CN219513065U

CN219513065U - Special fixing device of sop flip chip

Info

Publication number: CN219513065U
Application number: CN202320934463.XU
Authority: CN
Inventors: 达晓冬; 闫国友
Original assignee: Narui Scientific Instruments Jiangsu Co ltd
Current assignee: Narui Scientific Instruments Jiangsu Co ltd
Priority date: 2023-04-24
Filing date: 2023-04-24
Publication date: 2023-08-11
Anticipated expiration: 2033-04-24

Abstract

A special fixing device for a sop flip chip comprises a base and a clamping cover; the middle part of the base is provided with a U-shaped groove, and both sides of the base are provided with V-shaped clamping grooves; v-shaped buckles are arranged on two side edges of the clamping cover, and a tooth-shaped array is arranged on the top surface of the inner side; the V-shaped clamping groove is matched with the V-shaped buckle, and the V-shaped buckle can be buckled on the V-shaped clamping groove. The advantages are that: the chip is punched and put into the U-shaped groove, so that 5 pins of the chip are just hung on the edges of the groove in an inverted mode, the V-shaped clamping groove and the V-shaped buckle are matched with each other to clamp the chip, the materials of the base and the clamping cover are copper, and the conductivity of the copper is good; the clamping cover is clamped on the chip, and the V-shaped buckles on the two sides of the clamping cover are clamped with the V-shaped clamping grooves on the two sides of the base, so that the fixing force on the two sides of the chip is the same, and the whole chip is absolutely horizontal; the whole process is free of adhesive tape, so that the influence of the adhesive on the conductive adhesive tape on the vacuum degree of the vacuum chamber is solved; one base can be provided with a plurality of chips and is adhered uniformly.

Description

Special fixing device of sop flip chip

Technical Field

The utility model belongs to the technical field of integrated circuit manufacturing, and particularly relates to a special fixing device for a sop flip chip.

Background

In the prior art, the sop flip chip is fixed, the back of the chip is punched, 5 pins of the chip are stuck to the sample stage by using a conductive aluminum foil tape because the 5 pins are punched higher and are not in contact with the aluminum sample stage below, the 5 pins are also punched to be communicated with the aluminum sample stage, and the 5 pins are stuck to be communicated with the sample stage by using the aluminum foil conductive tape. The prior art has the following defects: 1) The conductivity of the aluminum foil conductive tape is poor; 2) The conductive adhesive tapes are stuck on the two sides, so that the fixing forces on the two sides cannot be the same, and the whole chip cannot be absolutely horizontal; 3) Because the chip needs to enter the vacuum chamber, and the adhesive on the conductive adhesive tape has an influence on the vacuum degree of the vacuum chamber; 4) Multiple chips cannot be adhered uniformly.

Disclosure of Invention

The utility model aims to solve the technical problems that: overcomes the defects of the prior art, and provides a special fixing device for a sop flip chip, wherein the conductivity and the chip level do not influence the vacuum degree of a vacuum chamber, and a plurality of chips are adhered consistently.

The technical scheme adopted for solving the technical problems is as follows: a special fixing device of sop flip chip, its characterized in that: comprises a base and a clamping cover; the middle part of the base is provided with a U-shaped groove, and both sides of the base are provided with V-shaped clamping grooves; the two sides of the clamping cover are respectively provided with a V-shaped buckle, and the top surface of the inner side is provided with a tooth-shaped array; the V-shaped clamping groove is matched with the V-shaped buckle, and the V-shaped buckle can be buckled on the V-shaped clamping groove.

Preferably, the base and the clamping cover are made of copper.

Compared with the prior art, the utility model has the beneficial effects that: the chip is punched and placed into the U-shaped groove, so that 5 pins of the chip are just hung on the edge of the groove, the V-shaped clamping groove and the V-shaped buckle are matched with each other to clamp the chip, the base and the clamping cover are made of copper, and the conductivity of copper is good; the clamping cover is clamped on the chip, holes are formed in the clamping cover according to the structure of the back surface of the chip, useful things on the chip are exposed from the front surface, the tooth-shaped array on the clamping cover has elasticity, the tooth-shaped array compresses corresponding pins according to different positions of 5 pins, the V-shaped buckles on the two sides of the clamping cover are clamped with the V-shaped clamping grooves on the two sides of the base, so that the fixing force on the two sides of the chip is the same, and the whole chip is absolutely horizontal; the whole process does not use adhesive tape, so that the influence of the adhesive on the conductive adhesive tape on the vacuum degree of the vacuum chamber is solved; a plurality of chips of base N have solved a plurality of chips and can't accomplish the problem of pasting unanimity.

Drawings

FIG. 1 is a schematic perspective view of a base according to an embodiment of the present utility model;

FIG. 2 is a schematic perspective view of a card cover according to an embodiment of the utility model;

FIG. 3 is a schematic perspective view of a first embodiment of the present utility model;

fig. 4 is a schematic perspective view of a chip placed in a base according to an embodiment of the present utility model.

Marked in the figure as:

1. a base; 2. a clamping cover; 11. a U-shaped groove; 12. a V-shaped clamping groove; 21. v-shaped buckle; 22. a tooth array; 3. and a chip.

Detailed Description

The utility model is further described below with reference to the accompanying examples:

examples

As shown in fig. 1 to 4, a special fixing device for a sop flip chip comprises a base 1 and a clamping cover 2, wherein the base 1 and the clamping cover 2 are made of copper; the middle part of the base 1 is provided with a U-shaped groove 11, and both side surfaces are provided with V-shaped clamping grooves 12; v-shaped buckles 21 are arranged on two sides of the clamping cover 2, and tooth-shaped arrays 22 are arranged on the top surface of the inner side; the V-shaped clamping groove 12 is matched with the V-shaped clamping buckle 21, and the V-shaped clamping buckle 21 can be tightly buckled on the V-shaped clamping groove.

The back of the chip 3 faces upwards and is placed into the U-shaped groove 11, namely 5 pins of the chip 3 face upwards and are hung on the top surfaces of two sides of the U-shaped groove 11 on the base 1 in an inverted mode; the clamping cover 2 is clamped on the chip, holes are formed in the clamping cover 2 according to the structure of the back face of the chip 3, useful things on the chip 3 are exposed from the front face, the tooth-shaped arrays 22 on the clamping cover 2 are elastic, the tooth-shaped arrays 22 can compress corresponding pins according to different positions of 5 pins of the chip 3, the V-shaped clamping buckles 21 on two sides of the clamping cover 2 are clamped with the V-shaped clamping grooves 12 on two sides of the base 1, the forces on two sides of the chip 3 are the same, and the whole chip 3 is in an absolute horizontal position.

The above description is only a preferred embodiment of the present utility model, and is not intended to limit the utility model in any way, and any person skilled in the art may make modifications or alterations to the disclosed technical content to the equivalent embodiments. However, any simple modification, equivalent variation and variation of the above embodiments according to the technical substance of the present utility model still fall within the protection scope of the technical solution of the present utility model.

Claims

1. A special fixing device of sop flip chip, its characterized in that: comprises a base and a clamping cover; the middle part of the base is provided with a U-shaped groove, and both sides of the base are provided with V-shaped clamping grooves; the two sides of the clamping cover are respectively provided with a V-shaped buckle, and the top surface of the inner side is provided with a tooth-shaped array; the V-shaped clamping groove is matched with the V-shaped buckle, and the V-shaped buckle can be buckled on the V-shaped clamping groove.

2. The dedicated fixture for sop flip chip of claim 1, characterized by: the base and the clamping cover are made of copper.