CN219555246U - Printed circuit board provided with differential signal wiring - Google Patents
Printed circuit board provided with differential signal wiring Download PDFInfo
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- CN219555246U CN219555246U CN202223603152.XU CN202223603152U CN219555246U CN 219555246 U CN219555246 U CN 219555246U CN 202223603152 U CN202223603152 U CN 202223603152U CN 219555246 U CN219555246 U CN 219555246U
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- printed circuit
- circuit board
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- bonding pad
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Abstract
The utility model relates to a printed circuit board provided with differential signal wires, wherein the printed circuit board is provided with a first component and a second component, the first component and the second component are communicated through differential signals, the printed circuit board is provided with a first bonding pad around the first component, a differential signal port of the first component is connected to the first bonding pad through wires on the printed circuit board, the printed circuit board is provided with a second bonding pad around the second component, and a differential signal port of the second component is connected to the second bonding pad through wires on the printed circuit board; corresponding FPC board is connected between the first bonding pad and the second bonding pad, wiring for transmitting differential signals is arranged on the FPC board, and the wiring is in communication connection with the first bonding pad and the second bonding pad.
Description
Technical Field
The utility model relates to the field of printed circuit boards, in particular to a printed circuit board provided with differential signal wires.
Background
The name of PCB is printed circuit board, also called printed circuit board, which is an important electronic component, is a support for electronic components, and is a carrier for electrically interconnecting electronic components.
In the design of the printed circuit of the electronic circuit with a small number of high-density layers, some important differential signal lines cannot be connected through single-sided wiring because of the layout or the structural layout, the impedance discontinuity of part of the high-speed differential signal lines can be caused by the connection of the through holes, or the impedance change is caused by the longer wiring on the printed circuit to be divided across the plane so as to influence the signal integrity, and the electromagnetic interference is easily caused by the high-speed differential lines on the high-density printed circuit.
It is an object of the present utility model to devise a printed circuit board provided with differential signal traces, which addresses the problems of the prior art described above.
Disclosure of Invention
The utility model aims to solve the problems of the prior art and provides a printed circuit board provided with differential signal wires.
The technical scheme of the utility model is as follows:
a printed circuit board provided with differential signal traces, the printed circuit board being provided with a first component, a second component, the first component and the second component being in communication via differential signals,
the printed circuit board is provided with a first bonding pad around the first component, the differential signal port of the first component is connected to the first bonding pad through a wire on the printed circuit board, the printed circuit board is provided with a second bonding pad around the second component, and the differential signal port of the second component is connected to the second bonding pad through a wire on the printed circuit board;
corresponding FPC board is connected between the first bonding pad and the second bonding pad, wiring for transmitting differential signals is arranged on the FPC board, and the wiring is in communication connection with the first bonding pad and the second bonding pad.
Further, a first FPC golden finger and a second FPC golden finger which are matched with the first bonding pad and the second bonding pad are arranged at two ends of the FPC board, the first FPC golden finger is provided with a P2 pin and an N2 pin, and the second FPC golden finger is provided with a P3 pin and an N3 pin;
the FPC board is connected with the first bonding pad and the second bonding pad through the first FPC golden finger and the second FPC golden finger respectively.
Further, the differential signal port of the first component comprises a first P0 port and a first N0 port, the first pad is provided with an a1 port and an a2 port, the first P0 port is connected to the a1 port through a wire on the printed circuit board, and the first N0 port is connected to the a2 port through a wire on the printed circuit board;
the differential signal port of the second component comprises a second P0 port and a second N0 port, the second bonding pad is provided with a b1 port and a b2 port, the second P0 port is connected to the b1 port through a wiring on the printed circuit board, and the second N0 port is connected to the b2 port through a wiring on the printed circuit board.
Further, the FPC board is provided with a first differential connecting wire and a second differential connecting wire, two ends of the first differential connecting wire are respectively connected with the P2 pin and the P3 pin, and two ends of the second differential connecting wire are respectively connected with the N2 pin and the N3 pin;
the P2 pin is connected with the a1 port, the P3 pin is connected with the b1 port, the N2 pin is connected with the a2 port, and the N3 pin is connected with the b2 port.
Further, the first component and the first bonding pad are arranged on the same layer of the printed circuit board, and the second component and the second bonding pad are arranged on the same layer of the printed circuit board.
Further, the first component and the second component are disposed on different planar layers of the printed circuit board, the printed circuit board is provided with an opening, and the FPC board passes through the opening to reach the different planar layers of the printed circuit board.
Further, the FPC board is of an electromagnetic shielding type.
The utility model has the advantages that:
according to the utility model, the wiring for transmitting the differential signals is arranged on the FPC board, and the wiring for transmitting the differential signals is not arranged on the PCB board, so that the wiring for transmitting the differential signals is not limited by the distribution, the shape and the like of components of the PCB board, and the situation that the important high-speed differential wires are too long or need to be replaced and connected in a punching way can be avoided.
