CN219459622U - Radiator - Google Patents

Radiator Download PDF

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Publication number
CN219459622U
CN219459622U CN202320287920.0U CN202320287920U CN219459622U CN 219459622 U CN219459622 U CN 219459622U CN 202320287920 U CN202320287920 U CN 202320287920U CN 219459622 U CN219459622 U CN 219459622U
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China
Prior art keywords
air
heat
air holes
air flow
heat sink
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CN202320287920.0U
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Chinese (zh)
Inventor
胡震楠
王悦
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Puyuan Jingdian Technology Co ltd
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Puyuan Jingdian Technology Co ltd
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Abstract

The application relates to a radiator, comprising: the heat-conducting fin comprises a shell and a fin structure, wherein the shell is of a structure which is sealed along the circumferential direction, the shell is constructed as a heat-conducting piece, two sides of the shell are respectively provided with an air flow inlet and an air flow outlet, the air flow inlet is opposite to the air flow outlet, and air entering through the air flow inlet conducts heat in the shell and flows out from the air flow outlet; the fin structure is formed between the air inlet and the air outlet; the fin structure is constructed as a hollowed-out structure along the airflow flowing direction. By adopting the fin radiator, the heat conduction and heat transfer efficiency of the radiator can be improved, and the loss of air flow heat dissipation is avoided.

