CN213660451U - EMC support for LED - Google Patents
EMC support for LED Download PDFInfo
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- CN213660451U CN213660451U CN202022933585.6U CN202022933585U CN213660451U CN 213660451 U CN213660451 U CN 213660451U CN 202022933585 U CN202022933585 U CN 202022933585U CN 213660451 U CN213660451 U CN 213660451U
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- emc
- support
- metal pad
- frame
- lamp pearl
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Abstract
The utility model discloses a EMC support for LED, it relates to LED technical field. It includes EMC frame, metal support, metal pad, cuts cut groove, is fixed with the EMC frame on the metal support, is provided with a plurality of bowls of cups on the EMC frame, is provided with on the metal pad between the bowl of cups and cuts cut the groove, does not have in the metal pad of the peripheral round bowl of EMC frame and cuts cut groove, separates the metal pad between the lamp pearl through cutting cut groove, realizes the independent state of pad of single lamp pearl, still keeps the state that whole board material does not scatter simultaneously. The utility model discloses do the precutting on the EMC support and handle, make the metal pad separation between the lamp pearl, and the EMC frame keeps the state that whole board is connected, but test phosphor powder point is glued the time and is gone up the test machine on the whole board, and the data of single lamp pearl of quick test, the effect of test phosphor powder examination point ratio shortens phosphor powder ratio test cycle, and application prospect is wide.
Description
Technical Field
The utility model relates to a LED technical field, concretely relates to EMC support for LED.
Background
Along with the large amount of applications of LED lamp pearl, the demand that the market promoted single LED's power is more and more popularized, and the LED lamp pearl demand of EMC material promotes rapidly. LED lamp pearl of EMC material has the technology of phosphor powder point gluing in the manufacture process, and conventional way is: cutting an entire board EMC support packaging product into independent single LED lamp beads, testing fluorescent powder dispensing ratio by using the single lamp beads, in order to verify the ratio, cutting the whole board after dispensing and baking the whole board material, and testing and verifying the fluorescent powder ratio by using a single finished product, so that the period of the whole fluorescent powder testing ratio is very long. In order to solve the above problems, it is particularly necessary to design a novel EMC bracket for LEDs.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a LED uses EMC support, simple structure, reasonable in design, it is easy and simple to handle, can test the effect of phosphor powder examination point ratio fast, effectively shorten the cycle of the experimental ratio of phosphor powder, the practicality is strong, easily uses widely.
In order to achieve the above purpose, the present invention is realized by the following technical solution: the utility model provides a EMC support for LED, includes EMC frame, metal support, metal pad, cuts cut groove, is fixed with the EMC frame on the metal support, is provided with a plurality of bowls of cups on the EMC frame, is provided with on the metal pad between every bowl of cups and cuts cut the groove, through cutting the metal pad between groove separation lamp pearl, realizes the independent state of pad of single lamp pearl, still keeps the state that whole board material does not scatter simultaneously.
Preferably, the cutting depth of the cutting groove is between the thickness of the metal bonding pad and one half of the thickness of the whole bracket.
Preferably, no cutting groove is formed in the metal bonding pad of the bowl cup on the periphery of the EMC frame, and the lamp beads on the periphery of the bowl cup are used for supporting the whole material without cutting the pins.
The utility model has the advantages that: this device is the precutting on conventional EMC support, makes the metal pad separation between the lamp pearl, and the EMC frame keeps the state that whole board is connected, just can the test machine on the whole board when experimental phosphor powder point is glued, the data of single lamp pearl of quick test, the effect of test phosphor powder examination point ratio shortens phosphor powder ratio test cycle, and is reliable practical, and application prospect is wide.
Drawings
The present invention will be described in detail with reference to the accompanying drawings and specific embodiments;
FIG. 1 is a schematic structural view of the utility model before cutting;
fig. 2 is the utility model discloses carry out precutting's structural schematic diagram to whole board EMC support.
Detailed Description
In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.
