CN219420975U - Microphone and electronic device - Google Patents

Abstract

The application provides a microphone and electronic equipment, relates to the acoustic field to rely on speaker vibrations transmission sound in the correlation technique, the microphone receives the problem of leaking sound, leads to far-end user to produce the echo. The microphone comprises a first shell, wherein the first shell is provided with an accommodating cavity, and the accommodating cavity is internally provided with a microphone body and an annular first damping piece; the first damping piece is provided with a damping cavity, the microphone body is positioned in the damping cavity, and a first damping bulge is arranged on the first damping piece; the microphone body is used for receiving sound signals of the loudspeaker. This application is through including first shock attenuation piece to be provided with first shock attenuation arch on first shock attenuation piece, can change the area of contact between first shock attenuation piece and the microphone body and between first shock attenuation piece and the first shell, thereby reduce the influence of speaker to microphone vibrations, reduce the intensity of the echo signal that the microphone produced, improve the quality that the microphone picked up sound signal, and further promote electronic equipment's whole speech effect.

Description

Microphone and electronic device

Technical Field

The present application relates to the field of acoustics, and in particular, to a microphone and an electronic device.

Background

Bone conduction is a sound conduction mode, and can convert sound into mechanical vibration with different frequencies, and sound waves are transmitted through skull, bone labyrinth, inner ear lymph fluid, screw and auditory center of a person. Compared with the classical sound conduction mode of generating sound waves through a vibrating diaphragm, the bone conduction omits a plurality of sound wave transmission steps, can realize clear sound restoration in a noisy high-decibel environment, and can not influence others due to diffusion in air.

Bone conduction technology is classified into bone conduction speaker technology and bone conduction microphone technology, namely, vibrator and microphone, in which a speaker transmits sound by vibration and a microphone receives a sound signal of a user's speaking by picking up vibration of a skin position when the user speaks. When the loudspeaker and the microphone work simultaneously, sound is transmitted by means of vibration of the loudspeaker, vibration energy is transmitted along the skull by taking the joint of the vibrator and the face as a source point, and part of the vibration energy can be transmitted to the microphone through the skull and the electronic equipment structure.

However, by transmitting sound through the vibration of the speaker, there is often a leak, and the microphone receives the leak, and the far-end user generates an echo.

Disclosure of Invention

In order to solve the problem mentioned in the background art, the application provides a microphone and electronic equipment, through being provided with first shock attenuation arch on first shock attenuation piece, can change the area of contact between first shock attenuation piece and the microphone body and between first shock attenuation piece and the first shell to reduce the influence of speaker to microphone vibrations, reduce the intensity of the echo signal that the microphone produced, improve the quality that the microphone picked up sound signal, and further promote electronic equipment's whole speech effect.

In order to achieve the above object, a first aspect of embodiments of the present application provides a microphone, which is mounted on an electronic device and is used for receiving a sound signal of a speaker, including a first housing having a receiving cavity, in which a microphone body and an annular first shock absorber are received; the first damping piece is provided with a damping cavity, the microphone body is positioned in the damping cavity, and a first damping protrusion is arranged on the first damping piece; the microphone body is used for receiving the sound signal of the loudspeaker.

As described above, optionally, the first damping member includes a damping body and a damping connection part provided on the damping body; the first damping bulge is arranged on the damping body, the first shell is provided with an opening, and the damping connecting part is positioned at the opening and is connected with the edge of the opening; the damping cavity is exposed to the first housing through the opening, and the damping connection part is connected with the first housing.

As described above, optionally, the vibration absorbing body is an annular member, one end of the vibration absorbing body is a closed end, the other end of the vibration absorbing body is an open end, the vibration absorbing connection portion is disposed at the open end, and the vibration absorbing cavity is formed in the vibration absorbing body.

As described above, optionally, the first damping protrusion is disposed on an inner wall surface and/or an outer wall surface of the closed end; and/or, the first shock absorption protrusion is arranged on the inner side wall and/or the outer side wall of the shock absorption body.

As described above, optionally, the first shock-absorbing protrusion is in a shape of a thread, a ring, or a dot.

As described above, optionally, the shock absorbing body, the shock absorbing connection portion, and the first shock absorbing protrusion are integrally formed.

As with the microphone described above, optionally, the first shock absorbing member comprises a silicone member or a rubber member.

