CN219495169U - Semiconductor wafer thickness detection device - Google Patents
Semiconductor wafer thickness detection device Download PDFInfo
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- CN219495169U CN219495169U CN202223359749.4U CN202223359749U CN219495169U CN 219495169 U CN219495169 U CN 219495169U CN 202223359749 U CN202223359749 U CN 202223359749U CN 219495169 U CN219495169 U CN 219495169U
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Abstract
The utility model provides a device for detecting the thickness of a semiconductor wafer, which comprises a base, wherein a rotary disc seat is arranged on the base, a rotary material disc is arranged on the rotary disc seat, a feeding roller frame is arranged on one side of the rotary disc seat, a discharging roller frame is arranged on one side of the rotary disc seat, which is far away from the feeding roller frame, a positioning device is arranged on one side of the middle part of the rotary disc seat, and a thickness detecting unit is arranged right above the positioning device. According to the utility model, the wafer is conveyed to the rotary tray by the conveying belt on the feeding roller frame, the worm is driven by the motor case to be meshed with the worm gear tooth socket of the switching part arranged at the bottom of the rotary tray, so that the rotary tray is driven to carry out rotary conveying, the wafer passes through the lower part of the thickness detection unit, the thickness detection unit detects the thickness of the wafer, and finally the conveying belt on the discharging roller frame is used for conveying out the wafer material on the rotary tray, so that the detection efficiency is high.
Description
Technical Field
The utility model relates to the technical field of semiconductor wafer detection equipment, in particular to a device for detecting the thickness of a semiconductor wafer.
Background
When enterprises carry out production operation on semiconductor wafers, the thickness of the processed semiconductor chips is often required to be measured, so that unqualified wafers are screened out and eliminated. The thickness of the traditional wafer is detected one by one, the detection speed is low, and more manpower and material resources are needed to be input. The prior art publication No. CN204194310U is a sapphire wafer thickness detection device, and it is including detecting the conveyer belt, and the quantity of detecting the conveyer belt is two, is equipped with testing platform between two detecting the conveyer belt, testing platform and detecting conveyer belt head and tail connection, and testing platform's height is unanimous with detecting the upper surface of conveyer belt, is equipped with high detector on testing platform for the one end that detects the rear of conveyer belt direction of delivery. The device can not rapidly position the semiconductor wafer, reduces the use convenience of the semiconductor wafer thickness detection device, ensures that the semiconductor wafer is easy to deviate in the detection process, and reduces the detection accuracy of the semiconductor wafer thickness detection device.
Disclosure of Invention
In order to solve the above problems, the present utility model proposes a semiconductor wafer thickness inspection apparatus to more exactly solve the above problems.
The utility model is realized by the following technical scheme:
the utility model provides a semiconductor wafer thickness detection device, which comprises a base, wherein a rotary disc seat in a circular ring support shape is arranged on the base, a rotary material disc in a circular ring shape is arranged on the upper part of the rotary disc seat, a feeding roller frame is arranged on one side of the rotary disc seat, a discharging roller frame is arranged on one side of the rotary disc seat, which is far away from the feeding roller frame, the feeding roller frame and the discharging roller frame are both connected with a material conveying belt through driving rollers, a positioning device is arranged on one side of the middle part of the rotary disc seat, the positioning device comprises a double-telescopic-rod hydraulic cylinder arranged at the bottom of the rotary disc seat, two telescopic rods of the double-telescopic-rod hydraulic cylinder extend in a horizontal direction, the axial directions of the telescopic rods of the double-telescopic-rod hydraulic cylinder are consistent with the radial directions of the rotary disc seat, supporting arms are respectively arranged at the end parts of the two telescopic rods of the double-telescopic-rod hydraulic cylinder, the two supporting arms are respectively arranged at the inner side and the outer side of the rotary disc seat, the upper ends of the two supporting arms are fixedly provided with a pair of symmetrically arranged clamping jaws, and the position right above the positioning device is provided with a thickness detection unit.
Further, the bottom integrated into one piece of rotatory charging tray has the switching portion, and the cooperation has the bearing between switching portion bottom and the rotary disk seat inside.
