CN219485141U - Double-sided grinding device - Google Patents
Double-sided grinding device Download PDFInfo
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- CN219485141U CN219485141U CN202320747954.3U CN202320747954U CN219485141U CN 219485141 U CN219485141 U CN 219485141U CN 202320747954 U CN202320747954 U CN 202320747954U CN 219485141 U CN219485141 U CN 219485141U
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- grinding wheel
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- grinding
- support frame
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
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Abstract
The utility model provides a double-sided grinding device, which is used for grinding a semiconductor chip and comprises the following components: the grinding surfaces of the pair of grinding wheels are oppositely arranged so that the chip is placed between the pair of grinding wheels; the chip supporting device is connected with the grinding wheel and used for supporting the chip; the grinding wheel adjusting device is connected with the grinding wheels and used for adjusting the positions of the grinding wheels so as to enable the pair of grinding wheels to clamp the chip; at least two distance sensors arranged on the chip supporting device for measuring the distance from the preset position to the front surface of the chip and the distance from the preset reference position to the back surface of the chip; the driving control device is used for driving the grinding wheel to adjust the position and rotating the grinding wheel according to the data measured by the distance sensor, so that grinding is realized. Through cooperation between grinding wheel adjusting device, distance sensor and the drive control device, realize carrying out accurate grinding to the chip to guarantee the holistic roughness of chip.
Description
Technical Field
The utility model relates to the technical field of chips, in particular to a double-sided grinding device.
Background
Integrated circuits, or microcircuits, microchips, wafers/chips, are a means in electronics to miniaturize circuits (including mainly semiconductor devices, also including passive components, etc.) and are often manufactured on semiconductor wafer surfaces. Semiconductor chips require grinding during processing.
However, the prior art double-sided lapping apparatus has the following drawbacks: firstly, most of the existing double-sided grinding devices cannot guarantee precision, hard damage is easily generated on the surface of a chip in the grinding process, so that the chip is damaged, and the quality is reduced. Secondly, when the double-sided grinding device is used for a long time, the positions of the grinding surfaces of the double-sided grinding device are deviated, and the problems of reduced flatness of the ground workpiece and the like can occur.
Disclosure of Invention
In order to overcome the defects in the prior art, the utility model provides a double-sided grinding device. The specific technical scheme is as follows:
a double-sided lapping apparatus for lapping a semiconductor chip, comprising:
the grinding surfaces of the pair of grinding wheels are oppositely arranged so that the chip is placed between the pair of grinding wheels;
the chip supporting device is connected with the grinding wheel and used for supporting the chip;
the grinding wheel adjusting device is connected with the grinding wheel and used for adjusting the position of the grinding wheel;
at least two distance sensors arranged on the chip supporting device and used for measuring the distance from the preset position to the front surface of the chip and the distance from the preset reference position to the back surface of the chip;
the distance sensor and the grinding wheel adjusting device are electrically connected to the driving control device, and the driving control device is used for adjusting the position of the grinding wheel according to the distance measured by the distance measuring device so as to realize grinding.
In a specific embodiment, the at least two distance sensors include a first distance sensor, a second distance sensor, and a third distance sensor, where the first distance sensor, the second distance sensor, and the third distance sensor are sequentially disposed along a length direction of the chip supporting device.
In a specific embodiment, the grinding machine further comprises a frame, a first grinding wheel support frame and a second grinding wheel support frame, wherein the first grinding wheel support frame and the second grinding wheel support frame are movably arranged on the frame, one grinding wheel is arranged on the first grinding wheel support frame, and the other grinding wheel is arranged on the second grinding wheel support frame; and the first grinding wheel support frame and the second grinding wheel support frame are both provided with the grinding wheel adjusting device for adjusting the position of the grinding wheel.
In a specific embodiment, the grinding wheel adjusting device comprises an axial rotation adjusting device and a movement adjusting device, wherein the axial rotation adjusting device is arranged in the first grinding wheel supporting frame and is used for enabling the grinding wheel on the first grinding wheel supporting frame to rotate and move along the axial direction; the movable adjusting device is arranged outside the first grinding wheel support frame and is used for enabling the first grinding wheel support frame to move in the horizontal or vertical direction, so that the grinding wheel on the first grinding wheel support frame moves in the horizontal or vertical direction;
the second grinding wheel support frame is internally provided with the axial rotation adjusting device which is used for enabling the grinding wheel on the second grinding wheel support frame to rotate and axially move; the outside of second emery wheel support frame also is equipped with remove adjusting device for make second emery wheel support frame horizontal or vertical direction remove, thereby make on the second emery wheel support frame the emery wheel horizontal or vertical direction removes.
