CN219449319U - Encapsulation structure of MEMS device - Google Patents
Encapsulation structure of MEMS device Download PDFInfo
- Publication number
- CN219449319U CN219449319U CN202320481094.3U CN202320481094U CN219449319U CN 219449319 U CN219449319 U CN 219449319U CN 202320481094 U CN202320481094 U CN 202320481094U CN 219449319 U CN219449319 U CN 219449319U
- Authority
- CN
- China
- Prior art keywords
- metal layer
- pad
- mems chip
- utility
- model
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Micromachines (AREA)
Abstract
The utility model provides a packaging structure of an MEMS device, which comprises: the MEMS chip is provided with a front cavity and a rear cavity; the packaging shell is arranged outside the MEMS chip and used for installing the MEMS chip; and an electromagnetic shielding structure disposed on the package case and allowing the electromagnetic shielding structure to shield signals of the front cavity of the MEMS chip. The utility model provides a packaging structure of an MEMS device, which can shield front cavity stray signals of an MEMS chip, increase emission sound pressure level and receiving sensitivity, improve performance of the MEMS device, and can be anti-corrosion, dustproof and waterproof.
Description
Technical Field
The utility model relates to the technical field of MEMS devices, in particular to a packaging structure of an MEMS device.
Background
The Micro-electro-Mechanical-System (MEMS) packaging technology is an important research direction in the field of MEMS research, on one hand, packaging can prevent the MEMS device from being affected by dust, moisture and the like on the movable structure, and on the other hand, the internal damping condition of the MEMS device can be changed through vacuum or airtight packaging, so that the performance of the product is improved. The current MEMS chip packaging technology does not carry out electromagnetic shielding treatment on the MEMS chip, so that stray signals of the MEMS chip influence the performance of the MEMS device.
Disclosure of Invention
The utility model aims to overcome the problems in the prior art and provide a packaging structure of an MEMS device, which can shield stray signals of a front cavity of an MEMS chip, thereby improving the performance of the MEMS chip.
In order to achieve the technical purpose and the technical effect, the utility model is realized by the following technical scheme:
the utility model provides a packaging structure of an MEMS device, which comprises:
the MEMS chip is provided with a front cavity and a rear cavity;
the packaging shell is arranged outside the MEMS chip and used for installing the MEMS chip; and
and the electromagnetic shielding structure is arranged on the packaging shell and allows the electromagnetic shielding structure to shield signals of the front cavity of the MEMS chip.
In one embodiment of the utility model, the package housing includes:
the first PCB is provided with an acoustic hole and is used for installing the MEMS chip;
the connecting frame is arranged on the first PCB and is positioned outside the MEMS chip; and
the second PCB board is arranged at one end of the connecting frame far away from the first PCB board.
In one embodiment of the present utility model, the first PCB includes:
a first plate body;
the first metal layer is arranged on one side, close to the MEMS chip, of the first plate body; and
the first insulating layer is arranged on the first metal layer, and a first groove is formed in the first insulating layer to allow the first metal layer to be exposed.
In one embodiment of the present utility model, the second PCB includes:
the second plate body is arranged at one end, far away from the first plate body, of the connecting frame;
the second metal layer is arranged on one side, close to the MEMS chip, of the second plate body; and
the second insulating layer is arranged on the second metal layer, and a second groove is formed in the second insulating layer to allow the second metal layer to be exposed.
In an embodiment of the utility model, the packaging structure further includes a waterproof and dustproof structure, and the waterproof and dustproof structure is disposed on the first PCB board and is used for shielding the sound hole.
In one embodiment of the present utility model, the electromagnetic shielding structure includes:
the third metal layer is arranged on the connecting frame;
the fourth metal layer is arranged on the connecting frame and connected with the first metal layer, and the fourth metal layer is electrically connected with the third metal layer; and
and the fifth metal layer is arranged on the connecting frame and connected with the second metal layer, and the fifth metal layer is electrically connected with the third metal layer.
In one embodiment of the present utility model, the first board body is provided with a first bonding pad, and the first bonding pad is electrically connected with the MEMS chip.
In one embodiment of the present utility model, the connection frame is provided with a second bonding pad and a third bonding pad, the second bonding pad is located at one end of the connection frame and is electrically connected with the first bonding pad, the third bonding pad is located at the other end of the connection frame and is electrically connected with the second bonding pad.
