CN220305760U

CN220305760U - Integrated board card, quantum measurement and control system and quantum computer

Info

Publication number: CN220305760U
Application number: CN202322228638.8U
Authority: CN
Inventors: 请求不公布姓名; 李雪白
Original assignee: Benyuan Quantum Computing Technology Hefei Co ltd
Current assignee: Benyuan Quantum Computing Technology Hefei Co ltd
Priority date: 2023-08-17
Filing date: 2023-08-17
Publication date: 2024-01-05
Anticipated expiration: 2033-08-17

Abstract

The utility model discloses an integrated board, a quantum measurement and control system and a quantum computer, wherein the integrated board comprises a routing board and a plurality of functional boards for controlling a quantum chip; the routing board card and each functional board card are connected through a first capacitor, the first capacitor is arranged at a receiving end of a first electronic element on the functional board card, and the first electronic element is used for receiving control signals transmitted by the routing board card. Compared with a transmitting end, the utility model reduces the reflection of signals by arranging the first capacitor and arranging the first capacitor at the receiving end of the first electronic element in the functional board card, can furthest filter the direct current signals coming in by crosstalk, ensures that the signals are symmetrical about 0 level, and improves the signal quality.

Description

Integrated board card, quantum measurement and control system and quantum computer

Technical Field

The utility model relates to the technical field of quantum computers, in particular to an integrated board card, a quantum measurement and control system and a quantum computer.

Background

The quantum chip is a core component for running quantum computation, a plurality of bits of quantum bits are integrated on the quantum chip, a special quantum control system is required to be built in order to ensure the normal work of the quantum bits, a plurality of functional boards are arranged in the quantum control system, and various control signals (such as a frequency control signal, a quantum state control signal and a measurement reading control signal) are provided for the quantum chip; the function board cards are connected with the central control module, and the task parameters of quantum computation are received through the central control module and forwarded to each function board card for controlling the operation of each function board card; in order to facilitate the electrical connection between the function boards and the central control module, the function boards are generally integrated in a chassis, and each function board is electrically connected with the central control module through a routing board in the chassis.

In practical application, signal data output by the central control module is forwarded to each functional board card through the routing board card in the form of SerDes signals, and the SerDes signals are affected by line loss, crosstalk and the like when transmitted across boards, so that the signal quality is affected.

It should be noted that the information disclosed in the background section of the present application is only for enhancement of understanding of the general background of the present application and should not be taken as an admission or any form of suggestion that this information forms the prior art already known to a person skilled in the art.

Disclosure of Invention

The utility model aims at: an integrated board card, a quantum measurement and control system and a quantum computer are provided to improve quality of SerDes signals in transmission across boards.

In order to achieve the above object, the present utility model provides the following technical solutions:

the first aspect of the utility model provides an integrated board, which comprises a routing board and a plurality of functional boards for controlling quantum chips; the routing board card and each functional board card are connected through a first capacitor, the first capacitor is arranged at a receiving end of a first electronic element on the functional board card, and the first electronic element is used for receiving control signals transmitted by the routing board card.

The integrated board card further comprises a PCB board, wherein the PCB board is provided with a first transmission line, the first transmission line is used for electrically connecting the transmitting end of the routing board card and the receiving end of the first electronic element on the functional board card, and a plurality of first ground holes are arranged around the first transmission line at intervals.

The integrated board card further comprises a multilayer PCB board, wherein the first transmission line comprises a first section of first transmission line arranged on the top layer of the multilayer PCB board and a second section of first transmission line arranged on the middle layer of the multilayer PCB board, and the first section of first transmission line and the second section of first transmission line are electrically connected through the first via hole.

The integrated board card further comprises a first through hole arranged below the first through hole.

The integrated board card further comprises a second capacitor connected between the routing board card and each functional board card, wherein the second capacitor is arranged at the receiving end of a second electronic element on the routing board card and used for receiving return signals transmitted by the functional board card.

The integrated board card further comprises a PCB board, wherein the second transmission line is arranged on the PCB board and is used for electrically connecting the transmitting end of the functional board card and the receiving end of the second electronic element on the routing board card, and a plurality of second ground holes are arranged around the second transmission line at intervals.

The integrated board card further comprises a multilayer PCB board, wherein the second transmission line comprises a first section of second transmission line arranged on the top layer of the multilayer PCB board and a second section of second transmission line arranged on the middle layer of the multilayer PCB board, and the first section of second transmission line and the second section of second transmission line are electrically connected through the second via hole.

