CN219575583U

CN219575583U - Silicon wafer continuous conveying film-plating carrier plate

Info

Publication number: CN219575583U
Application number: CN202320130945.XU
Authority: CN
Inventors: 林超亮; 李伟; 杨星
Original assignee: Suzhou Shengcheng Solar Equipment Co Ltd
Current assignee: Suzhou Shengcheng Solar Equipment Co Ltd
Priority date: 2023-01-14
Filing date: 2023-01-14
Publication date: 2023-08-22
Anticipated expiration: 2033-01-14

Abstract

The utility model belongs to the technical field of film plating carrier plates, and relates to a continuous conveying film plating carrier plate for silicon wafers, which comprises a supporting frame and a substrate, wherein the edge of the substrate is connected to the supporting frame, a plurality of hollowed film plating grooves are arranged on the substrate in an array manner, and criss-cross connecting strips are formed between the film plating grooves; a plurality of reinforcing support bars are arranged in the support frame, and the reinforcing support bars are arranged avoiding the coating grooves and are supported below the connecting bars. The coating film carrier plate can utilize the reinforced support bars to support the connecting strips, so that the supporting frame structure is more stable than a common frame, the connecting strips are prevented from being concavely deformed even if the base plate is large, and the problem of high plate breaking rate caused by deformation of the coating film grooves is avoided.

Description

Silicon wafer continuous conveying film-plating carrier plate

Technical Field

The utility model relates to the technical field of coated carrier plates, in particular to a silicon wafer continuous conveying coated carrier plate.

Background

Topcon is a tunneling oxide passivation contact solar cell technology based on the selective carrier principle, and was first proposed by Fraunhofer solar institute in germany in 2013. The TOPCON battery structure is an N-type silicon substrate battery, a layer of ultrathin silicon oxide is prepared on the back of the battery, and then a doped silicon thin layer is deposited, so that a passivation contact structure is formed by the ultrathin silicon oxide and the doped silicon thin layer, and the problems of surface recombination and metal contact recombination are effectively reduced. Calculations indicate that the TOPCon cell efficiency limit is 28.7%, closest to the crystalline silicon solar cell theoretical limit efficiency 29.43%.

In recent years, PERC is used as a mainstream product in industry, efficiency is improved and gradually meets bottleneck, and technical focus of industry is being changed from P type to N type. Compared with other N-type battery technologies, topcon can finish technology upgrading by modifying part of the technology on the basis of the existing PERC equipment. Therefore, topcon is widely focused by industry due to its low attenuation, high efficiency-enhancing potential, low production line-upgrading cost, and the like.

Topcon vacuum coating carrier plate is an important process equipment for placing silicon wafer in PECVD and PVD processes. The existing vacuum coating equipment mostly adopts a stainless steel carrier plate, and the carrier plate has the defects of large mass, easy deformation and intolerance to high temperature, and the carrier frame is easy to scratch silicon chips and even fragments. The porous air holes of the support plate made of graphite or carbon fiber influence the atmosphere during film plating, so that the film plating quality is reduced, and the cost is high.

Chinese patent 202123042770.7 discloses a coating carrier, which is composed of a pocket plate, a first support beam, a connecting piece and a second support beam, wherein the pocket plate has a coating slot structure for positioning a silicon wafer, and the first support beam and the second support beam form a frame structure for reinforcing the pocket plate. However, the number of the coating clamping grooves which can be arranged on the carrier is small, if the size of the pocket plate is enlarged, the middle part of the pocket plate is easier to sink and deform, and then the side edges of the silicon wafer are extruded, so that a higher plate breaking rate is caused. In order to weaken the sagging deformation, the width of the connecting strips between the coating clamping grooves cannot be very thin, and under the condition that more coating clamping grooves are arranged, the accumulated width of the connecting strips is very large, so that the carrier becomes heavy and is not beneficial to conveying.

Therefore, a new coated carrier plate is needed to solve the above problems.

