CN108435521A - A kind of ultrasonic sensor - Google Patents

A kind of ultrasonic sensor Download PDF

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Publication number
CN108435521A
CN108435521A CN201810202968.0A CN201810202968A CN108435521A CN 108435521 A CN108435521 A CN 108435521A CN 201810202968 A CN201810202968 A CN 201810202968A CN 108435521 A CN108435521 A CN 108435521A
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CN
China
Prior art keywords
support portion
piezoelectric ceramic
ceramic piece
piece
ultrasonic sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201810202968.0A
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Chinese (zh)
Inventor
刘欢
钟海
梁锭舒
钱常德
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhaoqing Aodiwei Sensing Technology Co ltd
Original Assignee
Zhaoqing Aodiwei Sensing Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zhaoqing Aodiwei Sensing Technology Co ltd filed Critical Zhaoqing Aodiwei Sensing Technology Co ltd
Priority to CN201810202968.0A priority Critical patent/CN108435521A/en
Publication of CN108435521A publication Critical patent/CN108435521A/en
Pending legal-status Critical Current

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B06GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06BMETHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction

Abstract

The invention discloses a kind of ultrasonic sensor, including shell, fixation kit and piezoelectric ceramic piece, cavity is equipped in the one end open of the shell, and the shell, the piezoelectric ceramic piece is set on the bottom of the cavity;The fixation kit includes fixing piece and support element, the fixing piece is sealedly connected on the open end of the shell, one end of the support element is connected to the fixing piece towards on the end surface of the piezoelectric ceramic piece, and the other end of the support element is resisted against the piezoelectric ceramics on piece;Open up fluted in the support element, the groove is between the fixing piece and the piezoelectric ceramic piece.The ultrasonic sensor of the present invention effectively can simplify technique and realize the free vibration of piezoelectric ceramic piece, to improve sensitivity.

Description

A kind of ultrasonic sensor
Technical field
The present invention relates to ultrasonic technology fields, more particularly, to a kind of ultrasonic sensor.
Background technology
Currently, ultrasonic sensor is the sensor developed using the characteristic of ultrasonic wave, by being mounted on shell Interior piezoelectric ceramic vibration realizes piezoelectricity conversion function, mode of oscillation and Oscillation Amplitude relationship of the piezoelectric ceramics inside shell To entire sensor electrical property convert validity, the load of piezoelectric ceramics is fewer, vibration it is freer, internal consumption it is useless Work(is fewer, and the sensitivity of sensor is bigger.
In the prior art, ultrasonic sensor is generally made using piezoelectric ceramic piece, wherein the one of piezoelectric ceramic piece Face needs to be attached in shell by patch glue, and another side then adds the acoustical cotton of softening, then adds embedding glue to reach To protection, waterproof and shockproof purpose.But the dosage of patch glue is difficult to control, it is easy to be overflowed and is bonded in piezoelectricity pottery On tile surface, lead to the vibration for fettering piezoelectric ceramics;And the addition of acoustical cotton then can make technique increasingly complex, while embedding Glue can become the load for influencing piezoelectric ceramic piece vibration, and the sensitivity of ultrasonic sensor product is caused to decline.
Invention content
An embodiment of the present invention provides a kind of ultrasonic sensors, to solve existing ultrasonic sensor due in shell It is added to patch glue, embedding glue, acoustical cotton to make complex process and influence the vibration of piezoelectric ceramic piece, cause under sensitivity The technical issues of drop, to effectively simplify technique and realize the free vibration of piezoelectric ceramic piece, and then improves supersonic sensing The sensitivity of device.
In order to solve identical technical problem, the present invention provides a kind of ultrasonic sensor, including shell, fixation kit and Cavity is equipped in piezoelectric ceramic piece, the one end open of the shell, and the shell, the piezoelectric ceramic piece is set to the cavity Bottom on;The fixation kit includes fixing piece and support element, and the fixing piece is sealedly connected on the open end of the shell On, one end of the support element is connected to the fixing piece towards on the end surface of the piezoelectric ceramic piece, the support element The other end be resisted against the piezoelectric ceramics on piece;Open up fluted in the support element, the groove is located at the fixing piece Between the piezoelectric ceramic piece.
Preferably, the ultrasonic sensor further includes control circuit board and signal wire, is set in the fixing piece There are placed cavity and signal line passage, the signal line passage to be connected to the placed cavity;
The control circuit board is set in the placed cavity, and the signal wire is set in the signal line passage, the control One end of circuit board processed is electrically connected with the signal wire, and the other end of the control circuit board passes through conducting wire and the piezoelectric ceramics Piece is electrically connected.
