CN219534475U - Vertical semi-automatic photoresist removing cavity structure for wafer vacuum photoresist removing - Google Patents
Vertical semi-automatic photoresist removing cavity structure for wafer vacuum photoresist removing Download PDFInfo
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- CN219534475U CN219534475U CN202320393754.2U CN202320393754U CN219534475U CN 219534475 U CN219534475 U CN 219534475U CN 202320393754 U CN202320393754 U CN 202320393754U CN 219534475 U CN219534475 U CN 219534475U
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- photoresist removing
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- removing cavity
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The utility model discloses a vertical semi-automatic photoresist removing cavity structure for vacuum photoresist removing of a wafer, which is used for photoresist removing or mask removing of the wafer and comprises a base box and a power source working box, wherein the power source working box is vertically supported and arranged at the top end of the base box; a plasma vacuum photoresist removing cavity with a main body part arranged in the base box and an external opening for the ingress and egress of wafers is arranged between the power source working box and the base box; the opening of the plasma vacuum photoresist removing cavity is also provided with a door plate lifting mechanism which is arranged in the base box and seals the opening in a sealing way; the photoresist removing cavity structure for photoresist removing of the wafer adopts vertical layout, has compact structure and small occupied space, is convenient for controlling the feeding and discharging of the wafer, and effectively improves the production efficiency of the small-batch wafers.
Description
[ field of technology ]
The utility model relates to a precision machining technology, in particular to a vertical semi-automatic photoresist removing cavity structure for vacuum photoresist removing of a wafer.
[ background Art ]
In the manufacturing process of a semiconductor wafer, photoresist is used as a mask material to play a role in pattern replication and transmission in a semiconductor processing technology, and once an etching technology or other technologies are completed, the service life of the photoresist is completed, and the photoresist must be completely removed, namely photoresist removal.
Common stripping is divided into wet stripping and dry stripping. (1) Wet photoresist removing, which is to soak the wafer with photoresist in proper organic solvent to dissolve or decompose the photoresist and remove the photoresist on the wafer surface. Before wet etching, the surface of the photoresist is subjected to surface strengthening treatment, which makes the photoresist insoluble or difficult to dissolve completely in most of the photoresist stripping solution. In this case, the uppermost layer of glue needs to be removed by plasma before wet stripping; the photoresist stripping period is long, inorganic impurities are easy to introduce, and the operation is troublesome. (2) Dry photoresist stripping, mainly plasma photoresist stripping, generally adopting plasma oxidation or decomposition and other modes to remove photoresist; the dry photoresist removing process does not need chemical reagent or heating, but the damage to the device on the surface of the wafer caused by ion bombardment is a concern in the dry photoresist removing process; although the dry photoresist stripping technology has been greatly improved, with the wide application of low dielectric materials in industry, technicians are faced with new challenges, and new processes and equipment need to be developed so as not to damage very sensitive materials in the process production, and the wafer photoresist stripping process and equipment in the existing semiconductors are improved.
[ utility model ]
The embodiment of the utility model provides a vertical semi-automatic photoresist removing cavity structure for vacuum photoresist removing of wafers, which adopts a vertical vacuum cavity for dry photoresist removing, has the advantages of compact structure, small occupied space, reasonable space arrangement, effective protection of sensitive materials in process processing, convenient control of feeding and discharging of the wafers and effective improvement of the production efficiency of small-batch wafers.
The technical scheme adopted by at least one embodiment of the utility model is as follows:
the vertical semi-automatic photoresist removing cavity structure for vacuum photoresist removing of the wafer is used for photoresist removing or mask removing of the wafer and comprises a base box and a power source working box, wherein the power source working box is vertically supported and installed at the top end of the base box;
a plasma vacuum photoresist removing cavity with a main body part arranged in the base box and an external opening for the ingress and egress of wafers is arranged between the power source working box and the base box, and the power source working box is used for providing a power source required by the photoresist removing of the wafers in the plasma vacuum photoresist removing cavity;
and a door plate lifting mechanism which is arranged in the base box and seals the opening is also arranged at the opening of the plasma vacuum photoresist removing cavity.
Preferably, the power source working box comprises a top frame and a plurality of power source protection plates, and the power source protection plates are respectively arranged on the periphery of the top frame and on the top end face;
and a power source is arranged in the top frame, and an ion ingress pipe connected with the lower end of the power source is positioned right above the plasma vacuum photoresist removing cavity and is vertically arranged.
Preferably, two sides of the rear end of the plasma vacuum photoresist removing cavity are respectively provided with an inverted L-shaped positioning bracket which is symmetrically distributed and fixedly arranged in the base box.
Preferably, the bottom side of the plasma vacuum photoresist removing cavity is also connected with a Y-shaped pipeline which is positioned in the base box and used for discharging waste gas substances after photoresist removing and vacuumizing by sharing with a vacuum pump (arranged outside).
Preferably, the base box comprises a square bottom frame, a plurality of wall plates, a plurality of universal casters, two left top plates and right top plates, wherein the wall plates are positioned around the periphery of the square bottom frame, the left top plates and the right top plates are parallel and level and installed at the top end of the square bottom frame, and the universal casters are equally divided and installed on four feet of the square bottom frame; the left top plate is positioned at the left side of the top end of the square bottom frame and provided with a plurality of through holes for the lower part of the plasma vacuum photoresist removing cavity to pass through, and the right top plate is positioned at the right side of the top end of the square bottom frame and provided with square holes for cables and pipelines to pass through; the wall plates on the front side and the rear side of the square bottom frame are also provided with a plurality of embedded handles which are symmetrically distributed on the front side and the rear side and used for pushing the whole base box to displace.
Preferably, the door plate lifting mechanism comprises a T-shaped door plate and a linear jacking assembly, and the linear jacking assembly drives the T-shaped door plate to lift up and down to cover the opening of the plasma vacuum photoresist removing cavity.
The beneficial effects of the utility model are as follows:
according to the utility model, a vertical design is adopted, the power source working box is vertically supported and arranged at the top end of the base box, the power source and the vacuum pump are arranged in the power source working box at the top side, the main body part of the plasma vacuum photoresist removing cavity is arranged in the base box, and the Y-shaped pipeline connected with the bottom side of the plasma vacuum photoresist removing cavity directly discharges the photoresist-removed waste gas substances and is used for vacuumizing together with an external vacuum pump.
[ description of the drawings ]
FIG. 1 is a schematic diagram of an explosive structure in an embodiment of the utility model;
FIG. 2 is a schematic perspective view of an embodiment of the present utility model;
FIG. 3 is a schematic perspective view of the case according to the embodiment of the present utility model with the case housing removed;
FIG. 4 is a schematic diagram of an exploded view of a plasma vacuum photoresist stripper and upper facing assembly in accordance with an embodiment of the present utility model.
[ detailed description ] of the utility model
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
The embodiment provides a vertical semi-automatic photoresist removing cavity structure for vacuum photoresist removing of a wafer, which is used for photoresist removing or mask removing of the wafer, as shown in fig. 1 to 4, and comprises a base box 1 and a power source working box 2, wherein the power source working box 2 is vertically supported and arranged at the top end of the base box 1; a plasma vacuum photoresist removing cavity 4 with a main body part arranged in the base box 1 and an external opening 3 for the wafer to enter and exit is arranged between the power source working box 2 and the base box 1, and the power source working box 2 is used for providing a power source required by the wafer photoresist removing in the plasma vacuum photoresist removing cavity 4; the opening 3 of the plasma vacuum photoresist removing cavity 4 is also provided with a door plate lifting mechanism 5 which is arranged in the base box 1 and seals the opening 3, wherein the door plate lifting mechanism 5 comprises a T-shaped door plate 50 and a linear lifting assembly 51, and the linear lifting assembly 51 drives the T-shaped door plate 50 to move up and down to cover the opening 3 of the plasma vacuum photoresist removing cavity 4.
As further shown in fig. 1 to 4, the power source working box 2 includes a top frame 20 and a plurality of power source protection plates 21, wherein the power source protection plates 21 are respectively installed around the periphery of the top frame 20 and on the top end surface; the top frame 20 is provided with a power source 6, and an ion introducing pipe 8 positioned at the lower end of the power source 6 is vertically arranged right above the plasma vacuum photoresist removing cavity 4, and the ion introducing pipe 8 is communicated with the plasma vacuum photoresist removing cavity 4 through a KF flange joint.
As shown in fig. 1 to 4, two sides of the rear end of the plasma vacuum photoresist removing cavity 4 are respectively provided with an inverted L-shaped positioning bracket 11 which is symmetrically distributed and is fixedly arranged in the base box 1, the bottom side of the plasma vacuum photoresist removing cavity 4 is also connected with a Y-shaped pipeline 12 which is positioned in the base box 1 and is used for discharging waste gas substances after photoresist and is used for vacuumizing together with a peripheral vacuum pump, and when the plasma vacuum photoresist removing cavity 4 is in operation, the vacuum pump is communicated with the Y-shaped pipeline 12 to vacuumize a wafer to be photoresist removed.
The base box 1 comprises a square bottom frame 1a, a plurality of wall plates 1b, a plurality of universal casters 1c and two parallel and level left top plates 1d and right top plates 1e which are arranged at the top end of the square bottom frame 1a, wherein the wall plates 1b are positioned at the periphery of the square bottom frame 1a, and the universal casters 1c are equally arranged on four feet of the square bottom frame 1 a; the left top plate 1d is positioned at the left side of the top end of the square bottom frame 1a and is provided with a plurality of through holes 13 for penetrating and installing the lower part of the plasma vacuum photoresist removing cavity 4, and the right top plate 1e is positioned at the right side of the top end of the square bottom frame 1a and is provided with square holes 14 for passing cables and pipelines; the wall plates 1b on the front side and the rear side of the square bottom frame 1a are also provided with a plurality of embedded handles 15 which are symmetrically distributed on the front side and the rear side and are used for pushing the whole base box 1 to displace.
In the embodiment, the power source working box 2 is vertically arranged on the base box 1, and a plasma vacuum photoresist removing cavity 4 which is convenient for processing the wafer feeding and discharging is arranged between the power source working box and the base box, so that the whole machine has a compact structure and small occupied space, and is convenient for small-batch production of wafers.
In the description of the present utility model, it should be noted that, directions or positional relationships indicated by terms such as "front", "rear", "left", "right", etc., are directions or positional relationships based on those shown in the drawings, or those that are conventionally put in use, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the apparatus or elements to be referred to must have a specific direction, be constructed and operated in a specific direction, and thus should not be construed as limiting the present utility model.
The above embodiments are merely preferred embodiments of the present utility model, and are not intended to limit the scope of the present utility model, but all equivalent changes according to the shape, construction and principle of the present utility model are intended to be included in the scope of the present utility model.
Claims (6)
1. The vertical semi-automatic photoresist removing cavity structure for vacuum photoresist removing of the wafer is used for photoresist removing or mask removing of the wafer and is characterized by comprising a base box and a power source working box, wherein the power source working box is vertically and supportingly arranged at the top end of the base box;
a plasma vacuum photoresist removing cavity with a main body part arranged in the base box and an external opening for the ingress and egress of wafers is arranged between the power source working box and the base box, and the power source working box is used for providing a power source required by the photoresist removing of the wafers in the plasma vacuum photoresist removing cavity;
and a door plate lifting mechanism which is arranged in the base box and seals the opening is also arranged at the opening of the plasma vacuum photoresist removing cavity.
2. The vertical type semiautomatic photoresist removing cavity structure for vacuum photoresist removing of a wafer according to claim 1, wherein the power source working box comprises a top frame and a plurality of power source protection plates, and the power source protection plates are respectively arranged on the periphery of the top frame and on the top end face;
and a power source is arranged in the top frame, and an ion ingress pipe connected with the lower end of the power source is positioned right above the plasma vacuum photoresist removing cavity and is vertically arranged.
3. The vertical type semiautomatic photoresist removing cavity structure for vacuum photoresist removing of claim 1, wherein two sides of the rear end of the plasma vacuum photoresist removing cavity are respectively provided with an inverted L-shaped positioning bracket which is symmetrically distributed and is fixedly arranged in the base box.
4. The vertical type semiautomatic photoresist removing cavity structure for vacuum photoresist removing of a wafer according to claim 1, wherein the bottom side of the plasma vacuum photoresist removing cavity is also connected with a Y-shaped pipeline which is positioned in the base box and used for discharging waste gas substances after photoresist removing and is used for vacuumizing together with a vacuum pump.
5. The vertical type semiautomatic photoresist removing cavity structure for vacuum photoresist removing of a wafer according to claim 1, 3 or 4, wherein the base box comprises a square bottom frame, a plurality of wall plates positioned around the periphery of the square bottom frame, a plurality of universal casters, and two parallel and level left top plates and right top plates which are arranged at the top end of the square bottom frame, and a plurality of universal casters are equally divided and arranged on four feet of the square bottom frame; the left top plate is positioned at the left side of the top end of the square bottom frame and provided with a plurality of through holes for the lower part of the plasma vacuum photoresist removing cavity to pass through, and the right top plate is positioned at the right side of the top end of the square bottom frame and provided with square holes for cables and pipelines to pass through; the wall plates on the front side and the rear side of the square bottom frame are also provided with a plurality of embedded handles which are symmetrically distributed on the front side and the rear side and used for pushing the whole base box to displace.
6. The vertical semi-automatic photoresist removing cavity structure for vacuum photoresist removing of a wafer according to claim 1, wherein the door plate lifting mechanism comprises a T-shaped door plate and a linear lifting assembly, and the linear lifting assembly drives the T-shaped door plate to lift up and down to cover the opening of the plasma vacuum photoresist removing cavity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320393754.2U CN219534475U (en) | 2023-03-03 | 2023-03-03 | Vertical semi-automatic photoresist removing cavity structure for wafer vacuum photoresist removing |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320393754.2U CN219534475U (en) | 2023-03-03 | 2023-03-03 | Vertical semi-automatic photoresist removing cavity structure for wafer vacuum photoresist removing |
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| CN219534475U true CN219534475U (en) | 2023-08-15 |
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| CN202320393754.2U Active CN219534475U (en) | 2023-03-03 | 2023-03-03 | Vertical semi-automatic photoresist removing cavity structure for wafer vacuum photoresist removing |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116364603A (en) * | 2023-03-03 | 2023-06-30 | 珠海恒格微电子装备有限公司 | Semi-automatic plasma photoresist remover |
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2023
- 2023-03-03 CN CN202320393754.2U patent/CN219534475U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116364603A (en) * | 2023-03-03 | 2023-06-30 | 珠海恒格微电子装备有限公司 | Semi-automatic plasma photoresist remover |
| CN116364603B (en) * | 2023-03-03 | 2023-12-22 | 珠海恒格微电子装备有限公司 | Semi-automatic plasma photoresist remover |
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