CN219469007U - Feeding mechanism for transistor - Google Patents
Feeding mechanism for transistor Download PDFInfo
- Publication number
- CN219469007U CN219469007U CN202320411884.4U CN202320411884U CN219469007U CN 219469007 U CN219469007 U CN 219469007U CN 202320411884 U CN202320411884 U CN 202320411884U CN 219469007 U CN219469007 U CN 219469007U
- Authority
- CN
- China
- Prior art keywords
- assembly
- frame
- plate
- buffer
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000463 material Substances 0.000 claims abstract description 181
- 238000012546 transfer Methods 0.000 claims abstract description 43
- 238000013519 translation Methods 0.000 claims description 32
- 238000001179 sorption measurement Methods 0.000 claims description 28
- 238000005192 partition Methods 0.000 claims description 7
- 230000003139 buffering effect Effects 0.000 claims description 4
- 238000010521 absorption reaction Methods 0.000 description 10
- 230000007547 defect Effects 0.000 description 6
- 229910000831 Steel Inorganic materials 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- De-Stacking Of Articles (AREA)
Abstract
The utility model relates to a feeding mechanism for a transistor, which comprises a material frame replacement assembly, a jacking assembly, a buffer assembly and a transfer assembly; the jacking component is positioned below the material frame replacement component, the buffer component is arranged above the material frame replacement component, and the transfer component is arranged above the buffer component; the material frame replacing assembly receives the fully loaded material frames and discharges the empty material frames; the material frame stores a plurality of stacked material pipes, transistors to be detected are arranged in the material pipes side by side, and the first surface, the second surface and the third surface of the material pipes are transparent and respectively opposite to three surfaces to be detected of the transistors in the material pipes; the jacking component integrally jacks the material pipes filled with the material frames in the material frame replacement component into the buffer component; the buffer component temporarily stores the material pipe lifted by the lifting component; and the transfer component sequentially carries the material pipes in the buffer component to the subsequent stations. The transfer efficiency can be improved through the temporary storage pipe of the buffer assembly; the uninterrupted feeding can be ensured through the replacement component of the material frame, and the feeding efficiency is improved.
Description
Technical Field
The utility model relates to transistor defect detection equipment, in particular to a feeding mechanism for a transistor.
Background
Automatic optical inspection (AOI for short, english: automated Optical Inspection) is a technology for detecting common defects of product appearance based on an optical principle. The AOI equipment automatically scans the product through the camera, acquires images, compares the region to be detected on the product with qualified parameters in the database, inspects the defects of the product through image processing, and displays or marks the defects through a display or an automatic mark for repair by maintenance personnel.
When the transistor is detected by AOI technology, defects need to be detected on one end of the transistor with a pin and on the front surface and the back surface. In the prior art, a transistor is clamped by a rotary clamping assembly and sequentially rotated twice, three surfaces to be detected are respectively sent to the same detection station, and the defect detection of the transistor is completed.
Because the transistor is small, the material is generally fed through the vibration disk, and when the transistor is piled up and moved in the vibration disk, the exposed pins of the transistor have the risk of being knocked.
Disclosure of Invention
The utility model provides a feeding mechanism for a transistor capable of continuously working, aiming at the problem that the existing feeding equipment for a material pipe cannot continuously work.
The technical scheme of the utility model is as follows: the feeding mechanism for the transistor comprises a material frame replacement assembly, a jacking assembly, a buffer assembly and a transfer assembly; wherein:
the jacking component is positioned below the material frame replacement component, the buffer component is arranged above the material frame replacement component, and the transfer component is arranged above the buffer component;
the frame replacement assembly is configured to receive a full frame and discharge an empty frame;
the material frame is configured to store a plurality of stacked material pipes, transistors to be detected are arranged in the material pipes side by side, and the first surface, the second surface and the third surface of the material pipes are transparent and respectively opposite to three surfaces to be detected of the transistors in the material pipes;
the jacking component is configured to integrally jack the material pipe filled with the material frame in the material frame replacement component into the buffer component;
the buffer component is configured to temporarily store the material pipe lifted by the lifting component;
the transfer component is configured to sequentially carry the material pipes in the buffer component to the subsequent stations.
The transistor to be detected is loaded through the material pipe, so that the transistor is prevented from being knocked; the buffer storage component temporarily stores the material pipe, so that the waiting time of the transfer component can be reduced, and the transfer efficiency of the transfer component can be improved; the material frame is replaced by the material frame replacement assembly, so that uninterrupted feeding can be ensured, and the feeding efficiency is improved.