In one embodiment, the movement adjustment device comprises a vertical position adjustment assembly, a horizontal position adjustment assembly, and a follower; the vertical position adjusting assembly and the horizontal position adjusting assembly are both connected to the driven piece.
In a specific embodiment, the chip support means comprises axial support means for positioning and supporting the chip in an axial direction and radial support means; the radial support device is used for positioning and rotating the support chip in the radial direction.
In one embodiment, the axial support device comprises a pair of static pressure pads, wherein the static pressure pads are in one-to-one correspondence with the grinding wheels and are used for supporting the front surface and the back surface of the chip.
In a specific embodiment, the grinding wheel further comprises a driving device, and the driving device is connected to the grinding wheel.
In a specific embodiment, the driving device comprises a rotary driving piece and a feeding driving piece, wherein the rotary driving piece and the feeding driving piece are connected with the grinding wheel, the rotary driving piece is used for driving the grinding wheel to rotate, and the feeding driving piece is used for driving the grinding wheel to move along the axial direction.
In a specific embodiment, the device further comprises a deformation calculation device, wherein the deformation calculation device is used for calculating the deformation of the chip according to the detection result of the distance sensor; the driving control device is electrically connected with the deformation calculation device and used for controlling according to the deformation amount so as to keep the chip flat.
The utility model has at least the following beneficial effects:
the utility model provides a double-sided grinding device, which is used for grinding a semiconductor chip and comprises the following components: the grinding surfaces of the pair of grinding wheels are oppositely arranged so that the chip is placed between the pair of grinding wheels; the chip supporting device is connected with the grinding wheel and used for supporting the chip; the grinding wheel adjusting device is connected with the grinding wheels and used for adjusting the positions of the grinding wheels so as to enable the pair of grinding wheels to clamp the chip; at least two distance sensors arranged on the chip supporting device for measuring the distance from the preset position to the front surface of the chip and the distance from the preset reference position to the back surface of the chip; the driving control device is used for driving the grinding wheel to adjust the position and rotating the grinding wheel according to the data measured by the distance sensor, so that grinding is realized. Through cooperation between grinding wheel adjusting device, two at least distance sensor and the drive control device, realize carrying out accurate grinding to the chip to guarantee the holistic roughness of chip.
Further, the at least two distance sensors include a first distance sensor, a second distance sensor, and a third distance sensor, and the first distance sensor, the second distance sensor, and the third distance sensor are sequentially disposed along a length direction of the chip supporting device. The first distance sensor, the second distance sensor and the third distance sensor are used for measuring the distances from the preset position to the front surface of the chip and the distance from the preset reference position to the back surface of the chip, so that the thicknesses of the plurality of positions of the chip are ensured, and the flatness of the chip is ensured.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a front view of a double-sided lapping apparatus provided by the present utility model;
FIG. 2 is a schematic diagram of a double-sided polishing apparatus according to the present utility model;
FIG. 3 is a front view of a motion adjustment device of a double-sided lapping device provided by the present utility model;
FIG. 4 is a perspective view of a motion adjusting device of the double-sided lapping device provided by the present utility model;
fig. 5 is a cross-sectional view of a movement adjusting device of the double-sided lapping device provided by the present utility model.
Reference numerals:
1-grinding wheel;
2-chip supporting means;
4-a distance sensor;
5-a drive control device;
31-an axial rotation adjustment device; 32-a movement adjustment device;
321-a vertical position adjustment assembly; 322-horizontal position adjustment assembly; 323-follower;
3211-a first motor; 3212-a first worm gear; 3213-a first set screw;
3221-a second motor; 3222-a second worm gear; 3223-a second set screw;
41-a first distance sensor; 42-a second distance sensor; 43-a third distance sensor;
6-a frame;
7-a first grinding wheel support frame; 8-a second grinding wheel support;
21-a static pressure pad;
51-a rotary drive; 52-a feed drive;
10-deformation calculation means;
11-chip.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
As shown in fig. 1 to 3, the present utility model provides a double-sided lapping apparatus for lapping a semiconductor chip 11, comprising: a pair of grinding wheels 1, the grinding surfaces of the pair of grinding wheels 1 being disposed opposite to each other so that the chip 11 is placed between the pair of grinding wheels 1; the chip 11 supporting device 2 is connected with the grinding wheel 1 and is used for supporting the chip 11; the grinding wheel adjusting device is connected with the grinding wheels 1 and is used for adjusting the positions of the grinding wheels 1 so as to enable the pair of grinding wheels 1 to clamp the chip 11; at least two distance sensors 4 provided on the chip 11 supporting means 2 for measuring distances from a preset position to the front surface of the chip 11 and a predetermined reference position to the back surface of the chip 11; the driving control device 5, the distance sensor 4 and the grinding wheel adjusting device are electrically connected to the driving control device 5, and the driving control device 5 is used for driving the grinding wheel 1 to adjust the position and rotate the grinding wheel 1 according to the data measured by the distance sensor 4, so that grinding is realized. Through cooperation between grinding wheel adjusting device, at least two distance sensor 4 and drive control device 5, realize carrying out accurate grinding to chip 11 to guarantee the holistic roughness of chip 11.
