CN219457591U - High-efficiency chip radiator and chip - Google Patents
High-efficiency chip radiator and chip Download PDFInfo
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- CN219457591U CN219457591U CN202222699108.7U CN202222699108U CN219457591U CN 219457591 U CN219457591 U CN 219457591U CN 202222699108 U CN202222699108 U CN 202222699108U CN 219457591 U CN219457591 U CN 219457591U
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- heat
- chip
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- pipe
- direct contact
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Abstract
The utility model discloses a high-efficiency chip radiator and a chip, wherein the chip radiator is provided with a radiating fin group, a heat conducting pipe and a heat conducting bracket, the heat conducting pipe comprises a direct contact part accommodated in a heat pipe groove, a radiating part penetrating through the radiating fin group and a transition part connecting the direct contact part and the radiating part, so that the heat of the chip is transferred to the radiating fin group through the heat conducting pipe, the widths of the direct contact part and the transition part are narrower than the cross-section diameter of the radiating part, the top surface of the direct contact part is flush with the top surface of the heat conducting bracket to form a chip contact surface which is in flat contact with the chip.
Description
Technical Field
The utility model belongs to the field of heat sinks, and particularly relates to a high-efficiency chip heat sink and a chip provided with the high-performance chip heat sink.
Background
The heat pipe radiator is used as a high-performance air-cooled radiator, and mainly uses heat pipes to quickly transfer the heat of chips to a heat-radiating fin group so as to realize the purposes of heat radiation and cooling of the chips, wherein the heat pipe radiator has the best performance of a heat pipe and chip direct contact structure, the direct contact structure is mainly applied to heat pipe radiators with the number of the heat pipes being four or less. Therefore, when the number of heat pipes exceeds four, a copper block is welded at the bottom of the heat pipe to increase the contact area with the chip, but this necessarily results in an increase in production process cost, and the heat resistance of the chip heat conducted to the heat pipe through the medium is increased compared with the direct contact heat conduction mode of the heat pipe, resulting in a decrease in the heat dissipation performance of the chip heat sink.
In addition, the direct contact structure of the heat pipe radiator mostly needs to be provided with a heat conducting base for accommodating the heat pipe groove, and the adjacent heat conducting pipes are completely separated by the heat conducting base, so that the heat conducting pipes have insufficient duty ratio at the chip contact surface, and part of heat still needs to be transferred to the heat conducting pipes and the heat radiating fin groups through the heat conducting base, thereby reducing the heat transfer efficiency.
Disclosure of Invention
In order to solve the technical problems, the utility model provides a high-efficiency chip radiator, which is provided with a radiating fin group, a heat conducting pipe and a heat conducting support, wherein the heat conducting support is provided with a heat pipe groove for accommodating the heat conducting pipe, the heat conducting pipe comprises a direct contact part accommodated in the heat pipe groove, a radiating part penetrating through the radiating fin group and a transition part connecting the direct contact part and the radiating part, so that heat of a chip is transmitted to the radiating fin group through the heat conducting pipe, the widths of the direct contact part and the transition part are smaller than the diameter of the section of the radiating part, and the top surface of the direct contact part is flush with the top surface of the heat conducting support to form a chip contact surface in flat contact with the chip.
Further, the heat sink is provided with at least 5 heat conduction pipes, and the sum of the sectional widths of the straight contact portions of the heat conduction pipes is not more than 28.0mm.
Further, the width of the straight contact part is 3.0mm-4.5mm.
Further, the heat sink is provided with 6 heat conduction pipes, and the width of the straight contact part is not more than 4.0mm.
Further, the heat pipe groove comprises a bottom surface accommodating part, the bottom surface accommodating part comprises a plurality of concave parts matched with the bottom surface of the direct contact part of the heat pipe, and the number of the concave parts is the same as that of the heat pipes.