Further, the lateral wall of switching portion is the worm wheel tooth's socket, and the base is located one side of rotary disk seat and is equipped with a pair of bearing support, has the worm between two bearing support, and the worm meshes with the worm wheel tooth's socket of switching portion, the outside of bearing support is equipped with the motor case, and the output axle head of motor case is connected with the one end transmission of worm.
Further, the top of the rotary disc seat is positioned on two sides of the inner annular wall and the outer annular wall of the rotary tray, and the material blocking edges are higher than the upper surface of the rotary tray by 2-3cm.
Further, the clamping jaws are horizontal plate bodies, and a space of 0.5-1mm is reserved between the lower surfaces of the clamping jaws and the upper surface of the rotary tray.
Further, clamping grooves are formed in the inner side ends of the two clamping jaws, and a layer of elastic rubber layer is fixedly adhered to the inner wall of the notch of each clamping groove.
Further, the thickness detection end of the thickness detection unit is arranged at the bottom, and an infrared sensor is arranged at the bottom of the thickness detection unit.
The utility model has the beneficial effects that:
1. according to the utility model, the wafer is conveyed to the rotary tray by the conveying belt on the feeding roller frame, the worm is driven by the motor case to be meshed with the worm gear tooth socket of the switching part arranged at the bottom of the rotary tray, so that the rotary tray is driven to carry out rotary conveying, the wafer passes through the lower part of the thickness detection unit, the thickness detection unit detects the thickness of the wafer, and finally the conveying belt on the discharging roller frame is used for conveying out the wafer material on the rotary tray, so that the detection efficiency is high;
2. in the wafer detection process of the thickness detection unit, the infrared sensor at the bottom of the thickness detection unit senses that a wafer enters a to-be-detected area, and the two telescopic rods of the double telescopic rod hydraulic cylinder are controlled to simultaneously stretch so as to drive the two clamping jaws to clamp and fix the passing wafer, the inner side ends of the clamping jaws are provided with clamping grooves for detecting and clamping wafers with different diameters, the clamping is stable, and the inner wall of the notch of the clamping groove is fixedly adhered with an elastic rubber layer, so that the abrasion in the wafer clamping process is greatly reduced, and the wafer detection is fast and the positioning is accurate.
Drawings
FIG. 1 is a perspective view of the whole structure of the present utility model;
FIG. 2 is a top view of the structure of the present utility model;
FIG. 3 is a cross-sectional view at A-A in FIG. 2;
FIG. 4 is a cross-sectional view at B-B in FIG. 2;
fig. 5 is a schematic perspective view of a rotary table base according to the present utility model.
In the figure: 1. a base; 2. a rotary disk seat; 201. rotating the material tray; 2011. a switching part; 202. a feed roll stand; 2021. a discharging roller frame; 2022. a material conveying belt; 203. a bearing support; 2031. a worm; 2032. a motor case; 3. a positioning device; 301. a double telescopic rod hydraulic cylinder; 302. a support arm; 303. a clamping jaw; 3031. a clamping groove; 4. and a thickness detection unit.
Detailed Description
In order to more clearly and completely describe the technical scheme of the utility model, the utility model is further described below with reference to the accompanying drawings.
Referring to fig. 1-3, the utility model provides a semiconductor wafer thickness detection device, which comprises a base 1, wherein a circular ring support-shaped rotating disc seat 2 is arranged on the base 1, a circular ring disc-shaped rotating disc 201 is arranged at the upper part of the rotating disc seat 2, a feeding roller frame 202 is arranged at one side of the rotating disc seat 2, a discharging roller frame 2021 is arranged at one side of the rotating disc seat 2 far away from the feeding roller frame 202, a material conveying belt 2022 is connected to the feeding roller frame 202 and the discharging roller frame 2021 through driving rollers, the material conveying belt 2022 on the feeding roller frame 202 conveys wafers to the rotating disc 201, the material conveying belt 2022 on the discharging roller frame 2021 is used for conveying the wafer materials on the rotating disc 201, a switching part 2011 is integrally formed at the bottom of the rotating disc 201, a bearing is matched between the bottom of the switching part 2011 and the inside of the rotating disc seat 2, the lateral wall of switching portion 2011 is the worm gear tooth groove, base 1 is located one side of rotary disk seat 2 and is equipped with a pair of bearing support 203, the switching has worm 2031 between two bearing support 203, and worm 2031 meshes with the worm gear tooth groove of switching portion 2011, the outside of bearing support 203 is equipped with motor case 2032, and the output shaft end of motor case 2032 is connected with the one end transmission of worm 2031, under motor case 2032 to worm 2031's drive, order about worm 2031 and the worm gear tooth groove meshing transmission of switching portion 2011 that the rotary tray 201 bottom was established, thereby order about rotary tray 201 to rotate the material of transporting, rotary disk seat 2 top is located the interior annular wall of rotary tray 201 and outer annular wall both sides all are equipped with the flange, the flange is higher than rotary tray 201 upper surface 2-3cm, prevent that the material from dropping.