Optionally, the material frame replacement assembly comprises a base, a sliding plate and a sliding rail, wherein the sliding plate is movably arranged on the base through the sliding rail, and the sliding plate is used for bearing the material frame.
The material frame replacement component adopts a sliding plate and a sliding rail, so that the drawing is smooth, and the material frame replacement is convenient.
Optionally, a positioning wheel is installed on the sliding plate, and a positioning groove for the positioning wheel to be clamped in a fitting way is formed in the bottom of the material frame.
Through the cooperation of locating wheel and constant head tank, can fix a position the material frame on the slide, prevent that the material frame from rocking.
Optionally, the frame replacing assembly further comprises a positioning assembly, wherein the positioning assembly is installed between the base and the sliding plate, and the positioning assembly is used for positioning the sliding plate on the base.
The sliding plate is positioned on the base through the positioning component, so that the material frame can be ensured to be at a preset position, and the jacking component can conveniently jack the material pipe.
Optionally, the lifting assembly comprises a lifting plate and a lifting plate lifting part, the lifting plate is mounted on a movable part of the lifting plate lifting part, the lifting plate lifting part drives the lifting plate to lift along the vertical direction, and a cavity for inserting the lifting plate into the lower part of the material pipe is formed at the bottom of the material frame.
The bottom of the material frame is provided with the cavity, so that the lifting plate of the lifting assembly is convenient to insert into the material frame, and interference cannot be generated.
Optionally, the buffer assembly includes a buffer frame, a fixed material plate and a fixed material plate translation part;
two fixed flitch arrange in the relative both sides of buffering frame, and every fixed flitch is installed at the expansion end of a fixed flitch translation portion, and two fixed flitch are configured to insert or shift out buffering frame under the drive of fixed flitch translation portion.
The material fixing plate translation part drives the material fixing plate to be inserted into the buffer storage frame, so that the material pipe in the buffer storage frame can be lifted in the buffer storage frame by jacking the jacking component, and the material frame is removed by the jacking component, thereby facilitating replacement of the material frame in the component.
Optionally, a plurality of baffles are vertically installed in the buffer frame, and the buffer frame is divided into a plurality of parallel buffer spaces by the plurality of baffles.
The buffer frame is internally provided with a plurality of buffer spaces, so that a plurality of material pipes can be stored at the same time, the waiting time of the transfer assembly can be reduced, and the transfer efficiency can be improved.
Optionally, the buffer storage assembly further comprises a fixed material plate lifting part, the fixed material plate translation part is mounted at the movable end of the fixed material plate lifting part, and the fixed material plate lifting part is used for driving the fixed material plate translation part to lift so that the uppermost material pipe in the buffer storage frame is in a constant position.
The fixed material plate lifting part drives the fixed material plate to lift to a preset position in the buffer storage component, so that the uppermost material pipe in the buffer storage frame is always at a constant position, and the transfer component is convenient to transfer the material pipe.
Optionally, the transferring component comprises a transferring translation part, an adsorption lifting part and an adsorption part, wherein the adsorption part is arranged on the adsorption lifting part, and the adsorption lifting part is arranged on the transferring translation part; the absorption portion is used for absorbing the material pipe in the buffer assembly, the absorption lifting portion is used for driving the absorption portion to lift, and the transfer translation portion is used for driving the absorption lifting portion to translate.
The material pipe in the buffer storage component is absorbed through the absorption part, and the absorption part is driven to move to the feeding position through the absorption lifting part and the transfer translation part, so that smooth feeding of the material pipe is realized.
Optionally, the adsorption part includes adsorption mounting plate and a plurality of adsorption components, and a plurality of adsorption components are installed in the below of adsorption mounting plate.
The suction part is provided with a plurality of suction parts, and the suction parts can reliably suck the material pipe, so that the material pipe can be prevented from falling down to damage the transistor.
Drawings
Fig. 1 is a schematic perspective view of a tube for loading transistors requiring the loading of the present utility model.
Fig. 2 is a schematic perspective view of an alternative embodiment of the present utility model.
Fig. 3 is a schematic perspective view of the transfer assembly of fig. 2, with the transfer assembly removed.
Fig. 4 is a schematic perspective view of the frame replacing assembly in fig. 2.
Fig. 5 is a schematic perspective view of the assembled base and slide plate of fig. 4.
Fig. 6 is an enlarged view at a in fig. 5.
