CN216057616U

CN216057616U - PCB structure with novel anti-pad

Info

Publication number: CN216057616U
Application number: CN202121856267.2U
Authority: CN
Inventors: 熊浩
Original assignee: Shanghai Yayuan Electronics Co ltd
Current assignee: Shanghai Yayuan Electronics Co ltd
Priority date: 2021-08-10
Filing date: 2021-08-10
Publication date: 2022-03-15
Anticipated expiration: 2031-08-10

Abstract

The utility model discloses a PCB structure with a novel anti-bonding pad, comprising: the signal layer, the SMA interface component, the connector interface component and the signal wire; the SMA interface assembly and the connector interface assembly are both arranged on the signal layer; the signal line is arranged on the signal layer, and two ends of the signal line are respectively connected with the SMA interface assembly and the connector interface assembly. The utility model overcomes the defects of higher backflow impedance and overall characteristic impedance of the signal hole at the SMA and lower characteristic impedance of the signal hole at the connector in the prior art, and improves the impedance continuity of the PCB.

Description

PCB structure with novel anti-pad

Technical Field

The utility model relates to the technical field of PCB boards, in particular to a PCB board structure with a novel anti-bonding pad.

Background

In the prior art, a pcb (printed Circuit board) board is connected to components by providing signal holes and signal lines, and an anti-pad is provided at the outer edge of the signal hole, so that there are defects that the backflow impedance and the overall characteristic impedance of the signal hole at the SMA (Sub-Miniature-a) are high, the characteristic impedance at the connector is low, and the impedance continuity is poor.

SUMMERY OF THE UTILITY MODEL

According to an embodiment of the present invention, there is provided a PCB board structure having a novel anti-pad, including: the signal layer, the SMA interface component, the connector interface component and the signal wire;

the SMA interface assembly and the connector interface assembly are both arranged on the signal layer;

the signal line is arranged on the signal layer, and two ends of the signal line are respectively connected with the SMA interface assembly and the connector interface assembly.

Further, the interface assembly at the SMA comprises: the first anti-pad area and the signal hole at the SMA;

the first anti-bonding pad area is arranged on the signal layer;

the SMA signal hole is arranged in the first reverse bonding pad area, and one end of the signal wire is connected with the SMA signal hole.

Further, the hollowed-out shape of the first anti-pad area is circular, and the first anti-pad area is concentric with the signal hole at the SMA.

Further, the range of the hollowed diameter of the first anti-pad region is as follows: 0.8mm to 1 mm.

Further, the interface assembly at the SMA further comprises: the plurality of backflow ground holes are formed in the signal layer and distributed around the SMA signal hole.

Furthermore, the distance between the backflow ground hole and the signal hole at the SMA is 0.8 mm-1.2 mm.

Further, the interface module at the connector includes: the second anti-pad area and the signal holes at the connectors;

the second anti-bonding pad area is arranged on the signal layer;

the signal holes at the connectors are arranged in the second anti-welding disc area, and the other ends of the signal wires are connected with the signal holes at the connectors.

Further, a plurality of signal holes at the connector are coaxially arranged inside the second anti-pad area.

Furthermore, the second anti-pad area is hollowed into an oval shape, and the signal holes at the connectors are coaxially arranged along the long axis of the second anti-pad area.

Further, the shortest distance range between the hollowed edge of the second anti-pad region and the signal hole at the connector is as follows: 1.2mm to 1.6 mm.

According to the PCB structure with the novel anti-bonding pad, the defects that the backflow impedance and the overall characteristic impedance of the signal hole at the SMA are high and the characteristic impedance of the signal hole at the connector is low in the prior art are overcome, and the impedance continuity of the PCB is improved.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and are intended to provide further explanation of the claimed technology.

Drawings

FIG. 1 is an enlarged partial view of an area of an interface assembly with SMA according to an embodiment of the present invention;

fig. 2 is an enlarged partial view of the area of the interface module with connectors according to an embodiment of the present invention.

Detailed Description

The present invention will be further explained by describing preferred embodiments of the present invention in detail with reference to the accompanying drawings.

First, a PCB structure with a novel anti-pad according to an embodiment of the present invention will be described with reference to fig. 1-2, which is a carrier for connecting electronic components and has a wide application range.

As shown in fig. 1-2, the PCB board structure with the novel anti-pad according to the embodiment of the present invention includes: signal layer 1, SMA department interface module, connector department interface module and signal line 4.

Specifically, as shown in fig. 1, the SMA interface module is disposed on the signal layer 1, the signal line 4 is disposed on the signal layer 1, and one end of the signal line 4 is connected to the SMA interface module.

Further, as shown in fig. 1, the interface assembly at the SMA comprises: a first anti-pad area 21 and a signal hole 22 at the SMA; the first anti-pad region 21 is disposed on the signal layer 1; a signal hole 22 at the SMA is provided inside the first anti-pad area 21, and one end of the signal line 4 is connected to the signal hole 22 at the SMA for transmitting a signal.

Further, as shown in fig. 1, the first anti-pad region 21 is hollowed out in a circular shape, and the first anti-pad region 21 is concentric with the signal hole 22 at the SMA.

Further, as shown in fig. 1, the first anti-pad area 21 has a hollowed diameter of 1mm, which shortens the signal return path and reduces the return impedance and the overall characteristic impedance of the signal hole 22 at the SMA.

Further, as shown in fig. 1, the interface assembly at SMA further includes: the number of the backflow ground holes 23 is 4, the backflow ground holes 23 are arranged on the signal layer 1, and the backflow ground holes 23 are distributed around the signal hole 22 at the SMA position and used for providing a minimum inductance return path and inhibiting crosstalk.

Further, as shown in fig. 1, the distance between the signal hole 22 at the SMA and the return ground hole is in the range of 0.8mm to 1.2mm, and preferably 1mm, so that the signal return path is shortened, and the return impedance and the overall characteristic impedance of the signal hole 22 at the SMA are reduced.

Specifically, as shown in fig. 2, the at-connector interface component is provided on the signal layer 1, and the other end of the signal line 4 is connected to the at-connector interface component.

Further, as shown in fig. 2, the interface module at the connector includes: a second anti-pad area 31 and a plurality of connector signal holes 32; the second anti-pad region 31 is disposed on the signal layer 1; a plurality of connector-side signal holes 32 are provided inside the second anti-pad area 31, and the other end of the signal line 4 is connected to the connector-side signal holes 32 for transmitting signals.

Further, as shown in fig. 2, a plurality of connector-site signal holes 32 are coaxially arranged inside the second anti-pad region 31, and the number of the plurality of connector-site signal holes 32 is 2.

Further, as shown in fig. 2, the second anti-pad area 31 is oval, and a plurality of signal holes 32 at the connector are coaxially arranged along the long axis of the second anti-pad area 31.

Further, as shown in fig. 2, the shortest distance between the hollowed edge of the second anti-pad area 31 and the signal hole 32 at the connector is 1.4mm, so that the effect of improving the characteristic impedance of the signal hole 32 at the connector is achieved, the impedance continuity is improved, meanwhile, sufficient space for arranging the signal lines 4 is ensured to be left between the adjacent second anti-pad areas 31, and the use space of the PCB board is reasonably utilized.

The embodiment of the utility model comprises the following steps: the signal layer 1, SMA department signal hole 22, first anti-pad area 21, two connector department signal holes 32, second anti-pad area 31, signal line 4 and four backward flow ground holes 23, first anti-pad area 21 and second anti-pad area 31 are arranged on the signal layer 1, SMA department signal hole 22 is arranged inside first anti-pad area 21, two connector department signal holes 32 are arranged inside second anti-pad area 31, signal line 4 is arranged on the signal layer 1, one end of signal line 4 is connected with SMA department signal hole 22, the other end of signal line 4 is connected with connector department signal hole 32, four backward flow ground holes 23 are all arranged on the signal layer 1, and four backward flow ground holes 23 are distributed around SMA department signal hole 22.

In the above, referring to fig. 1-2, a PCB structure with a novel anti-pad according to an embodiment of the present invention is described, which solves the defects in the prior art that the backflow impedance and the overall characteristic impedance of the signal hole 22 at the SMA are relatively high and the characteristic impedance of the signal hole at the connector is relatively low, and improves the impedance continuity of the PCB.

It should be noted that, in the present specification, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

While the present invention has been described in detail with reference to the preferred embodiments, it should be understood that the above description should not be taken as limiting the utility model. Various modifications and alterations to this invention will become apparent to those skilled in the art upon reading the foregoing description. Accordingly, the scope of the utility model should be determined from the following claims.

Claims

1. A PCB board structure with novel anti-pad, its characterized in that contains: the signal layer, the SMA interface component, the connector interface component and the signal wire;

2. The PCB board structure with the novel anti-pad of claim 1, wherein the SMA place interface assembly comprises: the first anti-pad area and the signal hole at the SMA;

the first anti-pad region is disposed on the signal layer;

3. The PCB board structure with the novel anti-pad of claim 2, wherein the hollowed shape of the first anti-pad area is circular, and the first anti-pad area is concentric with the signal hole at the SMA.

4. The PCB board structure with the novel anti-pad of claim 3, wherein the hollowed-out diameter range of the first anti-pad area is as follows: 0.8mm to 1 mm.

5. The PCB board structure with the novel anti-pad of claim 2, wherein the SMA interface assembly further comprises: the plurality of backflow ground holes are formed in the signal layer and distributed around the signal holes in the SMA.

6. The PCB board structure with the novel anti-pad as claimed in claim 5, wherein the distance between the reflow ground hole and the signal hole at the SMA is in the range of 0.8mm to 1.2 mm.

7. The PCB board structure with the novel anti-pad of claim 1, wherein the at-connector interface assembly comprises: the second anti-pad area and the signal holes at the connectors;

the second anti-pad region is arranged on the signal layer;

8. The PCB board structure with the novel anti-pad of claim 7, wherein the signal holes at the plurality of connectors are coaxially arranged inside the second anti-pad area.

9. The PCB board structure with the novel anti-pad of claim 7, wherein the second anti-pad area is oval in shape and the signal holes at the plurality of connectors are coaxially arranged along the long axis of the second anti-pad area.

10. The PCB board structure with the novel anti-pad of claim 7, wherein the shortest distance range between the hollowed edge of the second anti-pad area and the signal hole at the connector is as follows: 1.2mm to 1.6 mm.