Disclosure of Invention

The utility model mainly aims to provide a silicon wafer continuous conveying film-coated carrier plate, which is light and thin in structure and avoids higher plate breaking rate caused by concave deformation of a film-coated groove.

The utility model realizes the aim through the following technical scheme: the continuous silicon wafer conveying and film plating carrier plate comprises a supporting frame and a substrate, wherein the edge of the substrate is connected to the supporting frame, a plurality of hollowed film plating grooves are formed in an array manner on the substrate, and criss-cross connecting strips are formed between the film plating grooves; a plurality of reinforcing support bars are arranged in the support frame, and the reinforcing support bars are arranged avoiding the coating grooves and are supported below the connecting bars.

Specifically, the supporting frame comprises at least two supporting bars extending along a first direction and at least two supporting bars extending along a second direction, the supporting bars are vertically lapped with the supporting bars, a plurality of fixed slots are arranged on the same surface of the supporting bars, the supporting bars are provided with end parts with heights smaller than the middle, the end parts are embedded in the fixed slots and fixed by connecting pieces, and four sides of the substrate are connected with the supporting bars or the supporting bars.

Further, the reinforcing support bar is connected between two of the support bars along the second direction.

Furthermore, the four sides of the base plate are provided with a plurality of kidney-shaped holes, and the base plate is fixed on the supporting beam or the supporting beam by using a threaded connection component penetrating through the kidney-shaped holes.

Further, the supporting beam is of a D-shaped section structure formed by connecting U-shaped strips and plates.

Further, the U-shaped strip is provided with a plurality of notches on the surface parallel to the flat sheet, the flat sheet is provided with fixing holes at corresponding positions of the notches, the side edge of the substrate is provided with protruding parts embedded into the notches, each protruding part is provided with a waist-shaped hole, and the threaded connection assembly simultaneously penetrates through the fixing holes and the waist-shaped holes to connect the substrate with the supporting beam.

Further, the supporting beam comprises a first supporting beam connected with one ends of the two supporting beams and a second supporting beam connected with the other ends of the two supporting beams, a first inclined frame is arranged on the outer side of the first supporting beam, a second inclined frame is arranged on the outer side of the second supporting beam, and the inclined plane of the first inclined frame is parallel to the inclined plane of the second inclined frame in position and opposite in direction.

Specifically, the coating groove comprises a supporting surface lower than the upper surface of the substrate, and the periphery of the supporting surface is in guide slope transition with the upper surface.

Specifically, the substrate is provided with identification positions formed by a plurality of round holes.

The technical scheme of the utility model has the beneficial effects that:

the coating film carrier plate can utilize the reinforced support bars to support the connecting strips, so that the supporting frame structure is more stable than a common frame, the connecting strips are prevented from being concavely deformed even if the base plate is large, and the problem of high plate breaking rate caused by deformation of the coating film grooves is avoided.

Drawings

FIG. 1 is a perspective view of an embodiment of a continuous silicon wafer transport coated carrier;

FIG. 2 is an enlarged view of a portion of the position A of FIG. 1;

FIG. 3 is a perspective view of a support frame;

fig. 4 is a partial enlarged view of the position B in fig. 3.

The figures represent the numbers:

1-supporting frames, 11-supporting bars, 12-supporting beams, 12 a-first supporting beams, 12 b-second supporting beams, 121-end parts, 122-U-shaped bars, 1221-notches, 123-flat sheets, 13-reinforcing supporting bars, 14-first inclined frames and 15-second inclined frames;

2-substrate, 21-coating groove, 211-supporting surface, 212-guiding slope, 22-kidney-shaped hole, 23-bulge, 24-upper surface, 25-round hole and 26-connecting strip;

3-connectors;

4-threaded connection assembly.

Detailed Description

The present utility model will be described in further detail with reference to specific examples.