Fig. 1 to 6 include:
a transistor feeding mechanism 10;
the device comprises a buffer assembly 13, a buffer frame 131, a fixed material plate 132, a fixed material plate translation part 133, a partition plate 134, a fixed material plate lifting part 135 and a guide assembly 136;
transfer unit 14, transfer translation unit 141, suction lifting unit 142, suction unit 143, suction mounting plate 144, suction member 145;
the material frame replacing assembly 15, the base 151, the sliding plate 152, the sliding rail 153, the positioning wheel 154, the positioning assembly 155, the insert block 156, the socket 157, the steel ball 158 and the spring 159;
a jacking assembly 16, a jacking plate 161, and a jacking plate lifting part 162;
the material pipe 100, a first surface 101, a second surface 102, a third surface 103, a bolt 104 and a limiting protrusion 105;
the material frame 200, the positioning groove 201, the cushion block 202 and the partition plate 203.
Detailed Description
In order that the above-recited objects, features and advantages of the present utility model will become more readily apparent, a more particular description of the utility model will be rendered by reference to the appended drawings and appended detailed description.
As shown in fig. 1, there is a tube 100 for loading transistors requiring the loading of the present utility model, the tube 100. Transistors to be detected are arranged in the material pipe 100 side by side, and the first surface 101, the second surface 102 and the third surface 103 of the material pipe 100 are transparent and respectively opposite to three surfaces to be detected of the transistors in the material pipe 100. Optionally, the first surface 101 of the tube 100 is opposite the third surface 103.
Optionally, two ends of the length direction of the material pipe 100 are respectively provided with a bolt 104 for sealing the material pipe 100; adjacent two transistors in the material pipe 100 are mutually abutted, and a first surface 101 and a third surface 103 of the material pipe 100 are respectively formed with limiting protrusions 105 inwards; two limit projections 105 extend along the length of the tube 100, the two limit projections 105 catching the body portion of the transistor.
The transistor is reliably fixed in the feed tube 100 by the stopper protrusion 105.
Fig. 2 and 3 show a transistor feeding mechanism 10 for feeding a tube 100 loaded with transistors as shown in fig. 1. The transistor loading mechanism 10 includes a frame replacement unit 15, a lifting unit 16, a buffer unit 13, and a transfer unit 14.
Wherein: the jacking component 16 is positioned below the material frame replacement component 15, the buffer component 13 is arranged above the material frame replacement component 15, and the transfer component 14 is arranged above the buffer component 13;
the frame replacement assembly 15 is configured to receive a full frame 200 and discharge an empty frame 200;
the material frame 200 is configured to store a plurality of stacked material pipes 100, transistors to be detected are arranged in the material pipes 100 side by side, and the first surface 101, the second surface 102 and the third surface 103 of the material pipe 100 are transparent and respectively opposite to three surfaces to be detected of the transistors in the material pipes 100;
the jacking component 16 is configured to integrally jack the material pipe 100 filled with the material frame 200 in the material frame replacement component 15 into the buffer component 13;
the buffer assembly 13 is configured to temporarily store the pipe 100 lifted by the lifting assembly 16;
the transfer assembly 14 is configured to sequentially carry the tubes 100 in the buffer assembly 13 to a subsequent station.
The transistor to be detected is loaded through the material pipe 100, so that the transistor is prevented from being knocked; the buffer storage component 13 temporarily stores the material pipe 100, so that the waiting time of the transfer component 14 can be reduced, and the transfer efficiency of the transfer component 14 can be improved; the material frame 200 is replaced by the material frame replacing assembly 15, so that uninterrupted feeding can be ensured, and the feeding efficiency is improved.
As an alternative embodiment, as shown in fig. 2 and 3, the frame replacing assembly 15 includes a base 151, a sliding plate 152 and a sliding rail 153, where the sliding plate 152 is movably mounted on the base 151 through the sliding rail 153, and the sliding plate 152 is used for carrying the frame 200.
The material frame replacing assembly 15 adopts the sliding plate 152 and the sliding rail 153, and is smooth in drawing and pulling, so that the material frame 200 can be replaced conveniently.
As shown in fig. 4, optionally, a positioning wheel 154 is mounted on the sliding plate 152, and a positioning groove 201 for the positioning wheel 154 to fit and clamp is provided at the bottom of the material frame 200.
The positioning wheel 154 and the positioning groove 201 are matched, so that the material frame 200 can be positioned on the sliding plate 152, and the material frame 200 is prevented from shaking.
