CN219457554U

CN219457554U - Conveying and positioning tool for chip bonding wires

Info

Publication number: CN219457554U
Application number: CN202320864573.3U
Authority: CN
Inventors: 赵雪; 邹佩纯; 温正萍
Original assignee: Sichuan Xumaowei Technology Co ltd
Current assignee: Sichuan Xumaowei Technology Co ltd
Priority date: 2023-04-18
Filing date: 2023-04-18
Publication date: 2023-08-01
Anticipated expiration: 2033-04-18

Abstract

A conveying and positioning tool for chip bonding wires comprises: two backup pads, conveying component, locating component. Two side plates which are symmetrically arranged and move in opposite directions are arranged between the support plates, two support bars are arranged on the inner sides of the side plates along the length direction of the side plates, and the lead frame is positioned between the two support bars; the conveying assembly is arranged on one of the support plates and comprises a plurality of conveying modules which are arranged along the length direction of the support plate, each conveying module comprises two pushing plates which are arranged up and down and reciprocate along the length direction of the support plate, and the pushing plate above the conveying modules moves along the vertical direction and is used for conveying the lead frames; the locating component is arranged above the supporting plate and comprises two locating modules which are symmetrically arranged and move along the vertical direction, and the locating modules comprise three locating clamps which are arranged at intervals and are used for locating chips on the lead frame. Adopt two push plates to carry out intermittent type centre gripping propelling movement to lead frame to carry out accurate location to lead frame and chip, guarantee the connection accuracy of wire.

Description

Conveying and positioning tool for chip bonding wires

Technical Field

The utility model relates to the technical field of semiconductor device production, in particular to a conveying and positioning tool for chip bonding wires.

Background

After the chip is fixed on the lead frame, the chip and the lead frame are connected through the metal wire, so that pins of the chip and the lead frame are connected, and then a semiconductor device can be formed through plastic packaging, breaking and other processes.

Disclosure of Invention

To the not enough of above-mentioned relevant prior art, this application provides a chip bonding wire with carrying location frock, adopts two push plates to carry out intermittent type ground centre gripping propelling movement to lead frame to carry out accurate location to lead frame and chip, guarantee the connection accuracy of wire.

In order to achieve the above object, the present utility model adopts the following technique:

a conveying and positioning tool for chip bonding wires comprises: backup pad, conveying component, locating component.

The two support plates are symmetrically arranged, two side plates which are symmetrically arranged and move in opposite directions are arranged between the support plates, two support bars are arranged on the inner sides of the side plates along the length direction of the side plates, and two sides of the lead frame are positioned between the two support bars; the conveying assembly is arranged on one of the support plates and comprises a plurality of conveying modules which are arranged along the length direction of the support plate, each conveying module comprises two pushing plates which are arranged up and down and reciprocate along the length direction of the support plate, one side of each pushing plate is abutted to the support bar, and the pushing plate positioned above is moved along the vertical direction and used for conveying the lead frame; the locating component is arranged above the supporting plate and comprises two locating modules which are symmetrically arranged and move along the vertical direction, and the locating modules comprise three locating clamps which are arranged at intervals and are used for locating chips on the lead frame.

Further, push pedal one side is equipped with the bracing piece, and in the go-between was worn to locate by the bracing piece, backup pad and curb plate side all were equipped with two vertical through-holes of arranging, and the length of two through-holes is the same, and the height that highly is greater than the through-hole of below of the through-hole that is located the top, the bracing piece passed the through-hole, and the go-between cooperates in the through-hole of backup pad, still overlaps on the bracing piece and is equipped with the spring, and push pedal and go-between are connected respectively at the spring both ends, and the spring is in tensile state all the time.

Further, be located the go-between one end top of top and be equipped with the connecting rod, the connecting rod is connected in the removal end of first telescopic link, the stiff end sliding fit of first telescopic link is in the backup pad, along backup pad length direction removal, and be located the go-between both sides of top and be equipped with the L shape pole of inversion, be located the go-between both sides of below still be equipped with the gag lever post, L shape pole lower extreme slides and wears to locate in the gag lever post, be located the go-between of below still connects in the removal end of reciprocal straight line mechanism, reciprocal straight line mechanism arranges along backup pad length direction.

Further, the push plate both ends still are equipped with branch, and branch one end is equipped with the gyro wheel, and the gyro wheel butt is connected to the curb plate.

Further, the positioning module further comprises a lifting block, three sliding rods are matched on the lifting block, the sliding rods are arranged along the width direction of the supporting plate and locked by screws, one ends of the sliding rods positioned on two sides incline towards the outer side, and the positioning clamps are respectively arranged on one sliding rod.

Further, two lifting blocks are connected to one lifting plate, the lifting plate is connected to the moving end of the second telescopic rod, and the second telescopic rod is installed on the supporting plate.

The utility model has the beneficial effects that: the lead frame is clamped by the two push plates, and then the lead frame is intermittently pushed, so that the distance of each movement of the lead frame is ensured to be more accurate, each time of metal wires can be accurately connected to the corresponding positions of the lead frame and the chip, the production precision is ensured, and the product quality is further improved; in the process of connecting the metal wires, the positioning clamp is used for further positioning the chip position, so that the lead frame can be further prevented from being shifted; meanwhile, the distance between the two side plates is adjustable, and the locating clamp can be replaced, so that the lead frame is suitable for lead frames with different sizes.

Drawings

The drawings described herein are for illustration of selected embodiments only and not all possible implementations, and are not intended to limit the scope of the utility model.

Fig. 1 is a schematic perspective view of an overall structure according to an embodiment of the present application.

Fig. 2 is a schematic perspective view of a conveying module according to an embodiment of the present application.

Fig. 3 is another perspective view of a conveying module according to an embodiment of the present application.

Fig. 4 is a schematic perspective view of a positioning assembly according to an embodiment of the present application.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the following detailed description of the embodiments of the present utility model will be given with reference to the accompanying drawings, but the described embodiments of the present utility model are some, but not all embodiments of the present utility model.

As shown in fig. 1 to 4, this example provides a conveying and positioning tool for chip bonding wires, including: a support plate 100, a conveying assembly 200, and a positioning assembly 300.

The two support plates 100 are symmetrically arranged, two symmetrically arranged side plates 101 which move in opposite directions are arranged between the support plates 100, the synchronous opposite movement of the two side plates 101 can be driven by adopting a structure of a bidirectional screw rod and a motor, namely, the two side plates 101 are respectively connected to two sections of opposite threaded moving ends of the bidirectional screw rod, when the bidirectional screw rod rotates, the two side plates 101 can synchronously move in opposite directions or opposite directions, two support bars 102 are arranged on the inner side of the side plates 101 along the length direction of the side plates, and two sides of a lead frame are positioned between the two support bars 102; the conveying assembly 200 is mounted on one of the support plates 100 and comprises a plurality of conveying modules arranged along the length direction of the support plate 100, the conveying modules comprise two pushing plates 201 which are arranged up and down and reciprocate along the length direction of the support plate 100, one side of each pushing plate 201 is abutted to the support bar 102, the pushing plate 201 positioned above is moved along the vertical direction, and the two pushing plates 201 clamp and convey the lead frames forwards; the positioning assembly 300 is disposed above the support plate 100, and includes two positioning modules symmetrically disposed and moving in a vertical direction, wherein the positioning modules include three positioning clips 301 disposed at intervals, and are used for positioning chips on the lead frame.

Specifically, a supporting rod 202 is arranged on one side of the push plate 201, the supporting rod 202 is arranged in the connecting ring 203 in a penetrating manner, two vertically arranged through holes 103 are formed in the side surfaces of the supporting plate 100 and the side plate 101, the lengths of the two through holes 103 are identical, the height of the upper through hole 103 is larger than that of the lower through hole 103, the supporting rod 202 penetrates through the through hole 103, the connecting ring 203 is matched in the through hole 103 of the supporting plate 100, the lower connecting ring 203 can only move along the length direction of the supporting plate 100, the upper connecting ring 203 can also move in the vertical direction, a spring 204 is sleeved on the supporting rod 202, two ends of the spring 204 are respectively connected with the push plate 201 and the connecting ring 203, the spring 204 is always in a stretching state, accordingly, the side surface of the push plate 201 is guaranteed to be always abutted to the supporting rod 102, when the two side plates 101 move in opposite directions, the push plate 201 can follow synchronous movement, and even when the two side plates 101 move in opposite directions, the push plate 201 can also move synchronously with the side plates 101 under the pulling force of the spring 204.

Specifically, a connecting rod 206 is disposed at the top of one end of the upper connecting ring 203, the connecting rod 206 is connected to the moving end of the first telescopic rod 207, the connecting ring 203 disposed above is driven by the first telescopic rod 207 to move in the vertical direction, meanwhile, in order to avoid affecting the horizontal movement of the connecting ring 203, the fixed end of the first telescopic rod 207 is slidably matched with the supporting plate 100 to move along the length direction of the supporting plate 100, inverted L-shaped rods 208 are disposed at two sides of the upper connecting ring 203, meanwhile, in order to ensure that two connecting rings 203 in the vertical direction synchronously move along the length direction of the supporting plate 100, limit rods 209 are disposed at two sides of the lower connecting ring 203, the lower ends of the L-shaped rods 208 are slidably inserted into the limit rods 209, the connecting ring 203 disposed below is also connected to the moving end of the reciprocating linear mechanism, and the reciprocating linear mechanism is disposed along the length direction of the supporting plate 100.

Specifically, in order to make the movement of the push plate 201 smoother, the push plate 201 is further provided with support rods 210 at both ends thereof, one end of each support rod 210 is provided with a roller 211, and the roller 211 is abutted against the side plate 101.

Specifically, the positioning module further includes a lifting block 302, three sliding bars 303 are matched on the lifting block 302, the sliding bars 303 are arranged along the width direction of the supporting plate 100 and are locked by screws, when the lead frames with different sizes are required to be connected with metal wires, the sliding bars 303 can be replaced, one ends of the sliding bars 303 positioned at two sides incline outwards, the positioning clamps 301 are respectively installed on one sliding bar 303, one ends of the positioning clamps 301 incline downwards and are in a split shape, the pressure on the chip can be dispersed, the positioning clamps 301 positioned at two sides can position four corners of the chip, and the middle point of the two sides of the chip is positioned by the positioning clamps 301 positioned in the middle, so that when the positioning clamps 301 press the chip, the connection operation of the metal wires can be started.

Specifically, in order to move the two lifting blocks 302 up and down synchronously, both lifting blocks 302 are connected to one lifting plate 304, and the lifting plate 304 is connected to the moving end of the second telescopic rod 305, the second telescopic rod 305 is mounted on the support plate 100, and the two lifting blocks 302 are moved up and down by the driving of the second telescopic rod 305.

The above is only a preferred embodiment of the present utility model and is not intended to limit the present utility model, and it is obvious that those skilled in the art can make various modifications and variations to the present utility model without departing from the spirit and scope of the present utility model. Thus, it is intended that the present utility model also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.

Claims

1. Chip bonding wire is with carrying location frock, its characterized in that includes:

the lead frame comprises two support plates (100) which are symmetrically arranged, wherein two side plates (101) which are symmetrically arranged and move in opposite directions are arranged between the support plates (100), two support bars (102) are arranged on the inner sides of the side plates (101) along the length direction of the side plates, and two sides of the lead frame are positioned between the two support bars (102);

the conveying assembly (200) is arranged on one supporting plate (100) and comprises a plurality of conveying modules which are arranged along the length direction of the supporting plate (100), the conveying modules comprise two pushing plates (201) which are arranged up and down and reciprocate along the length direction of the supporting plate (100), one side of each pushing plate (201) is abutted to the supporting bar (102), and the pushing plate (201) positioned above is moved along the vertical direction and is used for conveying lead frames;

the positioning assembly (300) is arranged above the supporting plate (100) and comprises two positioning modules which are symmetrically arranged and move along the vertical direction, and each positioning module comprises three positioning clamps (301) which are arranged at intervals and used for positioning the chip on the lead frame.

2. The conveying and positioning tool for chip bonding wires according to claim 1, wherein a supporting rod (202) is arranged on one side of the push plate (201), the supporting rod (202) is arranged in the connecting ring (203) in a penetrating mode, two through holes (103) which are vertically arranged are formed in the side faces of the supporting plate (100) and the side plates (101), the lengths of the two through holes (103) are identical, the height of the through hole (103) located above is larger than that of the through hole (103) located below, the supporting rod (202) penetrates through the through hole (103), the connecting ring (203) is matched in the through hole (103) of the supporting plate (100), springs (204) are sleeved on the supporting rod (202), the two ends of each spring (204) are respectively connected with the push plate (201) and the connecting ring (203), and the springs (204) are always in a stretching state.

3. The conveying and positioning tool for chip bonding wires according to claim 2, wherein a connecting rod (206) is arranged at the top of one end of the connecting ring (203) above, the connecting rod (206) is connected to the moving end of the first telescopic rod (207), the fixed end of the first telescopic rod (207) is slidably matched with the supporting plate (100) to move along the length direction of the supporting plate (100), inverted L-shaped rods (208) are arranged at two sides of the connecting ring (203) above, limit rods (209) are further arranged at two sides of the connecting ring (203) below, the lower end of the L-shaped rod (208) is slidably arranged in the limit rods (209), the connecting ring (203) below is further connected to the moving end of a reciprocating linear mechanism, and the reciprocating linear mechanism is arranged along the length direction of the supporting plate (100).

4. The conveying and positioning tool for chip bonding wires according to claim 1, wherein two ends of the push plate (201) are further provided with supporting rods (210), one end of each supporting rod (210) is provided with a roller (211), and the rollers (211) are abutted to the side plates (101).

5. The conveying and positioning tool for chip bonding wires according to claim 1, wherein the positioning module further comprises a lifting block (302), three sliding rods (303) are matched on the lifting block (302), the sliding rods (303) are arranged along the width direction of the supporting plate (100) and are locked by screws, one ends of the sliding rods (303) located on two sides incline towards the outer side, and the positioning clamps (301) are respectively installed on one sliding rod (303).

6. The die bonding wire conveying and positioning tool according to claim 5, wherein two lifting blocks (302) are connected to one lifting plate (304), the lifting plate (304) is connected to a moving end of a second telescopic rod (305), and the second telescopic rod (305) is mounted on the supporting plate (100).