Description

Radiator
Technical Field
The present application relates to the field of heat sink devices, and in particular, to a fin heat sink.
Background
The existing fin radiator is basically provided with fins arranged in rows due to the limitation of processing, and gaps are formed between two adjacent fins, and the gaps are in open connection with the atmosphere, so that air flows can not be transferred out from the same direction after flowing through the gaps, and can flow out in all directions of the open type, wherein a part of air flows can flow out without heat transfer, and the heat dissipation rate is reduced. It can be seen that this open type of heat dissipation area has certain limitations, namely: the problem of air loss can occur in the heat dissipation of the fins in the inner space of the product.
Disclosure of Invention
Based on this, it is necessary to provide a radiator capable of closing a heat dissipation air duct to solve the problem that the heat dissipation capability is poor in a small-volume and high-heat-consumption environment, aiming at the problem that the air loss occurs in the heat dissipation of fins in the inner space of the product.
A heat sink includes: the heat-conducting device comprises a shell and a fin structure, wherein the shell is of a structure which is sealed along the circumferential direction, the shell is constructed to be a heat-conducting piece, two sides of the shell are respectively provided with an air flow inlet and an air flow outlet, the air flow inlet is opposite to the air flow outlet, and air entering through the air flow inlet conducts heat in the shell and flows out from the air flow outlet; the fin structure is formed between the air flow inlet and the air flow outlet; the fin structure is constructed as a hollowed-out structure along the airflow flowing direction.
In one embodiment, the fin structure includes a plurality of first air holes penetrating along the airflow flowing direction and arranged at intervals, a plurality of second air holes arranged at intervals are included in the hole wall between two adjacent first air holes, and the cross section area of the first air holes is larger than that of the second air holes.
In one embodiment, the cross-sections of the first air hole and the second air hole do not overlap.
In one embodiment, the first air hole and the second air hole have the same shape.
In one embodiment, the second air holes are a plurality of air holes with the same shape, and the sizes of the second air holes are the same or different.
In one embodiment, the cross section of each of the first air hole and the second air hole is configured as one of triangle or rectangle.
In one embodiment, a side of the housing, which is used for being in direct contact with the heating element, is provided with a heat conduction contact surface, and the heat conduction contact surface is located on the bottom surface of the housing.
In one embodiment, the area of the heat conducting contact surface is adapted to the contact area of the heating element.
In one embodiment, the housing and the fin structure are an integrally formed structure of a lost wax mold cavity.
In one embodiment, the housing and the fin structure are commonly formed from a copper alloy or an aluminum alloy.
By adopting the radiator, the open-type gaps between the fins can be avoided, so that the space area favorable for heat transfer and heat conduction of air flow is provided, air flowing into the fin radiator can not cause air flow loss, and the radiating efficiency is improved. Specifically, the fin structure is arranged in the shell in a penetrating manner along the airflow flowing direction, and the fin structure is formed between the airflow inlet and the airflow outlet, so that the airflow flowing into the shell can transfer heat in the hollow-shaped structure of the fin structure, and can not flow back to the atmosphere without transferring heat, namely, the hollow-shaped structure of the fin structure can be regarded as a fixed air channel, and the air channel only has the airflow inlet and the airflow outlet, and can not generate heat conduction airflow loss, so that the radiating efficiency of the radiator is improved.
Drawings
In order to more clearly illustrate the technical solutions of embodiments or conventional techniques of the present application, the drawings required for the descriptions of the embodiments or conventional techniques will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person of ordinary skill in the art.
Fig. 1 is a schematic axial structure of a radiator according to an embodiment of the present disclosure;
FIG. 2 is a schematic side view of the heat sink of FIG. 1;
FIG. 3 is a schematic view of the airflow inlet side of FIG. 1;
fig. 4 is a schematic view of the structure of the air outlet side of fig. 1.
10-a heat sink; 11-a housing; 12-an air flow inlet; 13-an air flow outlet; 14-a heat conduction contact surface; 15. a fin structure; 151-first air holes; 152-second air holes.
Detailed Description
In order to make the above objects, features and advantages of the present application more comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. This application is, however, susceptible of embodiment in many other forms than those described herein and similar modifications can be made by those skilled in the art without departing from the spirit of the application, and therefore the application is not to be limited to the specific embodiments disclosed below.
In the description of the present application, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," etc. indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be configured and operated in a particular orientation, and therefore should not be construed as limiting the present application.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present application, the meaning of "plurality" is at least two, such as two, three, etc., unless explicitly defined otherwise.
In this application, unless specifically stated and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be.
In this application, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
It will be understood that when an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.
As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," and/or the like, specify the presence of stated features, integers, steps, operations, elements, components, or groups thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or groups thereof. Also, in this specification, the term "and/or" includes any and all combinations of the associated listed items.
The fin radiator applied in the prior art has a certain limitation in the aspect of gas heat dissipation area due to the limitation of processing technology. Specifically, the fins in the existing fin radiator are assembled at intervals, and the arrangement mode of the radiator can be referred. When the assembly structure is adopted, when external air flows through the existing fin radiator, a large amount of air flows do not flow into the space between the fins for heat transfer due to the open gaps communicated with the atmosphere, but flow into the atmosphere, so that the radiating efficiency of the fins is greatly reduced.
In order to solve the above technical problems, the present application provides a radiator 10, which can avoid open gaps between fins to provide a space area beneficial to heat transfer and conduction of airflow, and the air flowing into the fin radiator 10 will not cause airflow loss, thereby improving heat dissipation efficiency.
As shown in fig. 1, the heat sink 10 provided in the present application includes: housing 11 and fin structure 15 (shown in fig. 3 and 4). Wherein, the shell 11 is a structure which is closed along the circumferential direction, and the shell 11 is constructed as a heat conducting piece. The housing 11 has an air inlet 12 and an air outlet 13 on both sides, the air inlet 12 being disposed opposite to the air outlet 13, and the air entering through the air inlet 12 conducts heat in the housing 11 and flows out from the air outlet 13. In addition, the fin structure 15 is formed between the air inlet 12 and the air outlet 13; the fin structure 15 is configured as a hollowed-out structure along the airflow flowing direction.