As described above, optionally, the first housing includes a housing body and a housing connection portion disposed on the housing body, the housing body has the opening, the housing connection portion is disposed at an edge of the opening, and the housing connection portion is connected with the shock absorbing connection portion.

A second aspect of embodiments of the present application provides an electronic device comprising a speaker and a microphone as described above; the speaker is configured to vibrate and propagate a sound signal, and the microphone is configured to receive the sound signal of the speaker.

The electronic device as described above, optionally, the speaker includes a second housing, in which the speaker body and the annular second damper are accommodated; the loudspeaker body is positioned in the second damping piece, and a second damping protrusion is arranged on the second damping piece; the electronic equipment further comprises a connecting support and an audio circuit board, the second shell and the first shell of the microphone are connected through the connecting support, the audio circuit board is arranged on the connecting support, and the microphone and the loudspeaker are electrically connected through the audio circuit board.

According to the microphone and the electronic equipment, the annular first damping piece is included, the microphone body is located in the first damping piece, on one hand, the first damping piece can play a role in protecting the microphone body and mainly plays a role in preventing dust, water and the like, on the other hand, the annular structure can completely wrap the microphone body, and therefore the strength of echo signals is reduced to the greatest extent; in still another aspect, after the microphone body and the first damping member are assembled, the first damping member can also play a certain role in fixing the microphone body, so that the assembly stability between the microphone body and the first damping member is improved. Through being provided with first shock attenuation arch on first shock attenuation spare, can change the area of contact between first shock attenuation spare and the microphone body and between first shock attenuation spare and the first shell to reduce the influence of speaker to microphone vibrations, reduce the intensity of the echo signal that the microphone produced, improve the quality that the microphone picked up sound signal, and further promote electronic equipment's whole speech effect.

In addition to the technical problems, technical features constituting the technical solutions, and beneficial effects caused by the technical features of the technical solutions described above in the embodiments of the present application, other technical problems that can be solved by the microphone and the electronic device provided in the embodiments of the present application, other technical features included in the technical solutions, and beneficial effects caused by the technical features will be described in further detail in the detailed description of the present application.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort to a person skilled in the art.

Fig. 1 is a schematic structural diagram of a microphone according to a first embodiment of the present disclosure;

fig. 2 is a schematic structural diagram of a first damping member of a microphone according to a first embodiment of the present disclosure;

fig. 3 is a schematic structural diagram of a first damping member of a microphone according to a first embodiment of the present disclosure;

FIG. 4 is a schematic view of a first embodiment of the present disclosure in which a first shock-absorbing protrusion is disposed on a first shock-absorbing member;

FIG. 5 is a second schematic structural view of a first shock-absorbing protrusion according to the first embodiment of the present application;

FIG. 6 is a schematic view of a third embodiment of the present disclosure in which a first shock-absorbing protrusion is disposed on a first shock-absorbing member;

fig. 7 is a schematic structural diagram of an electronic device according to a second embodiment of the present application;

fig. 8 is a schematic structural diagram of a microphone and a speaker of an electronic device provided in a second embodiment of the present application, where a lead and a wire hole are formed;

fig. 9 is a schematic structural diagram of a microphone, a speaker, a connection bracket, and an audio circuit board of an electronic device according to a second embodiment of the present application.

Reference numerals illustrate:

a 100-microphone;

110-a first housing; 111-a receiving cavity; 112-a housing body;

113-a housing connection; 120-microphone body; 121-a lead;

130-a first shock absorber; 131-a shock absorption cavity; 132-a shock absorbing body;

133-a shock absorbing connection; 134-first shock absorbing lobes; 135-wire outlet holes;

200-an electronic device; 210-a speaker; 211-a speaker body;

212-a second housing; 213-a second shock absorber; 2131-second shock absorbing lobes;

220-connecting a bracket; 230-audio circuit board.

Detailed Description

Bone conduction is a sound conduction mode, and can convert sound into mechanical vibration with different frequencies, and sound waves are transmitted through skull, bone labyrinth, inner ear lymph fluid, screw and auditory center of a person. Compared with the classical sound conduction mode of generating sound waves through a vibrating diaphragm, the bone conduction omits a plurality of sound wave transmission steps, can realize clear sound restoration in a noisy high-decibel environment, and can not influence others due to diffusion in air.