As shown in fig. 5 and 6, the frame replacing assembly 15 optionally further includes a positioning assembly 155, wherein the positioning assembly 155 is installed between the base 151 and the slide plate 152, and the positioning assembly 155 is used for positioning the slide plate 152 on the base 151.
By positioning the slide plate 152 on the base 151 by the positioning assembly 155, the material frame 200 is ensured to be at a predetermined position, so that the lifting assembly 16 can lift the material pipe 100 conveniently.
Specifically, the positioning assembly 155 includes an insert 156 and a socket 157, the insert 156 is mounted on the slide plate 152, the socket 157 is mounted on the base 151, a slot into which the insert 156 is inserted is provided on the socket 157, steel balls 158 are mounted on both sides of the slot, and the steel balls 158 are abutted against the insert 156 by springs 159.
Referring to fig. 3, alternatively, the jacking assembly 16 includes a jacking plate 161 and a jacking plate lifting part 162, the jacking plate 161 is mounted on a movable part of the jacking plate lifting part 162, the jacking plate lifting part 162 drives the jacking plate 161 to lift in a vertical direction, and a cavity for inserting the jacking plate 161 under the material pipe 100 is formed at the bottom of the material frame 200. Alternatively, the lift plate lifting part 162 employs a linear module.
The bottom of the material frame 200 is provided with a cavity, so that the jacking plate 161 of the jacking assembly 16 is conveniently inserted into the material frame 200, and interference is avoided.
Specifically, the material frame 200 is divided into a plurality of storage spaces by a plurality of partitions 203, a pad 202 is installed at the lower portion of each storage space, the material pipe 100 is placed on the pad 202, and a cavity for inserting the jacking plate 161 is formed under the material pipe 100.
As shown in fig. 2 and 3, the buffer assembly 13 optionally includes a buffer frame 131, a fixed plate 132, and a fixed plate translation portion 133.
Two fixed material plates 132 are disposed on opposite sides of the buffer frame 131, each fixed material plate 132 is mounted on a movable end of one fixed material plate translation portion 133, and each fixed material plate 132 is configured to be inserted into or removed from the buffer frame 131 under the driving of the fixed material plate translation portion 133. Alternatively, the fixed plate translating portion 133 employs an air cylinder.
The fixed material plate translation part 133 drives the fixed material plate 132 to be inserted into the buffer frame 131, so that the material pipe 100 lifted into the buffer frame 131 by the jacking component 16 can be lifted in the buffer frame 131, and the jacking component 16 can withdraw the material frame 200, thereby facilitating replacement of the material frame 200 in the material frame replacement component 15.
Optionally, a plurality of partitions 134 are vertically installed in the buffer frame 131, and the buffer frame 131 is divided into a plurality of parallel buffer spaces by the plurality of partitions 134.
The stack of the material pipes 100 can be stored in each buffer space separately, so that the transfer assembly 14 can conveniently grasp each material pipe 100 separately, other material pipes 100 are prevented from being driven to deviate, and stability of the transfer assembly 14 when grasping the material pipes 100 is improved.
As shown in fig. 2 and 3, optionally, the buffer assembly 13 further includes a fixed material plate lifting portion 135, and the fixed material plate translation portion 133 is mounted on a movable end of the fixed material plate lifting portion 135, where the fixed material plate lifting portion 135 is configured to drive the fixed material plate translation portion 133 to lift, so that the uppermost material pipe 100 in the buffer frame 131 is at a constant position. Optionally, the fixed material plate lifting part 135 adopts a screw motor, which is used for lifting the fixed material plate 132 and the fixed material plate translation part 133 step by step, so that the height of one material pipe 100 is lifted each time, the uppermost material pipe 100 in the buffer assembly 13 is always positioned at the same position, and the transfer assembly 14 is convenient to grasp.
The fixed material plate lifting part 135 drives the fixed material plate 132 to lift to a preset position in the buffer assembly 13, so that the uppermost material pipe 100 in the buffer frame 131 is always at a constant position, and the transfer assembly 14 is convenient for transferring the material pipe 100.
In one embodiment, as shown in fig. 2 and 3, the fixed plate lifting part 135 further includes a guide assembly 136, and the guide assembly 136 is configured to guide the fixed plate lifting part 135 when the fixed plate lifting part 135 is lifted. Optionally, the guide assembly 136 employs a guide rod. The buffer frame 131 is prevented from shaking by guiding the fixed-material-plate lifting part 135 by the guide assembly 136.