The rotary disk seat 2 middle part one side position is equipped with positioner 3, positioner 3 is including setting up in the two telescopic link pneumatic cylinders 301 of rotary disk seat 2 bottom, two telescopic links of two telescopic link pneumatic cylinders 301 are the horizontal direction and extend, and the telescopic link axial of two telescopic link pneumatic cylinders 301 is unanimous with the radial of rotary disk seat 2, two telescopic link tip of two telescopic link pneumatic cylinders 301 all are equipped with support arm 302, two support arms 302 set up respectively in the inside and outside both sides of rotary disk seat 2, and the upper end of two support arms 302 is fixed with the clamping jaw 303 of symmetrical setting, clamping jaw 303 is the horizontal plate body, and leave 0.5-1 mm's interval between the upper surface of clamping jaw 303 and rotary tray 201, it is fixed to order about the wafer that passes through simultaneously to drive two telescopic link pneumatic cylinders 301 through control two telescopic links, and then the inboard end of two clamping jaw 303 has all been seted up double-layered groove 3031 for the wafer detection centre gripping of different chi footpath is firm, and the notch inner wall bonding of double-layered elastic rubber layer of double-layered groove 3031, greatly reduced is to the wearing and tearing in the wafer centre gripping process.
The thickness detection unit 4 is arranged at the position right above the positioning device 3, the thickness detection end of the thickness detection unit 4 is arranged at the bottom, the thickness detection unit 4 is used for carrying out non-contact detection on the wafer clamped and fixed by the positioning device 3, and an infrared sensor is arranged at the bottom of the thickness detection unit 4 and used for sensing whether the wafer enters a to-be-detected area or not, so that the positioning device 3 can be driven to clamp and fix the wafer.
Working principle: the utility model carries out the material conveying by the material conveying belt 2022 on the feeding roller frame 202, the wafer is conveyed to the rotary tray 201, the worm 2031 is driven by the motor case 2032 to drive the worm 2031 to be meshed with the worm gear slot of the switching part 2011 arranged at the bottom of the rotary tray 201, thereby driving the rotary tray 201 to carry out the material conveying, the wafer passes below the thickness detection unit 4, the thickness detection unit 4 carries out the thickness detection on the wafer, and finally the material conveying belt 2022 on the discharging roller frame 2021 is used for conveying out the wafer material on the rotary tray 201, so the detection efficiency is high;
in the wafer detection process of the thickness detection unit 4, after the infrared sensor at the bottom of the thickness detection unit 4 senses that a wafer enters a to-be-detected area, the two telescopic rods of the double telescopic rod hydraulic cylinder 301 are controlled to stretch out and draw back simultaneously, and then the two clamping jaws 303 are driven to clamp and fix the passing wafer, the inner side ends of the clamping jaws 303 are provided with clamping grooves 3031 for detecting and clamping and fixing wafers with different ruler diameters, the clamping is stable, and the inner wall of a notch of the clamping groove 3031 is fixedly adhered with a layer of elastic rubber layer, so that abrasion in the wafer clamping process is greatly reduced, and the wafer detection is quick and the positioning is accurate.
Of course, the present utility model can be implemented in various other embodiments, and based on this embodiment, those skilled in the art can obtain other embodiments without any inventive effort, which fall within the scope of the present utility model.