The utility model replaces the PCB board carrying wiring high-density PCB with the shielding FPC soft board to design the unavoidable method for improving the signal integrity by cross-plane segmentation and perforation of the important high-speed differential signals. The problem of signal integrity caused by too long or layer-changing perforation connection of important high-speed differential lines or cross-plane wiring can be avoided, and the mutual interference of high-speed signal differential lines and other signal lines can also be avoided.
Drawings
Fig. 1 is a schematic view of an unconnected structure of the FPC board of the present utility model.
Fig. 2 is a schematic view of the structure of the FPC board according to the present utility model connected thereto.
Fig. 3 is a schematic view of a specific FPC board provided by the present utility model.
Fig. 4 is a schematic diagram of a specific printed circuit board according to the present utility model.
Detailed Description
For the convenience of understanding by those skilled in the art, the structure of the present utility model will now be described in further detail with reference to the accompanying drawings:
example 1
Referring to fig. 1-4, a printed circuit board provided with differential signal traces, the printed circuit board provided with a first component, a second component, the first component and the second component in communication via differential signals,
in this embodiment, differential signal communication is a signal transmission technology, which is different from the conventional method of transmitting signals on one signal line and one ground line, and the differential transmission transmits signals on two lines, where the amplitudes of the two signals are the same and the phases are opposite. The transmitted signals on these two wires are differential signals. The signal receiving end compares the difference value of the two voltages to judge the logic state sent by the sending end. On a circuit board, the differential trace must be two wires of equal length, equal width, in close proximity and at the same level.
The printed circuit board is provided with a first bonding pad around the first component, the differential signal port of the first component is connected to the first bonding pad through a wire on the printed circuit board, the printed circuit board is provided with a second bonding pad around the second component, and the differential signal port of the second component is connected to the second bonding pad through a wire on the printed circuit board;
in this embodiment, the first bonding pad is disposed around the first component, and the second bonding pad is disposed around the second component, so as to facilitate the bonding pad to approach the corresponding component and facilitate wiring on the printed circuit board. The printed circuit board can be connected with the bonding pads and corresponding components through the printed wiring, so that pins which are required to be in differential communication by the device are connected to the bonding pads, and the bonding pads can play a role in connecting different components.
Corresponding FPC board is connected between the first bonding pad and the second bonding pad, wiring for transmitting differential signals is arranged on the FPC board, and the wiring is in communication connection with the first bonding pad and the second bonding pad.
In one embodiment, the traces for transmitting differential signals must be two wires of equal length, equal width, in close proximity, and at the same level. Through setting up the wiring that transmits differential signal on the FPC board, the wiring that transmits differential signal is not setting up on the PCB board, consequently the wiring that transmits differential signal is not restricted by components and parts distribution, the shape etc. of PCB board, can avoid important high-speed differential line to walk too long or need trade the layer and want to punch the connection.
Further, referring to fig. 1, a first FPC gold finger and a second FPC gold finger which are matched with the first bonding pad and the second bonding pad are arranged at two ends of the FPC board, the first FPC gold finger is provided with a P2 pin and an N2 pin, and the second FPC gold finger is provided with a P3 pin and an N3 pin;
the FPC board is connected with the first bonding pad and the second bonding pad through the first FPC golden finger and the second FPC golden finger respectively.
The golden finger is a row of golden conductive contact pieces at the tail end of the FPC board, and can be inserted into or connected to a corresponding bonding pad through the golden finger, so that connection of the FPC board and the bonding pad and connection between the wiring for transmitting differential signals and the bonding pad are completed, and connection between the wiring for transmitting the differential signals and a differential signal port of a component is further realized.
Specifically, the differential signal port of the first component includes a first P0 port and a first N0 port, the first pad is provided with an a1 port and an a2 port, the first P0 port is connected to the a1 port through a trace on the printed circuit board, and the first N0 port is connected to the a2 port through a trace on the printed circuit board;
the differential signal port of the second component comprises a second P0 port and a second N0 port, the second bonding pad is provided with a b1 port and a b2 port, the second P0 port is connected to the b1 port through a wiring on the printed circuit board, and the second N0 port is connected to the b2 port through a wiring on the printed circuit board.
Further, the FPC board is provided with a first differential connecting wire 1 and a second differential connecting wire 2, two ends of the first differential connecting wire 1 are respectively connected with the P2 pin and the P3 pin, and two ends of the second differential connecting wire 2 are respectively connected with the N2 pin and the N3 pin;
the P2 pin is connected with the a1 port, the P3 pin is connected with the b1 port, the N2 pin is connected with the a2 port, and the N3 pin is connected with the b2 port.
Further, the first component and the first bonding pad are arranged on the same layer of the printed circuit board, and the second component and the second bonding pad are arranged on the same layer of the printed circuit board.
Further, the FPC board is of an electromagnetic shielding type. The electromagnetic shielding type can absorb energy (eddy current loss), reflect energy (interface reflection of electromagnetic wave on shielding body) and cancel energy (electromagnetic induction generates reverse electromagnetic field on shielding layer, and can cancel part of interference electromagnetic wave) on the external interference electromagnetic wave and internal electromagnetic wave from wire, cable, component, circuit or system, etc., and has the function of weakening interference.