As an alternative embodiment, as shown in fig. 2 and 3, the transfer unit 14 includes a transfer translation portion 141, an adsorption lifting portion 142, and an adsorption portion 143, the adsorption portion 143 is mounted on the adsorption lifting portion 142, and the adsorption lifting portion 142 is mounted on the transfer translation portion 141; the adsorption part 143 is used for adsorbing the material pipe 100 in the buffer assembly 13, the adsorption lifting part 142 is used for driving the adsorption part 143 to lift, and the transfer translation part 141 is used for driving the adsorption lifting part 142 to translate. Alternatively, the transfer translation portion 141 and the suction lifting portion 142 are respectively linear modules.
The material pipe 100 in the buffer assembly 13 is absorbed by the absorption part 143, and the absorption part 143 is driven by the absorption lifting part 142 and the transfer translation part 141 to move to a feeding position, so that smooth feeding of the material pipe 100 is realized.
In this embodiment, the suction portion 143 may optionally include a suction mounting plate 144 and a plurality of suction members 145, the plurality of suction members 145 being mounted below the suction mounting plate 144. Alternatively, suction member 145 employs a suction cup.
The suction portion 143 is provided with a plurality of suction members 145, and the suction members 145 reliably suck the material pipe 100, thereby preventing the material pipe 100 from dropping and damaging the transistor.
As shown in fig. 2 and 3, the working process of the utility model is as follows:
the carriage 200 is placed onto the sled 152 by the AGV cart, pushing the sled 152 in. At this time, the lifting plate 161 of the lifting assembly 16 is relatively inserted into the cavity of the material frame 200 below the material pipe 100, and the lifting plate 161 integrally lifts the material pipe 100 in the material frame 20 into the buffer assembly 13. The fixed material plate 132 at the buffer assembly 13 extends into the buffer frame 131 and serves as a support member of the material pipe group.
At this time, the lifting plate 161 may be lowered and reset, the material frame 200 may be withdrawn from the material frame replacing assembly 15, and a new material frame 200 with the full tube 100 placed therein may be replaced into the material frame replacing assembly 15 for standby.
The transfer assembly 14, in turn, grabs the uppermost tube 100 and feeds into the finishing assembly of the subsequent station.
The utility model has been described above in sufficient detail with a certain degree of particularity. It will be appreciated by those of ordinary skill in the art that the descriptions of the embodiments are merely exemplary and that all changes that come within the true spirit and scope of the utility model are desired to be protected. The scope of the utility model is indicated by the appended claims rather than by the foregoing description of the embodiments.
Claims (10)
1. The transistor feeding mechanism is characterized by comprising a material frame replacing assembly, a jacking assembly, a buffer assembly and a transferring assembly; wherein:
the jacking component is positioned below the material frame replacement component, the buffer component is arranged above the material frame replacement component, and the transfer component is arranged above the buffer component;
the frame replacement assembly is configured to receive a full frame and discharge the empty frame;
the material frame is configured to store a plurality of stacked material pipes, transistors to be detected are arranged in the material pipes side by side, and the first surface, the second surface and the third surface of the material pipes are transparent and respectively opposite to three surfaces to be detected of the transistors in the material pipes;
the jacking component is configured to integrally jack the material pipe of the full-load material frame in the material frame replacement component into the buffer component;
the buffer assembly is configured to temporarily store the material pipe lifted by the lifting assembly;
the transfer assembly is configured to sequentially carry the material pipes in the buffer assembly to a subsequent station.
2. The transistor feeding mechanism of claim 1, wherein the frame replacement assembly comprises a base, a slide plate and a slide rail, the slide plate is movably mounted on the base through the slide rail, and the slide plate is used for bearing the frame.
3. The transistor feeding mechanism according to claim 2, wherein the slide plate is provided with a positioning wheel, and a positioning groove for the positioning wheel to fit and clamp in is formed in the bottom of the material frame.
4. The transistor feeding mechanism of claim 2, wherein the frame replacement assembly further comprises a positioning assembly mounted between the base and the slide plate, the positioning assembly being configured to position the slide plate on the base.
5. The feeding mechanism for a transistor according to claim 1, wherein the lifting assembly comprises a lifting plate and a lifting plate lifting part, the lifting plate is mounted on a movable part of the lifting plate lifting part, the lifting plate lifting part drives the lifting plate to lift in the vertical direction, and a cavity for the lifting plate to be inserted below the material pipe is formed at the bottom of the material frame.