By way of example, a heat-conducting element is understood a structural element made of a material having thermal conductivity. For example: the housing 11 may be configured as a metal alloy member such as a copper alloy or an aluminum alloy.
The fin structure 15 is illustratively configured as a hollow structure, wherein the hollow structure is used to form the air inlet 12 or the air outlet 13.
It should be noted that, the fin structure 15 in the present application is formed by using a material of the fin, and the hollow structure directly forms the air inlet and the air outlet, so that the air can enter the fin structure 15 to conduct heat and flow out of the fin structure 15 to conduct heat.
For example, the structure and the size of the housing 11 are not limited in this application, and the heat transfer and heat conduction performance of the heat sink 10 can be achieved as long as the housing can communicate with the hollow structure of the fin structure 15.
The housing 11 and the fin structure 15 of the present application may be a split assembly structure, for example.
Illustratively, the housing 11 and fin structure 15 of the present application may be an integrally formed structure. The following scheme is illustrated by taking an integrally formed structure between the two.
By adopting the radiator 10, the open-type gaps of the fins can be avoided, so that the space area favorable for heat transfer and conduction of air flow is provided, and air flowing into the fin radiator 10 can not cause air flow loss, so that the radiating efficiency is improved. Specifically, the fin structure 15 of the radiator 10 is formed between the air inlet 12 and the air outlet 13 of the housing 11, so that the air flowing into the housing 11 can transfer heat in the hollow structure of the fin structure 15, and can not flow back to the atmosphere without transferring heat, i.e. the hollow structure of the fin structure 15 can be regarded as a fixed air channel, and the air channel has only the air inlet 12 and the air outlet 13, so that the heat dissipation efficiency of the radiator 10 can be improved without heat conduction air loss.
Further, in order to raise the disposable intake air amount of the fin structure 15, the hollow structure on the fin structure 15 needs to have a relatively large size in order to facilitate the air flowing into the hollow structure of the fin structure 15. However, due to the limitation of the length, width and other dimensions of the fin structures 15, in order to avoid the problem of stress concentration fracture possibly caused by smaller pore wall dimensions between adjacent pore structures, the application proposes to simultaneously arrange pore structures with unequal dimensions in the fin structures 15 so as to improve the pore wall dimensions between the adjacent pore structures. The following scheme is specifically referred to:
in an alternative embodiment of the present application, further referring to fig. 3, the fin structure 15 includes a plurality of first air holes 151 penetrating along the airflow direction and arranged at intervals, and a hole wall between two adjacent first air holes 151 includes a plurality of second air holes 152 arranged at intervals, where a cross-sectional area of the first air holes 151 is larger than a cross-sectional area of the second air holes 152.
The shape of each air hole is not limited in this application, as long as the inflow and outflow of air flow can be realized.
In one alternative embodiment of the present application, the cross-sections of the first air holes 151 and the second air holes 152 are each configured as one of a triangle or a rectangle. Illustratively, the use of a hole-shaped structure with corners facilitates the demolding process during the molding of the heat sink.
In an optional embodiment of the present application, the sections of the first air hole and the second air hole do not overlap with each other, so that heat dissipation efficiency can be further improved.
Further, in order to facilitate the improvement of the heat conduction and heat transfer efficiency of the air flow in the inner cavity, the following scheme is described:
in one alternative embodiment of the present application, the first air hole 151 and the second air hole 152 have the same shape. By adopting the scheme, the processing technology of the fin structure 15 can be simplified.
In one alternative embodiment of the present application, the second air holes 152 are a plurality of air holes with the same shape, and the sizes of the second air holes 152 are the same or different. By adopting the scheme, the second air holes 152 can be understood as a plurality of air holes, and the second air holes 152 can be air holes with the same size or air holes with different sizes, so that the hole wall between two adjacent air holes is not too small, and the problem of stress concentration fracture between two air holes in the forming process is avoided. Further ensuring that the fin structure of the present application is able to accommodate the structural requirements of different fin heat sinks 10.
Considering the installation and use environment of the fin radiator 10, the fin radiator 10 of the present application will be described as follows:
in one of the alternative embodiments of the present application, referring further to fig. 1-4, a side of the housing 11 for direct contact with the heat generating component is provided with a heat conducting contact surface 14, and the heat conducting contact surface 14 is located on the bottom surface of the housing 11.
Illustratively, the thermally conductive contact 14 of the present application is one of the bottom surfaces of the housing 11.
Illustratively, in the process of mounting the fin radiator 10 on the surface of the heating element, a heat-conducting silicone grease or a heat-conducting pad is disposed between the heat-conducting contact surface 14 and the surface of the heating element, and the heat-conducting silicone grease or the heat-conducting pad has heat resistance and heat conductivity, so that the stability of the electrical performance of the heating element is ensured.
In one of the alternative embodiments of the present application, the area of the heat conducting contact surface 14 is adapted to the contact area of the heat generating component, so as to avoid the problem of installation mismatch during installation through the heat conducting contact surface 14.
In one of the alternative embodiments of the present application, the housing 11 is constructed of one of a copper alloy or an aluminum alloy. The copper alloy or aluminum alloy has excellent heat conduction performance, and can conduct heat of the heating element to the inner cavity of the shell 11.
In one alternative embodiment of the present application, the housing 11 and fin structure 15 are an integrally formed structure of lost wax cavities. The manufacturing efficiency of the fin radiator 10 can be improved by adopting the lost wax mold cavity and the lost wax investment manufacturing process, the rapid forming of the fin structure 15 is facilitated, and the structural strength of the formed integrated structure is stronger.
In the description of the present specification, reference to the terms "some embodiments," "other embodiments," "ideal embodiments," and the like, means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic descriptions of the above terms do not necessarily refer to the same embodiment or example.
The technical features of the above embodiments may be arbitrarily combined, and for brevity, all of the possible combinations of the technical features of the above embodiments are not described, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples only represent a few embodiments of the present application, which are described in more detail and are not to be construed as limiting the scope of the claims. It should be noted that it would be apparent to those skilled in the art that various modifications and improvements could be made without departing from the spirit of the present application, which would be within the scope of the present application. Accordingly, the scope of protection of the present application is to be determined by the claims appended hereto.