In one embodiment of the present utility model, a fourth pad is disposed on the second board, and the fourth pad is electrically connected to the third pad.
In one embodiment of the present utility model, a fifth pad, a ground pad, and an external device pad are further disposed on the second board, where the fifth pad, the ground pad, and the external device pad are located on a side of the second board away from the fourth pad.
In summary, the utility model provides a packaging structure of a MEMS device, where a third metal layer is disposed on a connection frame, and the third metal layer is electrically connected with a first metal layer and a second metal layer through a fourth metal layer and a fifth metal layer, so that stray signals of a front cavity of the MEMS chip are shielded, a transmitting sound pressure level and a receiving sensitivity are increased, performance of the MEMS device is improved, a back cavity of the MEMS chip is adhered to a first PCB board to form a forward-mounted back transmitting signal, the transmitting sound pressure level and the receiving sensitivity are increased, a waterproof and dustproof film is adhered to the first PCB board, and a sound hole is covered, so that dust and water can be prevented from entering the packaging structure, and effects of corrosion resistance, dust resistance and water resistance are achieved.
Drawings
The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this application, illustrate embodiments of the utility model and together with the description serve to explain the utility model and do not constitute a limitation on the utility model. In the drawings:
FIG. 1 is a schematic overall construction of an embodiment of the present utility model;
FIG. 2 is a cross-sectional view of FIG. 1 of the present utility model;
FIG. 3 is an exploded view of the structure of FIG. 1 at an angle in accordance with the present utility model;
FIG. 4 is an exploded view of the structure of FIG. 1 at another angle in accordance with the present utility model;
FIG. 5 is a schematic view of a portion of the structure of FIG. 1 in accordance with the present utility model;
FIG. 6 is an exploded view of the structure of FIG. 5 in accordance with the present utility model;
fig. 7 is a structural exploded view of a second PCB panel of the present utility model;
FIG. 8 is an exploded view of the structure of one embodiment of the present utility model;
FIG. 9 is a cross-sectional view of one embodiment of the present utility model;
FIG. 10 is an exploded view of the structure of one embodiment of the present utility model;
FIG. 11 is a schematic view of the structure of FIG. 10 at another angle in accordance with the present utility model;
FIG. 12 is a cross-sectional view of one embodiment of the present utility model;
FIG. 13 is an exploded view of another embodiment of the present utility model;
fig. 14 is a cross-sectional view of another embodiment of the present utility model.
The reference numerals in the figures illustrate: 1-first plate body, 2-first insulating layer, 3-first metal layer, 4-link, 5-second insulating layer, 6-second plate body, 7-second metal layer, 8-sound hole, 9-MEMS chip, 10-adhesive tape, 11-waterproof dustproof film, 12-first conductive wire, 13-fourth metal layer, 14-third metal layer, 15-fifth metal layer, 16-grounding pad, 17-fifth pad, 18-third conductive wire, 19-fourth pad, 20-second pad, 21-external device pad, 22-third pad, 23-first pad, 24-second conductive wire, 25-sixth pad, 26-first trench, 27-second trench.
Detailed Description
The utility model will be described in detail below with reference to the drawings in combination with embodiments.
Referring to fig. 1 to 7, the present utility model provides a packaging structure of a MEMS device, which can shield the stray signals of the front cavity of the MEMS chip 9, so as to improve the performance of the MEMS chip 9. Specifically, the package structure includes a MEMS chip 9 and a package case provided outside the MEMS chip 9 for mounting the MEMS chip 9. The packaging shell comprises a first PCB, a connecting frame 4 and a second PCB, and sound holes 8 are formed in the first PCB. The shape of the sound hole 8 is not limited in the present application, and in one embodiment of the present utility model, the sound hole 8 may be circular, square, or any other irregular shape. The first PCB board includes first plate body 1, first metal layer 3 and first insulating layer 2, and first metal layer 3 sets up the one side that is close to MEMS chip 8 on first plate body 1. The first insulating layer 2 is disposed on the first metal layer 3, and a first trench 26 is disposed on the first insulating layer 2 to allow the first metal layer 3 to be exposed. Specifically, the first trench 26 may be a frame-shaped trench formed by etching a portion of the first insulating layer 2 on the first insulating layer 2, so that a portion of the first metal layer 3 is exposed. The first board body 1 is further provided with a sixth bonding pad 25, and the cross-sectional area of the sixth bonding pad 25 is small. The first plate body 1 is also provided with a first bonding pad 23, and the first bonding pad 23 is positioned on the first plate body 1 near the edge of the first plate body 1. The first pad 23 may be L-shaped, but is not limited thereto.