Claims (7)
1. The utility model provides a detection device of semiconductor wafer thickness, includes base (1), its characterized in that, be equipped with rotary disk seat (2) that are ring support form on base (1), rotary disk seat (2) upper portion is equipped with rotary tray (201) that are ring disk shape, one side of rotary disk seat (2) is equipped with feeding roller frame (202), one side that feeding roller frame (202) were kept away from to rotary disk seat (2) is equipped with ejection of compact roller frame (2021), all be connected with fortune material belt (2022) through the driving roller on feeding roller frame (202), ejection of compact roller frame (2021), rotary disk seat (2) middle part one side position is equipped with positioner (3), positioner (3) are including setting up in the two telescopic link pneumatic cylinders (301) of rotary disk seat (2) bottom, two telescopic link pneumatic cylinders (301) are the horizontal direction and extend, and two telescopic link axial and the radial unanimity of rotary disk seat (2) of telescopic link pneumatic cylinder (301), two telescopic link tip all are equipped with support arm (302), and two rotary disk (302) set up respectively in pair of symmetry on two support arm (2) and set up the both sides of two opposite sides and set up the position device (4) that have set up on the position of two opposite sides and have the position device (303).
2. The device for detecting the thickness of the semiconductor wafer according to claim 1, wherein the bottom of the rotary tray (201) is integrally formed with a transfer part (2011), and a bearing is matched between the bottom of the transfer part (2011) and the inside of the rotary tray seat (2).
3. The device for detecting the thickness of the semiconductor wafer according to claim 2, wherein the side wall of the transfer part (2011) is a worm gear slot, a pair of bearing supports (203) are arranged on one side of the base (1) located on the rotating disc base (2), a worm (2031) is transferred between the two bearing supports (203), the worm (2031) is meshed with the worm gear slot of the transfer part (2011), a motor case (2032) is arranged on the outer side of the bearing supports (203), and an output shaft end of the motor case (2032) is in transmission connection with one end of the worm (2031).
4. The semiconductor wafer thickness detection device according to claim 1, wherein the top of the rotary disk seat (2) is provided with a material blocking edge on both sides of the inner annular wall and the outer annular wall of the rotary tray (201), and the material blocking edge is 2-3cm higher than the upper surface of the rotary tray (201).
5. The semiconductor wafer thickness inspection apparatus according to claim 1, wherein the clamping jaws (303) are each a horizontal plate body, and a space of 0.5-1mm is left between the lower surface of the clamping jaw (303) and the upper surface of the rotary tray (201).
6. The semiconductor wafer thickness inspection apparatus according to claim 5, wherein the inner ends of both the clamping jaws (303) are provided with clamping grooves (3031), and a layer of elastic rubber layer is adhered and fixed to the inner wall of the notch of the clamping groove (3031).
7. The device for detecting the thickness of a semiconductor wafer according to claim 1, wherein the thickness detection end of the thickness detection unit (4) is arranged at the bottom, and an infrared sensor is arranged at the bottom of the thickness detection unit (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223359749.4U CN219495169U (en) | 2022-12-14 | 2022-12-14 | Semiconductor wafer thickness detection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223359749.4U CN219495169U (en) | 2022-12-14 | 2022-12-14 | Semiconductor wafer thickness detection device |
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| CN219495169U true CN219495169U (en) | 2023-08-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202223359749.4U Active CN219495169U (en) | 2022-12-14 | 2022-12-14 | Semiconductor wafer thickness detection device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117104775A (en) * | 2023-10-20 | 2023-11-24 | 江苏希太芯科技有限公司 | Infrared detection device for detecting thickness of semiconductor wafer |
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2022
- 2022-12-14 CN CN202223359749.4U patent/CN219495169U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117104775A (en) * | 2023-10-20 | 2023-11-24 | 江苏希太芯科技有限公司 | Infrared detection device for detecting thickness of semiconductor wafer |
| CN117104775B (en) * | 2023-10-20 | 2023-12-26 | 江苏希太芯科技有限公司 | Infrared detection device for detecting thickness of semiconductor wafer |
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