The integrated board card further comprises a second through hole below the second through hole.

The second aspect of the utility model provides a quantum measurement and control system, which comprises a VPX chassis, wherein the integrated board card is integrated in the VPX chassis.

The third aspect of the utility model provides a quantum computer, comprising the quantum measurement and control system.

The utility model has the beneficial effects that:

because the SerDes signal is a high-speed signal, in order to reduce signal attenuation during cross-board transmission, a direct current component is superimposed on the signal, and is generally biased at the receiving end, so that the direct current signal needs to be filtered out generally to reduce attenuation and improve signal quality.

The utility model reduces the reflection of signals by arranging the first capacitor and the receiving end of the first electronic element in the functional board card, can furthest filter the direct current signals, and simultaneously filters some direct current signals which cross talk in, so that the signals are symmetrical about 0 level, the signal loss is reduced, and the signal quality is improved.

The quantum measurement and control system and the quantum computer provided by the utility model comprise the integrated board card, so that the quantum measurement and control system and the quantum computer have the same beneficial effects and are not repeated herein.

Drawings

Fig. 1 is a schematic structural diagram of an integrated board card according to an embodiment of the present utility model;

FIG. 2 is a schematic diagram of a cross section of a functional board card according to an embodiment of the present utility model;

fig. 3 is a schematic structural diagram of a cross section of a routing board card according to an embodiment of the present utility model;

fig. 4 is a schematic structural diagram of a functional board card according to an embodiment of the present utility model in a top view;

fig. 5 is a schematic structural diagram of a routing board card according to an embodiment of the present utility model in a top view;

in the reference numerals:

10. a functional board card; 20. a routing board card; 30. a VPX chassis; 40. a VPX connector;

11. a first electronic component; 12. a first capacitor; 13. a first transmission line; 14. a first ground hole; 15. a first via; 16. a first through hole; 17. a first copper wire;

21. a second electronic component; 22. a second capacitor; 23. a second transmission line; 24. a second ground hole; 25. a second via; 26. a second through hole; 27. and a second copper wire.

Detailed Description

In order to better understand the technical solutions in the present application, the following description will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only some embodiments of the present application, not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, shall fall within the scope of the present application. The embodiments described below by referring to the drawings are exemplary only for the purpose of illustrating the present application and are not to be construed as limiting the present application.

In the description of the present utility model, it should be understood that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", etc., are based on the directions or positional relationships shown in the drawings, are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present utility model.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present utility model, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.

The quantum chip is a core component for running quantum computing, a plurality of quantum bits are integrated on the quantum chip, a special quantum control system is required to be built in order to ensure the normal work of the quantum bits, a plurality of functional boards 10 are arranged in the quantum control system, and the quantum chip generally comprises three types of functional boards 10, namely a first functional board for providing frequency control signals for the quantum bits, a second functional board for providing quantum state control signals for the quantum bits, and a third functional board for providing measurement reading control signals for the quantum bits. The functional board cards 10 are electrically connected with the central control module through the routing board card 20 and are used for receiving signal data output by the central control module, and in practical application, the signal data output by the central control module is forwarded to each functional board card 10 through the routing board card 20 in the form of SerDes signals, and meanwhile, return data of the functional board cards 10 is forwarded to a server through the routing board card 20 in the form of SerDes signals for data processing; when the SerDes signal is transmitted by the cross board, the SerDes signal is affected by line loss, crosstalk and the like, so that the signal attenuation is caused, the SerDes signal is a high-speed signal, in order to reduce the signal attenuation during the cross board transmission, a direct current component is superimposed on the signal, and the receiving end is normally biased, so that the direct current signal is generally required to be filtered out, the attenuation is reduced, and the signal quality is improved.

As shown in fig. 1 and 2, the present application discloses an integrated board, which includes a routing board 20 and a plurality of functional boards 10 for controlling quantum chips; the routing board card 20 and each functional board card 10 are connected through a first capacitor 12, the first capacitor 12 is disposed at a receiving end of a first electronic element 11 on the functional board card 10, and the first electronic element 11 is configured to receive a control signal transmitted by the routing board card 20.

According to the method, the first capacitor 12 is arranged at the receiving end of the first electronic element 11 in the functional board card 10, compared with the transmitting end, the reflection of signals is reduced, the direct current signals can be filtered to the greatest extent, meanwhile, some direct current signals which cross talk in are filtered, the signals are symmetrical about 0 level, the signal attenuation is reduced, and the signal quality is improved. Typically the capacity of the first capacitor 12 is selected to be between 0.01uF and 0.2uF, preferably 0.1uF.

Typically the electronic components on each functional board 10 comprise data processing means for generating working instructions from the received signals and functional means for performing corresponding actions on the quantum ratio control based on said working instructions. Specifically, the data processing device is a device with data forwarding and processing functions, and FPGA (Field Programmable Gate Array), MCU (Microcontroller Unit)), MPU (Microprocessor Unit) or DSP (Digital Signal Processor) and the like can be generally selected. In this embodiment, the data processing device is preferably an FPGA, that is, the first electronic component 11 is an FPGA, and the first capacitor 12 is disposed at a receiving end of the FPGA, and in other embodiments, other devices having similar data processing functions may be selected, which is not limited herein. It will be appreciated by those skilled in the art that in this embodiment, the function device functions to generate various signals required for control of manipulation, measurement, and reading of qubits. The device can be an ADC or a DAC, the ADC is used for acquiring information in the resonant cavity, and the DAC is used for generating a quantum state regulating signal for regulating quantum state information or generating a frequency regulating signal for regulating frequency parameters.

Further, in one implementation of this embodiment, as shown in fig. 4: the main body of the functional board 10 comprises a PCB board, a first transmission line 13 is disposed on the PCB board, the first transmission line 13 is configured to electrically connect the transmitting end of the routing board 20 with the receiving end of the first electronic component 11 on the functional board 10, and a plurality of first ground holes 14 are disposed around the first transmission line 13 at intervals. The first transmission line 13 is wrapped by arranging the plurality of first ground holes 14 around the first transmission line 13 at intervals, so that interference of other signal lines is reduced, loss of high-frequency signals is reduced, and signal quality is improved.

In particular, the distance between the first ground holes 14 is arranged in relation to the wavelength λ of the signal transmitted on the first transmission line 13, typically less than λ/10, in this embodiment the distance between adjacent first ground holes 14 is 80-120mil, preferably 100mil, this distance being chosen because: if the distance is too small, the operation is not easy, and the board is easy to be damaged when the hole is punched, if the distance is too large, when the signal flows on the ground wires, a larger loop area is formed due to the too large distance between the ground wires, so that the coupling effect of inductance and capacitance is generated, the coupling effect can lead current to form a loop path in the loop area, the effect is similar to that of an antenna, and radiation and external electromagnetic interference are generated and received, and the quality of the signal is affected.

In one implementation of the present embodiment, as shown in fig. 4: the specific arrangement of the first ground holes 14 is as follows: the first copper wires 17 (of course, a copper sheet may also be disposed on both sides of the first transmission line 13), and the first ground holes 14 are disposed on the first copper wires 17 at intervals, so as to ensure the continuity of the ground, avoid the ground potential difference caused by inconsistent ground return paths, and reduce the interference and noise caused by the ground return loop. In addition, connecting the first ground holes 14 to the same copper line also helps to reduce the complexity and routing difficulty of the PCB.

Further, in one implementation manner of this embodiment, as shown in fig. 2, the first transmission line 13 includes a first section of a first transmission line disposed on a top layer of the multi-layer PCB board and a second section of a first transmission line disposed on an intermediate layer of the multi-layer PCB board, where the first section of the first transmission line and the second section of the first transmission line are electrically connected through the first via hole 15. Because the functional board 10 is a multi-layer PCB board and the second section first transmission line is disposed in the middle layer, not only interference of other external signals can be avoided, but also the integration level can be improved conveniently.

Further, in an implementation manner of this embodiment, a first through hole 16 is disposed below the first via hole 15. By providing the first via hole 16 (also referred to as back drilling) below the first via hole 15, reflection and crosstalk phenomena when a signal passes through the first via hole 15 can be reduced, thereby improving transmission quality of the signal.

Further, in one implementation of this embodiment, as shown in fig. 3: the routing board card 20 is further connected with each functional board card 10 through a second capacitor 22, the second capacitor 22 is disposed at a receiving end of a second electronic element 21 on the routing board card 20, and the second electronic element 21 is configured to receive a return signal transmitted by the functional board card 10. By arranging the second capacitor 22 and the receiving end of the second electronic component 21 in the functional board 10, compared with the transmitting end, the reflection of the signal is reduced, the direct current signal can be filtered to the maximum extent, and meanwhile, some direct current signals which are crosstalked in are filtered, so that the signals are symmetrical about 0 level, and the signal quality is improved. The capacity of the second capacitor 22 is usually selected to be 0.01uF to 0.2uF, preferably 0.1uF.

Specifically, the second electronic component 21 of the routing board 20 is a data processing device, and devices for forwarding and processing functions of the backhaul data can be generally selected from FPGA (Field Programmable Gate Array), MCU (Microcontroller Unit)), MPU (Microprocessor Unit) or DSP (Digital Signal Processor). In this embodiment, the data processing device is preferably an FPGA, that is, the second electronic component 21 is an FPGA, and the second capacitor 22 is disposed at the receiving end of the FPGA, and other devices having similar data processing functions may be selected in other embodiments, which is not limited herein.

Further, in one implementation manner of this embodiment, as shown in fig. 5, the main body of the routing board 20 includes a PCB board, a second transmission line 23 is disposed on the PCB board, the second transmission line 23 is configured to electrically connect the transmitting end of the functional board 10 with the receiving end of the second electronic component 21 on the routing board 20, and a plurality of second ground holes 24 are disposed around the second transmission line 23 at intervals. The second transmission line 23 is wrapped by arranging the plurality of second ground holes 24 at intervals around the second transmission line 23, so that the interference of other signal lines is reduced, the loss of high-frequency signals is reduced, and the signal quality is improved.

Specifically, the distance between the second ground holes 24 is arranged in relation to the wavelength λ of the signal transmitted on the second transmission line 23, typically less than λ/10, in this embodiment the distance between adjacent second ground holes 24 is 80-120mil, preferably 100mil, which is chosen because: if the distance is too small, the operation is not easy, and the board is easy to be damaged when the hole is punched, if the distance is too large, when the signal flows on the ground wires, a larger loop area is formed due to the too large distance between the ground wires, so that the coupling effect of inductance and capacitance is generated, the coupling effect can lead current to form a loop path in the loop area, the effect is similar to that of an antenna, and radiation and external electromagnetic interference are generated and received, and the quality of the signal is affected.

In one implementation of this embodiment, the second ground hole 24 is specifically arranged as follows: a second copper wire 27 (of course, a second copper sheet may also be disposed on both sides of the second transmission line 23), and the second ground holes 24 are disposed on the second copper wire 27 at intervals, so as to ensure the continuity of the ground, avoid the ground potential difference caused by inconsistent ground return paths, and reduce the interference and noise caused by the ground return loop. In addition, connecting the second ground hole 24 to the same second copper wire 27 also helps to reduce the complexity and routing difficulty of the PCB board.

Further, in one implementation manner of this embodiment, as shown in fig. 3, the PCB board is a multi-layer PCB board, and the second transmission line 23 includes a first section of a second transmission line disposed on a top layer of the multi-layer PCB board and a second section of a second transmission line disposed on an intermediate layer of the multi-layer PCB board, where the first section of the second transmission line and the second section of the second transmission line are electrically connected through the second via 25. Because the routing board card 20 is a multi-layer PCB board and the second section second transmission line is arranged in the middle layer, not only the interference of other external signals can be avoided, but also the integration level is convenient to improve.

Further, in an implementation manner of this embodiment, a second through hole 26 is disposed below the second via hole 25. By arranging the second through hole 26 below the second through hole 25, the impedance of the second through hole 25 is obviously optimized, and the signal quality is further improved.

Further, in one implementation manner of this embodiment, the top layer of the multi-layer PCB board of the functional board card 10 is provided with a first bonding pad for soldering the first capacitor 12, and the adjacent layers of the first bonding pad are hollowed out, so as to optimize the impedance of the first bonding pad and improve the quality of signals. The top layer of the multilayer PCB board of the routing board card 20 is provided with a second bonding pad for welding the second capacitor 22, and adjacent layers of the second bonding pad are hollowed, so that the impedance of the second bonding pad is optimized, and the quality of signals is improved.

Further, as shown in fig. 4 and fig. 5, the SerDes signal is transmitted in a differential form, so that the anti-interference capability of the signal is further improved, and the signal quality is improved. In particular, differential wires typically require equal length arrangements, with differences controlled within 3-5 mils; meanwhile, the wiring length is shortened as much as possible, and the signal loss is reduced by using the arc wiring.

Based on the same application conception, the embodiment of the application also provides a quantum measurement and control system, which comprises a VPX chassis 30, wherein the integrated board card is integrated in the VPX chassis 30.

Specifically, as shown in fig. 1: the routing board card 20 and the functional board cards 10 are integrated in the VPX chassis 30, and the functional board cards 10 are electrically connected with the routing board card 20 through the back board of the VPX chassis 30.

Through integrating route integrated board 20 and function integrated board 10 in VPX machine case 30, realize the electrical connection between the two through the backplate, not only be convenient for install, improve the integrated level moreover. In the specific arrangement, the routing board card 20 and the functional board card 10 are arranged in parallel, and since the routing board card 20 and each functional board card 10 have an electrical connection relationship, the routing board card 20 is placed in the middle position, and the back plate of the VPX chassis 30 is arranged vertically to the routing board card 20 and the functional board card 10 (in fig. 1, the back plate of the VPX chassis 30 is completely shielded by the routing board card 20 and the functional board card 10, so that the back plate cannot be seen); in addition, electrical connection is made between the backplane and the routing board 20 and the functional board 10 through connectors (e.g., VPX connectors 40).

Based on the same application conception, the embodiment of the application also provides a quantum computer, which comprises the quantum measurement and control system.

It should be noted that, in the present application, the arrangement of the second electronic component 21, the second capacitor 22, the second transmission line 23, the second ground hole 24, the second via hole 25, the second via hole 26, and the second copper wire 27 in the routing board card 20 is the same as the arrangement of the first electronic component 11, the first capacitor 12, the first transmission line 13, the first ground hole 14, the first via hole 15, the first via hole 16, and the first copper wire 17 in the functional board card 10. In addition, the first transmission line 13 or the second transmission line 23 illustrated in fig. 4 and 5 is disposed on the same layer of the PCB board, and the first transmission line 13 or the second transmission line 23 illustrated in fig. 2 and 3 is disposed at a top layer of the PCB board and at a middle layer of the PCB board, and when the first transmission line 13 or the second transmission line 23 is divided into several sections, each section may be disposed with the first ground hole 14 or the second ground hole 24 in the manner of fig. 4 and 5.

In the description of the present specification, reference to the term "some embodiments" or "examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments. Further, one skilled in the art can engage and combine the different embodiments or examples described in this specification.

The foregoing is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Any person skilled in the art will make any equivalent substitution or modification to the technical solution and technical content disclosed in the utility model without departing from the scope of the technical solution of the utility model, and the technical solution of the utility model is not departing from the scope of the utility model.

Claims

1. The integrated board card is characterized by comprising a routing board card and a plurality of functional board cards for controlling quantum chips; the routing board card and each functional board card are connected through a first capacitor, the first capacitor is arranged at a receiving end of a first electronic element on the functional board card, and the first electronic element is used for receiving control signals transmitted by the routing board card.

2. The integrated board of claim 1, wherein the main body of the functional board comprises a PCB board, a first transmission line is disposed on the PCB board, the first transmission line is configured to electrically connect the transmitting end of the routing board and the receiving end of the first electronic component on the functional board, and a plurality of first ground holes are disposed around the first transmission line at intervals.

3. The integrated board card of claim 2, wherein the PCB is a multi-layer PCB, and the first transmission line includes a first section of first transmission line disposed on a top layer of the multi-layer PCB and a second section of first transmission line disposed on an intermediate layer of the multi-layer PCB, the first section of first transmission line and the second section of first transmission line being electrically connected by a first via.

4. The integrated board of claim 3, wherein a first via is disposed below the first via.

5. The integrated board of claim 1, wherein the routing board and each of the functional boards are further connected by a second capacitor, the second capacitor is disposed at a receiving end of a second electronic component on the routing board, and the second electronic component is configured to receive a return signal transmitted by the functional board.

6. The integrated board of claim 5, wherein the main body of the routing board comprises a PCB board, a second transmission line is disposed on the PCB board, the second transmission line is configured to electrically connect the transmitting end of the functional board and the receiving end of the second electronic component on the routing board, and a plurality of second ground holes are disposed around the second transmission line at intervals.

7. The integrated board of claim 6, wherein the PCB is a multi-layer PCB and the second transmission line includes a first section of the second transmission line disposed on a top layer of the multi-layer PCB and a second section of the second transmission line disposed on an intermediate layer of the multi-layer PCB, the first section of the second transmission line and the second section of the second transmission line being electrically connected by a second via.

8. The integrated board of claim 7, wherein a second via is disposed below the second via.

9. A quantum measurement and control system, comprising a VPX chassis, wherein the VPX chassis is integrated with the integrated board card according to any one of claims 1-8.

10. A quantum computer comprising the quantum measurement and control system of claim 9.