CN107222805A - A kind of bone conduction earphone suppresses leakage sound structure - Google Patents
A kind of bone conduction earphone suppresses leakage sound structure Download PDFInfo
- Publication number
- CN107222805A CN107222805A CN201710644594.3A CN201710644594A CN107222805A CN 107222805 A CN107222805 A CN 107222805A CN 201710644594 A CN201710644594 A CN 201710644594A CN 107222805 A CN107222805 A CN 107222805A
- Authority
- CN
- China
- Prior art keywords
- bone
- damping layer
- conduction speaker
- conduction
- leakage sound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 210000000988 bone and bone Anatomy 0.000 title claims abstract description 40
- 238000013016 damping Methods 0.000 claims abstract description 87
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- 229920001971 elastomer Polymers 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 239000000741 silica gel Substances 0.000 claims description 5
- 229910002027 silica gel Inorganic materials 0.000 claims description 5
- 229920001935 styrene-ethylene-butadiene-styrene Polymers 0.000 claims description 5
- 229920002725 thermoplastic elastomer Polymers 0.000 claims description 5
- 229920006346 thermoplastic polyester elastomer Polymers 0.000 claims description 5
- 241000202567 Fatsia japonica Species 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 230000010358 mechanical oscillation Effects 0.000 abstract description 18
- 230000005540 biological transmission Effects 0.000 abstract description 6
- 230000010355 oscillation Effects 0.000 abstract description 2
- 230000003139 buffering effect Effects 0.000 description 5
- 239000013013 elastic material Substances 0.000 description 4
- 230000001629 suppression Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- -1 TPSIV Polymers 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000000686 essence Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 210000001519 tissue Anatomy 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
- H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only
- H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
- H04R1/2869—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself
- H04R1/2876—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself by means of damping material, e.g. as cladding
- H04R1/288—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself by means of damping material, e.g. as cladding for loudspeaker transducers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2460/00—Details of hearing devices, i.e. of ear- or headphones covered by H04R1/10 or H04R5/033 but not provided for in any of their subgroups, or of hearing aids covered by H04R25/00 but not provided for in any of its subgroups
- H04R2460/13—Hearing devices using bone conduction transducers
Landscapes
- Health & Medical Sciences (AREA)
- Otolaryngology (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Details Of Audible-Bandwidth Transducers (AREA)
Abstract
Suppress leakage sound structure the invention discloses a kind of bone conduction earphone, belong to bone conduction earphone technical field.The bone conduction earphone of the present invention, which suppresses leakage sound structure, includes bone-conduction speaker, damping layer and shell, and the bone-conduction speaker is connected with damping layer, and the damping layer is connected with shell；The bone-conduction speaker has no with shell directly to be contacted, and is separated by damping layer.The structure of the present invention can increase the oscillation space of bone-conduction speaker, preferably absorb the energy produced by vibration, it is to avoid pass to shell；The mechanical oscillation that the present invention is produced bone-conduction speaker by damping layer absorb, so as to reduce the leakage sound for producing the energy transmission of mechanical oscillation to earphone outer covering.
Description
Technical field
The invention belongs to bone conduction earphone technical field, more particularly to a kind of bone conduction earphone suppresses leakage sound structure.
Background technology
Bone conduction earphone is to convert electrical signals to mechanical oscillation, and mechanical oscillation are passed in human ear by tissue and produced
The sense of hearing；The classical sound conduction mode of sound wave is produced with respect to vibrating diaphragm, osteoacusis eliminates the step of many sound waves are transmitted,
Clearly sound-reducing can be realized in a noisy environment, and sound wave also will not have influence on him because of spreading in atmosphere
People.
The leakage mail topic of current bone conduction earphone there is no good solution, mainly have two sides on leakage sound source of sound
Face, can produce vibration when on the one hand being worked for bone-conduction speaker, so as to drive surrounding air to send sound；On the other hand it is bone
Earphone outer covering vibration is conducted, drives surrounding air to send sound.As shown in figure 1, prior art is straight by bone-conduction speaker (1)
It is connected on earphone outer covering (3), causes shell (3) vibration sounding, suppresses to leak sound without any processing；Another existing skill
Art by the pattern handling of bone-conduction speaker (1), connecting pole (5), earphone outer covering (3) longitudinal stack as shown in Fig. 2 leak mail
Topic, but the buffering effect that connecting pole (5) is played is limited.Therefore presently disclosed technology does not find suitable mode also and come more
Good solution bone conduction earphone leakage mail topic.