Wherein the abrasive surface of one grinding wheel 1 is used for contacting the front surface of the chip 11, and the abrasive surface of the other grinding wheel 1 is used for contacting the back surface of the chip 11. The one end of the grinding wheel 1 far away from the grinding surface is provided with a rotating shaft which is connected with a grinding wheel adjusting device so as to adjust the positions of the grinding surface of one grinding wheel 1 and the grinding surface of the other grinding wheel 1 through the grinding wheel adjusting device, and the grinding surface of one grinding wheel 1 and the grinding surface of the other grinding wheel 1 are selectively arranged, thereby realizing double-sided grinding of the chip 11.
As shown in fig. 1 to 3, specifically, the grinding wheel 1 is a cup-shaped grinding wheel 1, and the grinding surface of the grinding wheel 1 is the annular grinding wheel 1 surface. The chip 11 is subjected to rotary grinding by a pair of grinding faces on the grinding wheel 1.
As shown in fig. 1 to 3, specifically, the at least two distance sensors 4 include a first distance sensor 41, a second distance sensor 42, and a third distance sensor 43, and the first distance sensor 41, the second distance sensor 42, and the third distance sensor 43 are disposed in this order along the length direction of the chip 11 supporting device 2. The distances from the preset position to the front surface of the chip 11 and the predetermined reference position to the back surface of the chip 11 at the plurality of positions of the chip 11 are measured by the first distance sensor 41, the second distance sensor 42 and the third distance sensor 43, thereby ensuring the thickness of the plurality of positions of the chip 11 to ensure the flatness of the chip 11.
As shown in fig. 1-3, the double-sided grinding device further comprises a frame 6, a first grinding wheel support frame 7 and a second grinding wheel support frame 8, wherein the first grinding wheel support frame 7 and the second grinding wheel support frame 8 are movably arranged on the frame 6, one grinding wheel 1 is arranged on the first grinding wheel support frame 7, and the other grinding wheel 1 is arranged on the second grinding wheel support frame 8; and the first grinding wheel support frame 7 and the second grinding wheel support frame 8 are both provided with a grinding wheel adjusting device for adjusting the position of the grinding wheel 1.
As shown in fig. 1-5, the grinding wheel adjusting device comprises an axial rotation adjusting device 31 and a movement adjusting device 32, wherein the axial rotation adjusting device 31 is arranged in the first grinding wheel supporting frame 7 and is used for rotating and axially moving the grinding wheel 1 on the first grinding wheel supporting frame 7; the outside of the first grinding wheel support frame 7 is provided with a movement adjusting device 32 for moving the first grinding wheel support frame 7 in the horizontal or vertical direction, so that the grinding wheel 1 on the first grinding wheel support frame 7 moves in the horizontal or vertical direction;
an axial rotation adjusting device 31 is also arranged in the second grinding wheel support 8 and is used for enabling the grinding wheel 1 on the second grinding wheel support 8 to rotate and axially move; the second grinding wheel support 8 is also provided with a movement adjusting device 32 on the outside for moving the second grinding wheel support 8 in a horizontal or vertical direction, thereby moving the grinding wheel 1 on the second grinding wheel support 8 in a horizontal or vertical direction.
As shown in fig. 3-5, the movement adjustment device 32 includes a vertical position adjustment assembly 321, a horizontal position adjustment assembly 322, and a follower 323; both the vertical position adjustment assembly 321 and the horizontal position adjustment assembly 322 are connected to the follower 323.
