CN220322396U - Ultrasonic sensor - Google Patents
Ultrasonic sensor Download PDFInfo
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- CN220322396U CN220322396U CN202321931039.6U CN202321931039U CN220322396U CN 220322396 U CN220322396 U CN 220322396U CN 202321931039 U CN202321931039 U CN 202321931039U CN 220322396 U CN220322396 U CN 220322396U
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- piezoelectric ceramic
- ultrasonic sensor
- ceramic plate
- circuit board
- ceramic sheet
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- 239000000919 ceramic Substances 0.000 claims abstract description 120
- 239000011358 absorbing material Substances 0.000 claims abstract description 19
- 238000003466 welding Methods 0.000 claims abstract description 10
- 238000012360 testing method Methods 0.000 abstract description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000002592 echocardiography Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 230000005236 sound signal Effects 0.000 description 1
Abstract
The utility model discloses an ultrasonic sensor, relates to the field of sensors, solves the problem of interference during ultrasonic sensor testing, and has the technical scheme that: the piezoelectric ceramic comprises a piezoelectric ceramic piece, an FPC circuit board and a shell with an opening at the top end; the FPC circuit board covers the side surface and the upper surface of the piezoelectric ceramic plate in a welding mode, the shell is used for assembling the piezoelectric ceramic plate covered with the FPC circuit board, the lower surface of the piezoelectric ceramic plate is positioned on the bottom surface of the shell, and sound absorbing materials are filled between the shell and the piezoelectric ceramic plate covered with the FPC circuit board. According to the utility model, the FPC circuit board is covered on the side surface and the upper surface of the piezoelectric ceramic plate in a welding mode, and the lower surface of the piezoelectric ceramic plate is in contact with the bottom surface of the shell, so that after the sound absorbing material is filled in the shell, the periphery of the piezoelectric ceramic plate can be completely wrapped, interference around the piezoelectric ceramic plate is completely shielded, and the phenomenon of interference during ultrasonic sensor testing is avoided.
Description
Technical Field
The present utility model relates to the field of sensors, and more particularly, to ultrasonic sensors.
Background
The ultrasonic sensor is a sensor for converting ultrasonic signals into other energy signals, the ultrasonic waves can be obviously reflected to form reflection echoes when the ultrasonic waves collide with impurities or interfaces, and the ultrasonic sensor can emit ultrasonic waves or receive ultrasonic waves.
The existing ultrasonic sensor is characterized in that a lead wire and a shielding wire are assembled after a piezoelectric ceramic plate is assembled, a shielding cover is assembled to cover the periphery of the piezoelectric ceramic plate completely, interference around the piezoelectric ceramic plate is shielded through the shielding cover, and a gap exists between the shielding cover and the piezoelectric ceramic plate after the assembly; finally, the gap between the piezoelectric ceramic plate and the shielding cover is filled with the sound absorbing material, and the shielding cover is upwards propped up after the sound absorbing material is solidified, so that a certain distance is generated between the shielding cover and the bottom of the piezoelectric ceramic plate, the periphery of the piezoelectric ceramic plate cannot be completely covered by the shielding cover, interference around the piezoelectric ceramic plate is not completely shielded, and an interference phenomenon occurs during ultrasonic sensor testing.
Disclosure of Invention
In order to solve the problem of interference during ultrasonic sensor testing, the utility model provides an ultrasonic sensor, the FPC circuit board is covered on the side surface and the upper surface of the piezoelectric ceramic plate in a welding mode, and the lower surface of the piezoelectric ceramic plate is in contact with the bottom surface of the shell, so that after the sound absorbing material is filled in the shell, the periphery of the piezoelectric ceramic plate can be completely wrapped, the interference around the piezoelectric ceramic plate is completely shielded, and the phenomenon of interference during ultrasonic sensor testing is avoided.
In order to achieve the above object, the present application provides an ultrasonic sensor including a piezoelectric ceramic sheet, an FPC board, and a housing having an opening at the top end;
the FPC circuit board covers in the side surface and the upper surface of piezoceramics piece through the mode of welding, the casing is used for assembling and covers the piezoceramics piece of FPC circuit board, just piezoceramics piece's lower surface is located on the bottom surface of casing the casing with cover has sound absorbing material between the piezoceramics piece of FPC circuit board.
In one implementation scheme, the FPC circuit board comprises a first component and a second component, wherein the first component is covered on the side surface of the piezoelectric ceramic piece, the second component is covered on the upper surface of the piezoelectric ceramic piece, and the first component and the second component are integrally formed.
In one implementation, the dimensions of the first component are adapted to the dimensions of the side surfaces of the piezoelectric ceramic sheet such that the first component is in close proximity to the piezoelectric ceramic sheet and entirely covers the side surfaces of the piezoelectric ceramic sheet; the size of the second component is matched with the size of the upper surface of the piezoelectric ceramic plate, so that the second component is tightly attached to the piezoelectric ceramic plate and covers the upper surface of the piezoelectric ceramic plate.
In one embodiment, the first component is elongated and is provided with leads for transmitting ultrasonic signals.
In one implementation, the lead is at an angle of 90 degrees to the first component.
In one implementation, a portion of the leads are located outside the opening in the top end of the housing.
In one implementation scheme, the surface of the side surface of the piezoelectric ceramic piece covered by the first component is provided with a negative electrode bonding pad, the negative electrode bonding pad is connected with the negative electrode of the piezoelectric ceramic piece, the surface of the upper surface of the piezoelectric ceramic piece covered by the second component is provided with a positive electrode bonding pad, and the positive electrode bonding pad is connected with the positive electrode of the piezoelectric ceramic piece.
In one implementation, the angle between the first and second members is 90 degrees.
In one implementation, the ultrasonic sensor further comprises a matching layer, one surface of the matching layer is adhered to the lower surface of the piezoelectric ceramic piece, and the other surface of the matching layer is located on the bottom surface of the shell.
Compared with the prior art, the utility model has the following beneficial effects:
1. according to the utility model, the FPC circuit board is covered on the side surface and the upper surface of the piezoelectric ceramic plate in a welding mode, and the lower surface of the piezoelectric ceramic plate is in contact with the bottom surface of the shell, so that after the sound absorbing material is filled in the shell, the periphery of the piezoelectric ceramic plate can be completely wrapped, interference around the piezoelectric ceramic plate is completely shielded, and the phenomenon of interference during ultrasonic sensor testing is avoided.
2. The ultrasonic sensor can replace a shielding cover, a shielding wire and positive and negative electrode leads which are needed by the traditional ultrasonic sensor, can reduce 4 welding spots among the leads, the shielding wire and a PCB (printed circuit board), and 1 welding spot between the lead and the shielding cover, and further improves the reliability of the ultrasonic sensor.
Drawings
The accompanying drawings, which are included to provide a further understanding of embodiments of the utility model and are incorporated in and constitute a part of this application, illustrate embodiments of the utility model. In the drawings:
fig. 1 is a schematic cross-sectional view of an ultrasonic sensor according to an embodiment of the present application;
fig. 2 shows a schematic structural diagram of an FPC circuit board provided in an embodiment of the present application;
fig. 3 is a schematic structural diagram of an FPC board covered with a piezoelectric ceramic sheet according to an embodiment of the present application;
fig. 4 shows a schematic perspective view of an ultrasonic sensor according to an embodiment of the present application.
In the drawings, the reference numerals and corresponding part names:
1. a piezoelectric ceramic sheet; 2. an FPC circuit board; 3. a housing; 4. a matching layer; 21. a first component; 22. a second component; 23. and (5) a lead wire.
Detailed Description
For the purpose of making apparent the objects, technical solutions and advantages of the present utility model, the present utility model will be further described in detail with reference to the following examples and the accompanying drawings, wherein the exemplary embodiments of the present utility model and the descriptions thereof are for illustrating the present utility model only and are not to be construed as limiting the present utility model.
It is noted that the terms "comprises" or "comprising" when utilized in various embodiments of the present application are indicative of the existence of, and do not limit the addition of, one or more functions, operations or elements of the subject application. Furthermore, as used in various embodiments of the present application, the terms "comprises," "comprising," and their cognate terms are intended to refer to a particular feature, number, step, operation, element, component, or combination of the foregoing, and should not be interpreted as first excluding the existence of or increasing likelihood of one or more other features, numbers, steps, operations, elements, components, or combinations of the foregoing.
It is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are merely for convenience in describing and simplifying the description based on the orientation or positional relationship shown in the drawings, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus are not to be construed as limiting the utility model.
Furthermore, terms such as "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature.
The existing ultrasonic sensor is characterized in that a piezoelectric ceramic plate is assembled, an outgoing line and a shielding wire are assembled, a shielding cover is assembled to cover the periphery of the piezoelectric ceramic plate completely, interference around the piezoelectric ceramic plate is shielded through the shielding cover, and a gap exists between the shielding cover and the piezoelectric ceramic plate after the assembly; finally, the gap between the piezoelectric ceramic plate and the shielding cover is filled with the sound absorbing material, and the shielding cover is upwards propped up after the sound absorbing material is solidified, so that a certain distance is generated between the shielding cover and the bottom of the piezoelectric ceramic plate, the periphery of the piezoelectric ceramic plate cannot be completely covered by the shielding cover, interference around the piezoelectric ceramic plate is not completely shielded, and an interference phenomenon occurs during ultrasonic sensor testing.
Referring to fig. 1 and fig. 4, fig. 1 shows a schematic cross-sectional structure of an ultrasonic sensor provided in an embodiment of the present application, fig. 4 shows a schematic perspective structure of an ultrasonic sensor provided in an embodiment of the present application, and as shown in fig. 1, the ultrasonic sensor includes a piezoelectric ceramic plate 1, an FPC circuit board 2, and a housing 3 with an opening at the top end;
the FPC circuit board 2 covers in the side surface and the upper surface of piezoceramics piece 1 through the mode of welding, casing 3 is used for assembling and covers with piezoceramics piece 1 of FPC circuit board 2, just the lower surface of piezoceramics piece 1 is located on the bottom surface of casing 3 the casing 3 with cover with the sound absorbing material is filled between the piezoceramics piece 1 of FPC circuit board 2.
In this embodiment, first, the conventional technology will be described, in which the FPC board 2 and the piezoelectric ceramic sheet 1, the FPC board 2 is a flexible printed circuit board, and the flexible printed circuit board is a flexible printed circuit board made of polyimide or polyester film as a base material and having high reliability. The flexible printed circuit board or the FPC has the characteristics of high wiring density, light weight and thin thickness.
The piezoelectric ceramic plate 1 is an electronic sound producing element, and is made of a piezoelectric ceramic dielectric material placed between two copper circular electrodes, and when an alternating current audio signal is connected to the upper surfaces of the two copper circular electrodes, the piezoelectric plate vibrates according to the magnitude frequency of the signal to produce corresponding sound. The working principle of the piezoelectric ceramic piece 1 is as follows: when a voltage is applied to the piezoelectric ceramic, mechanical deformation occurs with changes in voltage and frequency. On the other hand, when the piezoelectric ceramic is vibrated, an electric charge is generated. By using this principle, when an electric signal is applied to a vibrator composed of two piezoelectric ceramics or one piezoelectric ceramic and one metal sheet, so-called a bimorph element, ultrasonic waves are emitted due to flexural vibration. Conversely, when ultrasonic vibrations are applied to the bimorph element, an electrical signal is generated. Based on the above, piezoelectric ceramics can be used as the ultrasonic sensor.
In order to solve the problems of the prior ultrasonic sensor, the piezoelectric ceramic plate is assembled, then the lead wire and the shielding wire are assembled, then the shielding cover is assembled to cover the periphery of the piezoelectric ceramic plate completely, the interference around the piezoelectric ceramic plate is shielded by the shielding cover, and a gap exists between the shielding cover and the piezoelectric ceramic plate after the assembly; finally, the gap between the piezoelectric ceramic plate and the shielding cover is filled with the sound absorbing material, and the shielding cover is upwards propped up after the sound absorbing material is solidified, so that a certain distance is generated between the shielding cover and the bottom of the piezoelectric ceramic plate, the periphery of the piezoelectric ceramic plate cannot be completely covered by the shielding cover, interference around the piezoelectric ceramic plate is not completely shielded, and an interference phenomenon occurs during sensor testing.
As will be appreciated by those skilled in the art, since the types of the piezoelectric ceramic plates 1 are various, the shape and size of the FPC board 2 should be matched with those of the piezoelectric ceramic plates 1 of the corresponding types, so that the shape and structure of the FPC board 2 are not limited and can be adaptively modified according to practical situations. Furthermore, the sound absorbing material used in the present embodiment is the same type as that used in the conventional ultrasonic sensor, and belongs to the prior art, so the detailed description of the sound absorbing material in the present embodiment is omitted.
Accordingly, the housing 3 may be made of plastic, and the present embodiment is not particularly limited.
As a specific example, the sound absorbing material may be a sound deadening sponge or silicone rubber.
In this embodiment, an FPC circuit board 2 is adopted for assembly, the FPC circuit board 2 is covered on the side surface and the upper surface of the piezoelectric ceramic plate 1 in a welding manner, and the lower surface of the piezoelectric ceramic plate 1 is in contact with the bottom surface of the housing 3, so that after the housing 3 is filled with a sound absorbing material, the periphery of the piezoelectric ceramic plate 1 can be completely wrapped, thereby completely shielding the interference around the piezoelectric ceramic plate 1 and avoiding the phenomenon of interference during the ultrasonic sensor test.
In one embodiment, the FPC board 2 includes a first member 21 and a second member 22, the first member 21 covers the side surface of the piezoelectric ceramic sheet 1, the second member 22 covers the upper surface of the piezoelectric ceramic sheet 1, and the first member 21 and the second member 22 are integrally formed.
Referring to fig. 2, fig. 2 shows a schematic structural diagram of the FPC board 2 provided in the embodiment of the present application, as shown in fig. 2, the shape of the piezoelectric ceramic sheet 1 includes a circle, a ring, a bar, a rectangle, etc., so when the FPC board 2 wraps the piezoelectric ceramic sheet 1, the side surface of the piezoelectric ceramic sheet 1 can be seen as a square, and the upper surface of the piezoelectric ceramic sheet 1 can take different shapes (such as a circle, a ring, etc.), therefore, in this embodiment, the FPC board 2 is divided into a first component 21 and a second component 22, the first component 21 is used for covering the side surface of the piezoelectric ceramic sheet 1, the second component 22 is used for covering the upper surface of the piezoelectric ceramic sheet 1, so as to facilitate the assembly of the ultrasonic sensor by an operator.
In one embodiment, the dimensions of the first part 21 are adapted to the dimensions of the side surfaces of the piezoelectric ceramic sheet 1, so that the first part 21 is in close proximity to the piezoelectric ceramic sheet 1 and covers the side surfaces of the piezoelectric ceramic sheet 1 entirely; the dimensions of the second part 22 are adapted to the dimensions of the upper surface of the piezoelectric ceramic plate 1, so that the second part 22 is in close contact with the piezoelectric ceramic plate 1 and covers the upper surface of the piezoelectric ceramic plate 1 entirely.
The shape of the piezoelectric ceramic sheet 1 according to the above embodiment includes a circle, a ring, a bar, a rectangle, etc., so when the FPC board 2 wraps the piezoelectric ceramic sheet 1, the side surface of the piezoelectric ceramic sheet 1 can be seen to be unfolded into a square shape, and the upper surface of the piezoelectric ceramic sheet 1 can be in different shapes (such as a circle, a ring, etc.), so that the size of the first component 21 is adapted to the size of the side surface of the piezoelectric ceramic sheet 1, so that the first component 21 is closely attached to the piezoelectric ceramic sheet 1 and covers the side surface of the piezoelectric ceramic sheet 1; the size of the second component 22 is adapted to the size of the upper surface of the piezoelectric ceramic plate 1, so that the second component 22 is tightly attached to the piezoelectric ceramic plate 1 and fully covers the upper surface of the piezoelectric ceramic plate 1, thus, the interference around the piezoelectric ceramic plate 1 can be completely shielded, and finally, the anti-interference performance of the ultrasonic sensor is realized.
In one embodiment, the first member 21 has an elongated shape, and the first member 21 is provided with a lead 23 for transmitting an ultrasonic signal.
The lead 23 is a known technology for those skilled in the art, and the material of the lead is not specifically described in this embodiment, but may be gold wire, copper wire, or the like, and the present embodiment is not limited thereto. Further, the lead 23 may be provided on the second member 22 in addition to the first member 21, but the provision of the lead on the first member 21 facilitates the assembly of the ultrasonic sensor in consideration of the influence in the actual assembly process.
In one embodiment, the lead 23 is at an angle of 90 degrees to the first member 21.
Referring to fig. 1 and 4, the lead 23 disposed perpendicular to the first member 21 may be vertically erected in the housing 3 when the sound absorbing material is filled, so as to prevent the lead 23 from being excessively pressed by the sound absorbing material, resulting in a blockage of transmission of the ultrasonic signal.
In one embodiment, a portion of the leads 23 are located outside the opening in the top end of the housing 3.
As shown in fig. 4, as is well known to those skilled in the art, the ultrasonic sensor needs to be connected to the terminal device to analyze the ultrasonic signal produced thereby, and thus, the lead 23 is extended outside the housing 3 to facilitate connection to the terminal device.
In one embodiment, the surface of the first part 21 covering the side surface of the piezoelectric ceramic sheet 1 is provided with a negative electrode pad, the negative electrode pad is connected with the negative electrode of the piezoelectric ceramic sheet 1, and the surface of the second part 22 covering the upper surface of the piezoelectric ceramic sheet 1 is provided with a positive electrode pad, and the positive electrode pad is connected with the positive electrode of the piezoelectric ceramic sheet 1.
In this embodiment, the arrangement of the positive and negative electrode pads of the FPC board 2 and the connection thereof with the positive and negative electrodes of the piezoelectric ceramic sheet 1 are common knowledge of those skilled in the art, and the present embodiment is not specifically described.
In one embodiment, the angle between the first part 21 and the second part 22 is 90 degrees.
Referring to fig. 3, after the first component 21 and the second component 22 are integrally formed, an included angle between the two components is 90 degrees, so as to better complete the surrounding wrapping of the piezoelectric ceramic sheet 1 and prevent the interference phenomenon during the ultrasonic sensor test.
In one embodiment, the ultrasonic sensor further comprises a matching layer 4, one surface of the matching layer 4 is adhered to the lower surface of the piezoelectric ceramic plate 1, and the other surface of the matching layer 4 is located on the bottom surface of the housing 3. The matching layer 4 is arranged to facilitate propagation of the ultrasonic wave.
The foregoing description of the embodiments has been provided for the purpose of illustrating the general principles of the utility model, and is not meant to limit the scope of the utility model, but to limit the utility model to the particular embodiments, and any modifications, equivalents, improvements, etc. that fall within the spirit and principles of the utility model are intended to be included within the scope of the utility model.
Claims (9)
1. The ultrasonic sensor is characterized by comprising a piezoelectric ceramic plate, an FPC circuit board and a shell with an opening at the top end;
the FPC circuit board covers in the side surface and the upper surface of piezoceramics piece through the mode of welding, the casing is used for assembling and covers the piezoceramics piece of FPC circuit board, just piezoceramics piece's lower surface is located on the bottom surface of casing the casing with cover has sound absorbing material between the piezoceramics piece of FPC circuit board.
2. The ultrasonic sensor of claim 1, wherein the FPC circuit board includes a first member and a second member, the first member covers a side surface of the piezoelectric ceramic sheet, the second member covers an upper surface of the piezoelectric ceramic sheet, and the first member and the second member are integrally molded.
3. The ultrasonic sensor of claim 2, wherein the dimensions of the first component are adapted to the dimensions of the side surfaces of the piezoelectric ceramic sheet such that the first component is in close proximity to the piezoelectric ceramic sheet and covers the side surfaces of the piezoelectric ceramic sheet entirely; the size of the second component is matched with the size of the upper surface of the piezoelectric ceramic plate, so that the second component is tightly attached to the piezoelectric ceramic plate and covers the upper surface of the piezoelectric ceramic plate.
4. The ultrasonic sensor of claim 2, wherein the first member is elongated, and the first member is provided with leads for transmitting ultrasonic signals.
5. The ultrasonic sensor of claim 4, wherein the lead is at an angle of 90 degrees to the first member.
6. The ultrasonic sensor of claim 4, wherein a portion of the leads are located outside the opening in the top end of the housing.
7. The ultrasonic sensor according to claim 2, wherein a negative electrode pad is provided on a surface of the first member covering the side surface of the piezoelectric ceramic sheet, the negative electrode pad is connected to a negative electrode of the piezoelectric ceramic sheet, and a positive electrode pad is provided on a surface of the second member covering the upper surface of the piezoelectric ceramic sheet, the positive electrode pad is connected to a positive electrode of the piezoelectric ceramic sheet.
8. The ultrasonic sensor of claim 2, wherein the angle between the first and second members is 90 degrees.
9. The ultrasonic sensor of claim 1, further comprising a matching layer, one face of the matching layer being bonded to the lower surface of the piezoelectric ceramic sheet, the other face of the matching layer being located on the bottom face of the housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321931039.6U CN220322396U (en) | 2023-07-21 | 2023-07-21 | Ultrasonic sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321931039.6U CN220322396U (en) | 2023-07-21 | 2023-07-21 | Ultrasonic sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220322396U true CN220322396U (en) | 2024-01-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321931039.6U Active CN220322396U (en) | 2023-07-21 | 2023-07-21 | Ultrasonic sensor |
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| CN (1) | CN220322396U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117664203A (en) * | 2024-01-31 | 2024-03-08 | 成都楷模电子科技有限公司 | Novel high-frequency ultrasonic sensor |
| CN117664203B (en) * | 2024-01-31 | 2024-04-26 | 成都楷模电子科技有限公司 | High-frequency ultrasonic sensor |
-
2023
- 2023-07-21 CN CN202321931039.6U patent/CN220322396U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117664203A (en) * | 2024-01-31 | 2024-03-08 | 成都楷模电子科技有限公司 | Novel high-frequency ultrasonic sensor |
| CN117664203B (en) * | 2024-01-31 | 2024-04-26 | 成都楷模电子科技有限公司 | High-frequency ultrasonic sensor |
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