In this embodiment, the first component and the second component are disposed on the same plane layer of the printed circuit board, so that the FPC board only needs to be normally connected.
Example two
The difference between the present embodiment and the first embodiment is that the first component and the second component are disposed on different plane layers of the printed circuit board, the printed circuit board is provided with an opening, and the FPC board passes through the opening to reach the different plane layers of the printed circuit board.
Because the first component and the second component are arranged on different plane layers of the printed circuit board, the FPC board can reach the corresponding plane layers only by penetrating through the opening, so that the golden finger of the FPC board is connected to the bonding pads of the different plane layers.
It should be noted that the implementation principle and the technical effects of the present embodiment are the same as those of the first embodiment, and for brevity, reference may be made to the corresponding content of the first embodiment.
It should be noted that in the claims, any reference signs placed between parentheses shall not be construed as limiting the claim. The word "comprising" does not exclude the presence of elements or steps not listed in a claim. The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements. The utility model may be implemented by means of hardware comprising several distinct elements, and by means of a suitably programmed computer. In the unit claims enumerating several means, several of these means may be embodied by one and the same item of hardware. The use of the words first, second, third, etc. do not denote any order. These words may be interpreted as names.
While preferred embodiments of the present utility model have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. It is therefore intended that the following claims be interpreted as including the preferred embodiments and all such alterations and modifications as fall within the scope of the utility model.
It will be apparent to those skilled in the art that various modifications and variations can be made to the present utility model without departing from the spirit or scope of the utility model. Thus, it is intended that the present utility model also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.
In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.
In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present utility model. In this specification, schematic representations of the above terms should not be understood as necessarily being directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.
The foregoing description is only of the preferred embodiments of the utility model, and all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Claims (7)
1. A printed circuit board provided with differential signal wiring, the printed circuit board is provided with first components, second components, first components with second components pass through differential signal communication, its characterized in that:
the printed circuit board is provided with a first bonding pad around the first component, the differential signal port of the first component is connected to the first bonding pad through a wire on the printed circuit board, the printed circuit board is provided with a second bonding pad around the second component, and the differential signal port of the second component is connected to the second bonding pad through a wire on the printed circuit board;
corresponding FPC board is connected between the first bonding pad and the second bonding pad, wiring for transmitting differential signals is arranged on the FPC board, and the wiring is in communication connection with the first bonding pad and the second bonding pad.
2. A printed circuit board provided with differential signal traces as in claim 1, wherein: the two ends of the FPC board are provided with a first FPC golden finger and a second FPC golden finger which are matched with the first bonding pad and the second bonding pad, the first FPC golden finger is provided with a P2 pin and an N2 pin, and the second FPC golden finger is provided with a P3 pin and an N3 pin;
the FPC board is connected with the first bonding pad and the second bonding pad through the first FPC golden finger and the second FPC golden finger respectively.
3. A printed circuit board provided with differential signal traces as in claim 2, wherein: the differential signal port of the first component comprises a first P0 port and a first N0 port, the first bonding pad is provided with an a1 port and an a2 port, the first P0 port is connected to the a1 port through a wire on the printed circuit board, and the first N0 port is connected to the a2 port through a wire on the printed circuit board;
the differential signal port of the second component comprises a second P0 port and a second N0 port, the second bonding pad is provided with a b1 port and a b2 port, the second P0 port is connected to the b1 port through a wiring on the printed circuit board, and the second N0 port is connected to the b2 port through a wiring on the printed circuit board.
4. A printed circuit board provided with differential signal traces as in claim 3, wherein: the FPC board is provided with a first differential connecting wire and a second differential connecting wire, two ends of the first differential connecting wire are respectively connected with the P2 pin and the P3 pin, and two ends of the second differential connecting wire are respectively connected with the N2 pin and the N3 pin;
the P2 pin is connected with the a1 port, the P3 pin is connected with the b1 port, the N2 pin is connected with the a2 port, and the N3 pin is connected with the b2 port.
5. A printed circuit board provided with differential signal traces as in claim 1, wherein: the first component and the first bonding pad are arranged on the same layer of the printed circuit board, and the second component and the second bonding pad are arranged on the same layer of the printed circuit board.
6. A printed circuit board provided with differential signal traces as in claim 1, wherein: the first component and the second component are arranged on different plane layers of the printed circuit board, the printed circuit board is provided with an opening, and the FPC board passes through the opening so as to reach the different plane layers of the printed circuit board.
7. A printed circuit board provided with differential signal traces as in claim 1, wherein: the FPC board is of an electromagnetic shielding type.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223603152.XU CN219555246U (en) | 2022-12-30 | 2022-12-30 | Printed circuit board provided with differential signal wiring |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223603152.XU CN219555246U (en) | 2022-12-30 | 2022-12-30 | Printed circuit board provided with differential signal wiring |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219555246U true CN219555246U (en) | 2023-08-18 |
Family
ID=87733381
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223603152.XU Active CN219555246U (en) | 2022-12-30 | 2022-12-30 | Printed circuit board provided with differential signal wiring |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219555246U (en) |
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2022
- 2022-12-30 CN CN202223603152.XU patent/CN219555246U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |