CN219561787U

CN219561787U - Double-station laser dotting and blackening equipment

Info

Publication number: CN219561787U
Application number: CN202320296249.6U
Authority: CN
Inventors: 李齐良; 方福堂
Original assignee: Plotech Technology Kunshan Co ltd
Current assignee: Plotech Technology Kunshan Co ltd
Priority date: 2023-02-23
Filing date: 2023-02-23
Publication date: 2023-08-22
Anticipated expiration: 2033-02-23

Abstract

The utility model discloses double-station laser dotting and blackening equipment which comprises a feeding platform for storing a PCB, a first visual detection device arranged above the feeding platform and used for identifying the position of an optical locating point on the front surface of the PCB, a second visual detection device arranged on the side edge of the feeding platform and used for identifying the position of the optical locating point on the back surface of the PCB, a double-station carrying device, a turnover device arranged between the double-station carrying devices and used for turning over the PCB, and a blanking platform for blanking the PCB through the carrying device; and each carrying device is provided with a laser driven to dot the optical locating points on the PCB and a code spraying machine driven to spray the processed optical locating points. The utility model realizes the improvement of the efficiency of laser dotting treatment on the optical positioning points.

Description

Double-station laser dotting and blackening equipment

Technical Field

The utility model belongs to the technical field of PCB manufacture, and particularly relates to double-station laser dotting and blackening equipment.

Background

The optical locating point is commonly called as a Mark point, and is a point for locating when the PCB is taken out and welded by a machine. Generally, mark points are required to be set on a PCB board of a surface mounted component, and during mass production, a chip mounter can search the Mark points manually or automatically by an operator to calibrate, so that common positioning points are provided for all steps in an assembly process to position circuit patterns, and therefore, the Mark points are critical to SMT production.

The burning removal is needed for the poor optical positioning points on the PCB, and manual removal is adopted conventionally, so that the burning removal is time-consuming. An optical anchor point can be effectively processed by improving a laser cutting head system using a PCB/FPC laser cutting machine such as CN200920206245.4, but there is still a need for an apparatus capable of efficiently and automatically performing double-sided dotting work for a larger batch of PCBs.

Disclosure of Invention

The utility model aims to solve the technical problems and provides a double-station laser dotting and blackening device, so that the efficiency of laser dotting treatment on optical positioning points is improved. In order to achieve the above purpose, the technical scheme of the utility model is as follows:

the double-station laser dotting and blackening equipment comprises a feeding platform for storing a PCB, a first visual detection device arranged above the feeding platform and used for identifying the position of an optical locating point on the front surface of the PCB, a second visual detection device arranged on the side edge of the feeding platform and used for identifying the position of the optical locating point on the back surface of the PCB, a double-station carrying device, a turnover device arranged between the double-station carrying devices and used for turning over the PCB, and a blanking platform for blanking the PCB through the carrying device; and each carrying device is provided with a laser driven to dot the optical locating points on the PCB and a code spraying machine driven to spray the processed optical locating points.

Specifically, the material loading platform is including being used for the pile up neatly to place PCB's work or material rest, the adjacent side of work or material rest is provided with the side shield that is used for spacing PCB.

Specifically, the first visual inspection device comprises a first fixed frame, a first camera module arranged above the first fixed frame, and first light source modules arranged at two sides of the bottom of the first fixed frame; the first fixed frame is located above the feeding platform.

Specifically, the second visual inspection device comprises a second fixed frame, second light source modules arranged on two sides of the top of the second fixed frame, and a second camera module arranged below the second fixed frame; the second fixed frame is positioned below the carrying device.

Specifically, handling device includes first linear module, installs in a set of transport absorption tongs of first linear module side, sets up the absorption platform that is used for adsorbing PCB that removes the setting in first linear module below.

Specifically, the first linear module is arranged along the X-axis direction, the adsorption platform is mounted on the second linear module, and the second linear module is arranged along the Y-axis direction.

Specifically, the side that first linear module deviates from the transport absorption tongs installs laser instrument and ink jet numbering machine.

Specifically, turning device is including being used for fixing a position PCB's suspension platform, setting up in suspension platform side and receiving the rotatory upset absorption tongs of drive.

Specifically, the unloading platform is including being used for preliminary unloading location PCB's flitch, setting up in the unloading absorption tongs and the unloading line that the flitch side removes the setting.

Specifically, the blanking adsorption gripper is arranged on a third linear module, and the third linear module is arranged along the Y-axis direction; the fourth linear module is installed to the bottom of flitch, fourth linear module sets up along X axle direction.