Wherein, the external connection of first emery wheel support frame 7 has follower 323, and vertical position adjustment subassembly 321 is connected in follower 323, drives the vertical removal of follower 323 through vertical position adjustment subassembly 321 to drive the vertical removal of first emery wheel support frame 7 on the follower 323, thereby drive the vertical removal of emery wheel 1 on the first emery wheel support frame 7. The horizontal position adjusting component 322 is also connected to the driven member 323, and drives the driven member 323 to move horizontally through the horizontal position adjusting component 322 so as to drive the first grinding wheel support frame 7 on the driven member 323 to move horizontally, thereby driving the grinding wheel 1 on the first grinding wheel support frame 7 to move horizontally.
The outside of second grinding wheel support frame 8 also is connected with follower 323, and vertical position adjustment subassembly 321 is connected in follower 323, drives follower 323 through vertical position adjustment subassembly 321 and vertically removes to drive the vertical removal of second grinding wheel support frame 8 on the follower 323, thereby drive the vertical removal of grinding wheel 1 on the second grinding wheel support frame 8. The horizontal position adjusting component 322 is also connected to the driven member 323, and drives the driven member 323 to move horizontally through the horizontal position adjusting component 322 so as to drive the second grinding wheel support frame 8 on the driven member 323 to move horizontally, thereby driving the grinding wheel 1 on the second grinding wheel support frame 8 to move horizontally.
As shown in fig. 3-5, the vertical position adjustment assembly 321 includes a first motor 3211, a first worm gear 3212, and a first adjustment screw 3213, rotation of an output shaft of the first motor 3211 is transmitted to the first adjustment screw 3213 via the first worm gear 3212, and in this way, the first adjustment screw 3213 is vertically screwed in and out, thereby causing the driven body to follow the vertical adjustment movement.
The horizontal position adjusting assembly 322 includes a second motor 3221, a second worm wheel 3222, and a second adjusting screw 3223, and rotation of an output shaft of the second motor 3221 is transmitted to the second adjusting screw 3223 via the second worm wheel 3222, and in this way, the second adjusting screw 3223 is horizontally screwed in and out, so that the driven body follows the horizontal adjusting movement.
As shown in fig. 1-5, the chip 11 support means 2 comprises axial support means for positioning and supporting the chip 11 in an axial direction and radial support means; the radial support means serve to radially position and rotationally support the chip 11.
As shown in fig. 1 to 5, the axial supporting device includes a pair of static pressure pads 21, and the static pressure pads 21 are in one-to-one correspondence with the grinding wheels 1 for supporting the front and back surfaces of the chip 11.
As shown in fig. 1-5, the grinding wheel adjusting device further comprises a driving device, which is connected to the grinding wheel 1. Specifically, the output end of the driving device is connected to the rotating shaft of the grinding wheel 1 to drive the grinding wheel 1 to rotate.
The rotating device comprises a motor, a driving motor and the like.
As shown in fig. 1 to 5, the driving device comprises a rotary driving member 51 and a feeding driving member 52, wherein the rotary driving member 51 and the feeding driving member 52 are connected with the grinding wheel 1, the rotary driving member 51 is used for driving the grinding wheel 1 to rotate, and the feeding driving member 52 is used for driving the grinding wheel 1 to move along the axial direction.
As shown in fig. 1-5, the grinding wheel adjusting device further comprises a deformation calculating device 10, wherein the deformation calculating device 10 is used for calculating the deformation of the chip 11 according to the detection result of the distance sensor 4; the driving control device 5 is electrically connected to the deformation calculating device 10, and is used for controlling according to the deformation amount so as to keep the chip 11 flat.
In the description of the present utility model, it should be noted that the azimuth or positional relationship indicated by the terms "vertical", "upper", "lower", "horizontal", etc. are based on the azimuth or positional relationship shown in the drawings, and are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the apparatus or element referred to must have a specific azimuth, be constructed and operated in a specific azimuth, and thus should not be construed as limiting the present utility model.
In the description of the present utility model, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.
Those skilled in the art will appreciate that the drawing is merely a schematic illustration of a preferred implementation scenario and that the modules or flows in the drawing are not necessarily required to practice the utility model.
Those skilled in the art will appreciate that modules in an apparatus in an implementation scenario may be distributed in an apparatus in an implementation scenario according to an implementation scenario description, or that corresponding changes may be located in one or more apparatuses different from the implementation scenario. The modules of the implementation scenario may be combined into one module, or may be further split into a plurality of sub-modules.
The above-mentioned inventive sequence numbers are merely for description and do not represent advantages or disadvantages of the implementation scenario.