Further, the heat conducting support is provided with side containing parts protruding upwards relative to the bottom of the heat pipe groove and forming an inward concave space for containing the heat conducting pipes at the edges of the two sides of the heat pipe groove, limiting ribs which are preset in height and extend along the length direction of the groove are arranged between the adjacent heat pipe grooves, the height of each limiting rib is lower than that of each side containing part, the bottom of each heat conducting pipe is matched and limited in the corresponding containing part of the bottom of the heat pipe groove, the top of each heat conducting pipe is flush with the upper surface of the corresponding side containing part, an integral heat conducting containing cavity is formed by the corresponding side containing part and the corresponding heat pipe groove, and the heat conducting pipes are distributed in the corresponding heat conducting containing cavity without gaps.
Further, the side accommodating parts are lugs which are arranged at the two side edges of the heat pipe groove and protrude upwards relative to the bottom of the heat pipe groove, and the upper surfaces of the lugs are flush with the flat surface of the top of the heat pipe.
Further, the tops of the heat conducting pipes are integrated flat surfaces for seamless connection of every two heat conducting pipes.
Further, a heat conduction silicone grease layer is arranged between the heat conduction pipe and the chip, and the heat conduction support is an aluminum heat conduction support.
The utility model also provides a chip, which is provided with the high-efficiency chip radiator, and is provided with a radiating fin group, a heat conducting pipe and a heat conducting support, wherein the heat conducting support is provided with a heat pipe groove for accommodating the heat conducting pipe, the heat conducting pipe comprises a direct contact part which is accommodated in the heat pipe groove, a radiating part which is arranged in the radiating fin group in a penetrating way and a transition part which is connected with the direct contact part and the radiating part in a penetrating way, so that the heat of the chip is transferred to the radiating fin group through the heat conducting pipe, the widths of the direct contact part and the transition part are narrower than the diameter of the section of the radiating part, and the top surface of the direct contact part is flush with the top surface of the heat conducting support to form a chip contact surface which is in flat contact with the chip.
The utility model discloses a high-efficiency chip radiator and a chip, which are provided with a radiating fin group, a heat conducting pipe and a heat conducting support, wherein the heat conducting support is provided with a heat pipe groove for accommodating the heat conducting pipe, the heat conducting pipe comprises a direct contact part accommodated in the heat pipe groove, a radiating part penetrating through the radiating fin group and a transition part connecting the direct contact part and the radiating part, so that the heat of the chip is transferred to the radiating fin group through the heat conducting pipe, the widths of the direct contact part and the transition part are smaller than the diameter of the section of the radiating part, and the top surface of the direct contact part is flush with the top surface of the heat conducting support to form a chip contact surface in flat contact with the chip. According to the utility model, the straight contact part and the transition part of the upsetting heat conduction pipe are enabled to be converged in width and narrower than the cross section diameter of the radiating part, so that the number of heat conduction pipes which can be arranged in the chip size can be increased while the direct contact part of the heat conduction pipe is ensured to be in direct contact with the chip, and the technical problem that the heat conduction pipes are limited by the chip size and the heat of the chip is difficult to be effectively transferred to the radiating pipe through the contact surface is solved.
Drawings
In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a conventional six-heat pipe radiator;
FIG. 2 is a schematic diagram of a high performance chip heat spreader according to the present utility model;
FIG. 3 is a schematic cross-sectional view of a high performance chip heat spreader according to the present utility model;
fig. 4 is a schematic structural view of a heat conductive bracket according to the present utility model.
Description of main reference numerals:
1-a heat radiation fin group; 2-a heat conduction pipe; 21-a straight contact; 22-transition; 3-a heat conduction bracket; 31-a heat pipe groove; 32-a side receiving portion; 33-limit ridges; 4-copper sheet
Detailed Description
In the description of the present utility model, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present utility model, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.