Compared with the prior art, the double-station laser dotting and blackening equipment has the following main beneficial effects:

by arranging the first visual detection device and the second visual detection device, the front and back conditions of the PCB can be accurately detected in the feeding process, and the position of an optical locating point can be determined; the turnover device is used for performing secondary processing on the turnover of the PCB between the conveying devices of the double stations, so that the front surface and the back surface of the PCB can be synchronously processed, and the turnover device is suitable for large-scale efficient processing; the laser, the ink jet numbering machine and the feeding position are respectively arranged at two sides of the first linear module, the moving adsorption platform is utilized for carrying and transporting the PCB, so that the turnover device can have enough avoiding space, the arrangement positions of the laser and the ink jet numbering machine are reasonably optimized, the whole equipment structure is more compact, the beat of the PCB transporting process from the vision detection of the feeding position to the adsorption platform is more efficient, and the transporting time arrangement is reasonable; the whole equipment realizes high-efficiency and automatic processing of the positions of the optical positioning points on the two sides of the PCB.

Drawings

FIG. 1 is a schematic top view of an apparatus according to an embodiment of the present utility model;

fig. 2 is a schematic structural diagram of a first visual inspection device and a second visual inspection device in the present embodiment;

FIG. 3 is a schematic diagram of the structure of the laser and the ink jet printer in the present embodiment;

fig. 4 is a schematic structural diagram of a turnover device in the present embodiment;

FIG. 5 is a schematic diagram of a blanking platform in this embodiment;

the figures represent the numbers:

1 material loading platform, 11 work or material rest, 12 side shield, 2 first visual detection device, 21 first fixed frame, 22 first camera module, 23 first light source module, 3 second visual detection device, 31 second fixed frame, 32 second light source module, 4 handling device, 41 first linear module, 42 transport absorption tongs, 43 absorption platform, 44 second linear module, 5 turning device, 51 pause platform, 52 upset absorption tongs, 6 unloading platform, 61 blanking plate, 62 unloading absorption tongs, 63 unloading line, 64 third linear module, 65 fourth linear module, 7 laser instrument, 71 ink jet numbering machine.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely, but is apparent to those skilled in the art in view of the present utility model.

Examples:

referring to fig. 1-5, the embodiment is a dual-station laser dotting and blackening device, which comprises a feeding platform 1 for storing PCBs, a first visual detection device 2 arranged above the feeding platform 1 and used for identifying the position of an optical locating point on the front side of the PCBs, a second visual detection device 3 arranged on the side edge of the feeding platform 1 and used for identifying the position of the optical locating point on the back side of the PCBs, a dual-station carrying device 4, a turning device 5 arranged between the dual-station carrying devices 4 and used for turning the PCBs, and a discharging platform 6 for discharging the PCBs through the carrying device 4.

Each carrying device 4 is provided with a laser 7 driven to dot the optical positioning points on the PCB and a code spraying machine 71 driven to spray the processed optical positioning points. Aiming at the optical locating point positions which need to be processed on the PCB, when the locating precision deviation exists in the laser 7, the optical locating point positions can still be covered through the spraying processing of the ink jet printer 71, so that the problem of locating errors caused by the exposure of the optical locating point positions in the later PCB processing is avoided.

The feeding platform 1 comprises a material rack 11 for stacking and placing PCBs, and side baffles 12 for limiting the PCBs are arranged on adjacent sides of the material rack 1. The PCB can be stably positioned in the material rack 11, and when the picking movement is required, the uppermost PCB in the material rack 11 is adsorbed and transferred.

The first visual inspection device 2 includes a first fixed frame 21, a first camera module 22 disposed above the first fixed frame 21, and first light source modules 23 disposed on two sides of the bottom of the first fixed frame 21. The first fixed frame 21 is located above the feeding platform 1, the first light source module 23 can polish the uppermost layer of the PCB in the material rack 11, the first camera module 22 performs visual identification on the position of the optical locating point on the front surface of the PCB, and specific coordinate parameters of the position of the optical locating point are determined.

The second visual inspection device 3 includes a second fixing frame 31, second light source modules 32 disposed on two sides of the top of the second fixing frame 31, and a second camera module disposed below the second fixing frame 31. The second fixing frame 31 is located below the handling device 4, the second light source module 32 can polish the back of the PCB in the handling process, the second camera module performs visual identification on the position of the optical locating point on the back of the PCB, and specific coordinate parameters of the position of the optical locating point are determined.