The foregoing description of the preferred embodiments of the utility model is not intended to limit the utility model to the precise form disclosed, and any such modifications, equivalents, and alternatives falling within the spirit and scope of the utility model are intended to be included within the scope of the utility model.
Claims (10)
1. A double-sided lapping apparatus for lapping a semiconductor chip, comprising:
the grinding surfaces of the pair of grinding wheels are oppositely arranged so that the chip is placed between the pair of grinding wheels;
the chip supporting device is connected with the grinding wheel and used for supporting the chip;
the grinding wheel adjusting device is connected with the grinding wheels and used for adjusting the positions of the grinding wheels so as to enable the pair of grinding wheels to clamp the chip;
at least two distance sensors arranged on the chip supporting device and used for measuring the distance from the preset position to the front surface of the chip and the distance from the preset reference position to the back surface of the chip;
the driving control device is used for driving the grinding wheel to adjust the position and rotate the grinding wheel according to the data measured by the distance sensor, so that grinding is realized.
2. The double-sided lapping device of claim 1, wherein the at least two distance sensors comprise a first distance sensor, a second distance sensor, and a third distance sensor, the first distance sensor, the second distance sensor, and the third distance sensor being disposed sequentially along a length direction of the chip supporting device.
3. The double-sided lapping device of claim 1, further comprising a frame, a first grinding wheel support frame and a second grinding wheel support frame, the first grinding wheel support frame and the second grinding wheel support frame being movably disposed on the frame, one grinding wheel being disposed on the first grinding wheel support frame and the other grinding wheel being disposed on the second grinding wheel support frame; and the first grinding wheel support frame and the second grinding wheel support frame are both provided with the grinding wheel adjusting device for adjusting the position of the grinding wheel.
4. A double-sided grinding apparatus according to claim 3, wherein the grinding wheel adjusting means comprises an axial rotation adjusting means and a movement adjusting means, the axial rotation adjusting means being provided inside the first grinding wheel supporting frame for rotating and axially moving the grinding wheel on the first grinding wheel supporting frame; the movable adjusting device is arranged outside the first grinding wheel support frame and is used for enabling the first grinding wheel support frame to move in the horizontal or vertical direction, so that the grinding wheel on the first grinding wheel support frame moves in the horizontal or vertical direction;
the second grinding wheel support frame is internally provided with the axial rotation adjusting device which is used for enabling the grinding wheel on the second grinding wheel support frame to rotate and axially move; the outside of second emery wheel support frame also is equipped with remove adjusting device for make second emery wheel support frame horizontal or vertical direction remove, thereby make on the second emery wheel support frame the emery wheel horizontal or vertical direction removes.
5. The double-sided lapping device of claim 4, wherein the movement adjustment device comprises a vertical position adjustment assembly, a horizontal position adjustment assembly, and a follower; the vertical position adjusting assembly and the horizontal position adjusting assembly are both connected to the driven piece.
6. The double-sided lapping device of claim 1, wherein the chip support device comprises an axial support device for positioning and supporting a chip in an axial direction and a radial support device; the radial support device is used for positioning and rotating the support chip in the radial direction.
7. The double-sided lapping device of claim 6, wherein the axial support device comprises a pair of hydrostatic pads in one-to-one correspondence with the grinding wheels for supporting the front and back sides of the chip.
8. The double-sided lapping device of claim 1, wherein the drive control device comprises a rotary drive member and a feed drive member, the rotary drive member and the feed drive member being connected to the grinding wheel, the rotary drive member being configured to drive the grinding wheel in rotation, the feed drive member being configured to drive the grinding wheel in axial movement.
9. The double-sided lapping device of claim 1, wherein the lapping surface of the grinding wheel is an annular grinding wheel surface.
10. The double-sided lapping device according to claim 1, further comprising a deformation calculation device for calculating a deformation amount of the chip according to a detection result of the distance sensor; the driving control device is electrically connected with the deformation calculation device and used for controlling according to the deformation amount so as to keep the chip flat.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320747954.3U CN219485141U (en) | 2023-04-03 | 2023-04-03 | Double-sided grinding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320747954.3U CN219485141U (en) | 2023-04-03 | 2023-04-03 | Double-sided grinding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219485141U true CN219485141U (en) | 2023-08-08 |
Family
ID=87476550
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320747954.3U Active CN219485141U (en) | 2023-04-03 | 2023-04-03 | Double-sided grinding device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219485141U (en) |
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2023
- 2023-04-03 CN CN202320747954.3U patent/CN219485141U/en active Active
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