CN212909944U - Earphone with microphone new assembly structure - Google Patents
Earphone with microphone new assembly structure Download PDFInfo
- Publication number
- CN212909944U CN212909944U CN202021095497.7U CN202021095497U CN212909944U CN 212909944 U CN212909944 U CN 212909944U CN 202021095497 U CN202021095497 U CN 202021095497U CN 212909944 U CN212909944 U CN 212909944U
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- China
- Prior art keywords
- earphone
- microphone
- upper cover
- circuit board
- chamber
- Prior art date
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- 238000003466 welding Methods 0.000 claims abstract description 4
- 239000011359 shock absorbing material Substances 0.000 claims abstract description 3
- 238000013016 damping Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 229920000742 Cotton Polymers 0.000 claims description 4
- 238000000034 method Methods 0.000 claims 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 239000000741 silica gel Substances 0.000 description 7
- 229910002027 silica gel Inorganic materials 0.000 description 7
- 210000005069 ears Anatomy 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- 230000003044 adaptive effect Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 208000002925 dental caries Diseases 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
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- Headphones And Earphones (AREA)
Abstract
The utility model provides an earphone with a new microphone assembly structure, which comprises an earphone body provided with an earphone circuit board and an earphone upper cover covered on the earphone body, wherein the side surface of the earphone upper cover is provided with a side end with a sound inlet hole; the earphone circuit board towards the welding of earphone upper cover direction have a microphone, be equipped with shock-absorbing material around the microphone, cover on the earphone, be provided with the microphone that holds the microphone and hold the chamber with the microphone department of correspondence when the earphone upper cover lid is on the earphone body, the sound hole of advancing communicate with each other with microphone holds the chamber. The utility model discloses in because it has the microphone to hold the chamber to reserve, only need like this advance the sound hole with should hold the chamber communicate with each other can, convenient assembly.
Description
Technical Field
The utility model relates to an earphone field, especially an earphone with microphone new assembly structure.
Background
Earphones (ears; heads-sets; ears) are a pair of conversion units that receive electrical signals from a media player or receiver and convert them into audible sound waves using speakers near the ears. The headset is typically detachable from the media player and utilizes a plug connection. The advantage is that the user can listen to the sound independently without influencing other people; can also isolate the sound of the surrounding environment, and is very helpful for people who use in noisy environment such as a recording studio, a bar, a journey, sports, and the like. The earphone is originally used for telephone and radio, but with the prevalence of portable electronic devices, the earphone is often used for mobile phones, walkmans, radios, portable electronic games, digital audio players, and the like.
Currently, some earphones are further provided with a microphone, for example, chinese patent publication No. CN100563609C discloses an earphone with a microphone device, which includes: a first inner lid portion for forming a noise suppressing space; a second outer cover portion for forming a space for accommodating an electronic device and/or a power supply, a partition wall for separating the two spaces from each other; and a microphone provided with a hood of porous material for receiving sound from the environment; the microphone is arranged on the inside of the outer cover part, the continuation of the outer surfaces of the outer cover part, which surfaces jointly expand in the vicinity of the windshield, a cavity being provided between the inside of the windshield and the opening.
In practice, a porous material wind shield is installed around a microphone in an adaptive assembly mode, a silica gel sleeve is installed on a PCB of an earphone body of an existing earphone, after the microphone is welded on the PCB of the earphone body, the silica gel sleeve is installed around the microphone in an adaptive assembly mode, when the silica gel sleeve is assembled with an upper cover of the earphone, a sound inlet hole corresponding to the sound inlet hole in the side end of the upper cover of the earphone is formed in the side end of the silica gel sleeve, the microphone is small originally, the silica gel sleeve needs to be installed around the microphone, and one end, provided with the sound inlet hole, of the silica gel sleeve corresponds to the sound inlet hole in the position of the end body of the upper cover of the earphone, so that the requirement on assembly is high, and the assembly is not good in. The use of a microphone silicone sleeve also affects the consistency of the sound of the earphone microphone.
SUMMERY OF THE UTILITY MODEL
The utility model discloses need correspond the assembly with the sound hole of advancing on the microphone silica gel cover with the sound hole is advanced to earphone upper cover side end to the earphone that has the microphone new assembly structure at present when the assembly, assemble inconvenient not enough, provide an earphone that has the microphone new assembly structure.
The utility model discloses realize that its technical purpose technical scheme is: an earphone with a new microphone assembly structure comprises an earphone body provided with an earphone circuit board and an earphone upper cover covering the earphone body, wherein the side surface of the earphone upper cover is provided with a side end with a sound inlet hole; the earphone circuit board towards the welding of earphone upper cover direction have a microphone, be equipped with shock-absorbing material around the microphone, cover on the earphone, be provided with the microphone that holds the microphone and hold the chamber with the microphone department of correspondence when the earphone upper cover lid is on the earphone body, the sound hole of advancing communicate with each other with microphone holds the chamber.
Further, in the earphone with the new microphone assembling structure, the following steps are carried out: the microphone accommodating cavity is arranged on the earphone and is provided with a thin-wall structure with four protruding edges, extending out of the upper cover body, and the thin-wall structure is flush with the matching position of the microphone and the earphone circuit board.
Further, in the earphone with the new microphone assembling structure, the following steps are carried out: the damping material of microphone assembly all around adopt EAV cotton.
Further, in the earphone with the new microphone assembling structure, the following steps are carried out: the earphone body is oval, and microphones are welded at two ends of the earphone circuit board respectively.
The utility model discloses in because it has the microphone to hold the chamber to reserve, only need like this advance the sound hole with should hold the chamber communicate with each other can, convenient assembly.