In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "fixedly connected," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; may be directly connected or indirectly connected through an intermediary unless explicitly defined otherwise. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present utility model, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
The heat pipe radiator is used as a high-performance air-cooled radiator, and mainly uses heat pipes to quickly transfer the heat of chips to a heat-radiating fin group so as to realize the purposes of heat radiation and cooling of the chips, wherein the heat pipe radiator has the best performance of a heat pipe and chip direct contact structure, the direct contact structure is mainly applied to heat pipe radiators with the number of the heat pipes being four or less. Therefore, when the number of heat pipes exceeds four, a copper block is welded to the bottom of the heat pipe to increase the contact area with the chip (as shown in fig. 1), but this inevitably results in an increase in the production process cost, and the heat resistance of the chip heat conducted to the heat pipe through the medium increases compared with the direct contact type heat conduction mode of the heat pipe, resulting in a decrease in the heat dissipation performance of the chip heat sink.
In addition, the direct contact structure of the heat pipe radiator mostly needs to be provided with a heat conducting base for accommodating the heat pipe groove, and the adjacent heat conducting pipes are completely separated by the heat conducting base, so that the heat conducting pipes have insufficient duty ratio at the chip contact surface, and part of heat still needs to be transferred to the heat conducting pipes and the heat radiating fin groups through the heat conducting base, thereby reducing the heat transfer efficiency.
In order to solve the above-mentioned problems, the present utility model provides a high-performance chip heat sink and a chip, and the following description further describes and illustrates the embodiments of the present utility model with reference to fig. 2 to 4.
Inventive example 1:
the utility model provides a high-efficiency chip radiator, as shown in fig. 2-4, the chip radiator is provided with a radiating fin group 1, a heat conducting pipe 2 and a heat conducting support 3, the heat conducting support 3 is provided with a heat pipe groove 31 for accommodating the heat conducting pipe, the heat conducting pipe 2 comprises a direct contact part 21 accommodated in the heat pipe groove 31, a radiating part penetrating through the radiating fin group and a transition part 22 connecting the direct contact part and the radiating part, so as to transfer the chip heat to the radiating fin group through the heat conducting pipe.
In order to further solve the problem that the existing direct-contact type radiator with more than four heat pipes is limited by a chip, a heat source size or wind resistance to cause low radiating efficiency, the utility model provides a technical scheme of the direct-contact type high-efficiency chip radiator suitable for the radiator with more than four heat pipes, wherein the radiator is at least provided with five heat pipes, and the sum of the section widths of direct contact parts of the heat pipes is not more than 28.0mm; in order to enhance applicability, the utility model adopts a standard heat conduction pipe, namely a heat conduction pipe with the cross section diameter of 6.0mm before upsetting, and the straight contact part of the heat conduction pipe after upsetting is 3.0mm-4.5mm. To match a common 24mm chip, the embodiment further provides a high-efficiency six-heat-pipe chip radiator, and the width of the straight contact part is not more than 4.0mm.
Inventive example 2:
in order to rationalize the structure and enhance the heat conduction efficiency, on the basis of embodiment 1, this embodiment provides an improved high-performance chip radiator, as shown in fig. 2-4, the heat pipe groove 31 includes a bottom surface accommodating portion, the bottom surface accommodating portion includes a plurality of concave portions matched with the bottom surfaces of the heat pipe direct contact portions and the same number as the heat pipes, the heat pipe bracket 3 is provided with side accommodating portions 32 protruding upward relative to the bottom of the heat pipe groove and forming an indent space for accommodating the heat pipes at two side edges of the heat pipe groove 31, limit ridges 33 with a preset height and extending along the length direction of the groove are provided between adjacent heat pipe grooves 31, the bottom of the heat pipe 2 is matched and limited in the bottom accommodating portion of the heat pipe groove 31 and the top of the pressed heat pipe 2 is flush with the upper surface of the side accommodating portion 32, the side accommodating portion 32 and the heat pipe groove 31 form an integral heat conduction accommodating cavity, and the space between the heat pipes 2 is arranged in the heat conduction accommodating cavity without gaps, in this embodiment, the height of the limit ridges 33 is set lower than the side accommodating portion 32, so that the top surface of the pressed heat pipe 2 is in contact with the chip directly, the chip is in contact with the heat pipe bracket, the heat dissipation efficiency is increased, and the heat conduction efficiency is increased, and the chip is directly contacts the whole chip, and the heat dissipation efficiency is increased, and the chip is compared with the heat dissipation efficiency and the chip is directly and the heat transfer efficiency. In order to further improve the energy transfer efficiency, the top of each heat conducting pipe is an integrated flat surface formed by seamless connection of every two heat conducting pipes.