Referring to fig. 1-2, the following technical solutions are adopted in the present embodiment: the utility model provides a EMC support for LED, includes EMC frame 1, metal support 2, metal pad 3, cuts cut groove 4, is fixed with EMC frame 1 on the metal support 2, is provided with a plurality of bowls of cups on the EMC frame 1, is provided with on the metal pad 3 between every bowl of cups and cuts cut groove 4, separates metal pad 3 between the lamp pearl through cutting cut groove 4, realizes the independent state of pad of single lamp pearl, still keeps the state that whole board material does not scatter simultaneously.
It is worth noting that no cutting groove is formed in the metal bonding pad 3 of the bowl cup on the periphery of the EMC frame 1.
The process of metal pad separation cutting is carried out on a conventional EMC support (figure 1) by the specific embodiment, and the independent state of the pad of a single lamp bead is realized. Specifically, the method comprises the following steps: in the LED packaging process, before the fluorescent powder is tested to be matched in a dispensing manner, cutting equipment is used, pre-cutting action is performed on the local bottom of the EMC frame 1, the EMC frame 1 is kept in a whole plate state, the pad pins of each bowl cup are independent, lamp beads except the peripheral circle are used for supporting a whole piece of material, the pins are not cut, the pre-cutting depth of the cutting groove 4 is based on a cutting metal layer, the cutting depth value is not more than a half thickness value of the whole support, namely the cutting depth of the cutting groove 4 is between the thickness of the metal pad 3 and the thickness of the whole half of the support, so that the metal pads connected together inside the EMC support originally are in an independent separation state, the EMC frame part still keeps a whole module shape, the whole support keeps an integrated structure, and single test of the whole plate is realized.
This embodiment is in the LED encapsulation production process of original EMC material, increase the precutting process, cutting process makes lamp pearl metal pad circuit layer independent, realize the function of single point survey of the whole board material of EMC support, and whole board lamp pearl still keeps the whole piece state, this structure makes the LED semi-manufactured goods of EMC material can carry out the single test of whole board in the experimental ratio is glued to the phosphor powder point, help LED packaging in-process, the product of phosphor powder point technology of gluing carries out quick experimental ratio and confirms, shorten the cycle time of the experimental ratio of phosphor powder, the efficiency of gluing is greatly improved, and wide market perspective has.
The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (3)
1. The utility model provides a LED uses EMC support, its characterized in that, includes EMC frame (1), metal support (2), metal pad (3), cuts cut groove (4), is fixed with EMC frame (1) on metal support (2), is provided with a plurality of bowls cup on EMC frame (1), is provided with on metal pad (3) between every bowl cup and cuts cut groove (4), separates metal pad (3) between the lamp pearl through cutting cut groove (4), realizes the pad independent structure of single lamp pearl.
2. EMC bracket for an LED according to claim 1, characterized in that the cutting depth of said cut groove (4) is between the thickness of the metal pad (3) and one half of the thickness of the bracket as a whole.
3. EMC bracket for LED according to claim 1, characterized in that there is no cut groove in the metal pad (3) of the cup around the EMC frame (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022933585.6U CN213660451U (en) | 2020-12-09 | 2020-12-09 | EMC support for LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022933585.6U CN213660451U (en) | 2020-12-09 | 2020-12-09 | EMC support for LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213660451U true CN213660451U (en) | 2021-07-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022933585.6U Active CN213660451U (en) | 2020-12-09 | 2020-12-09 | EMC support for LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213660451U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117691026A (en) * | 2024-02-01 | 2024-03-12 | 深圳市天成照明有限公司 | Lamp bead assembly and preparation method of LED lamp beads |
-
2020
- 2020-12-09 CN CN202022933585.6U patent/CN213660451U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117691026A (en) * | 2024-02-01 | 2024-03-12 | 深圳市天成照明有限公司 | Lamp bead assembly and preparation method of LED lamp beads |
| CN117691026B (en) * | 2024-02-01 | 2024-05-14 | 深圳市天成照明有限公司 | Lamp bead assembly and preparation method of LED lamp beads |
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