The content of the invention
It is an object of the invention to overcome shortcoming and deficiency present in above-mentioned prior art, there is provided a kind of bone conduction earphone
Suppress leakage sound structure.The bone conduction earphone of the present invention, which suppresses leakage sound structure, can reduce the energy that mechanical oscillation are converted to air vibration
Amount, reaches the effect for effectively suppressing leakage sound.
The purpose of the present invention is achieved through the following technical solutions：A kind of bone conduction earphone suppresses leakage sound structure, including bone is passed
Loudspeaker, damping layer and shell are led, the bone-conduction speaker is connected with damping layer, the damping layer is connected with shell；
The bone-conduction speaker has no with shell directly to be contacted, and is separated by damping layer.Bone-conduction speaker is at work
Mechanical oscillation are produced, row buffering are entered by damping layer, only few portion of energy is delivered in shell.
As preferred embodiment, described damping layer is the damping layer of elastic material.
As preferred embodiment, the damping layer be rubber, TPR, TPX, TPV, TPO, TPU, TPEE, TPE,
One or more in SEBS, SBS, SIS, TPSIV, PVC, PU, silica gel, sheet metal, paper.
As preferred embodiment, the main body of the damping layer is can have raised recessed in planar structure, planar structure
Groove or perforation.
As preferred embodiment, the damping layer outer ledge and the cage connection, the damping layer centre bit
Put or non-edge position is connected with the bone-conduction speaker, the bone-conduction speaker is suspended on institute by the damping layer
State on shell.
As preferred embodiment, described shell is U-shaped shell, and the damping layer is located at U-shaped opening.
As preferred embodiment, the bone-conduction speaker is by bone-conduction speaker transducer, bone-conduction speaker
Shake piece and connector is constituted；The bone-conduction speaker piece that shakes is connected with the damping layer.
As preferred embodiment, the bone-conduction speaker shakes piece through damping layer.
As preferred embodiment, the bone-conduction speaker piece that shakes is in the inside of damping layer.
As preferred embodiment, the bone-conduction speaker piece that shakes is in the inside of damping layer, and the osteoacusis is raised
The sound device piece that shakes is connected with damping layer using physical bond mode.
Because bone-conduction speaker is mounted in earphone outer covering, his vibration area is big necessarily without earphone outer covering；Together
When common headphones be using vibrating diaphragm shake air sounding, but common headphones leakage sound be seldom, it can be seen that bone conduction earphone leak
Sound is mainly vibrated by earphone outer covering to be produced.The mechanical oscillation that above-mentioned technical proposal is produced bone-conduction speaker by damping layer
Absorb, so as to reduce the leakage sound for producing the energy transmission of mechanical oscillation to earphone outer covering.
The present invention has the following advantages and effect relative to prior art：
The structure of the present invention can increase the oscillation space of bone-conduction speaker, preferably absorb the energy produced by vibration
Amount, it is to avoid pass to shell；The mechanical oscillation that the present invention is produced bone-conduction speaker by damping layer absorb, so as to reduce machine
The leakage sound that the energy transmission of tool vibration is produced to earphone outer covering.
Brief description of the drawings
Fig. 1 is that the bone-conduction speaker of prior art is directly assembled to the cross-sectional view on shell；
Fig. 2 is the cross-section structure signal of the connection for the bone-conduction speaker that bone conduction earphone contains connecting pole in the prior art
Figure；
Fig. 3 is the cross-sectional view of bone conduction earphone suppression leakage sound structure in the embodiment of the present invention 1.
Fig. 4 is the cross-sectional view of bone conduction earphone suppression leakage sound structure in the embodiment of the present invention 2.
Fig. 5 is the cross-sectional view of bone conduction earphone suppression leakage sound structure in the embodiment of the present invention 3.
Embodiment
With reference to embodiment and accompanying drawing, the present invention is described in further detail, but embodiments of the present invention are not limited
In this.