The present invention will be described in more detail with reference to the accompanying drawings and examples.
Drawings
Fig. 1 is the utility model discloses embodiment 1 earphone main part sketch map.
Fig. 2 is a front view of the upper cover of the earphone according to embodiment 1 of the present invention.
Fig. 3 is a top view of the earphone according to embodiment 1 of the present invention.
Detailed Description
The embodiment is an earphone with a microphone, as shown in fig. 1, 2 and 3, the earphone comprises an earphone body 1, also called an earphone seat and an earphone main body, the earphone body is in an oval shape, a circuit board 2 is installed in the earphone body 1 by adopting screws, two microphones 3 are welded on the circuit board 2 and respectively welded at two ends of the circuit board 2, in practice, only one microphone 3 can be arranged according to needs, the welding position can be welded on the earphone circuit board 2 according to needs, a damping material 4 is arranged around the microphone 3, in the embodiment, EVA cotton is used, the welded microphone 3 is embedded in the EVA cotton, and the upper surface of the microphone 3 is exposed outside. In practice, the damping material may be other elastic materials, various porous materials, sponge, etc. The microphone 3 is welded on the earphone circuit board 2 towards the direction of the earphone upper cover 5, the face, exposed outside, of the microphone 3 is opposite to the earphone upper cover 5, the damping materials 4 are assembled around the microphone 3, a microphone accommodating cavity 7 for accommodating the microphone 3 is arranged at the position, corresponding to the microphone 3, of the earphone upper cover 5 when the earphone upper cover 5 is covered on the earphone body 1, and the sound inlet hole 6 is communicated with the microphone accommodating cavity 7. The sound inlet hole 6 is connected with the microphone accommodating cavity 7 as long as the sound inlet hole 6 is communicated with the microphone accommodating cavity 7, in this embodiment, the two microphones 3 are welded at two ends of the circuit board 2, so that the microphone accommodating cavity 7 is arranged at a corresponding position on the earphone upper cover 5, the sound inlet hole 6 can be arranged at the top, and can be seen from the top view of the earphone upper cover 5, namely, fig. 3.
Microphone holds chamber 7 and can set up according to actual conditions such as the shape of earphone and microphone 3 itself, and in this embodiment, microphone holds chamber 7 and sets up the protruding thin-walled structure of four sides that extends out in earphone upper cover 5 internal portion, and microphone 3 cooperation department parallel and level. In this embodiment, microphone holds the chamber 7 and comprises the protruding thin-walled structure of four sides that the internal portion of earphone upper cover 5 extended out, it cooperates the department parallel and level with microphone 3 and headphone circuit board 2, and sound hole 6 just in time is located 5 end positions of earphone upper cover and holds 7 cavitys UNICOMs in chamber with the microphone on the 5 bodies of earphone upper cover, like this when earphone upper cover 5 and earphone main part assembly back, microphone 3 is accomodate in the microphone that earphone upper cover held in chamber 7, earphone microphone 3 during operation, external sound is held in chamber 7 through the microphone that enters sound hole 6 entering, microphone 3 carries out work.
The utility model provides an earphone with microphone, owing to adopted the microphone that is used for holding microphone 3 on headphone circuit board 2 to hold chamber 7 on earphone upper cover 5, in convenient assembling, can also improve the uniformity of 3 sounds of earphone microphone.
Claims (4)
1. An earphone with a new microphone assembly structure comprises an earphone body (1) provided with an earphone circuit board (2) and an earphone upper cover (5) covered on the earphone body (1), wherein a sound inlet hole (6) is formed in the side surface of the earphone upper cover (5); the method is characterized in that: earphone circuit board (2) towards the welding of earphone upper cover (5) direction have microphone (3), be equipped with shock-absorbing material (4) around microphone (3), on earphone upper cover (5), correspond the department when earphone upper cover (5) lid is on earphone body (1) with microphone (3) and be provided with the microphone that holds the microphone and hold chamber (7), sound inlet hole (6) and microphone hold chamber (7) and communicate with each other.
2. The earphone with the new microphone assembling structure as claimed in claim 1, wherein: microphone hold chamber (7) set up in the protruding thin wall structure of four sides of earphone upper cover (5) internal extension, with microphone (3) and earphone circuit board cooperation department parallel and level.
3. The earphone with the new microphone assembling structure as claimed in claim 1, wherein: the damping material (4) arranged around the microphone (3) is made of EAV cotton.
4. A headset with a microphone new fitting structure according to claim 1, 2 or 3, characterized in that: the earphone body (1) is oval, and microphones (3) are welded at two ends of the earphone circuit board (2) respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021095497.7U CN212909944U (en) | 2020-06-15 | 2020-06-15 | Earphone with microphone new assembly structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021095497.7U CN212909944U (en) | 2020-06-15 | 2020-06-15 | Earphone with microphone new assembly structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212909944U true CN212909944U (en) | 2021-04-06 |
Family
ID=75276978
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021095497.7U Active CN212909944U (en) | 2020-06-15 | 2020-06-15 | Earphone with microphone new assembly structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212909944U (en) |
-
2020
- 2020-06-15 CN CN202021095497.7U patent/CN212909944U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 523000 Room 501, Building 3, No. 388, Bihu Avenue, Fenggang Town, Dongguan City, Guangdong Province Patentee after: Guangdong Huaguan Zhilian Technology Co.,Ltd. Address before: 518000 Room 101, No.46 Xinhe Road, shangmugu community, Pinghu street, Longgang District, Shenzhen City, Guangdong Province Patentee before: Shenzhen Huaguan Zhilian Technology Co.,Ltd. |