Examples

As shown in fig. 1 to 4, the continuous silicon wafer conveying and film plating carrier plate of the utility model comprises a supporting frame 1 and a substrate 2, wherein the edge of the substrate 2 is connected to the supporting frame 1, a plurality of hollowed film plating grooves 21 are arranged on the substrate 2 in an array manner, connecting strips 26 which are crisscrossed vertically and horizontally are formed between the film plating grooves 21, a plurality of reinforcing support strips 13 are arranged in the supporting frame 1, and the reinforcing support strips 13 are arranged and supported below the connecting strips 26 while avoiding the film plating grooves 21. The coating grooves 21 are a grid structure separated by connecting bars 26 for positioning the wafer to be coated. Since the coating grooves 21 are used to expose most of the bottom surface of the wafer, the reinforcing support bars 13 are not shielded from the bottom surface of the wafer, and are located under the connecting bars 26 between the coating grooves 21. In the embodiment, two substrates 2 are provided on the support frame 1, and 3×11 coating grooves 21 are provided on each substrate 2, which results in a particularly long coated carrier in one direction. Two connecting strips 26 are arranged between 3 coating grooves 21 in the width direction (i.e. the first direction) of the substrate 2, ten connecting strips 26 are arranged between 11 coating grooves 21 in the length direction (i.e. the second direction), but the width of the connecting strips 26 is only 5-10mm and is thinner than that of the connecting strips on a common coating carrier plate, so that the accumulated width of the connecting strips 26 is smaller, the size of the substrate 2 is smaller than that of the common coating carrier plate under the condition of the same number of coating grooves 21, and the problem of weakening strength caused by thinning of the connecting strips 26 can be solved by the reinforcing support strips 13. In practical application, the supporting frame 1 not only can be a Chinese character 'ri' shaped frame, but also can be a rectangular frame, a Chinese character 'tian' shaped frame and the like; the reinforcing support bars 13 may be arranged along the longitudinal direction of the base plate 2, or along the width direction of the base plate 2, or may be arranged in a vertically staggered network structure. The reinforcing support bar 13 not only strengthens the structural stability of the support frame 1, but also plays a supporting role for the connecting bar 26 on at least one side of each coating groove 21, so that the connecting bar 26 does not significantly sink even after loading silicon wafers. Therefore, the coating film carrier plate can utilize the reinforcing support bar 13 to support the connecting bar 26, so that the structure of the supporting frame 1 is more stable than that of a common frame, the connecting bar 26 is not deformed downwards even if the base plate 2 is large, and the problem of high plate breaking rate caused by deformation of the coating film groove 21 is avoided.

As shown in fig. 1 and 3, the support frame 1 includes two support bars 11 extending in a first direction and four support bars 12 extending in a second direction, the support bars 11 vertically overlap the support bars 12 (i.e., the first direction is in a vertical relationship with the second direction), the support bars 11 are provided with a plurality of fixing grooves (not exposed) on the same surface, the support bars 12 have end portions 121 with a height smaller than that of the middle, the end portions 121 are embedded in the fixing grooves and fixed by the connection members 3, and four sides of the substrate 2 are connected to the support bars 12 or the support bars 11. In this embodiment, the frame of the zigzag structure is enclosed by two support bars 11 and four support bars 12, two support bars 12 are connected between the middle parts of the support bars 11, one support bar 12 (i.e. a first support bar 12a and a second support bar 12 b) is also connected between the front part and the rear part, the width of the fixing groove is matched with the total width of the support bars 12 accommodated by the fixing groove, so that a relatively accurate vertical relationship can be maintained between the support bars 12 and the support bars 11, and each end 121 is fixed face to face up and down with the corresponding fixing groove. As long as the depth of the fixing groove is the same, no planar deformation occurs after fixing with the end 121. The fixing grooves may be formed on the upper surface of the supporting bar 11 or on the lower surface of the supporting bar 11. The connecting piece may be a bolt. The stability of the support frame 1 is improved through the cooperation design of the fixing groove and the end part 121. In other embodiments, if the support frame 1 is a rectangular frame, there are only two support bars 11 and two support bars 12, and one substrate 2 is disposed in the middle; if the support frame 1 is a frame shaped like a Chinese character 'tian', there are four support bars 11 and four support bars 12, and four base plates 2 are arranged in the middle.