Claims (10)

1. A heat sink, comprising:
the shell is of a structure which is sealed along the circumferential direction, the shell is constructed as a heat conducting piece, two sides of the shell are respectively provided with an air flow inlet and an air flow outlet, the air flow inlet is opposite to the air flow outlet, and the air entering through the air flow inlet conducts heat in the shell and flows out from the air flow outlet;
a fin structure formed between the airflow inlet and the airflow outlet;
the fin structure is constructed as a hollowed-out structure along the airflow flowing direction.
2. The heat sink of claim 1 wherein the fin structure includes a plurality of first air holes penetrating in the air flow direction and spaced apart, and a plurality of second air holes spaced apart are included in the wall of the hole between two adjacent first air holes, and the cross-sectional area of the first air holes is larger than the cross-sectional area of the second air holes.
3. The heat sink of claim 2, wherein cross-sections of the first air holes and the second air holes do not overlap each other.
4. The heat sink of claim 2, wherein the first air holes and the second air holes are the same shape.
5. The heat sink of claim 4, wherein the second air holes are a plurality of air holes with the same shape, and the sizes of the second air holes are the same or different.
6. The heat sink of claim 4 or 5, wherein the first air hole and the second air hole each have a cross section configured as one of a triangle or a rectangle.
7. The heat sink of claim 1, wherein a side of the housing for direct contact with the heat generating component is provided with a thermally conductive contact surface, the thermally conductive contact surface being located on a bottom surface of the housing.
8. The heat sink of claim 7 wherein the area of the thermally conductive contact surface is adapted to the contact area of the heat generating component.
9. The heat sink of claim 1 wherein the housing and fin structure are an integral structure of a lost wax mold cavity.
10. The heat sink of claim 9 wherein the housing and the fin structures are commonly formed from a copper alloy or an aluminum alloy.
CN202320287920.0U 2023-02-22 2023-02-22 Radiator Active CN219459622U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202320287920.0U CN219459622U (en) 2023-02-22 2023-02-22 Radiator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202320287920.0U CN219459622U (en) 2023-02-22 2023-02-22 Radiator

Publications (1)

Publication Number Publication Date
CN219459622U true CN219459622U (en) 2023-08-01

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ID=87423256

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202320287920.0U Active CN219459622U (en) 2023-02-22 2023-02-22 Radiator

Country Status (1)

Country Link
CN (1) CN219459622U (en)

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