CN202996827U - Wafer capable of realizing simultaneous test for multiple chip - Google Patents
Wafer capable of realizing simultaneous test for multiple chip Download PDFInfo
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- CN202996827U CN202996827U CN 201220632743 CN201220632743U CN202996827U CN 202996827 U CN202996827 U CN 202996827U CN 201220632743 CN201220632743 CN 201220632743 CN 201220632743 U CN201220632743 U CN 201220632743U CN 202996827 U CN202996827 U CN 202996827U
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CN 201220632743 CN202996827U (en) | 2012-11-26 | 2012-11-26 | Wafer capable of realizing simultaneous test for multiple chip |
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CN 201220632743 CN202996827U (en) | 2012-11-26 | 2012-11-26 | Wafer capable of realizing simultaneous test for multiple chip |
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CN202996827U true CN202996827U (en) | 2013-06-12 |
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CN 201220632743 Expired - Fee Related CN202996827U (en) | 2012-11-26 | 2012-11-26 | Wafer capable of realizing simultaneous test for multiple chip |
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108133921A (en) * | 2017-12-14 | 2018-06-08 | 深圳市金誉半导体有限公司 | Semiconductor chip and preparation method thereof |
CN108133923A (en) * | 2017-12-18 | 2018-06-08 | 深圳市金誉半导体有限公司 | Semiconductor chip and preparation method thereof |
CN108535621A (en) * | 2018-04-11 | 2018-09-14 | 上海华虹宏力半导体制造有限公司 | The crystal round test approach of discrete device chip |
CN111106162A (en) * | 2019-12-23 | 2020-05-05 | 东莞市中晶半导体科技有限公司 | LED wafer with LED test points and transfer method |
CN112051496A (en) * | 2020-07-31 | 2020-12-08 | 嘉兴威伏半导体有限公司 | System for realizing SLT automatic multi-chip simultaneous measurement on wafer |
CN112582383A (en) * | 2019-09-27 | 2021-03-30 | 成都辰显光电有限公司 | Chip structure and chip detection method |
-
2012
- 2012-11-26 CN CN 201220632743 patent/CN202996827U/en not_active Expired - Fee Related
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108133921A (en) * | 2017-12-14 | 2018-06-08 | 深圳市金誉半导体有限公司 | Semiconductor chip and preparation method thereof |
CN108133923A (en) * | 2017-12-18 | 2018-06-08 | 深圳市金誉半导体有限公司 | Semiconductor chip and preparation method thereof |
CN108535621A (en) * | 2018-04-11 | 2018-09-14 | 上海华虹宏力半导体制造有限公司 | The crystal round test approach of discrete device chip |
CN112582383A (en) * | 2019-09-27 | 2021-03-30 | 成都辰显光电有限公司 | Chip structure and chip detection method |
CN112582383B (en) * | 2019-09-27 | 2022-12-20 | 成都辰显光电有限公司 | Chip structure and chip detection method |
CN111106162A (en) * | 2019-12-23 | 2020-05-05 | 东莞市中晶半导体科技有限公司 | LED wafer with LED test points and transfer method |
CN112051496A (en) * | 2020-07-31 | 2020-12-08 | 嘉兴威伏半导体有限公司 | System for realizing SLT automatic multi-chip simultaneous measurement on wafer |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: SHANGHAI HUAHONG GRACE SEMICONDUCTOR MANUFACTURING Free format text: FORMER OWNER: HUAHONG NEC ELECTRONICS CO LTD, SHANGHAI Effective date: 20131220 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 201206 PUDONG NEW AREA, SHANGHAI TO: 201203 PUDONG NEW AREA, SHANGHAI |
|
TR01 | Transfer of patent right |
Effective date of registration: 20131220 Address after: 201203 Shanghai city Zuchongzhi road Pudong New Area Zhangjiang hi tech Park No. 1399 Patentee after: Shanghai Huahong Grace Semiconductor Manufacturing Corporation Address before: 201206, Shanghai, Pudong New Area, Sichuan Road, No. 1188 Bridge Patentee before: Shanghai Huahong NEC Electronics Co., Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130612 Termination date: 20151126 |