6. The transistor feeding mechanism according to claim 1, wherein the buffer assembly comprises a buffer frame, a fixed plate and a fixed plate translation part;
two fixed flitch arrange in the relative both sides of buffering frame, every fixed flitch is installed one fixed flitch translation portion's expansion end, two fixed flitch is configured to insert or remove under fixed flitch translation portion's drive the buffering frame.
7. The transistor feeding mechanism according to claim 6, wherein a plurality of partition boards are vertically installed in the buffer frame, and the buffer frame is partitioned into a plurality of parallel buffer spaces by the plurality of partition boards.
8. The transistor feeding mechanism of claim 6, wherein the buffer assembly further comprises a fixed material plate lifting part, the fixed material plate translation part is mounted at a movable end of the fixed material plate lifting part, and the fixed material plate lifting part is used for driving the fixed material plate translation part to lift so as to enable a topmost material pipe in the buffer frame to be in a constant position.
9. The transistor feeding mechanism according to claim 1, wherein the transfer unit includes a transfer translation portion, an adsorption lifting portion, and an adsorption portion, the adsorption portion is mounted on the adsorption lifting portion, and the adsorption lifting portion is mounted on the transfer translation portion; the adsorption part is used for adsorbing the material pipe in the cache assembly, the adsorption lifting part is used for driving the adsorption part to lift, and the transfer translation part is used for driving the adsorption lifting part to translate.
10. The transistor feeding mechanism according to claim 9, wherein the adsorbing portion includes an adsorbing mounting plate and a plurality of adsorbing members, and the plurality of adsorbing members are mounted below the adsorbing mounting plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320411884.4U CN219469007U (en) | 2023-03-03 | 2023-03-03 | Feeding mechanism for transistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320411884.4U CN219469007U (en) | 2023-03-03 | 2023-03-03 | Feeding mechanism for transistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219469007U true CN219469007U (en) | 2023-08-04 |
Family
ID=87437589
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320411884.4U Active CN219469007U (en) | 2023-03-03 | 2023-03-03 | Feeding mechanism for transistor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219469007U (en) |
-
2023
- 2023-03-03 CN CN202320411884.4U patent/CN219469007U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN113772410B (en) | Trigger on dustless level centre gripping formula support plate | |
| KR100865823B1 (en) | Glass plate moving load device, inserting method, inserting device and apparatus for adjusting position of box-like container for glass plate | |
| CN217569752U (en) | Defect detection equipment of communication electronic device | |
| US8926255B2 (en) | Component transfer apparatus and method | |
| CN114247662A (en) | Chip screening device and chip detection production line | |
| CN112246663A (en) | Product counting device and chip testing equipment | |
| CN115355788A (en) | PCB module automatic test platform and control method | |
| CN219469007U (en) | Feeding mechanism for transistor | |
| CN220432229U (en) | Water sample detection test tube shifts loading attachment | |
| CN115159113A (en) | PCB module jacking and carrying device and using method thereof | |
| CN111122609A (en) | Defect detection equipment | |
| CN217433624U (en) | Automatic assembling and testing production line for server mainboard | |
| CN114553997B (en) | Detection line, detection method and storage medium for mobile phone motherboard | |
| CN114850933A (en) | Tool changing device and processing equipment | |
| CN219475437U (en) | Automatic optical detection device for transistor | |
| CN111703887A (en) | Bar strip automatic feeding and discharging device | |
| CN221719904U (en) | Automatic feeding and discharging device for tray | |
| JP4849744B2 (en) | Display substrate inspection equipment | |
| CN116223524A (en) | Automatic optical detection device for transistor | |
| CN219168959U (en) | Detection device | |
| CN220431463U (en) | Pump body buffer storage equipment | |
| CN221304633U (en) | Transmission device and array welding machine | |
| CN216917615U (en) | Automatic disk inserting machine | |
| CN219899171U (en) | Receiving device for transistor and transistor detection equipment | |
| CN218331291U (en) | Detection bearing device and detection production line |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240805 Address after: No. 3, Xinhua Road, Xinwu District, Wuxi City, Jiangsu Province, 214000 Patentee after: Wuxi Aotewei Kexin Semiconductor Technology Co.,Ltd. Country or region after: China Address before: No. 5 Minshan Road, Xinwu District, Wuxi City, Jiangsu Province, 214000 Patentee before: WUXI AUTOWELL TECHNOLOGY CO.,LTD. Country or region before: China |