Bone conduction techniques are classified into bone conduction speaker techniques, also referred to as vibrators, and bone conduction microphone techniques, also referred to as microphones. Bone conduction speaker technology is used for transmitting, and is used for converting an electric signal into an acoustic vibration signal, and transmitting the acoustic vibration signal to an acoustic nerve through bones. Bone conduction microphone technology is used for receiving a call, i.e. collecting sound, and transmitting sound wave vibration signals emitted by a bone conduction speaker to a microphone through bones, and further converting the sound wave vibration signals into electric signals to be sent out. The above-described electronic devices manufactured using bone conduction techniques are referred to as bone conduction electronic devices, and are also referred to as bone conduction electronic devices, bone sensing electronic devices, bone conduction electronic devices, and bone sensing electronic devices.

When the loudspeaker and the microphone work simultaneously, the bone conduction electronic equipment transmits sound by means of vibration of the loudspeaker, the vibration energy is transmitted along the skull by taking the joint part of the vibrator and the face as a source point, and part of the vibration energy can be transmitted to the microphone through the skull and the electronic equipment structure and is transmitted to a far end, namely echo in a sound source mode.

The reason for the echo generation is as follows: after the bone conduction electronic equipment receives a downlink sound signal sent by a far-end transmitter, an electric signal is converted into an acoustic vibration signal, main energy of the acoustic vibration signal reaches an auditory center through skull and is converted into sound heard by a receiver, a small part of energy can be transmitted to a microphone through an electronic equipment structure and skull vibration, then the small part of energy is converted into the electric signal in a mode of uplink sound source vibration from the microphone and is transmitted back to a far-end transmitter initiator, and the initiator can feel echo when speaking.

In the related art, the strength of the echo signal is weakened mainly through two modes of physical noise reduction or software algorithm noise reduction. The physical noise reduction mode mainly comprises the following steps: the method is characterized in that a high damping material is selected or the material damping of an embedded inclusion is improved, the propagation of sound is related to the Young modulus and the density of a medium, and according to the speed of sound propagation, a rubber vibration high damping material is firstly selected, and in addition, the purpose of reducing sound wave vibration is achieved through a high damping additive and improving the damping characteristic of the inclusion. The noise reduction mode of the software algorithm mainly comprises the following steps: the echo generated when the bone transmission electronic equipment is in communication is reduced through the algorithm of the echo cancellation of the bone transmission electronic equipment and through the combination of software and hardware.

However, the above methods are relatively single, and none of them can completely eliminate the influence of the speaker on the vibration of the microphone, and cannot effectively reduce the intensity of the echo signal generated by the microphone.

Based on the technical problems, the microphone and the electronic device are provided, the microphone body is located in the first shock absorbing piece through the annular first shock absorbing piece, on one hand, the first shock absorbing piece can play a role in protecting the microphone body and mainly comprises a role in preventing dust, water and the like for the microphone, and on the other hand, the annular structure can completely wrap the microphone body, so that the strength of echo signals is reduced to the greatest extent; in still another aspect, after the microphone body and the first damping member are assembled, the first damping member can also play a certain role in fixing the microphone body, so that the assembly stability between the microphone body and the first damping member is improved. Through being provided with first shock attenuation arch on first shock attenuation spare, can change the area of contact between first shock attenuation spare and the microphone and between first shock attenuation spare and the first shell to reduce the influence of speaker to microphone vibrations, reduce the intensity of the echo signal that the microphone produced, improve the quality that the microphone picked up sound signal, and further promote electronic equipment's whole speech effect.

For the purposes of making the objects, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.

Fig. 1 is a schematic structural diagram of a microphone according to a first embodiment of the present disclosure; fig. 2 is a schematic structural diagram of a first damping member of a microphone according to a first embodiment of the present disclosure; fig. 3 is a schematic structural diagram of a first damping member of a microphone according to a first embodiment of the present disclosure; FIG. 4 is a schematic view of a first embodiment of the present disclosure in which a first shock-absorbing protrusion is disposed on a first shock-absorbing member; FIG. 5 is a second schematic structural view of a first shock-absorbing protrusion according to the first embodiment of the present application; fig. 6 is a schematic view of a third structure in which a first shock-absorbing protrusion is disposed on a first shock-absorbing member according to the first embodiment of the present application.

Example 1

The microphone provided in the embodiment of the present application will be described below with reference to fig. 1 to 6.