The side receiving portions 32 are protrusions provided at both side edges of the heat pipe groove 31 and protruding upward with respect to the bottom of the heat pipe groove, and the upper surfaces of the protrusions are flush with the flat surface of the top of the heat pipe 2 for rationalizing the structure and reducing the cost.
In order to enhance the heat transfer efficiency, a heat conduction silicone grease layer is further arranged between the heat conduction pipe 2 and the chip, and the heat radiator and the chip are usually made of different materials, so that the surfaces of the heat radiator and the chip are not in complete contact due to different expansion or contraction amounts during heating and cooling, and the heat transfer efficiency is affected. In order to further improve the heat dissipation efficiency of the chip, the heat conducting bracket 3 in this embodiment is an aluminum heat conducting bracket.
Inventive example 3:
based on embodiments 1 and 2, the present embodiment provides a chip, which is equipped with a high-performance chip radiator as shown in fig. 2-4, the chip radiator is provided with a heat radiation fin group 1, a heat conduction pipe 2 and a heat conduction bracket 3, the heat conduction bracket 3 is provided with a heat pipe groove 31 for accommodating the heat conduction pipe, the heat conduction pipe 2 comprises a direct contact part 21 accommodated in the heat pipe groove 31, a heat radiation part penetrating through the heat radiation fin group and a transition part 22 connecting the direct contact part and the heat radiation part, so as to transfer the chip heat to the heat radiation fin group through the heat conduction pipe, in order to increase the number of heat conduction pipes which can be arranged in a unit chip size, the width of the direct contact part and the transition part of the flat heat conduction pipe is converged and is smaller than the cross-sectional diameter of the heat radiation part, and the top surface of the direct contact part formed by punching is flush with the top surface of the heat conduction bracket and forms a chip contact surface which is in flat contact with the chip, thereby the technical problem that the heat conduction pipe is limited by the chip size and the heat conduction pipe is difficult to effectively transfer the chip heat to the heat radiation part through the contact surface is solved.
Further, in order to rationalize the structure and enhance the heat conduction efficiency, the heat pipe groove 31 includes a bottom surface accommodating portion, the bottom surface accommodating portion includes a plurality of concave portions which are matched with the bottom surface of the direct contact portion of the heat pipe and have the same number as the heat pipe, the heat conducting bracket 3 is provided with side accommodating portions 32 which protrude upward relative to the bottom of the heat pipe groove and form an indent space for accommodating the heat pipe at two side edges of the heat pipe groove 31, a spacing ridge 33 which is preset in height and extends along the length direction of the groove is provided between adjacent heat pipe grooves 31, the bottom of the heat pipe 2 is matched and limited in the bottom accommodating portion of the heat pipe groove 31, the top of the pressed heat pipe 2 is flush with the upper surface of the side accommodating portion 32, the side accommodating portion 32 and the heat pipe groove 31 form an integral heat conducting accommodating cavity, and the heat pipe 2 is arranged in the heat conducting accommodating cavity without gaps, in this embodiment, the height of the spacing ridge 33 is lower than the side accommodating portion 32, so that the top surface of the pressed heat pipe 2 is in direct flat contact with the chip, compared with the conventional radiator, the embodiment has the heat conduction efficiency by reducing the chip contact area of the bracket, the chip contact area of the heat pipe chip contact area, the heat conduction efficiency is higher than the chip heat conduction efficiency, and the heat conduction efficiency is more than the heat dissipation efficiency. In order to further improve the energy transfer efficiency, the top of each heat conducting pipe is an integrated flat surface formed by seamless connection of every two heat conducting pipes.
The foregoing has outlined a detailed description of a high performance chip heat sink according to the present utility model, wherein specific examples are provided herein to illustrate the principles and embodiments of the present utility model, and the above examples are provided to assist in understanding the core concept of the present utility model; also, as will be apparent to those skilled in the art in light of the present teachings, the present disclosure should not be limited to the specific embodiments and applications described herein.
Claims (10)
1. The utility model provides a high-efficiency chip radiator, is equipped with heat radiation fin group, heat pipe and heat conduction support, the heat conduction support is provided with the heat pipe groove that is used for holding the heat pipe, the heat pipe including holding in the heat pipe groove direct contact portion, run through set up in heat radiation fin group's heat dissipation portion and connection direct contact portion with heat radiation portion's transition portion to transmit the chip heat to heat radiation fin group through the heat pipe, its characterized in that, direct contact portion and transition portion width are narrower than heat radiation portion's cross-section diameter, direct contact portion's top surface with heat conduction support top surface parallel and level and constitute the chip contact surface with the flat contact of chip.
2. The high performance chip heat sink as recited in claim 1 wherein said heat sink is configured with at least 5 heat pipes, the sum of the cross-sectional widths of the straight contact portions of the heat pipes being no more than 28.0mm.
3. The high performance chip heat spreader of claim 2, wherein the straight contact width is 3.0mm to 4.5mm.
4. The high performance chip heat sink as recited in claim 3 wherein said heat sink is configured with 6 heat pipes and said straight contact is no more than 4.0mm wide.
5. The high performance chip heat sink as recited in claim 1 wherein said heat pipe slot includes a bottom surface receiving portion, said bottom surface receiving portion including a plurality of recesses matching a bottom surface of said heat pipe direct contact portion, said plurality of recesses being equal to said heat pipe.
6. The high performance chip heat sink as claimed in claim 5, wherein the heat conducting support has side receiving parts protruding upward from the bottom of the heat pipe groove and forming a concave space for receiving the heat pipe at two side edges of the heat pipe groove, a limit ridge extending along the length direction of the groove with a predetermined height is provided between adjacent heat pipe grooves, the height of the limit ridge is lower than that of the side receiving parts, the bottom of the heat pipe is limited in the bottom receiving part of the heat pipe groove in a matching manner, the top of the heat pipe is flush with the upper surface of the side receiving parts, the side receiving parts and the heat pipe groove form an integral heat conducting receiving cavity, and the heat pipes are arranged in the heat conducting receiving cavity without gaps.
7. The high performance chip heat sink as recited in claim 6 wherein said side receiving portions are bumps disposed on opposite side edges of said heat pipe groove and protruding upward relative to the bottom of said heat pipe groove, the upper surfaces of said bumps being flush with said flat top surface of said heat pipe.
8. The high performance chip heat sink as recited in claim 6 wherein the top of said heat pipes are integrally flattened surfaces joined by a seamless joint of two heat pipes.
9. The high performance chip heat sink as recited in claim 1 wherein a thermally conductive silicone grease layer is disposed between said heat pipe and said chip, and wherein said thermally conductive support is an aluminum thermally conductive support.
10. A chip, characterized in that it is equipped with a high-performance chip heat sink according to any one of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222699108.7U CN219457591U (en) | 2022-10-13 | 2022-10-13 | High-efficiency chip radiator and chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222699108.7U CN219457591U (en) | 2022-10-13 | 2022-10-13 | High-efficiency chip radiator and chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219457591U true CN219457591U (en) | 2023-08-01 |
Family
ID=87385524
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222699108.7U Active CN219457591U (en) | 2022-10-13 | 2022-10-13 | High-efficiency chip radiator and chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219457591U (en) |
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2022
- 2022-10-13 CN CN202222699108.7U patent/CN219457591U/en active Active
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