Embodiment 1
As shown in figure 3, suppressing leakage sound structure the invention provides a kind of bone conduction earphone, including bone-conduction speaker 1, subtract
Shaken layer 2 and shell 3, and the bone-conduction speaker 1 is connected with damping layer 2, and the damping layer 2 is connected with shell 3；The bone
Conduction speaker 1 has no with shell 3 and directly contacted, and is separated by damping layer 2.Bone-conduction speaker 1 is produced at work
Raw mechanical oscillation, enter row buffering, only few portion of energy is delivered in shell 3 by damping layer 2.
Described damping layer 2 is the damping layer of elastic material.
The damping layer 2 be rubber, TPR, TPX, TPV, TPO, TPU, TPEE, TPE, SEBS, SBS, SIS, TPSIV,
One or more in PVC, PU, silica gel, sheet metal, paper.
The main body of the damping layer 2 is can have convex groove or perforation in planar structure, planar structure.
The outer ledge of damping layer 2 is connected with the shell 3, the damping layer center or non-edge position and institute
State bone-conduction speaker 1 to connect, the bone-conduction speaker 1 is suspended on by the damping layer 2 on the shell 3.
Described shell 3 is U-shaped shell, and the damping layer 2 is located at U-shaped opening.
The bone-conduction speaker 1 is shaken piece 12 and connector 13 by bone-conduction speaker transducer 11, bone-conduction speaker
Constitute；The bone-conduction speaker piece 12 that shakes is connected with the damping layer 2, and the bone-conduction speaker shakes piece 12 through damping layer
2。
Because bone-conduction speaker is mounted in earphone outer covering, his vibration area is big necessarily without earphone outer covering；Together
When common headphones be using vibrating diaphragm shake air sounding, but common headphones leakage sound be seldom, it can be seen that bone conduction earphone leak
Sound is mainly vibrated by earphone outer covering to be produced.The mechanical oscillation that above-mentioned technical proposal is produced bone-conduction speaker by damping layer
Absorb, so as to reduce the leakage sound for producing the energy transmission of mechanical oscillation to earphone outer covering.
Embodiment 2
As shown in figure 4, suppressing leakage sound structure the invention provides a kind of bone conduction earphone, including bone-conduction speaker 1, subtract
Shaken layer 2 and shell 3, and the bone-conduction speaker 1 is connected with damping layer 2, and the damping layer 2 is connected with shell 3；The bone
Conduction speaker 1 has no with shell 3 and directly contacted, and is separated by damping layer 2.Bone-conduction speaker 1 is produced at work
Raw mechanical oscillation, enter row buffering, only few portion of energy is delivered in shell 3 by damping layer 2.
Described damping layer 2 is the damping layer of elastic material.
The damping layer 2 be rubber, TPR, TPX, TPV, TPO, TPU, TPEE, TPE, SEBS, SBS, SIS, TPSIV,
One or more in PVC, PU, silica gel, sheet metal, paper.
The main body of the damping layer 2 is can have convex groove or perforation in planar structure, planar structure.
The outer ledge of damping layer 2 is connected with the shell 3, the damping layer center or non-edge position and institute
State bone-conduction speaker 1 to connect, the bone-conduction speaker 1 is suspended on by the damping layer 2 on the shell 3.
Described shell 3 is U-shaped shell, and the damping layer 2 is located at U-shaped opening.
The bone-conduction speaker 1 is shaken piece 12 and connector 13 by bone-conduction speaker transducer 11, bone-conduction speaker
Constitute；The bone-conduction speaker piece 12 that shakes is connected with the damping layer 2, and the bone-conduction speaker piece 12 that shakes is in damping layer
2 inside.
Because bone-conduction speaker is mounted in earphone outer covering, his vibration area is big necessarily without earphone outer covering；Together
When common headphones be using vibrating diaphragm shake air sounding, but common headphones leakage sound be seldom, it can be seen that bone conduction earphone leak
Sound is mainly vibrated by earphone outer covering to be produced.The mechanical oscillation that above-mentioned technical proposal is produced bone-conduction speaker by damping layer
Absorb, so as to reduce the leakage sound for producing the energy transmission of mechanical oscillation to earphone outer covering.