In contrast, the first visual inspection device 2 is mounted at a position higher than the second visual inspection device 3, the first visual inspection device 2 is disposed above the workbench, and the second visual inspection device 3 is disposed inside the workbench in a recessed manner.

The handling device 4 comprises a first linear module 41, a group of handling and sucking grippers 42 arranged on the side edge of the first linear module 41, and a sucking platform 43 arranged below the first linear module 41 and used for sucking the PCB. The first linear modules 41 are arranged along the X-axis direction, and correspondingly, the adsorption platform 43 is mounted on the second linear modules 44, and the second linear modules 44 are arranged along the Y-axis direction. The carrying and adsorbing swivel hand 42 has a lifting and adjusting function, and is driven by an air cylinder or a screw rod, and the carrying and adsorbing gripper 42 adopts a group of sucker structures which are arranged at intervals. The carrying suction grippers 42 can stably suction and position the PCB for transplanting. The PCB in the material rack 11 is picked up by the carrying adsorption gripper 42 of the carrying device 4 at the first station and identified and detected at the first visual detection device 2, the PCB is moved again to be identified and detected at the second visual detection device 3, and then the PCB is positioned on the adsorption platform 43, and the adsorption platform 43 transfers the PCB beyond the first linear module 41.

The side that first linear module 41 deviates from transport absorption tongs 42 installs laser instrument 7 and ink jet numbering machine 71, and laser instrument 7 and ink jet numbering machine 71 all possess the lift regulatory function, realize the drive through cylinder or motor, and laser instrument 7 burns the positive optics setpoint position of PCB on the absorption platform 43 and handles, and ink jet numbering machine 71 spouts the sign indicating number to the optics setpoint position after handling again and covers, and after the PCB was accomplished positive processing, absorption platform 43 moved to initial position along the linear module 44 of second.

The structure of the carrying device 4 with double stations is consistent and will not be described again. The first linear modules 41 of the double-station carrying device 4 are arranged along the same linear direction, a turnover device 5 is arranged between the adjacent first linear modules 41, and the turnover device 5 comprises a pause platform 51 for positioning a PCB and a turnover adsorption gripper 52 arranged on the side edge of the pause platform 51 and driven to rotate; the flip suction gripper 52 has a suction cup structure arranged at intervals like the transport suction gripper 42, and can stably suction and move the PCB. The overturn adsorption gripper 52 is driven in rotation by a motor and a belt pulley. The horizontal positioning direction of the turning adsorption grip 52 is consistent with the surface of the suspension platform 51, and the turning adsorption grip 52 is turned upwards, and is connected with the PCB transferred from the adsorption platform 43 by the carrying adsorption grip 42, and is rotated 180 ° to be placed on the suspension platform. In the same manner as in the handling device 4 at the second station, the handling suction gripper 42 sucks the PCB turned over on the suspension stage 51 to the suction stage 43, and the transfer PCB is subjected to laser dotting treatment and paint spraying coverage treatment, and the handling suction gripper 42 transfers the PCB from the suction stage 43 to perform blanking.

The blanking platform 6 comprises a blanking plate 61 for primarily blanking and positioning the PCB, a blanking adsorption gripper 62 arranged on the side edge of the blanking plate 61 in a moving manner, and a blanking line 63. The blanking adsorbing gripper 62 is mounted on the third linear module 64, the blanking adsorbing gripper 62 and the carrying adsorbing gripper 42 are provided with a group of sucker structures which are arranged at intervals, the blanking adsorbing gripper 62 is provided with a lifting function, and driving is achieved through a motor. The third linear module 64 is disposed along the Y-axis direction. A fourth linear module 65 is mounted at the bottom of the blanking plate 61, the fourth linear module 65 is disposed along the X-axis direction, and the blanking plate 61 is driven to move along the X-axis direction. The carrying suction grip 42 positions the PCB after the back dotting process is completed on the blanking plate 61, the blanking plate 61 moves to extend to the lower side of the third linear module 64, and the blanking suction grip 62 sucks the PCB of the blanking plate 61 and transfers the PCB to the blanking line 63.

When the embodiment is applied, the PCB is firstly subjected to front visual inspection by the first visual inspection device 2, then is subjected to back visual inspection by the second visual inspection device 3, the PCB is conveyed and adsorbed by the adsorption gripper 42 to be moved to the adsorption platform 43 for laser dotting and spraying treatment at the front optical locating point position, the PCB is turned over and transferred and is subjected to back optical locating point position treatment again, and the PCB is subjected to blanking from the adsorption platform 43 by the blanking adsorption gripper 62.

