of forming an insulating layer, a semiconductor layer, and a conductive layer by coating or vapor deposition, and a patterning process of the insulating layer, semiconductor layer, and conductive layer layer by a photolithography process.

The display device layer DP-OLED includes the light emitting device ELD described with reference to FIG. 3A. The light emitting device ELD may include an organic light emitting diode or a quantum dot light emitting diode. The display device layer DP-OLED may further include an organic layer such as a pixel defining layer.

The encapsulation substrate EP may include a synthetic resin substrate or a glass substrate. The sealing member SM may include an inorganic adhesive member such as a flit. The present invention is not limited thereto, and the sealing member SM may include an organic adhesive member. In this embodiment, since the display panel DP can be completely sealed from the outside, it is possible to prevent a defect of the light emitting device due to moisture.

As shown in FIG. 4B, the input sensing unit ISU may be directly disposed on the base surface provided by the encapsulation substrate EP. In the present specification, "the configuration of B is directly disposed on the configuration of A" means that a separate adhesive layer/adhesive member is not disposed between the configuration of A and the configuration of B.

The input sensing unit ISU includes at least a sensor electrode SE. In this embodiment, the input sensing unit ISU further includes insulating layers IS1 and IS2. Although not shown, in the embodiment, the input sensing unit ISU may further include a signal line connected to the sensor electrode SE.

In this embodiment, the input sensing unit ISU may be a two-layer type capacitive touch panel. The sensor unit SP1 of the first sensor electrode, the sensor unit (not shown) of the second sensor electrode, and the connection unit BR1 may be disposed on the upper surface of the encapsulation substrate EP. The sensor unit SP1 of the first sensor electrode may contact the upper surface of the encapsulation substrate EP or may be disposed on an insulating layer disposed on the upper surface of the encapsulation substrate EP.

The first insulating layer IS1 is disposed on the upper surface of the encapsulation substrate EP, and the connection part BR1 of the first sensor electrode is disposed on the first insulating layer IS1. The sensor part SP1 of the first sensor electrode and the connection part BR1 may be connected through a contact hole penetrating the first insulating layer IS1. When the sensor part SP1 and the connection part BR1 of the first sensor electrode are connected to each other so that the first sensor electrode extends in the second direction DR2, the sensor part (not shown) and the connection part BR2 of the second sensor electrode are ) Are connected to each other so that the second sensor electrode may extend in the first direction. A second insulating layer IS2 covering the connection part BR2 is disposed on the first insulating layer IS1.

5A and 5B are plan views of a circuit board (FPCB) according to an embodiment of the present invention. Hereinafter, a detailed description of the same configuration as the configuration described with reference to FIGS. 1 to 4B will be omitted. Hereinafter, the first adhesive member AM1 is illustrated as a first adhesive member corresponding to FIG. 3I, but may be a first adhesive member corresponding to FIGS. 3F to 3H.

As shown in FIG. 5A, the first adhesive member AM1 may include a plurality of adhesive portions AM1-1 and AM1-2. The first adhesive portion AM1-1 and the second adhesive portion AM1-2 may be disposed to be spaced apart in the second direction DR2. A first passage area PA1 and a second passage area PA2 may be defined between the first bonding portion AM1-1 and the second bonding portion AM1-2.

The first passage area PA1 and the second passage area PA2 may be disposed on both sides of the driving chip D-IC in the first direction DR1. The widths of the first passage area PA1 and the second passage area PA2 in the second direction DR2 may be 5% to 20% of the length of the first direction DR1 of the driving chip D-IC. .

As shown in FIG. 5B, the first adhesive member AM1 may include first to fourth adhesive portions AM1-1 to AM1-4. First to fourth passage areas PA1 to PA4 may be defined between the first to fourth adhesive portions AM1-1 to AM1-4. The width of the first passage area PA1 and the third passage area PA3 in the second direction DR2 and the width of the second passage area PA2 and the fourth passage area PA4 in the first direction DR1 The sum may be 5% to 20% of the length of the driving chip D-IC in the first direction DR1.

The area of the passage area and the area of the adhesive portion may be variously modified in consideration of heat dissipation characteristics and adhesive force.

6A is a rear view of a display device DD according to an exemplary embodiment of the present invention. 6B is a cross-sectional view of a display device DD according to an exemplary embodiment of the present invention. Hereinafter, a detailed description of the same configuration as the configuration described with reference to FIGS. 1 to 5B will be omitted.

The display device DD according to the present exemplary embodiment may further include an insulating member SIL disposed on a lower surface of the heat dissipating member HRL. The heat dissipation member HRL and the driving chip D-IC of the metal layer are insulated to prevent an electric short-circuit between the heat dissipation member HRL and the driving chip D-IC. The insulating member SIL may include an electrical insulating tape. The electrical insulating tape may include a synthetic resin layer and an adhesive layer having high electrical insulating properties.

The insulating member SIL may overlap a part of the heat dissipating member HRL. The insulating member SIL has a larger area than the driving chip D-IC on a plane. On a plane, the driving chip D-IC is disposed inside the insulating member SIL.

In FIG. 6B, the first adhesive member AM1 is shown to be adhered to the lower surfaces of the insulating member SIL and the heat dissipating member HRL. The first adhesive member AM1 may be entirely adhered to the lower surface of the insulating member SIL.

7A is a perspective view of a display device DD according to an exemplary embodiment of the present invention. 7B and 7C are cross-sectional views of a display device DD according to an exemplary embodiment of the present invention. Hereinafter, detailed descriptions of the same configuration as those described with reference to FIGS. 1 to 6B will be omitted.

According to the present embodiment, unlike the display device DD illustrated in FIG. 3A, the input sensing unit ISU may be disposed on the antireflection unit ARU. The table antireflection unit ARU may be coupled to the display panel DP through a third adhesive member AM3. In addition, according to the present embodiment, some members have a different shape from the corresponding member among the members shown in FIG. 3A.

The display panel DP may be a flexible type display panel. The display panel DP may not include the encapsulation substrate EP and the sealing member SM compared to the display panel DP illustrated in FIG. 4A. In comparison with the display panel DP shown in FIG. 4A, the display panel DP according to the present exemplary embodiment includes a flexible base layer BL, a circuit element layer DP-CL on the base layer BL, and a display. It may include a device layer (DP-OLED) and a thin film encapsulation layer. The base layer BL may include a synthetic resin film such as polyimide or polyamide. The thin film encapsulation layer may include an organic thin film and an inorganic thin film.

Part of the display panel DP may be bent. As the display panel DP is bent, it may be divided into a non-bending portion NBA and a bending portion BA or a first portion. The bending part BA is a curvature part (CA, or a second part) having a predetermined curvature in a bent state, and an opposite part (FA or a third part) that will face the non-bending part NBA in the bent state It may include. In the bent state, a predetermined radius of curvature is defined in the bending part BA around the bending axis BX.

The base layer BL and the circuit layer CL may be disposed to correspond to the non-bending portion NBA and the bending portion BA. The display device layer DP-OLED and the thin film encapsulation layer may be disposed on the non-bending portion NBA.

The display panel DP may be coupled to the protective film PF by the fourth adhesive member AM4. The protective film PF may include a first protective film PF1 and a second protective film PF2 spaced apart from each other. The fourth adhesive member AM4 may include a first adhesive portion AM4-1 and a second adhesive portion AM4-2 corresponding to the first protective film PF1 and the second protective film PF2, respectively. have.

The non-bending portion NBA and the first protective film PF1 may be joined by the first adhesive portion AM4-1. The opposing portion FA and the second protective film PF2 may be joined by the second adhesive portion AM4-2. When the display panel DP is bent, the first protective film PF1 and the second protective film PF2 are spaced apart from each other with the curvature area CA interposed therebetween.

The first protective film PF1 and the lower member LM may be coupled by a fifth adhesive member AM5.

When the display panel DP is bent, the second protective film PF2 and the heat dissipating member HRL may be coupled by the sixth adhesive member AM6. The first circuit board FPCB and the heat dissipation member HRL may be coupled by a seventh adhesive member AM7. The seventh adhesive member AM7 may correspond to the first adhesive member AM1 of FIG. 3F. The second circuit board MPCB and the heat dissipation member HRL may be coupled by an eighth adhesive member AM8.

The display panel DP may further include a stress control film SCF disposed on the circuit layer to at least correspond to the curvature area CA. The stress control film SCF may have 70% or more of the total area disposed in the curvature area CA. A portion of the stress control film SCF may also overlap the non-bending portion NBA and the opposite portion FA. The stress control film (SCF) may include a synthetic resin film, such as a protective film (PF).

Previously, it has been described that each of the protective film PF and the fourth adhesive member AM4 includes two parts, but in one aspect of the present invention, a curvature region is provided in each of the protective film PF and the fourth adhesive member AM4. CA) may be treated as having a slit defined.

Although the above has been described with reference to the preferred embodiments of the present invention, those skilled in the art or those of ordinary skill in the art will not depart from the spirit and scope of the present invention described in the claims to be described later. It will be understood that various modifications and changes can be made to the present invention within the scope of the invention.

Therefore, the technical scope of the present invention should not be limited to the content described in the detailed description of the specification, but should be determined by the claims.

FPCB: 1st circuit board
H-AM: adhesive layer
H-CL: metal layer
HRL: heat dissipation member
IA: inner region
ISU: Input detection unit
L-AM: adhesive layer
LBL: light blocking member
LM: lower member
PA: passage area
SIL: Insulation member
HRL: heat dissipation member

Claims (20)

Window member; And
A display module disposed on a lower surface of the window member, the display module,
A display panel including a display substrate including a base layer, a pixel disposed on the base layer, a signal line disposed on the base layer, and a pad connected to the signal line;
A lower member disposed under the display panel;
A heat dissipating member disposed under the lower member and including a metal layer;
A first circuit board electrically connected to the pad and overlapping the heat dissipating member;
A driving chip mounted on the first circuit board and disposed between the first circuit board and the heat dissipating member;
An insulating member disposed under the heat dissipating member and overlapping the driving chip; And
And an adhesive member that couples the first circuit board to at least one of the heat dissipation member and the insulating member and is disposed adjacent to the driving chip on a plane. The method of claim 1,
The lower member includes at least one of a light blocking member and an elastic member. The method of claim 1,
The first circuit board,
A first portion overlapping the pad;
A second portion extending from the first portion and having a curvature; And
A display device including a third portion extending from the second portion, overlapping the lower member, and mounting the driving chip. The method of claim 1,
On a plane, the driving chip is disposed inside the adhesive member,
The adhesive member includes a plurality of stacked layers,
At least one of the plurality of layers is not disposed in a partial area. The method of claim 4,
The at least one layer is an adhesive layer. The method of claim 1,
The display device further comprising a second circuit board electrically connected to the first circuit board. The method of claim 6,
An input sensing unit disposed between the window member and the display panel and including a sensor electrode; And
The display device further comprising a third circuit board electrically connecting the input sensing unit and the second circuit board. The method of claim 6,
The second circuit board is electrically connected to the metal layer. The method of claim 1,
On a plane, the insulating member overlaps a portion of the heat radiating member and exposes another portion of the heat radiating member. The method of claim 1,
The insulating member is a display device including an electrical insulating tape. The method of claim 1,
The metal layer includes copper, gold, silver, or aluminum. The method of claim 1,
The display substrate,
A first portion in which the pixel is disposed;
A second portion extending from the first portion and having a curvature; And
And a third portion extending from the second portion and overlapping the lower member. Window member;
A display module disposed under the window member; And
And a polarizing film disposed between the window member and the display module, the display module,
A display panel including a display substrate including a signal line and a pad connected to the signal line, and an encapsulation substrate facing the display substrate;
A sensor electrode directly disposed on the upper surface of the encapsulation substrate;
A lower member disposed under the display panel;
A heat dissipating member disposed under the lower member and including a metal layer;
A first circuit board electrically connected to the pad and overlapping the heat dissipating member;
A driving chip mounted on the first circuit board and disposed between the first circuit board and the lower member;
An insulating layer disposed under the radiating member and overlapping the driving chip; And
And a first adhesive member coupling the first circuit board and the lower member,
The first adhesive member defines an inner region in which the driving chip is disposed on a plane, and a passage region connecting the inner region to an outer space of the first adhesive member. The method of claim 13,
The first circuit board,
A first portion overlapping the pad;
A second portion extending from the first portion and having a curvature; And
A display device including a third portion extending from the second portion, overlapping the lower member, and mounting the driving chip. The method of claim 13,
A second circuit board electrically connected to the first circuit board and overlapping the heat dissipating member; And
The display device further comprising a second adhesive member coupling the second circuit board and the lower member. The method of claim 15,
The first adhesive member is thicker than the second adhesive member. The method of claim 15,
The heat dissipation member includes a metal layer,
The second circuit board includes a first pad electrically connected to the first circuit board and a second pad overlapping the metal layer and electrically connected to the metal layer,
The second adhesive member includes an anisotropic conductive film. A display substrate including a base layer, a light emitting diode disposed on the base layer, and a signal line disposed on the base layer;
An encapsulation substrate facing the display substrate;
A sealing member that couples the display substrate and the encapsulation substrate;
A heat dissipating member disposed under the display substrate and including a metal layer;
A first circuit board electrically connected to the signal line and overlapping the heat dissipating member;
A driving chip mounted on the first circuit board and disposed between the first circuit board and the heat dissipating member;
An insulating layer disposed under the radiating member and overlapping the driving chip; And
And an adhesive member that couples the first circuit board and the heat dissipation member and surrounds the driving chip on a plane,
The adhesive member,
A first portion having a first thickness; And
A display module including a second portion having a second thickness smaller than the first thickness, and the length of the second portion is 5% to 20% of the length of the driving chip. The method of claim 18,
The adhesive member,
A base film corresponding to the first portion and the second portion;
A first adhesive layer corresponding to the base film; And
A display module including a second adhesive layer disposed on the first portion and not disposed on the second portion. Window member; And
A display module disposed under the window member, the display module,
A display panel including a signal line and a pad connected to the signal line;
A lower member disposed under the display panel;
A heat dissipating member disposed under the lower member and including a metal layer;
A circuit board electrically connected to the pad and partially disposed under the heat dissipating member;
A driving chip mounted on the circuit board and disposed between the circuit board and the heat dissipating member;
An insulating layer disposed under the radiating member and overlapping the driving chip; And
And a spacer disposed between the circuit board and the heat dissipating member,
The spacer includes a first portion having a first thickness and a second portion having a second thickness less than the first thickness, wherein the first portion and the second portion define a closed line on a plane, and The driving chip is a display device disposed in an inner region of the closed line.

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