CN219542949U - Fixing device for semiconductor wafer test - Google Patents

Abstract

The utility model relates to the technical field of wafer testing, in particular to a fixing device for testing semiconductor wafers, which comprises a carrying disc, wherein the bottom of the carrying disc is provided with a driving shaft to realize rotation, a pressure plate which is rotationally connected with the edge of the carrying disc is arranged above the carrying disc, the top surface of the carrying disc is provided with a placing groove for placing the semiconductor wafers, two sides of the inside of the placing groove are respectively and slidingly connected with positioning plates, the semiconductor wafers are positioned between the positioning plates on two sides, the carrying disc is respectively and spirally connected with a threaded column from the two sides of the bottom of the carrying disc upwards, the upper end of the threaded column is provided with a cone end, and the cone end is upwards pushed against the positioning plates to translate, so that the original fixed positioning plates in the carrying disc are optimized to be designed in a horizontal translation way, and therefore, staff can adjust the distance between the positioning plates according to different semiconductor widths to meet the testing conditions of various semiconductors without frequent replacement, the use range of a testing carrier is enlarged, and the testing efficiency is improved.

Description

Fixing device for semiconductor wafer test

Technical Field

The utility model relates to the technical field of wafer testing, in particular to a fixing device for testing a semiconductor wafer.

Background

The test carrier is used for testing the semiconductor wafer, and the semiconductor wafer is supported by the test carrier when the semiconductor wafer is subjected to compatible test. In order to prevent the semiconductor wafer from shifting during the inspection, which affects the inspection accuracy, the semiconductor wafer is usually placed in a placement groove of a test carrier to fix its position, but the widths of the semiconductor wafers with different specifications are different, at present, people usually configure a plurality of test carriers meeting the requirements for different semiconductor wafers, but repeatedly replace the carriers, which affects the test efficiency.

Disclosure of Invention

The utility model aims to solve the defects in the prior art and provides a fixing device for testing a semiconductor wafer.

In order to achieve the above purpose, the present utility model adopts the following technical scheme:

the utility model provides a semiconductor wafer test is with fixing device, includes the carrying tray, the bottom of carrying tray is provided with the drive shaft in order to realize rotating, and the top of carrying tray is provided with the pressure disk of being connected rather than the border rotation, the standing groove that is used for placing semiconductor wafer is offered to the top surface of carrying tray the inside both sides of standing groove sliding connection has the spacer respectively, and semiconductor wafer is located between the spacer on both sides, the carrying tray upwards has the screw thread post by its bottom both sides respectively screwed connection, and the upper end of screw thread post is provided with the cone, the cone extends to in the standing groove, and its tail end design of spacer on the same side is the inclined plane and with the cone looks adaptation that corresponds, the cone upwards pushes away the tail end inclined plane of supporting the spacer and promotes the spacer translation.

In a preferred technical scheme, opposite side surfaces of the positioning sheet are designed to be inner concave surfaces, and a gap reserved between opposite edges of the positioning sheet on two sides is designed to be a material taking opening.

In a preferred technical scheme, the carrying disc is provided with sliding grooves at two sides of the bottom of the placing groove respectively, and the bottom of the positioning sheet is provided with a fixed block which is arranged in the sliding grooves and slides along the sliding grooves in a straight line.

In a preferred technical scheme, a spring is arranged on the side face of the fixed block, and the other end of the spring is in butt joint with the groove wall of the chute.

In a preferred technical scheme, a knob is arranged at the bottom end of the threaded column.

The beneficial effects of the utility model are as follows:

1. the opposite side surfaces of the locating plate are designed to be inner concave surfaces, and gaps reserved between the opposite edges of the locating plates on two sides are designed to be material taking openings, so that workers can conveniently take semiconductor wafers.

2. The pressure plate above can limit the semiconductor wafer to move longitudinally, the positioning sheet can limit the semiconductor wafer to move transversely when clamping the semiconductor, and the two modes are matched for use, so that the semiconductor wafer can be ensured to be in a fixed state during testing.

3. The staff can select to rotate one of the knobs or two knobs according to the specification of the semiconductor wafer, and the distance between the positioning sheets is changed greatly, so that the testing conditions of various semiconductors can be met, and frequent replacement is not needed.

In summary, through the fixing device that this scheme provided, the test carrier that has solved different semiconductor wafer tests and need use corresponding specification, frequent change can lead to the problem that semiconductor test efficiency is not high, this fixing device's propose, but with the interior fixed spacer optimization of year dish for horizontal translation formula design, the staff can be according to different semiconductor width like this, the distance between each spacer is adjusted to satisfy the test condition of various semiconductors, do not need frequent change, enlarged the application range of test carrier, can promote test efficiency.

Drawings

FIG. 1 is a schematic front view of a fixing device according to the present utility model;

FIG. 2 is a schematic top view of a fixing device according to the present utility model;

fig. 3 is a schematic view of a threaded column according to the present utility model.

In the figure: 1. a carrier plate; 2. a placement groove; 3. a pressure plate; 4. a drive shaft; 5. a positioning sheet; 6. a chute; 7. a fixed block; 8. a spring; 9. a threaded column; 10. a cone end; 11. a knob; 12. and a material taking opening.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.

In this embodiment, referring to fig. 1-3, a fixing device for testing semiconductor wafers includes a carrier plate 1, a driving shaft 4 is disposed at the bottom of the carrier plate 1 to realize rotation, a pressing plate 3 rotationally connected to the edge of the carrier plate 1 is disposed above the carrier plate 1, a placement groove 2 for placing semiconductor wafers is formed on the top surface of the carrier plate 1, and the pressing plate 3 is adapted to the placement groove 2 in the carrier plate 1 to press the semiconductor wafers.

The positioning plates 5 are respectively and slidably connected to two sides of the inner part of the placement groove 2, as shown in fig. 1, the carrier plate 1 is provided with sliding grooves 6 respectively on two sides of the bottom of the placement groove 2, the bottom of the positioning plate 5 is provided with a fixing block 7, and the fixing block 7 is arranged in the sliding grooves 6 and linearly slides along the sliding grooves 6. The semiconductor wafer is located between the positioning pieces 5 on both sides. The opposite sides of the positioning sheet 5 are designed to be concave inwards, and the gap left between the opposite edges of the positioning sheet 5 on two sides is designed to be a material taking opening 12. The material taking opening 12 is designed to be the edge position of the two positioning sheets 5 protruding from the opposite side surfaces, and the semiconductor wafer is convenient to take by the design.

The side of the fixed block 7 is provided with a spring 8, and the other end of the spring 8 is butted on the groove wall of the chute 6. The spring 8 can be compressed, and the fixing block 7 and the locating piece 5 are integrally formed, so that the spring 8 can be compressed when the locating piece 5 transversely slides, and the spring 8 has elastic potential energy.

The carrying disc 1 is respectively and spirally connected with a threaded column 9 from two sides of the bottom upwards, the upper end of the threaded column 9 is provided with a cone end 10, the cone end 10 extends into the placing groove 2, the tail end of the locating piece 5 on the same side is designed to be an inclined plane and is matched with the corresponding cone end 10, and the cone end 10 pushes up against the tail end inclined plane of the locating piece 5 and pushes the locating piece 5 to translate. Finally, the bottom end of the threaded post 9 is provided with a knob 11.

In the actual operation process, the positioning pieces 5 on both sides will be at the position relatively farthest, when the worker puts the semiconductor wafer between the two positioning pieces 5, the two knobs 11 on the bottom are rotated to control the cone end 10 to move upwards, and in the process of moving the cone end 10, the positioning pieces 5 will be gradually pushed to move towards the middle, so that the semiconductor wafer placed in the middle is fixed. Here, the upper platen 3 can limit the semiconductor wafer to move longitudinally, and the positioning sheet 5 can limit the semiconductor wafer to move transversely when clamping the semiconductor wafer, and the two modes are matched for use, so that the semiconductor wafer can be finally ensured to be in a fixed state during testing.

When the semiconductor wafer needs to be taken out, the knob 11 is reversely rotated, and when the acting force of the cone end 10 acting on the tail end of the locating piece 5 is removed, the locating piece 5 can be pushed back to the original position under the rebound action of the spring 8, namely, the locating pieces 5 on two sides simultaneously slide outwards, the clamping force on the middle semiconductor wafer is removed, and thus, a worker can take the semiconductor wafer out from the material taking opening 12.

It should be noted that, the staff can choose to rotate one of the knob 11 or two knob 11 according to the specification of the semiconductor wafer, the distance between the positioning sheets 5 is greatly changed, so that the testing conditions of various semiconductors can be satisfied, frequent replacement is not needed, and the testing efficiency can be improved.

The foregoing is only a preferred embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art, who is within the scope of the present utility model, should make equivalent substitutions or modifications according to the technical scheme of the present utility model and the inventive concept thereof, and should be covered by the scope of the present utility model.

Claims (5)

1. The utility model provides a semiconductor wafer test is with fixing device, includes carrier plate (1), the bottom of carrier plate (1) is provided with drive shaft (4) in order to realize rotating, and the top of carrier plate (1) is provided with pressure disk (3) of being connected rather than the border rotation, a serial communication port, standing groove (2) that are used for placing semiconductor wafer are offered to the top surface of carrier plate (1) inside both sides of standing groove (2) sliding connection has spacer (5) respectively, and semiconductor wafer is located between spacer (5) on both sides, carrier plate (1) upwards screwed connection has screw thread post (9) respectively by its bottom both sides, and the upper end of screw thread post (9) is provided with awl end (10), awl end (10) extend to in standing groove (2), and the design of its tail end of spacer (5) on the same side is the inclined plane and with the awl end (10) looks adaptation that corresponds, awl end (10) upwards pushes away the tail end inclined plane of spacer (5) and promotes spacer (5) translation.

2. The fixture for testing semiconductor wafers according to claim 1, wherein the opposite sides of the positioning sheet (5) are each designed as an inner concave surface, and the gap left between the opposite edges of the positioning sheet (5) on both sides is designed as a take-out opening (12).

3. The fixing device for testing semiconductor wafers according to claim 1, wherein the carrier plate (1) is provided with sliding grooves (6) on two sides of the bottom of the placing groove (2), and the bottom of the positioning sheet (5) is provided with a fixing block (7), and the fixing block (7) is arranged in the sliding grooves (6) and slides along the sliding grooves (6) in a straight line.

4. A semiconductor wafer testing fixture according to claim 3, wherein the side of the fixing block (7) is provided with a spring (8), and the other end of the spring (8) is abutted against the groove wall of the chute (6).

5. The fixture for semiconductor wafer testing according to claim 1, wherein the bottom end of the threaded post (9) is provided with a knob (11).