In the embodiment, by arranging the first visual detection device 2 and the second visual detection device 3, the front and back conditions of the PCB can be accurately detected in the feeding process, and the position of an optical locating point can be determined; the turnover device 5 is arranged between the conveying devices 4 of the double stations, and the turnover of the PCB is carried out for secondary processing, so that the front surface and the back surface of the PCB can be synchronously processed, and the double-station conveying device is suitable for large-batch efficient processing; the laser 7, the ink jet printer 71 and the loading positions are respectively arranged on two sides of the first linear module 41, and the moving adsorption platform 43 is utilized for carrying and transporting the PCB, so that the turnover device 5 can have enough avoiding space, the arrangement positions of the laser 7 and the ink jet printer 71 are reasonably optimized, the whole equipment structure is more compact, the beat of the PCB transporting process from the vision detection of the loading position to the adsorption platform 43 is more efficient, and the transporting time arrangement is reasonable; the whole equipment realizes high-efficiency and automatic processing of the positions of the optical positioning points on the two sides of the PCB.

In the description of the present specification, the terms "one embodiment," "some embodiments," "particular embodiments," and the like, mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Although the embodiments of the present utility model are described above, the embodiments are only used for facilitating understanding of the present utility model, and are not intended to limit the present utility model. Any person skilled in the art can make any modification and variation in form and detail without departing from the spirit and scope of the present disclosure, but the scope of the present disclosure is to be determined by the appended claims.

Claims

1. Double-station laser dotting and blackening equipment is characterized in that: the PCB feeding device comprises a feeding platform for storing the PCB, a first visual detection device arranged above the feeding platform and used for identifying the position of an optical locating point on the front surface of the PCB, a second visual detection device arranged on the side edge of the feeding platform and used for identifying the position of the optical locating point on the back surface of the PCB, a double-station carrying device, a turnover device arranged between the double-station carrying devices and used for turning over the PCB, and a discharging platform for discharging the PCB through the carrying device; and each carrying device is provided with a laser driven to dot the optical locating points on the PCB and a code spraying machine driven to spray the processed optical locating points.

2. The double-station laser dotting and blackening device as claimed in claim 1, wherein: the material loading platform is including being used for the pile up neatly to place PCB's work or material rest, the adjacent side of work or material rest is provided with the side shield that is used for spacing PCB.

3. The double-station laser dotting and blackening device as claimed in claim 1, wherein: the first visual inspection device comprises a first fixed frame, a first camera module arranged above the first fixed frame, and first light source modules arranged on two sides of the bottom of the first fixed frame; the first fixed frame is located above the feeding platform.

4. The double-station laser dotting and blackening device as claimed in claim 1, wherein: the second visual inspection device comprises a second fixed frame, second light source modules arranged on two sides of the top of the second fixed frame, and a second camera module arranged below the second fixed frame; the second fixed frame is positioned below the carrying device.

5. The double-station laser dotting and blackening device as claimed in claim 1, wherein: the handling device comprises a first linear module, a group of handling adsorption grippers arranged on the side edge of the first linear module, and an adsorption platform arranged below the first linear module and used for adsorbing the PCB.

6. The double-station laser dotting and blackening device as claimed in claim 5, wherein: the first linear modules are arranged along the X-axis direction, the adsorption platform is mounted on the second linear modules, and the second linear modules are arranged along the Y-axis direction.

7. The double-station laser dotting and blackening device as claimed in claim 5, wherein: the side that first linear module deviates from the transport absorption tongs installs laser instrument and ink jet numbering machine.

8. The double-station laser dotting and blackening device as claimed in claim 1, wherein: the turnover device comprises a pause platform for positioning the PCB and a turnover adsorption gripper arranged on the side edge of the pause platform and driven to rotate.

9. The double-station laser dotting and blackening device as claimed in claim 1, wherein: the blanking platform comprises a blanking plate for primarily blanking and positioning the PCB, a blanking adsorption gripper arranged on the side edge of the blanking plate in a moving mode, and a blanking line.

10. The double-station laser dotting and blackening device as claimed in claim 9, wherein: the blanking adsorption gripper is arranged on a third linear module, and the third linear module is arranged along the Y-axis direction; the fourth linear module is installed to the bottom of flitch, fourth linear module sets up along X axle direction.