Embodiment 3
As shown in figure 5, suppressing leakage sound structure the invention provides a kind of bone conduction earphone, including bone-conduction speaker 1, subtract
Shaken layer 2 and shell 3, and the bone-conduction speaker 1 is connected with damping layer 2, and the damping layer 2 is connected with shell 3；The bone
Conduction speaker 1 has no with shell 3 and directly contacted, and is separated by damping layer 2.Bone-conduction speaker 1 is produced at work
Raw mechanical oscillation, enter row buffering, only few portion of energy is delivered in shell 3 by damping layer 2.
Described damping layer 2 is the damping layer of elastic material.
The damping layer 2 be rubber, TPR, TPX, TPV, TPO, TPU, TPEE, TPE, SEBS, SBS, SIS, TPSIV,
One or more in PVC, PU, silica gel, sheet metal, paper.
The main body of the damping layer 2 is can have convex groove or perforation in planar structure, planar structure.
The outer ledge of damping layer 2 is connected with the shell 3, the damping layer center or non-edge position and institute
State bone-conduction speaker 1 to connect, the bone-conduction speaker 1 is suspended on by the damping layer 2 on the shell 3.
Described shell 3 is U-shaped shell, and the damping layer 2 is located at U-shaped opening.
The bone-conduction speaker 1 is shaken piece 12 and connector 13 by bone-conduction speaker transducer 11, bone-conduction speaker
Constitute；The bone-conduction speaker piece 12 that shakes is connected with the damping layer 2, and the bone-conduction speaker piece 12 that shakes is in damping layer
2 inside, the bone-conduction speaker piece 12 that shakes is connected with damping layer 2 using physical bond mode.
Because bone-conduction speaker is mounted in earphone outer covering, his vibration area is big necessarily without earphone outer covering；Together
When common headphones be using vibrating diaphragm shake air sounding, but common headphones leakage sound be seldom, it can be seen that bone conduction earphone leak
Sound is mainly vibrated by earphone outer covering to be produced.The mechanical oscillation that above-mentioned technical proposal is produced bone-conduction speaker by damping layer
Absorb, so as to reduce the leakage sound for producing the energy transmission of mechanical oscillation to earphone outer covering.
Above-described embodiment is preferably embodiment, but embodiments of the present invention are not by above-described embodiment of the invention
Limitation, other any Spirit Essences without departing from the present invention and the change made under principle, modification, replacement, combine, simplification,
Equivalent substitute mode is should be, is included within protection scope of the present invention.
Claims (10)
1. a kind of bone conduction earphone suppresses leakage sound structure, it is characterised in that：Including bone-conduction speaker, damping layer and shell, institute
State bone-conduction speaker to be connected with damping layer, the damping layer is connected with shell；The bone-conduction speaker and shell are simultaneously
Without directly contacting, separated by damping layer.
2. bone conduction earphone according to claim 1 suppresses leakage sound structure, it is characterised in that：Described damping layer is elasticity
The damping layer of material.
3. bone conduction earphone according to claim 1 suppresses leakage sound structure, it is characterised in that：The damping layer be rubber,
One in TPR, TPX, TPV, TPO, TPU, TPEE, TPE, SEBS, SBS, SIS, TPSIV, PVC, PU, silica gel, sheet metal, paper
Plant or a variety of.
4. bone conduction earphone according to claim 1 suppresses leakage sound structure, it is characterised in that：The main body of the damping layer is
Can there are convex groove or perforation in planar structure, planar structure.
5. bone conduction earphone according to claim 1 suppresses leakage sound structure, it is characterised in that：The damping layer outer ledge
With the cage connection, the damping layer center or non-edge position are connected with the bone-conduction speaker, make the bone
Conduction speaker is hung on the housing by the damping layer.
6. bone conduction earphone according to claim 1 suppresses leakage sound structure, it is characterised in that：Described shell is U-shaped outer
Shell, the damping layer is located at U-shaped opening.
7. bone conduction earphone according to claim 1 suppresses leakage sound structure, it is characterised in that：The bone-conduction speaker by
Shake piece and connector of bone-conduction speaker transducer, bone-conduction speaker is constituted；The bone-conduction speaker piece that shakes subtracts with described
The layer that shakes is connected.
8. bone conduction earphone according to claim 7 suppresses leakage sound structure, it is characterised in that：The bone-conduction speaker shakes
Piece passes through damping layer.