As shown in fig. 2 and 3, the reinforcing support bar 13 is connected between the two support bars 11 in the second direction. The second direction is the length direction of the base plate 2, and the length direction of the reinforcing support bar 13 is shorter than the total length of the reinforcing support bar 13 along the width direction, which is beneficial to reducing the total weight of the coated carrier plate.

As shown in fig. 2, the four sides of the base plate 2 are provided with a plurality of kidney-shaped holes 22, and the base plate 2 is fixed to the support beam 12 or the support bar 11 by means of the screw connection assembly 4 passing through the kidney-shaped holes 2. The same high temperature resistant material is preferably used for the support frame 1 and the substrate 2, so that the synchronous deformation can be maintained basically. But some relative movement is still unavoidable locally. Each side of the substrate 2 is fixed to the supporting frame 1, in the embodiment, the long side of the substrate 2 is fixed to the supporting beam 12, and the wide side is fixed to the supporting beam 11, so that the substrate 2 will not deform in the vertical direction under the condition that the supporting frame 1 is not easy to deform, and the waist-shaped hole 22 can still adapt to the position of the connecting piece 3 when the substrate 2 expands with heat and contracts with cold in the horizontal direction.

As shown in fig. 4, the support beam 12 has a D-shaped cross-sectional structure formed by connecting a U-shaped bar 122 and a flat plate 123. The support beam 12 forms a tubular structure, and the U-shaped strip 122 has good rigidity, is not easy to deform in the vertical direction and the horizontal direction, has no heavy mass, but can significantly improve the structural stability of the whole support frame 1. This construction of the support beam 12 is suitable for the long side of the support frame 1, so that the length of the whole coated carrier plate can be longer, the area of the substrate 2 is larger, more coating grooves 21 can be provided, and more silicon wafers can be transported.

As shown in fig. 4, the U-shaped strip 122 is provided with a plurality of notches 1221 on a surface parallel to the flat plate 123, the flat plate 123 is provided with fixing holes (not exposed) at corresponding positions of the notches 1221, the side edge of the base plate 2 is provided with a protruding portion 23 embedded in the notch 1221, each protruding portion 23 is provided with a kidney-shaped hole 22, and the threaded connection assembly 4 simultaneously passes through the fixing holes and the kidney-shaped holes 22 to connect the base plate 2 with the support beam 1. The protrusion 23 has a mating relationship with the notch 1221 to facilitate the limiting of the substrate 2. And the upper surface of the substrate 2 can be not higher than the upper surface of the supporting beam 12, and the whole coating carrier plate is relatively thin in height.

As shown in fig. 2, the coating groove 21 includes a support surface 211 lower than the upper surface 24 of the substrate 2, and a transition between the outer periphery of the support surface 211 and the upper surface 24 is made by a guide slope 212. When the silicon wafer is positioned, the edges need to lean against the upper part of the supporting surface 211, the supporting surface 211 is of a square structure with the width not exceeding 2.5mm, each edge of the silicon wafer is ensured to be contacted with the supporting surface 211, the bottom surface of the silicon wafer is not blocked too much, and the scratch and the abrasion of the contact surface of the silicon wafer are greatly controlled. The guide slope 212 can guide the silicon wafer to automatically fall onto the supporting surface 211 when the coating groove 21 is in place.