Referring to fig. 1 to 6, the embodiment of the present application provides a microphone 100 mounted on an electronic device 200 for receiving sound signals of a speaker 210. It should be noted that, the electronic device 200 in the embodiment of the present application may be an earphone, a player, a hearing aid, or the like, or may be other electronic devices 200.

In this embodiment, the electronic device 200 is mainly used as an example of an earphone, and based on the working principle of the earphone, the earphone may be divided into a bone conduction earphone or an air conduction earphone.

The bone conduction earphone adopts an advanced bone conduction technology, sound is transmitted to the inner ear through bone vibration, and high-quality sound can be heard without entering the ear, so that the harm of wearing the earphone for a long time to the ear is effectively reduced.

Unlike bone conduction headphones, air conduction headphones, whether ordinary wired headphones, bluetooth headphones or noise reduction headphones, are essentially "air conduction headphones", which transfer sound by vibrating air to our eardrum to vibrate, driving other organs such as ossicles.

In the embodiment of the present application, the main bone conduction earphone is illustrated as an example, the microphone 100 is a bone conduction microphone, and the speaker 210 is a bone conduction speaker.

Referring to fig. 1, 4 to 6, the microphone 100 includes a first housing 110, the first housing 110 having a receiving cavity 111, a microphone body 120 and an annular first shock absorbing member 130 being received in the receiving cavity 111, the microphone body 120 being configured to receive a sound signal of a speaker 210.

With continued reference to fig. 2 and 3, the first shock absorbing member 130 has a shock absorbing cavity 131, and when installed, the microphone body 120 is positioned in the shock absorbing cavity 131, and the first shock absorbing member 130 is provided with a first shock absorbing protrusion 134.

In the related art, the damping member, which is also referred to as an embedded package, is taken as an example of the microphone 100, and the microphone 100 is usually fixed and installed by directly wrapping the damping member with the embedded package and then connecting the damping member with other external structures. However, since the connection positions of the embedded enclosure and the microphone 100 and the connection positions of the embedded enclosure and other external structures are all plane, the contact area between the embedded enclosure and the microphone 100 and the contact area between the embedded enclosure and other external structures are large, which may cause mutual winding between the speaker 210 and the microphone 100, and the initiator may feel echo when speaking.

It will be appreciated that the initiator may also be referred to as a remote user.

Therefore, in the embodiment of the present application, the first shock absorbing member 130 is configured to be annular, so that on one hand, the first shock absorbing member 130 can protect the microphone body 120, so as to avoid damage of external impurities to the microphone body 120; on the other hand, the annular structure can completely wrap the microphone body 120.

The specific shape of the ring is not further limited. For example: may be a circular ring, a square ring, a triangular ring, a quadrangular ring, etc.

With continued reference to fig. 2 and 3, the first shock absorbing protrusion 134 is disposed on the first shock absorbing member 130, so that the structure of the first shock absorbing member 130 can be changed, and thus the contact area between the first shock absorbing member 130 and the microphone body 120 can be changed, or the contact area between the first shock absorbing member 130 and the first housing 110 can be changed, further the influence of the speaker 210 on the vibration of the microphone 100 can be effectively reduced, the propagation of sound wave vibration is greatly reduced, the intensity of echo signals generated by the microphone 100 is reduced, the quality of sound signals picked up by the microphone 100 is improved, and the overall voice effect of the electronic device 200 is further improved.

It is to be appreciated that in some embodiments, the sound signal may include video, audio files having a particular data format, or data or files that may be converted to sound in a particular way. The signal containing the audio information may be from a storage component of the electronic device 200 itself, or may be from a system for generating, storing, or transmitting information outside the electronic device 200. In addition, the signal containing the sound information may be from one signal source or a plurality of signal sources, and the plurality of signal sources may or may not be correlated.

In some embodiments, the electronic device 200 may also acquire the signal containing the acoustic information in a number of different ways, the acquisition of the signal may be wired or wireless, and may be real-time or delayed.

In one possible manner, referring to fig. 2 and 3, the first shock absorbing member 130 may include a shock absorbing body 132 and a shock absorbing connection portion 133 provided on the shock absorbing body 132, the first shock absorbing protrusion 134 is provided on the shock absorbing body 132, the first housing 110 has an opening, the shock absorbing connection portion 133 is located at the opening and connected with an edge of the opening, the shock absorbing cavity 131 is exposed to the first housing 110 through the opening, and the first housing 110 is connected with the shock absorbing connection portion 133.

It can be appreciated that the first shock absorbing member 130 is annular, that is, the shock absorbing body 132 and the shock absorbing connecting portion 133 are annular, the accommodating cavity 111 penetrates the shock absorbing connecting portion 133, and the first housing 110 and the shock absorbing connecting portion 133 are connected, so that the connection between the shock absorbing member and the first housing 110 can be realized, and the connection stability is improved.

One end of the shock absorbing body 132 is a closed end, the other end of the shock absorbing body 132 is an open end, the shock absorbing connecting portion 133 is disposed at the open end, and the shock absorbing cavity 131 is formed in the shock absorbing body 132.

In this embodiment, the setting position of the first shock absorbing protrusion 134 on the shock absorbing body 132 is not further limited, and the following various implementation manners will be mainly described as examples.

In a first possible manner, referring to fig. 4, the first shock-absorbing protrusion 134 may be provided at an outer wall surface of the closed end, and the first shock-absorbing protrusion 134 may be provided at an outer side wall of the shock-absorbing body 132.

In a second possible manner, referring to fig. 5, the first shock-absorbing protrusion 134 may be provided at an inner wall surface of the closed end, and the first shock-absorbing protrusion 134 may be provided at an inner wall of the shock-absorbing body 132.

In a third possible manner, referring to fig. 6, the first shock-absorbing protrusions 134 may be provided at both the inner wall surface and the outer wall surface of the closed end, and the first shock-absorbing protrusions 134 may be provided at both the inner side wall and the outer side wall of the shock-absorbing body 132.

It should be noted that, the setting position of the first damping protrusion 134 includes, but is not limited to, the above-mentioned modes, so long as the influence of the speaker 210 on the vibration of the microphone 100 can be reduced, and the reduction of the intensity of the echo signal generated by the microphone 100 is all within the scope of protection of the present application.

By providing the first damper protrusion 134 on the damper body 132, the structure of the damper body 132 is changed, thereby effectively reducing the contact area between the damper body 132 and the microphone body 120, and between the damper body 132 and the first housing 110.

In one possible implementation, the shape of the first shock-absorbing bump 134 is not further limited. The shape of the first shock-absorbing protrusion 134 may be a screw thread shape, or the shape of the first shock-absorbing protrusion 134 may also be a dot shape, a ring shape, or the like, so long as the shape of the first shock-absorbing member 130 can be changed, and reducing the contact area between the inner surface of the first shock-absorbing member 130 and the microphone body 120, and the outer surface of the first shock-absorbing member 130 and the first housing 110 falls within the scope of the present application.

It is understood that when the shape of the first shock-absorbing protrusions 134 is a screw shape, the number of the first shock-absorbing protrusions 134 is one, and when the shape of the first shock-absorbing protrusions 134 is a dot shape or a ring shape, etc., the number of the first shock-absorbing protrusions 134 may include a plurality of the first shock-absorbing protrusions 134 spaced apart from each other on the shock-absorbing body 132.

In one implementation manner, the shock absorbing body 132, the shock absorbing connecting portion 133 and the first shock absorbing protrusion 134 are integrally formed, and the shock absorbing body 132, the shock absorbing connecting portion 133 and the first shock absorbing protrusion 134 may be formed by injection molding, so that stability and reliability of connection among the shock absorbing body 132, the connecting portion and the first shock absorbing protrusion 134 are guaranteed, the number of parts of the first shock absorbing member 130 is reduced, and production efficiency of the first shock absorbing member 130 is improved.

In some embodiments, the first shock absorbing bump 134 can also be attached to the shock absorbing body 132 by an adhesive, and in some embodiments, the first shock absorbing bump 134 can also be secured to the shock absorbing body 132 by welding, clamping, riveting, screwing (e.g., by connecting with screws, bolts, etc.), clamping, pinning, etc.

In one implementation manner, the material of the first shock absorbing member 130 is not further limited, and exemplary materials of the first shock absorbing member 130 may be a silicone member, or materials of the first shock absorbing member 130 may be a rubber member, and the silicone and the rubber are soft and have high elasticity, and compared with steel materials, elastic deformation of the silicone and the rubber is large, which is beneficial to fully contacting between the first shock absorbing member 130 and the microphone body 120, and between the first shock absorbing member 130 and the first housing 110, so as to improve assembly efficiency. In some embodiments, the first shock absorbing protrusion 134 needs to maintain a certain elasticity, so that the loss of the first shock absorbing member 130 during the conduction process can be reduced, and the user can be guaranteed to feel good after wearing the earphone. Meanwhile, the silica gel and the rubber have certain flexibility, have no sharp corners and the like, and can avoid risks of scratching users and the like.

In addition, the first shock-absorbing protrusion 134 may also refer to a structure having a certain elasticity by which the intensity of mechanical vibration transmitted from the echo signal source is reduced. In some embodiments, the first shock-absorbing bump 134 may be an elastic member to reduce the intensity of the transmitted mechanical vibration, and the elasticity of the first shock-absorbing bump 134 may be variously determined by the material, thickness, structure, etc.

In one implementation, the first housing 110 may include a housing body 112 and a housing connection part 113 disposed on the housing body 112, the housing body 112 having an opening, the housing connection part 113 being disposed at an edge of the opening, the housing connection part 113 being connected to the shock-absorbing connection part 133. The housing body 112 and the housing connecting portion 113 may be provided as a single piece.

Example two

Fig. 7 is a schematic structural diagram of an electronic device provided in a second embodiment of the present application, fig. 8 is a schematic structural diagram of a microphone and a speaker of the electronic device provided in the second embodiment of the present application, where a lead and a wire hole are formed on the microphone, the speaker, a connection bracket, and an audio circuit board of the electronic device provided in the second embodiment of the present application.

The electronic device 200 provided in the second embodiment of the present application will be described below with reference to fig. 7 to 9.

An electronic device 200 is provided in the present embodiment, including a speaker 210 and the microphone 100 in the first embodiment. The speaker 210 is used to vibrate and transmit sound signals, the microphone 100 is used to receive sound signals transmitted by the speaker 210, and the electronic device 200 is mainly illustrated as a bone conduction headset.

When assembled, the connection relationship between the speaker 210 and the microphone 100 is not further limited, for example, when the user wears the earphone on the head, the speaker 210 and the microphone 100 are separately mounted on two sides of the head, and the speaker 210 and the microphone 100 can be connected by radio connection; alternatively, a connection bracket 220 may be further included, and the speaker 210 and the microphone 100 are connected through the connection bracket 220.

In particular, similar to the microphone 100, the speaker 210 includes a second housing 212, in which a speaker body 211 and a ring-shaped second shock absorbing member 213 are accommodated in the second housing 212, the speaker body 211 is located in the second shock absorbing member 213, and the second shock absorbing member 213 is provided with a second shock absorbing protrusion 2131. When assembled, the second housing 212 of the speaker 210 and the first housing 110 of the microphone 100 are connected by the connection bracket 220.

It should be noted that, in order to ensure electrical conduction between the microphone 100 and the speaker 210, in this embodiment, as shown in fig. 8 and 9, an audio circuit board 230 is further included, and the audio circuit board 230 is disposed on the connection bracket 220. Specifically, during connection, the microphone body 120 and the speaker body 211 are respectively provided with a lead 121, the first damping member 130 and the second damping member 213 are respectively provided with a wire outlet hole 135, and the two leads 121 are respectively led out from the microphone body 120 and the speaker body 211, pass through the corresponding wire outlet holes 135, and are connected to two sides of the audio circuit board 230, so as to realize electrical connection between the microphone 100 and the speaker 210.

It should be noted that the specific placement of the audio circuit board 230 is not further limited, for example, the audio circuit board 230 may be located on a side closer to the microphone 100, or the audio circuit board 230 may be located on a side closer to the speaker 210.

Through being provided with the second shock attenuation arch 2131 on second shock attenuation piece 213, can change the structure of second shock attenuation piece 213 like this to can change the area of contact between second shock attenuation piece 213 and the speaker body 211, perhaps change the area of contact between second shock attenuation piece 213 and the second shell 212, and then can effectively reduce the influence of the vibrations of speaker 210, reduce the sound wave vibrations propagation greatly, further promote the whole speech effect of electronic equipment 200.

Other technical features are the same as those of the first embodiment, and the same technical effects can be achieved, and are not described in detail herein.

According to the microphone 100 and the electronic device 200 provided by the embodiment of the utility model, the annular first shock absorbing member 130 is included, and the microphone body 120 is located in the first shock absorbing member 130, on one hand, the first shock absorbing member 130 can protect the microphone body 120 and mainly has the functions of dust prevention, water prevention and the like on the microphone, and on the other hand, the annular structure can completely wrap the microphone body 120, so that the strength of echo signals is reduced to the greatest extent; in still another aspect, after the microphone body and the first damping member are assembled, the first damping member can also play a certain role in fixing the microphone body, so that the assembly stability between the microphone body and the first damping member is improved. By providing the first shock absorbing protrusions 134 on the first shock absorbing member 130, a contact area between the first shock absorbing member 130 and the microphone body 120 and between the first shock absorbing member 130 and the first housing 110 can be changed, thereby reducing an influence of the speaker 210 on the vibration of the microphone 100, reducing the intensity of an echo signal generated by the microphone 100, improving the quality of a sound signal picked up by the microphone 100, and further improving the overall voice effect of the electronic device 200.

In the description of the present application, it is to be understood that the terms "center," "length," "width," "thickness," "top," "bottom," "upper," "lower," "left," "right," "front," "rear," "vertical," "horizontal," "inner," "outer," "axial," "circumferential," etc. are used to indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate description of the present application and simplify description, and do not indicate or imply that the locations or elements referred to must have a particular orientation, in a particular configuration and operation, and therefore are not to be construed as limiting of the present application.

Furthermore, features defining "first", "second" may include one or more such features, either explicitly or implicitly. In the description of the present application, the meaning of "plurality" is at least two, such as two, three, etc., unless explicitly defined otherwise.

In this application, unless specifically stated and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrated; can be mechanically connected, electrically connected or can be communicated with each other; can be directly connected or indirectly connected through an intermediate medium, and can lead the interior of two elements to be communicated or lead the two elements to be in interaction relationship. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be.

In this application, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, and may also include the first and second features not being in direct contact but being in contact with each other by way of additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.

Claims (10)

1. A microphone, which is assembled on an electronic device and is used for receiving sound signals of a loudspeaker, and is characterized in that the microphone comprises a first shell, wherein the first shell is provided with a containing cavity, and a microphone body and an annular first damping piece are contained in the containing cavity;

the first damping piece is provided with a damping cavity, the microphone body is positioned in the damping cavity, and a first damping protrusion is arranged on the first damping piece;

the microphone body is used for receiving the sound signal of the loudspeaker.

2. The microphone of claim 1 wherein the first shock absorbing member comprises a shock absorbing body and a shock absorbing connection disposed on the shock absorbing body;

the first damping bulge is arranged on the damping body, the first shell is provided with an opening, and the damping connecting part is positioned at the opening and is connected with the edge of the opening;

the damping cavity is exposed to the first housing through the opening, and the damping connection part is connected with the first housing.

3. The microphone of claim 2 wherein the shock absorbing body is a ring-like member, one end of the shock absorbing body is a closed end, the other end of the shock absorbing body is an open end, the shock absorbing connection is disposed at the open end, and the shock absorbing cavity is formed in the shock absorbing body.

4. A microphone according to claim 3, wherein the first damper protrusion is provided on an inner wall surface and/or an outer wall surface of the closed end;

and/or, the first shock absorption protrusion is arranged on the inner side wall and/or the outer side wall of the shock absorption body.

5. The microphone of any of claims 1-4, wherein the first shock absorbing protrusion is threaded, annular, or punctiform.

6. The microphone of any of claims 2-4 wherein the shock absorbing body, the shock absorbing connection, and the first shock absorbing protrusion are one piece.

7. The microphone of any of claims 1-4, wherein the first shock absorbing member comprises a silicone member or a rubber member.

8. The microphone of any of claims 2-4 wherein the first housing comprises a housing body and a housing connection disposed on the housing body, the housing body having the opening, the housing connection disposed at an edge of the opening, the housing connection being connected to the shock absorbing connection.

9. An electronic device comprising a speaker and a microphone according to any of the preceding claims 1-8;

the speaker is configured to vibrate and propagate a sound signal, and the microphone is configured to receive the sound signal propagated by the speaker.

10. The electronic device of claim 9, wherein the speaker comprises a second housing having a speaker body and an annular second shock absorber housed therein;

the loudspeaker body is positioned in the second damping piece, and a second damping protrusion is arranged on the second damping piece;

the electronic equipment further comprises a connecting support and an audio circuit board, the second shell and the first shell of the microphone are connected through the connecting support, the audio circuit board is arranged on the connecting support, and the microphone of the electronic equipment is electrically connected with the loudspeaker through the audio circuit board.