9. bone conduction earphone according to claim 7 suppresses leakage sound structure, it is characterised in that：The bone-conduction speaker shakes
Piece is in the inside of damping layer.
10. bone conduction earphone according to claim 7 suppresses leakage sound structure, it is characterised in that：The bone-conduction speaker
The piece that shakes is in the inside of damping layer, and the bone-conduction speaker piece that shakes is connected with damping layer using physical bond mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710644594.3A CN107222805A (en) | 2017-07-31 | 2017-07-31 | A kind of bone conduction earphone suppresses leakage sound structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710644594.3A CN107222805A (en) | 2017-07-31 | 2017-07-31 | A kind of bone conduction earphone suppresses leakage sound structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107222805A true CN107222805A (en) | 2017-09-29 |
Family
ID=59954784
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710644594.3A Pending CN107222805A (en) | 2017-07-31 | 2017-07-31 | A kind of bone conduction earphone suppresses leakage sound structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107222805A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107995550A (en) * | 2017-11-29 | 2018-05-04 | 苏州佑克骨传导科技有限公司 | It is a kind of that there is the back-wear type bone conduction earphone for letting out sound hole |
| CN110139198A (en) * | 2018-02-09 | 2019-08-16 | 南昌欧菲显示科技有限公司 | Shell and terminal device |
| CN112153541A (en) * | 2018-09-18 | 2020-12-29 | 徐发喜 | Intelligent wearable device |
| WO2021128654A1 (en) * | 2019-12-24 | 2021-07-01 | 深圳市睿德龙科技有限公司 | Bone conduction loudspeaker for ultrasonic and electroacoustic system |
| WO2023208050A1 (en) * | 2022-04-29 | 2023-11-02 | 苏州索迩电子技术有限公司 | Bone conduction sound-producing unit and wearable device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103716739A (en) * | 2014-01-06 | 2014-04-09 | 深圳市韶音科技有限公司 | Method for suppressing sound leakage of bone conduction loudspeaker and bone conduction loudspeaker |
| CN205142506U (en) * | 2015-08-13 | 2016-04-06 | 深圳市韶音科技有限公司 | Improve osteoacusis speaker that osteoacusis speaker leaks sound |
| CN206948584U (en) * | 2017-07-31 | 2018-01-30 | 深圳市微运动信息科技有限公司 | A kind of bone conduction earphone suppresses leakage sound structure |
-
2017
- 2017-07-31 CN CN201710644594.3A patent/CN107222805A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103716739A (en) * | 2014-01-06 | 2014-04-09 | 深圳市韶音科技有限公司 | Method for suppressing sound leakage of bone conduction loudspeaker and bone conduction loudspeaker |
| CN205142506U (en) * | 2015-08-13 | 2016-04-06 | 深圳市韶音科技有限公司 | Improve osteoacusis speaker that osteoacusis speaker leaks sound |
| CN206948584U (en) * | 2017-07-31 | 2018-01-30 | 深圳市微运动信息科技有限公司 | A kind of bone conduction earphone suppresses leakage sound structure |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107995550A (en) * | 2017-11-29 | 2018-05-04 | 苏州佑克骨传导科技有限公司 | It is a kind of that there is the back-wear type bone conduction earphone for letting out sound hole |
| CN110139198A (en) * | 2018-02-09 | 2019-08-16 | 南昌欧菲显示科技有限公司 | Shell and terminal device |
| CN112153541A (en) * | 2018-09-18 | 2020-12-29 | 徐发喜 | Intelligent wearable device |
| CN112153542A (en) * | 2018-09-18 | 2020-12-29 | 徐发喜 | Bone conduction loudspeaker |
| CN112153540A (en) * | 2018-09-18 | 2020-12-29 | 徐发喜 | Intelligent wearable device |
| WO2021128654A1 (en) * | 2019-12-24 | 2021-07-01 | 深圳市睿德龙科技有限公司 | Bone conduction loudspeaker for ultrasonic and electroacoustic system |
| WO2023208050A1 (en) * | 2022-04-29 | 2023-11-02 | 苏州索迩电子技术有限公司 | Bone conduction sound-producing unit and wearable device |
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Application publication date: 20170929 |
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