As shown in fig. 1 and 3, the support beam 12 includes a first support beam 12a connected to one end of the two support bars 11 and a second support beam 12b connected to the other end of the two support bars 11, a first inclined frame 14 is provided on the outer side of the first support beam 12a, a second inclined frame 15 is provided on the outer side of the second support beam 12b, and the inclined plane of the first inclined frame 14 is parallel to the inclined plane of the second inclined frame 15 in opposite directions. In the embodiment, the inclined surface on the first inclined frame 14 is inclined upwards, and the inclined surface on the second inclined frame 15 is inclined downwards. In practical application, a plurality of coated carrier plates are continuously conveyed on the production line, and the inclined plane of the first inclined frame 14 of one coated carrier plate is opposite to the inclined plane of the second inclined frame 15 of the adjacent coated carrier plate. If the two coated carrier plates are too close to each other to be extruded, the second inclined frame 15 moves upward along the first inclined frame 14 to stagger the two coated carrier plates up and down, so as to avoid deformation of the coated carrier plates caused by horizontal extrusion, which in turn leads to a problem of broken plates of the wafer.

As shown in fig. 1, the substrate 1 is provided with recognition sites composed of a plurality of circular holes 25. In the embodiment, the identification bit is formed by six circular holes 25 which are equidistantly arranged in a straight line, and in practical application, the positions of the six circular holes which are equidistantly arranged form a binary identification mark due to the circular holes and the non-circular holes. The coating equipment can identify the model of the coated carrier plate according to the identification position, and then the model of the silicon wafer is known so as to perform corresponding processing operation.

What has been described above is merely some embodiments of the present utility model. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit of the utility model.

Claims

1. The utility model provides a silicon chip continuous feed coating film carrier plate which characterized in that: the device comprises a supporting frame and a substrate, wherein the edge of the substrate is connected to the supporting frame, a plurality of hollowed-out coating grooves are formed in an array manner on the substrate, and criss-cross connecting strips are formed between the coating grooves; a plurality of reinforcing support bars are arranged in the support frame, and the reinforcing support bars are arranged avoiding the coating grooves and are supported below the connecting bars.

2. The continuous transport coated carrier for silicon wafers according to claim 1, wherein: the support frame comprises at least two support bars extending along a first direction and at least two support bars extending along a second direction, the support bars are vertically lapped with the support bars, a plurality of fixing grooves are formed in the same surface of the support bars, the support bars are provided with end parts with heights smaller than the middle, the end parts are embedded in the fixing grooves and fixed through connecting pieces, and four sides of the substrate are connected with the support bars or the support bars.

3. The continuous silicon wafer conveying and coating carrier plate according to claim 2, wherein: the reinforcing support bars are connected between two support bars along a second direction.

4. The continuous silicon wafer conveying and coating carrier plate according to claim 2, wherein: the four sides of the base plate are provided with a plurality of kidney-shaped holes, and the base plate is fixed on the supporting beam or the supporting bar by using a threaded connection component penetrating through the kidney-shaped holes.

5. The continuous transport coated carrier for silicon wafers of claim 4, wherein: the supporting beam is of a D-shaped cross-section structure formed by connecting U-shaped strips and flat plates.

6. The continuous transport coated carrier for silicon wafers of claim 5, wherein: the U-shaped strip is provided with a plurality of notches on the surface parallel to the flat sheet, the flat sheet is provided with fixing holes at the corresponding positions of the notches, the side edges of the base plate are provided with protruding parts embedded into the notches, each protruding part is provided with a waist-shaped hole, and the threaded connection assembly simultaneously penetrates through the fixing holes and the waist-shaped holes to connect the base plate with the supporting beam.

7. The continuous silicon wafer conveying and coating carrier plate according to claim 2, wherein: the support beam is including the first support beam of the one end of connecting two support bars and the second support beam of connecting two support bars other end, the outside of first support beam is equipped with first sloping, the outside of second support beam is equipped with the second sloping, the inclined plane of first sloping with the inclined plane position parallel of second sloping, the orientation is opposite.

8. The continuous transport coated carrier for silicon wafers according to claim 1, wherein: the coating groove comprises a supporting surface lower than the upper surface of the substrate, and the periphery of the supporting surface is in guide slope transition with the upper surface.

9. The continuous transport coated carrier for silicon wafers according to claim 1, wherein: the substrate is provided with identification positions formed by a plurality of round holes.