Referring to fig. 1 to 4, in an embodiment of the present utility model, the connection frame 4 is disposed on the first PCB board, and the connection frame 4 is located outside the MEMS chip 9. The connecting frame 4 is provided with a second bonding pad 20 and a third bonding pad 22, the second bonding pad 20 is positioned at one end of the connecting frame 4, the second bonding pad 20 is electrically connected with the first bonding pad 23, the third bonding pad 22 is positioned at the other end of the connecting frame 4, and the third bonding pad 22 is electrically connected with the second bonding pad 20. In one embodiment of the present utility model, the third pad 22 and the second pad 20 may be electrically connected through the via hole, but is not limited thereto. The shape of the second and third pads 20 and 22 is the same as the shape of the first pad 23.
Referring to fig. 1 to 4 and fig. 7, in an embodiment of the utility model, the second PCB is disposed at an end of the connecting frame 4 far from the first PCB. The second PCB board comprises a second board body 6, a second metal layer 7 and a second insulating layer 5, and the second board body 6 is disposed at one end of the connecting frame 4 far away from the first board body 1. The second metal layer 7 is disposed on the second plate 6 at a side close to the MEMS chip 9. The second insulating layer 5 is disposed on the second metal layer 7, and a second trench 27 is disposed on the second insulating layer 5 to allow the second metal layer 7 to be exposed. Specifically, the second trench 27 may be a frame-shaped trench formed by etching a portion of the second insulating layer 5 on the second insulating layer 5, so that a portion of the second metal layer 7 is exposed. The second board body 6 is provided with a fourth bonding pad 19, and the fourth bonding pad 19 is electrically connected with the third bonding pad 22. The fourth pad 19 has the same shape as the first pad 23. In one embodiment of the present utility model, the second board 6 is further provided with a fifth pad 17, a ground pad 16 and an external device pad 21, and the fifth pad 17, the ground pad 16 and the external device pad 21 are located on a side of the second board 6 remote from the fourth pad 19. The fifth pad 17 is used for leading out signals of the MEMS chip 9, the ground pad 16 is used for grounding, and the external device pad 21 is used for connecting with other devices.
Referring to fig. 1 to 6, 9 to 12, and 14, in an embodiment of the present utility model, the package structure further includes a MEMS chip 9, the MEMS chip 9 has a front cavity and a back cavity, the MEMS chip 9 is disposed on the first PCB, the MEMS chip 9 is located on one side of the first PCB, the back cavity of the MEMS chip 9 is adhered to the first PCB, and a helmholtz resonant cavity is formed between the back cavity of the MEMS chip 9 and the first PCB and between the back cavity and the acoustic hole 8, so as to improve the emission sensitivity of the MEMS chip 9. And the back cavity of the MEMS chip 9 sounds to form a forward-mounted back-emission signal, so that the emission sound pressure level and the receiving sensitivity are increased. The MEMS chip 9 is further provided with a first conductive wire 12, the first conductive wire 12 is located in the front cavity of the MEMS chip 9, one end of the first conductive wire 12 is connected with the MEMS chip 9, and the other end of the first conductive wire 12 is connected with the sixth bonding pad 25. The sixth pad 5 is connected to the first pad 23 through a second conductive line 24, and the first pad 23 is electrically connected to the MEMS chip 9.