Preferably, the other end of the support element extends along the side wall of the piezoelectric ceramic piece and forms the first peace The outer side wall surface of tankage, the piezoelectric ceramic piece is resisted against in the interior side-wall surface of first mounting groove;
The area of section of first mounting groove be more than the groove area of section, and first mounting groove with it is described It is formed with first step portion before groove, is resisted against at the top of the piezoelectric ceramic piece in the first step portion, the piezoelectricity The bottom of potsherd is resisted against on the bottom of the cavity.
Preferably, the cross section of the support element, shape and the piezoelectricity of first mounting groove are made pottery The shape of tile is adapted, and the other end end edge of the support element is equipped with several solder joint slots.
Preferably, the support element includes the first support portion and the second support portion being oppositely arranged;
One end of first support portion is fixed on the fixing piece towards on the end surface of the piezoelectric ceramic piece, institute The other end for stating the first support portion is resisted against on the top surface of the piezoelectric ceramic piece, and one end of second support portion is fixed On end surface of the fixing piece towards the piezoelectric ceramic piece, the other end of second support portion is resisted against the pressure On the top surface of electroceramics piece, the bottom of the piezoelectric ceramic piece is resisted against on the bottom of the cavity.
Preferably, the support element further includes third support portion and the 4th support portion, the third support portion and 4th support portion is molded to the central concave of the groove, to be formed for conducting wire to be fixed on the piezoelectric ceramic piece Top surface on bond pad locations;
One end of the third support portion is fixed on the fixing piece towards on the end surface of the piezoelectric ceramic piece, institute The other end for stating third support portion is resisted against on the top surface of the piezoelectric ceramic piece, and one end of the 4th support portion is fixed On end surface of the fixing piece towards the piezoelectric ceramic piece, the other end of the 4th support portion is resisted against the pressure On the top surface of electroceramics piece;
The side of first support portion is connect by the third support portion with the side of second support portion, described The other side of first support portion is connect by the 4th support portion with the other side of second support portion.
Preferably, first support portion, second support portion, the third support portion, 4th described The section of support part is arc-shaped.
Preferably, the central axis of the piezoelectric ceramic piece is overlapped with the central axis of the support element, and institute State the height all same of the first support portion, second support portion, the third support portion, the 4th support portion.
Preferably, the other end of the other end of first support portion and second support portion is along the pressure The side wall of electroceramics piece extends and is formed the second mounting groove, and the outer side wall surface of the piezoelectric ceramic piece is resisted against second peace In the interior side-wall surface of tankage;
The area of section of second mounting groove be more than the groove area of section, and second mounting groove with it is described It is formed with second step portion before groove, is resisted against at the top of the piezoelectric ceramic piece in the second step portion, the piezoelectricity The bottom of potsherd is resisted against on the bottom of the cavity.
Preferably, the other end end of the other end end edge of first support portion and second support portion Portion edge is equipped with several solder joint slots.
Compared with the prior art, the advantageous effect of the embodiment of the present invention is, the piezoelectricity is made pottery by the support element Tile is fixed on the bottom of the cavity, without using patch glue and embedding glue, so as to avoid piezoelectric ceramic piece by It overflows and is bonded on piezoelectric ceramic piece surface in patch glue, lead to the vibration for fettering piezoelectric ceramics;Using sealed connection side Formula, by the fixing piece be mounted on the shell open end on, can completely isolated embedding and/or the infiltration of patch glue, And the position of most enlivening that the piezoelectric ceramic piece vibrates is isolated with external environment, so that the top of the piezoelectric ceramic piece It is unfettered, to realize free vibration, and then improve the sensitivity of the ultrasonic sensor;The supports support described Piezoelectric ceramic piece, and the shell has defencive function, to be conducive to promote the compression strength of ultrasonic sensor;Meanwhile Open up fluted in the support element, the groove is between the fixing piece and the piezoelectric ceramic piece, the groove energy The contact range for enough reducing the support element and the piezoelectric ceramic piece, to reduce the binding force of the piezoelectric ceramic piece, And then improve the sensitivity of the ultrasonic sensor;In addition, in the cavity without using the acoustical cotton of softening, to have Technique is simplified to effect, thereby reduces cost of manufacture.
Description of the drawings
Fig. 1 is the sectional view of the first embodiment of ultrasonic sensor of the present invention;
Fig. 2 a~2d illustrate the assembling structure of fixation kit and piezoelectric ceramic piece in first embodiment in Fig. 1, wherein Fig. 2 a are the sectional views of Fig. 2 c, and Fig. 2 b are the sectional views of Fig. 2 d;
Fig. 3 is the sectional view of the second embodiment of ultrasonic sensor of the present invention;
Fig. 4 a~4d illustrate the assembling structure of fixation kit and piezoelectric ceramic piece in first embodiment in Fig. 3, wherein Fig. 4 a are the sectional views of Fig. 4 c, and Fig. 4 b are the sectional views of Fig. 4 d;
Fig. 5 is the sectional view of the third embodiment of ultrasonic sensor of the present invention;
Fig. 6 a~6d illustrate the assembling structure of fixation kit and piezoelectric ceramic piece in first embodiment in Fig. 5, wherein Fig. 6 a are the sectional views of Fig. 6 c, and Fig. 6 b are the sectional views of Fig. 6 d;
Wherein, 1, shell;2, fixation kit;21, support element;211, first step portion;212, second step portion;213, One support portion;214, the second support portion;215, third support portion;22, fixing piece;23, groove;3, piezoelectric ceramic piece;4, signal Line.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete Site preparation describes, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on Embodiment in the present invention, those of ordinary skill in the art are obtained every other without creative efforts Embodiment shall fall within the protection scope of the present invention.
Referring to Fig. 1, the preferred embodiment of the present invention provides a kind of ultrasonic sensor, including shell 1,2 and of fixation kit Piezoelectric ceramic piece 3;The one end open of the shell 1, and cavity is equipped in the shell 1, the piezoelectric ceramic piece 3 is set to described On the bottom of cavity;The fixation kit 2 includes fixing piece 22 and support element 21, and the fixing piece 22 is sealedly connected on the shell On the open end of body 1, one end of the support element 21 is connected to one end table of the fixing piece 22 towards the piezoelectric ceramic piece 3 On face, the other end of the support element 21 is resisted against on the piezoelectric ceramic piece 3;Fluted 23 are opened up in the support element 21, The groove 23 is between the fixing piece 22 and the piezoelectric ceramic piece 3.
In embodiments of the present invention, the piezoelectric ceramic piece 3 is fixed on by 1 cavity of the shell by the support element 21 On interior bottom, without using patch glue and embedding glue, so as to avoid piezoelectric ceramic piece 3 since patch glue overflows simultaneously It is bonded on 3 surface of piezoelectric ceramic piece, leads to the vibration for fettering piezoelectric ceramics;Using the mode of sealed connection, by the fixing piece 22 are mounted on the open end of the shell 1, can completely isolated embedding and/or the infiltration of patch glue, and by the piezoelectricity The position of most enlivening that potsherd 3 vibrates is isolated with external environment, so that the top of the piezoelectric ceramic piece 3 is unfettered, To realize free vibration, and then improve the sensitivity of the ultrasonic sensor;The support element 21 supports the piezoelectricity pottery Tile 3, and the shell 1 has defencive function, to be conducive to promote the compression strength of ultrasonic sensor;Meanwhile it is described Fluted 23 are opened up in support element 21, the groove 23 is described recessed between the fixing piece 22 and the piezoelectric ceramic piece 3 Slot 23 can reduce the contact range of the support element 21 and the piezoelectric ceramic piece 3, to reduce the piezoelectric ceramic piece 3 Binding force, and then improve the sensitivity of the ultrasonic sensor;In addition, without using the suction of softening in the cavity Sound cotton thereby reduces cost of manufacture to effectively simplify technique.
In the present embodiment, it should be noted that the piezoelectric ceramic piece 3 is the high frequency oscillator of ultrasonic sensor, because The vibration source of high-frequency vibration occurs as the ultrasonic sensor for this.The ultrasonic sensor being made of the piezoelectric ceramic piece 3 It is bilateral transducer, the piezoelectric ceramic piece 3 can convert electric energy into mechanical oscillation and generate ultrasonic wave, while the piezoelectricity It when potsherd 3 receives ultrasonic wave, can also be transformed into electric energy, be applicable to the purposes such as ranging, remote control, antitheft;Such as Reversing DAS (Driver Assistant System), medical system etc..Ultrasonic sensor can utilize electric signal to drive the piezoelectric ceramic piece 3, described Piezoelectric ceramic piece 3 vibrates under the excitation of voltage, and the vibrations of the shell contacted therewith 1 is driven to send out ultrasonic wave.Due to super Sound wave good directionality can be encountered interface and will produce notable back wave with direction propagation, and by receiving reflected ultrasound Ultrasonic signal is converted into electric signal and amplifies filtering, be converted into digital signal later, by the number with range information by wave Signal transmission gives the control circuit board, to complete ranging process.In addition, the material of the shell 1 includes but not limited to gold Belong to material other materials.
In embodiments of the present invention, the ultrasonic sensor further includes control circuit board (not shown) and signal wire 4, institute It states and is equipped with placed cavity and signal line passage in fixing piece 22, the signal line passage is connected to the placed cavity;The control electricity Road plate is set in the placed cavity, and the signal wire 4 is set in the signal line passage, one end of the control circuit board and institute The electrical connection of signal wire 4 is stated, the other end of the control circuit board is electrically connected by conducting wire with the piezoelectric ceramic piece 3.It will be described Control circuit board is placed in the placed cavity, when the fixing piece 22 is metal material, shielding can be played to circuit and is made With reducing extraneous interference, improve the to-noise ratio of signal, while reducing cost.
In the present embodiment, it should be noted that the piezoelectric ceramic piece 3 as inverting element and with the control circuit Plate is electrically connected, and the piezoelectric ceramic piece 3 can be controlled by the control circuit board and sends ultrasonic signal or acquisition ultrasonic wave letter Number, signal parameter corresponding with the signal that the piezoelectric ceramic piece 3 acquires is obtained, and by the control circuit board to the signal Parameter is handled, and is directly generated measured.Signal without acquiring ultrasonic sensor carries out long distance transmission, saves and passes Error caused by the propagation delay of signal can be reduced while defeated line, can effectively avoid the destabilizing factor of external environment to letter Number propagate influence, to improve the reliability and measurement accuracy of ultrasonic sensor.
It should be understood that the control circuit board uses flexible PCB, since flexible PCB has larger pad, To be easy to the connection of electric wire and the piezoelectric ceramic piece 3, and it can effectively simplify and conducting wire is fixed on the piezoelectric ceramics Technique on the end surface of piece 3.
Please refer to Fig.1 with Fig. 2 a~2d, introduce in detail below the present invention ultrasonic sensor first embodiment.
In the present embodiment, the other end of the support element 21 extends along the side wall of the piezoelectric ceramic piece 3 and forms The outer side wall surface of one mounting groove, the piezoelectric ceramic piece 3 is resisted against in the interior side-wall surface of first mounting groove;Described The area of section of one mounting groove is more than the area of section of the groove 23, and first mounting groove and shape before the groove 23 At thering is first step portion 211, the top of the piezoelectric ceramic piece 3 to be resisted against in the first step portion 211, the piezoelectric ceramics The bottom of piece 3 is resisted against on the bottom in 1 cavity of the shell.
In the present embodiment, the structure in a ring of the piezoelectric ceramic piece 3, shape and the piezoelectricity of first mounting groove The shape of potsherd 3 is adapted, therefore, can by 3 part of the piezoelectric ceramic piece it is accommodating in first mounting groove so that institute It states between the bottom that piezoelectric ceramic piece 3 is fixed in 1 cavity of the first step portion 211 and the shell.The groove 23 In the top of the piezoelectric ceramic piece 3, to effectively reduce contact model of the fixing piece 22 with the piezoelectric ceramic piece 3 It encloses, thereby reduces 3 binding force of piezoelectric ceramic piece, greatly improve the sensitivity of the ultrasonic sensor.
It should be understood that the outer side wall surface of the piezoelectric ceramic piece 3 is resisted against the madial wall table of first mounting groove On face, so that the piezoelectric ceramic piece 3 is adjacent in first mounting groove, to prevent the piezoelectric ceramic piece 3 from shaking It is dynamic, and then improve the stability that the piezoelectric ceramic piece 3 is mounted in shell 1.
Further, the cross section of the support element 21, shape and the piezoelectric ceramics of first mounting groove The shape of piece 3 is adapted, and the other end end edge of the support element 21 is equipped with several solder joint slots, consequently facilitating by institute It states piezoelectric ceramic piece 3 to be fixed on the support element 21, and then is convenient for when assembling the ultrasonic sensor, described fixed group Part 2 and the piezoelectric ceramic piece 3 are fit directly into the cavity.
Fig. 3 and Fig. 4 a~4d are please referred to, introduce the second embodiment of the ultrasonic sensor of the present invention in detail below.
In the present embodiment, the support element 21 includes the first support portion 213 and the second support portion 214 being oppositely arranged; One end of first support portion 213 is fixed on the fixing piece 22 towards on the end surface of the piezoelectric ceramic piece 3, described The other end of first support portion 213 is resisted against on the top of the piezoelectric ceramic piece 3, and one end of second support portion 214 is solid The fixing piece 22 is scheduled on towards on the end surface of the piezoelectric ceramic piece 3, the other end of second support portion 214 against On the top surface of the piezoelectric ceramic piece 3, the bottom of the piezoelectric ceramic piece 3 is resisted against the cavity of the shell 1 Bottom on.First support portion 213 and second support portion 214 have supporting role to the piezoelectric ceramics, can be with The section of first support portion 213 and second support portion 214 that understand is arc-shaped, first support portion 213 Other end end edge is equipped with several solder joint slots, consequently facilitating the piezoelectric ceramic piece 3 is fixed on the support element 21 On, and then convenient for the ultrasonic sensor in assembly, the fixation kit 2 and the piezoelectric ceramic piece 3 are fit directly into In 1 cavity of the shell.
Further, the support element 21 further includes third support portion 215 and the 4th support portion (not shown), the third Support portion 215 and the 4th support portion are molded to the central concave of the groove 23, to be formed for conducting wire to be fixed on Bond pad locations on the top surface of the piezoelectric ceramic piece 3;One end of the third support portion 215 is fixed on the fixing piece 22 towards on the end surface of the piezoelectric ceramic piece 3, and the other end of the third support portion 215 is resisted against the piezoelectric ceramics On the top surface of piece 3, one end of the 4th support portion is fixed on the fixing piece 22 towards the one of the piezoelectric ceramic piece 3 On end surfaces, the other end of the 4th support portion is resisted against on the top surface of the piezoelectric ceramic piece 3;First support The side in portion 213 is connect by the third support portion 215 with the side of second support portion 214, first support portion 213 other side is connect by the 4th support portion with the other side of second support portion 214.The third support portion 215 and the 4th support portion be the piezoelectric ceramic piece 3 provide bond pad locations, in order to the electric wire of the control circuit board It is welded on the top surface of the piezoelectric ceramic piece 3, to realize the normal function of the piezoelectric ceramic piece 3.
In embodiments of the present invention, it should be noted that first support portion 213, second support portion 214, institute It is arc-shaped to state third support portion 215, the section of the 4th support portion.
Further, the central axis of the piezoelectric ceramic piece 3 is overlapped with the central axis of the support element 21, and institute It is homogeneous to state the first support portion 213, second support portion 214, the third support portion 215, the height of the 4th support portion Together, so that the fixation kit 2 and the piezoelectric ceramic piece 3 after assembling, ensure that 3 plane of the piezoelectric ceramic piece maintains an equal level, connects It touches, and the intermediate position of the piezoelectric ceramic piece 3 is isolated by the groove 23.
It should be understood that the groove 23 is located at the top of the piezoelectric ceramic piece 3, it is described solid to effectively reduce The contact range for determining part 22 and the piezoelectric ceramic piece 3 thereby reduces the binding force of piezoelectric ceramic piece 3, greatly improves described The sensitivity of ultrasonic sensor.
Fig. 5 and Fig. 6 a~6d are please referred to, introduce the third embodiment of the ultrasonic sensor of the present invention in detail below.
In the present embodiment, the equal edge of the other end of the other end of first support portion 213 and second support portion 214 The side wall of the piezoelectric ceramic piece 3 extends and is formed the second mounting groove, and the outer side wall surface of the piezoelectric ceramic piece 3 is resisted against institute In the interior side-wall surface for stating the second mounting groove;The area of section of second mounting groove is more than the area of section of the groove 23, It is formed with second step portion 212 before second mounting groove and the groove 23, the top of the piezoelectric ceramic piece 3 is resisted against In the second step portion 212, the bottom of the piezoelectric ceramic piece 3 is resisted against on the bottom in 1 cavity of the shell.
Compared to second embodiment, the other end of first support portion 213 of present embodiment and second described The other end of support part 214 extends along the side wall of the piezoelectric ceramic piece 3 and is formed the second mounting groove, can be by the piezoelectric ceramics 3 part of piece it is accommodating in second mounting groove so that the piezoelectric ceramic piece 3 is fixed on the second step portion 212 and institute Between the bottom of the cavity for stating shell 1.The groove 23 is located at the top of the piezoelectric ceramic piece 3, to effectively subtract The contact range for having lacked the fixing piece 22 and the piezoelectric ceramic piece 3 thereby reduces 3 binding force of piezoelectric ceramic piece, significantly Improve the sensitivity of the ultrasonic sensor.
Further, the other end of the other end end edge of first support portion 213 and second support portion 214 End edge is equipped with several solder joint slots.The third support portion 215 and the 4th support portion are the piezoelectric ceramic piece 3 Provide bond pad locations, in order to the control circuit board wire welding on the surface of the piezoelectric ceramic piece 3, to real The normal function of the existing piezoelectric ceramic piece 3.
To sum up, the present invention provides a kind of ultrasonic sensors, including shell 1, fixation kit 2 and piezoelectric ceramic piece 3;Institute The one end open of shell 1 is stated, and is equipped with cavity in the shell 1, the piezoelectric ceramic piece 3 is set on the bottom of the cavity; The fixation kit 2 includes fixing piece 22 and support element 21, and the fixing piece 22 is mounted on the open end of the shell 1, institute The one end for stating support element 21 is connected to the fixing piece 22 towards on the end surface of the piezoelectric ceramic piece 3, the support element 21 other end is resisted against on the piezoelectric ceramic piece 3;Fluted 23 are opened up in the support element 21, the groove 23 is located at institute It states between fixing piece 22 and the piezoelectric ceramic piece 3.
Middle ultrasonic sensor is due to being added to patch glue, embedding glue, acoustical cotton compared with the prior art in shell 1 So that complex process and influencing the vibration of piezoelectric ceramic piece 3, sensitivity is caused to decline, the present invention has the advantages that:
(1) piezoelectric ceramic piece 3 is fixed on the bottom in 1 cavity of the shell by the support element 21, nothing Patch glue and embedding glue need to be used, so as to avoid piezoelectric ceramic piece 3 since patch glue overflows and is bonded in piezoelectricity pottery On 3 surface of tile, lead to the vibration for fettering piezoelectric ceramics;
(2) sealed connection mode is used, the fixing piece 22 is mounted on the open end of the shell 1, it can be complete Be isolated embedding and/or the infiltration of patch glue, and by the piezoelectric ceramic piece 3 vibrate most enliven position and external environment every From so that the top of the piezoelectric ceramic piece 3 is unfettered, to realize free vibration, and then the raising ultrasonic wave passes The sensitivity of sensor;
(3) support element 21 supports the piezoelectric ceramic piece 3, and the shell 1 has defencive function, to advantageous In the compression strength for promoting ultrasonic sensor;
(4) simultaneously, fluted 23 are opened up in the support element 21, the groove 23 is located at the fixing piece 22 and the pressure Between electroceramics piece 3, the groove 23 can reduce the contact range of the support element 21 and the piezoelectric ceramic piece 3, to The binding force of the piezoelectric ceramic piece 3 is reduced, and then improves the sensitivity of the ultrasonic sensor;
(5) it in addition, without using the acoustical cotton of softening in the cavity, to effectively simplify technique, and then drops Low cost of manufacture;
It (6), need to be in the upper of piezoelectric ceramic piece 3 after piezoelectric ceramic piece 3 is attached on protective shell due in the prior art Square slot milling, to eliminate the excessive constraint to sheet metal by air insulated, but since the top of piezoelectric ceramic piece 3 is without support Part 21 causes the anti-pressure ability of product to be determined completely by the bonding force of the intensity of shell 1 and patch glue, is unfavorable for ultrasound in this way The resistance to compression reliability assessment of wave sensor product and promotion.Ultrasonic sensor provided by the invention passes through the fixation kit 2 It not only fully ensured that the free vibration of the piezoelectric ceramic piece 3, promoted product sensitivity, but also considerably increased pressure resistance Degree;
In this way, ultrasonic sensor provided by the invention has prevented the influence because of Heraeus hypervolia, avoid simultaneously Flexible glue substance, the fixation kit 2 of the top of the piezoelectric ceramic piece 3 is used to have above the piezoelectric ceramic piece 3 Effect is fixed and supported, to the compactness being effectively protected between the piezoelectric ceramic piece 3 and the bottom of the cavity, originally Invention effectively can simplify technique and realize the free vibration of piezoelectric ceramic piece 3, to improve ultrasonic sensor sensibility.
The above is the preferred embodiment of the present invention, it is noted that for those skilled in the art For, various improvements and modifications may be made without departing from the principle of the present invention, these improvements and modifications are also considered as Protection scope of the present invention.

Claims (10)

1. a kind of ultrasonic sensor, which is characterized in that including shell, fixation kit and piezoelectric ceramic piece, the one of the shell End opening, and cavity is equipped in the shell, the piezoelectric ceramic piece is set on the bottom of the cavity;The fixation kit packet Fixing piece and support element are included, the fixing piece is sealedly connected on the open end of the shell, one end connection of the support element On end surface of the fixing piece towards the piezoelectric ceramic piece, the other end of the support element is resisted against the piezoelectricity pottery On tile;Open up fluted in the support element, the groove is between the fixing piece and the piezoelectric ceramic piece.
2. ultrasonic sensor structure as described in claim 1, which is characterized in that the ultrasonic sensor further includes control Circuit board and signal wire, the fixing piece is interior to be equipped with placed cavity and signal line passage, the signal line passage and the placed cavity Connection;
The control circuit board is set in the placed cavity, and the signal wire is set in the signal line passage, the control electricity One end of road plate is electrically connected with the signal wire, and the other end of the control circuit board passes through conducting wire and piezoelectric ceramic piece electricity Connection.
3. ultrasonic sensor as claimed in claim 1 or 2, which is characterized in that the other end of the support element is along the pressure The side wall of electroceramics piece extends and is formed the first mounting groove, and the outer side wall surface of the piezoelectric ceramic piece is resisted against first peace In the interior side-wall surface of tankage;
The area of section of first mounting groove is more than the area of section of the groove, and first mounting groove and the groove It is formed with first step portion before, is resisted against at the top of the piezoelectric ceramic piece in the first step portion, the piezoelectric ceramics The bottom of piece is resisted against on the bottom of the cavity.
4. ultrasonic sensor as claimed in claim 3, which is characterized in that the cross section of the support element, described The shape of one mounting groove is adapted with the shape of the piezoelectric ceramic piece, and the other end end edge of the support element is equipped with Several solder joint slots.
5. ultrasonic sensor as claimed in claim 1 or 2, which is characterized in that the support element includes be oppositely arranged One support portion and the second support portion;
One end of first support portion is fixed on the fixing piece towards on the end surface of the piezoelectric ceramic piece, and described The other end of one support portion is resisted against on the top surface of the piezoelectric ceramic piece, and one end of second support portion is fixed on institute Fixing piece is stated towards on the end surface of the piezoelectric ceramic piece, the other end of second support portion is resisted against the piezoelectricity pottery On the top surface of tile, the bottom of the piezoelectric ceramic piece is resisted against on the bottom of the cavity.
6. ultrasonic sensor as claimed in claim 5, which is characterized in that the support element further includes third support portion and Four support portions, the third support portion and the 4th support portion are molded to the central concave of the groove, are used for being formed Bond pad locations conducting wire being fixed on the top surface of the piezoelectric ceramic piece;
One end of the third support portion is fixed on the fixing piece towards on the end surface of the piezoelectric ceramic piece, and described The other end of three support portions is resisted against on the top surface of the piezoelectric ceramic piece, and one end of the 4th support portion is fixed on institute Fixing piece is stated towards on the end surface of the piezoelectric ceramic piece, the other end of the 4th support portion is resisted against the piezoelectricity pottery On the top surface of tile;
The side of first support portion is connect by the third support portion with the side of second support portion, and described first The other side of support portion is connect by the 4th support portion with the other side of second support portion.
7. ultrasonic sensor as claimed in claim 6, which is characterized in that first support portion, second support portion, The third support portion, the section of the 4th support portion are arc-shaped.
8. ultrasonic sensor as claimed in claim 6, which is characterized in that the central axis of the piezoelectric ceramic piece with it is described The central axis of support element overlaps, and first support portion, second support portion, the third support portion, the described 4th The height all same of support portion.
9. such as claim 6~8 any one of them ultrasonic sensor, which is characterized in that first support portion it is another The other end of end and second support portion extends along the side wall of the piezoelectric ceramic piece and is formed the second mounting groove, the pressure The outer side wall surface of electroceramics piece is resisted against in the interior side-wall surface of second mounting groove;
The area of section of second mounting groove is more than the area of section of the groove, and second mounting groove and the groove It is formed with second step portion before, is resisted against at the top of the piezoelectric ceramic piece in the second step portion, the piezoelectric ceramics The bottom of piece is resisted against on the bottom of the cavity.
10. ultrasonic sensor as claimed in claim 9, which is characterized in that the other end end edge of first support portion The other end end edge of edge and second support portion is equipped with several solder joint slots.
CN201810202968.0A 2018-03-12 2018-03-12 A kind of ultrasonic sensor Pending CN108435521A (en)

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Publication number Priority date Publication date Assignee Title
CN108680211A (en) * 2018-08-31 2018-10-19 四川菲罗米特仪表有限公司 A kind of gas ultrasonic flow sensor
CN110948072A (en) * 2019-11-25 2020-04-03 广东奥迪威传感科技股份有限公司 Production process of closed ultrasonic sensor
CN111054615A (en) * 2019-11-22 2020-04-24 武汉大学 MEMS piezoelectric ultrasonic transducer with horn structure
CN112044668A (en) * 2020-09-03 2020-12-08 桐乡清锋科技有限公司 Leadless piezoelectric atomization element and vibrating sieve hole type atomizer
CN113219649A (en) * 2021-04-30 2021-08-06 哈尔滨芯明天科技有限公司 High-reliability piezoelectric deflection mirror for aerospace application
CN113995476A (en) * 2021-12-30 2022-02-01 厚凯(北京)医疗科技有限公司 Ultrasonic knife, ultrasonic knife handle and handle assembly
CN115007429A (en) * 2022-04-14 2022-09-06 威海市天罡仪表股份有限公司 Transducer for micro-power ultrasonic instrument and preparation method thereof

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5495766A (en) * 1993-09-28 1996-03-05 Murata Manufacturing Co., Ltd. Ultrasonic sensor
US20120187801A1 (en) * 2011-01-24 2012-07-26 Yasuhide Matsuo Piezoelectric sensor
CN203657858U (en) * 2013-12-06 2014-06-18 宁波水表股份有限公司 Ultrasonic water meter transducer
CN203691628U (en) * 2013-12-30 2014-07-02 广州市番禺奥迪威电子有限公司 Open type ultrasonic sensor
CN104225811A (en) * 2014-09-17 2014-12-24 深圳市普罗惠仁医学科技有限公司 Ultrasonic focusing transducer and ultrasonic focusing treatment head
CN104535988A (en) * 2014-12-05 2015-04-22 常州波速传感器有限公司 Ultrasonic sensor
CN104640036A (en) * 2013-11-06 2015-05-20 西安北斗星数码信息股份有限公司 Ultrasonic wave sensor

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5495766A (en) * 1993-09-28 1996-03-05 Murata Manufacturing Co., Ltd. Ultrasonic sensor
US20120187801A1 (en) * 2011-01-24 2012-07-26 Yasuhide Matsuo Piezoelectric sensor
CN104640036A (en) * 2013-11-06 2015-05-20 西安北斗星数码信息股份有限公司 Ultrasonic wave sensor
CN203657858U (en) * 2013-12-06 2014-06-18 宁波水表股份有限公司 Ultrasonic water meter transducer
CN203691628U (en) * 2013-12-30 2014-07-02 广州市番禺奥迪威电子有限公司 Open type ultrasonic sensor
CN104225811A (en) * 2014-09-17 2014-12-24 深圳市普罗惠仁医学科技有限公司 Ultrasonic focusing transducer and ultrasonic focusing treatment head
WO2016041320A1 (en) * 2014-09-17 2016-03-24 深圳市普罗惠仁医学科技有限公司 Ultrasound focusing transducer and ultrasound focusing treatment head
CN104535988A (en) * 2014-12-05 2015-04-22 常州波速传感器有限公司 Ultrasonic sensor

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108680211A (en) * 2018-08-31 2018-10-19 四川菲罗米特仪表有限公司 A kind of gas ultrasonic flow sensor
CN111054615A (en) * 2019-11-22 2020-04-24 武汉大学 MEMS piezoelectric ultrasonic transducer with horn structure
CN111054615B (en) * 2019-11-22 2021-02-02 武汉大学 MEMS piezoelectric ultrasonic transducer with horn structure
CN110948072A (en) * 2019-11-25 2020-04-03 广东奥迪威传感科技股份有限公司 Production process of closed ultrasonic sensor
CN110948072B (en) * 2019-11-25 2021-10-19 广东奥迪威传感科技股份有限公司 Production process of closed ultrasonic sensor
CN112044668A (en) * 2020-09-03 2020-12-08 桐乡清锋科技有限公司 Leadless piezoelectric atomization element and vibrating sieve hole type atomizer
CN113219649A (en) * 2021-04-30 2021-08-06 哈尔滨芯明天科技有限公司 High-reliability piezoelectric deflection mirror for aerospace application
CN113219649B (en) * 2021-04-30 2022-11-22 哈尔滨芯明天科技有限公司 High-reliability piezoelectric deflection mirror for aerospace application
CN113995476A (en) * 2021-12-30 2022-02-01 厚凯(北京)医疗科技有限公司 Ultrasonic knife, ultrasonic knife handle and handle assembly
CN113995476B (en) * 2021-12-30 2022-04-08 厚凯(北京)医疗科技有限公司 Ultrasonic knife, ultrasonic knife handle and handle assembly
CN115007429A (en) * 2022-04-14 2022-09-06 威海市天罡仪表股份有限公司 Transducer for micro-power ultrasonic instrument and preparation method thereof

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