Referring to fig. 1 to 14, in one embodiment of the present utility model, the package structure further includes an electromagnetic shielding structure disposed on the package housing and allowing the electromagnetic shielding structure to shield signals of the front cavity of the MEMS chip 9. Specifically, the electromagnetic shielding structure includes a third metal layer 14, a fourth metal layer 13, and a fifth metal layer 15, where the third metal layer 14 is disposed on the connection frame 4. The specific location of the third metal layer 14 is not limited in this application, and in one embodiment of the present utility model, the third metal layer 14 may be disposed on the inner surface of the connection frame 4 and cover the inner surface of the connection frame 4, and the third metal layer 14 may also be disposed on the outer surface of the connection frame 4 and cover the outer surface of the connection frame 4. When the third metal layer 14 is disposed on the outer surface of the connecting frame 4, an insulating layer covers the outer surface of the third metal layer 14. The fourth metal layer 13 is disposed on the connecting frame 3 and connected to the first metal layer 3, and the fourth metal layer 15 is electrically connected to the third metal layer 14. The fourth metal layer 13 and the third metal layer 14 may be electrically connected through the third conductive line 18, but is not limited thereto. The fifth metal layer 15 is disposed on the connecting frame 4 and connected to the second metal layer 7, and the fifth metal layer 15 is electrically connected to the third metal layer 14. The fifth metal layer 15 and the third metal layer 14 may be electrically connected through the third conductive line 18, but is not limited thereto. The specific materials of the first metal layer 3, the second metal layer 7, the third metal layer 14, the fourth metal layer 13 and the fifth metal layer 15 are not limited in this application, and in one embodiment of the present utility model, the first metal layer 3, the second metal layer 7, the third metal layer 14, the fourth metal layer 13 and the fifth metal layer 15 may be metal layers, for example, copper, zinc or nickel. The third metal layer 14 is connected with the first metal layer 3 and the second metal layer 7 through the fourth metal layer 13 and the fifth metal layer 15 to form electrical conduction, so that stray signals of the front cavity of the MEMS chip 9 can be shielded, and the performance of the MEMS chip 9 is improved.
Referring to fig. 1 to 14, in an embodiment of the present utility model, the package structure further includes a waterproof and dustproof structure disposed on the first PCB board for shielding the sound hole 8. Specifically, the waterproof and dustproof structure may be a waterproof and dustproof film 11, and the waterproof and dustproof film 11 is adhered to the first PCB board through the adhesive 10. Specifically, the waterproof and dustproof film 11 may be adhered to the side, far away from the MEMS chip 9, of the first plate 1, and the waterproof and dustproof film 11 may also be adhered to the side, close to the MEMS chip 9, of the first insulating layer 2, so that the package size of the MEMS chip 9 may be reduced when the waterproof and dustproof film 11 is adhered to the first insulating layer 2. The waterproof and dustproof film 11 can prevent dust and water from entering the packaging structure from the sound hole 8 and affecting the performance of the MEMS chip 9.
In summary, the utility model provides a packaging structure of a MEMS device, where a third metal layer is disposed on a connection frame, and the third metal layer is electrically connected with a first metal layer and a second metal layer through a fourth metal layer and a fifth metal layer, so that stray signals of a front cavity of the MEMS chip are shielded, a transmitting sound pressure level and a receiving sensitivity are increased, performance of the MEMS device is improved, a back cavity of the MEMS chip is adhered to a first PCB board to form a forward-mounted back transmitting signal, the transmitting sound pressure level and the receiving sensitivity are increased, a waterproof and dustproof film is adhered to the first PCB board, and a sound hole is covered, so that dust and water can be prevented from entering the packaging structure, and effects of corrosion resistance, dust resistance and water resistance are achieved.
The foregoing has shown and described the basic principles, principal features and advantages of the utility model. It will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present utility model, and various changes and modifications may be made without departing from the spirit and scope of the utility model, which is defined in the appended claims.
Claims (10)
1. A package structure of a MEMS device, the package structure comprising:
the MEMS chip is provided with a front cavity and a rear cavity;
the packaging shell is arranged outside the MEMS chip and used for installing the MEMS chip; and
and the electromagnetic shielding structure is arranged on the packaging shell and allows the electromagnetic shielding structure to shield signals of the front cavity of the MEMS chip.
2. The package structure of claim 1, wherein the package housing comprises:
the first PCB is provided with an acoustic hole and is used for installing the MEMS chip;
the connecting frame is arranged on the first PCB and is positioned outside the MEMS chip; and
the second PCB board is arranged at one end of the connecting frame far away from the first PCB board.
3. The package structure of claim 2, wherein the first PCB board comprises:
a first plate body;
the first metal layer is arranged on one side, close to the MEMS chip, of the first plate body; and
the first insulating layer is arranged on the first metal layer, and a first groove is formed in the first insulating layer to allow the first metal layer to be exposed.
4. The package structure of claim 3, wherein the second PCB board comprises:
the second plate body is arranged at one end, far away from the first plate body, of the connecting frame;
the second metal layer is arranged on one side, close to the MEMS chip, of the second plate body; and
the second insulating layer is arranged on the second metal layer, and a second groove is formed in the second insulating layer to allow the second metal layer to be exposed.
5. The package structure of claim 2, further comprising a waterproof and dustproof structure disposed on the first PCB for shielding the sound hole.
6. The package structure of claim 4, wherein the electromagnetic shielding structure comprises:
the third metal layer is arranged on the connecting frame;
the fourth metal layer is arranged on the connecting frame and connected with the first metal layer, and the fourth metal layer is electrically connected with the third metal layer; and
and the fifth metal layer is arranged on the connecting frame and connected with the second metal layer, and the fifth metal layer is electrically connected with the third metal layer.
7. The package structure of claim 4, wherein the first board body is provided with a first bonding pad, and the first bonding pad is electrically connected with the MEMS chip.
8. The package structure of claim 7, wherein a second bonding pad and a third bonding pad are disposed on the connection frame, the second bonding pad is located at one end of the connection frame and is electrically connected to the first bonding pad, the third bonding pad is located at the other end of the connection frame and is electrically connected to the second bonding pad.
9. The package structure of claim 8, wherein a fourth pad is disposed on the second board body, and the fourth pad is electrically connected to the third pad.
10. The package structure of claim 9, wherein a fifth pad, a ground pad, and an external device pad are further disposed on the second board, and the fifth pad, the ground pad, and the external device pad are located on a side of the second board away from the fourth pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320481094.3U CN219449319U (en) | 2023-03-09 | 2023-03-09 | Encapsulation structure of MEMS device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320481094.3U CN219449319U (en) | 2023-03-09 | 2023-03-09 | Encapsulation structure of MEMS device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219449319U true CN219449319U (en) | 2023-08-01 |
Family
ID=87413702
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320481094.3U Active CN219449319U (en) | 2023-03-09 | 2023-03-09 | Encapsulation structure of MEMS device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219449319U (en) |
-
2023
- 2023-03-09 CN CN202320481094.3U patent/CN219449319U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108366330B (en) | Micro-electromechanical packaging structure | |
| US7945062B2 (en) | Microelectromechanical microphone packaging system | |
| CN101237720A (en) | Semiconductor device | |
| CN111556419A (en) | Bone voiceprint sensor and electronic device | |
| WO2020164497A1 (en) | Packaging assembly and electronic device | |
| CN210112277U (en) | Silicon microphone packaging structure | |
| CN211056708U (en) | Silicon microphone packaging structure | |
| CN219449319U (en) | Encapsulation structure of MEMS device | |
| CN212486787U (en) | MEMS microphone and electronic equipment | |
| CN111510836B (en) | MEMS packaging structure and MEMS microphone | |
| CN220322396U (en) | Ultrasonic sensor | |
| CN210112276U (en) | Silicon microphone packaging structure | |
| CN110526199A (en) | Silicon microphone packaging structure and its packaging method | |
| CN215935100U (en) | Microphone structure, packaging structure and electronic equipment | |
| CN112897451B (en) | Sensor packaging structure, manufacturing method thereof and electronic equipment | |
| US20060110000A1 (en) | Condenser microphone | |
| CN212486786U (en) | MEMS microphone and electronic equipment | |
| CN210958792U (en) | MEMS microphone and electronic equipment | |
| CN201294630Y (en) | Anti-interference capacitance microphone | |
| JP2007060228A (en) | Silicon microphone package | |
| CN210807650U (en) | Waterproof dustproof antivibration silicon material microphone | |
| CN201142758Y (en) | Full-shielding capacitor type miniature microphone | |
| CN209562739U (en) | Microphone packaging scheme and electronic equipment | |
| CN114339560B (en) | Miniature microphone and electronic equipment | |
| CN111050238A (en) | Novel microphone packaging structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |