CN206948584U - A kind of bone conduction earphone suppresses leakage sound structure - Google Patents
A kind of bone conduction earphone suppresses leakage sound structure Download PDFInfo
- Publication number
- CN206948584U CN206948584U CN201720946277.2U CN201720946277U CN206948584U CN 206948584 U CN206948584 U CN 206948584U CN 201720946277 U CN201720946277 U CN 201720946277U CN 206948584 U CN206948584 U CN 206948584U
- Authority
- CN
- China
- Prior art keywords
- bone
- damping layer
- conduction speaker
- conduction
- leakage sound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Details Of Audible-Bandwidth Transducers (AREA)
Abstract
The utility model discloses a kind of bone conduction earphone to suppress leakage sound structure, belongs to bone conduction earphone technical field.Bone conduction earphone of the present utility model, which suppresses leakage sound structure, includes bone-conduction speaker, damping layer and shell, and the bone-conduction speaker is connected with damping layer, and the damping layer is connected with shell；The bone-conduction speaker has no with shell directly to be contacted, and is separated by damping layer.Structure of the present utility model can increase the oscillation space of bone-conduction speaker, preferably absorb energy caused by vibrating, avoid passing to shell；The utility model is absorbed mechanical oscillation caused by bone-conduction speaker by damping layer, sound will be leaked caused by the energy transmission to earphone outer covering of mechanical oscillation so as to reduce.
Description
Technical field
The utility model belongs to bone conduction earphone technical field, and more particularly to a kind of bone conduction earphone suppresses leakage sound structure.
Background technology
Bone conduction earphone is to convert electrical signals to mechanical oscillation, and mechanical oscillation are passed in human ear by tissue and produced
The sense of hearing；The classical sound conduction mode of sound wave is produced with respect to vibrating diaphragm, osteoacusis eliminates the step of many sound waves transmit,
Clearly sound-reducing can be realized in a noisy environment, and sound wave also will not have influence on him because of spreading in atmosphere
People.
The leakage mail topic of bone conduction earphone there is no good solution at present, mainly have two sides on leakage sound source of sound
Face, vibration can be produced when on the one hand being worked for bone-conduction speaker, so as to drive surrounding air to send sound；On the other hand it is bone
Earphone outer covering vibration is conducted, drives surrounding air to send sound.As shown in figure 1, prior art is straight by bone-conduction speaker (1)
It is connected on earphone outer covering (3), causes shell (3) vibration sounding, suppresses to leak sound without any processing；Another existing skill
Art by the pattern handling of bone-conduction speaker (1), connecting pole (5), earphone outer covering (3) longitudinal stack as shown in Fig. 2 leak mail
Topic, but the buffering effect that connecting pole (5) plays is limited.Therefore presently disclosed technology does not find suitable mode also and come more
Good solution bone conduction earphone leakage mail topic.
Utility model content
The purpose of this utility model is to overcome shortcoming and deficiency present in above-mentioned prior art, there is provided a kind of osteoacusis
Earphone suppresses leakage sound structure.Bone conduction earphone suppression leakage sound structure of the present utility model can reduce mechanical oscillation and be converted to air
The energy of vibration, reach the effect for effectively suppressing leakage sound.
The purpose of this utility model is achieved through the following technical solutions：A kind of bone conduction earphone suppresses leakage sound structure, including
Bone-conduction speaker, damping layer and shell, the bone-conduction speaker are connected with damping layer, and the damping layer coordinates with shell and connected
Connect；The bone-conduction speaker has no with shell directly to be contacted, and is separated by damping layer.Bone-conduction speaker is working
Middle generation mechanical oscillation, row buffering is entered by damping layer, only few portion of energy is delivered in shell.
As preferred embodiment, described damping layer is the damping layer of elastic material.
As preferred embodiment, the damping layer be rubber, TPR, TPX, TPV, TPO, TPU, TPEE, TPE,
One or more in SEBS, SBS, SIS, TPSIV, PVC, PU, silica gel, sheet metal, paper.
As preferred embodiment, the main body of the damping layer is planar structure, can be had in planar structure raised recessed
Groove or perforation.
As preferred embodiment, the damping layer outer ledge and the cage connection, the damping layer centre bit
Put or non-edge position is connected with the bone-conduction speaker, the bone-conduction speaker is suspended on institute by the damping layer
State on shell.
As preferred embodiment, described shell is U-shaped shell, and the damping layer is located at U-shaped opening.
As preferred embodiment, the bone-conduction speaker is by bone-conduction speaker transducer, bone-conduction speaker
Shake piece and connector is formed；The bone-conduction speaker piece that shakes is connected with the damping layer.
As preferred embodiment, the bone-conduction speaker piece that shakes passes through damping layer.
As preferred embodiment, the bone-conduction speaker piece that shakes is in the inside of damping layer.
As preferred embodiment, the bone-conduction speaker piece that shakes is in the inside of damping layer, and the osteoacusis is raised
The sound device piece that shakes is connected with damping layer using physical bond mode.
Because bone-conduction speaker is mounted in earphone outer covering, his vibration area is big necessarily without earphone outer covering；Together
When common headphones be using vibrating diaphragm vibrations air sounding, but common headphones leakage sound be seldom, it can be seen that bone conduction earphone leak
Sound is mainly vibrated by earphone outer covering to be produced.Above-mentioned technical proposal is by damping layer by mechanical oscillation caused by bone-conduction speaker
Absorb, sound will be leaked caused by the energy transmission to earphone outer covering of mechanical oscillation so as to reduce.
The utility model is had the following advantages relative to prior art and effect：
Structure of the present utility model can increase the oscillation space of bone-conduction speaker, preferably absorb caused by vibration
Energy, avoid passing to shell；The utility model is absorbed mechanical oscillation caused by bone-conduction speaker by damping layer, so as to subtract
Leakage sound caused by the energy transmission of major general's mechanical oscillation to earphone outer covering.
Brief description of the drawings
Fig. 1 is the cross-sectional view that the bone-conduction speaker of prior art is directly assembled on shell；
Fig. 2 is the cross-section structure signal of the connection for the bone-conduction speaker that bone conduction earphone contains connecting pole in the prior art
Figure；
Fig. 3 is the cross-sectional view that bone conduction earphone suppresses leakage sound structure in the utility model embodiment 1.
Fig. 4 is the cross-sectional view that bone conduction earphone suppresses leakage sound structure in the utility model embodiment 2.
Fig. 5 is the cross-sectional view that bone conduction earphone suppresses leakage sound structure in the utility model embodiment 3.
Embodiment
The utility model is described in further detail with reference to embodiment and accompanying drawing, but implementation of the present utility model
Mode not limited to this.
Embodiment 1
As shown in figure 3, the utility model, which provides a kind of bone conduction earphone, suppresses leakage sound structure, including bone-conduction speaker
1st, damping layer 2 and shell 3, the bone-conduction speaker 1 are connected with damping layer 2, and the damping layer 2 is connected with shell 3；Institute
State bone-conduction speaker 1 and had no with shell 3 and directly contacted, separated by damping layer 2.Bone-conduction speaker 1 is working
Middle generation mechanical oscillation, row buffering is entered by damping layer 2, only few portion of energy is delivered in shell 3.
Described damping layer 2 is the damping layer of elastic material.
The damping layer 2 be rubber, TPR, TPX, TPV, TPO, TPU, TPEE, TPE, SEBS, SBS, SIS, TPSIV,
One or more in PVC, PU, silica gel, sheet metal, paper.
The main body of the damping layer 2 is planar structure, can have convex groove or perforation in planar structure.
The outer ledge of damping layer 2 is connected with the shell 3, the damping layer center or non-edge position and institute
State bone-conduction speaker 1 to connect, the bone-conduction speaker 1 is suspended on by the damping layer 2 on the shell 3.
Described shell 3 is U-shaped shell, and the damping layer 2 is located at U-shaped opening.
The bone-conduction speaker 1 is shaken piece 12 and connector 13 by bone-conduction speaker transducer 11, bone-conduction speaker
Form；The bone-conduction speaker piece 12 that shakes is connected with the damping layer 2, and the bone-conduction speaker piece 12 that shakes passes through damping layer
2。
Because bone-conduction speaker is mounted in earphone outer covering, his vibration area is big necessarily without earphone outer covering；Together
When common headphones be using vibrating diaphragm vibrations air sounding, but common headphones leakage sound be seldom, it can be seen that bone conduction earphone leak
Sound is mainly vibrated by earphone outer covering to be produced.Above-mentioned technical proposal is by damping layer by mechanical oscillation caused by bone-conduction speaker
Absorb, sound will be leaked caused by the energy transmission to earphone outer covering of mechanical oscillation so as to reduce.
Embodiment 2
As shown in figure 4, the utility model, which provides a kind of bone conduction earphone, suppresses leakage sound structure, including bone-conduction speaker
1st, damping layer 2 and shell 3, the bone-conduction speaker 1 are connected with damping layer 2, and the damping layer 2 is connected with shell 3；Institute
State bone-conduction speaker 1 and had no with shell 3 and directly contacted, separated by damping layer 2.Bone-conduction speaker 1 is working
Middle generation mechanical oscillation, row buffering is entered by damping layer 2, only few portion of energy is delivered in shell 3.
Described damping layer 2 is the damping layer of elastic material.
The damping layer 2 be rubber, TPR, TPX, TPV, TPO, TPU, TPEE, TPE, SEBS, SBS, SIS, TPSIV,
One or more in PVC, PU, silica gel, sheet metal, paper.
The main body of the damping layer 2 is planar structure, can have convex groove or perforation in planar structure.
The outer ledge of damping layer 2 is connected with the shell 3, the damping layer center or non-edge position and institute
State bone-conduction speaker 1 to connect, the bone-conduction speaker 1 is suspended on by the damping layer 2 on the shell 3.
Described shell 3 is U-shaped shell, and the damping layer 2 is located at U-shaped opening.
The bone-conduction speaker 1 is shaken piece 12 and connector 13 by bone-conduction speaker transducer 11, bone-conduction speaker
Form；The bone-conduction speaker piece 12 that shakes is connected with the damping layer 2, and the bone-conduction speaker piece 12 that shakes is in damping layer
2 inside.
Because bone-conduction speaker is mounted in earphone outer covering, his vibration area is big necessarily without earphone outer covering；Together
When common headphones be using vibrating diaphragm vibrations air sounding, but common headphones leakage sound be seldom, it can be seen that bone conduction earphone leak
Sound is mainly vibrated by earphone outer covering to be produced.Above-mentioned technical proposal is by damping layer by mechanical oscillation caused by bone-conduction speaker
Absorb, sound will be leaked caused by the energy transmission to earphone outer covering of mechanical oscillation so as to reduce.
Embodiment 3
As shown in figure 5, the utility model, which provides a kind of bone conduction earphone, suppresses leakage sound structure, including bone-conduction speaker
1st, damping layer 2 and shell 3, the bone-conduction speaker 1 are connected with damping layer 2, and the damping layer 2 is connected with shell 3；Institute
State bone-conduction speaker 1 and had no with shell 3 and directly contacted, separated by damping layer 2.Bone-conduction speaker 1 is working
Middle generation mechanical oscillation, row buffering is entered by damping layer 2, only few portion of energy is delivered in shell 3.
Described damping layer 2 is the damping layer of elastic material.
The damping layer 2 be rubber, TPR, TPX, TPV, TPO, TPU, TPEE, TPE, SEBS, SBS, SIS, TPSIV,
One or more in PVC, PU, silica gel, sheet metal, paper.
The main body of the damping layer 2 is planar structure, can have convex groove or perforation in planar structure.
The outer ledge of damping layer 2 is connected with the shell 3, the damping layer center or non-edge position and institute
State bone-conduction speaker 1 to connect, the bone-conduction speaker 1 is suspended on by the damping layer 2 on the shell 3.
Described shell 3 is U-shaped shell, and the damping layer 2 is located at U-shaped opening.
The bone-conduction speaker 1 is shaken piece 12 and connector 13 by bone-conduction speaker transducer 11, bone-conduction speaker
Form；The bone-conduction speaker piece 12 that shakes is connected with the damping layer 2, and the bone-conduction speaker piece 12 that shakes is in damping layer
2 inside, the bone-conduction speaker piece 12 that shakes are connected with damping layer 2 using physical bond mode.
Because bone-conduction speaker is mounted in earphone outer covering, his vibration area is big necessarily without earphone outer covering；Together
When common headphones be using vibrating diaphragm vibrations air sounding, but common headphones leakage sound be seldom, it can be seen that bone conduction earphone leak
Sound is mainly vibrated by earphone outer covering to be produced.Above-mentioned technical proposal is by damping layer by mechanical oscillation caused by bone-conduction speaker
Absorb, sound will be leaked caused by the energy transmission to earphone outer covering of mechanical oscillation so as to reduce.
Above-described embodiment is the preferable embodiment of the utility model, but embodiment of the present utility model is not by above-mentioned
The limitation of embodiment, it is other it is any without departing from Spirit Essence of the present utility model with made under principle change, modify, replace
Generation, combination, simplify, should be equivalent substitute mode, be included within the scope of protection of the utility model.
Claims (10)
1. a kind of bone conduction earphone suppresses leakage sound structure, it is characterised in that：Including bone-conduction speaker, damping layer and shell, institute
State bone-conduction speaker to be connected with damping layer, the damping layer is connected with shell；The bone-conduction speaker and shell are simultaneously
Without directly contacting, separated by damping layer.
2. bone conduction earphone according to claim 1 suppresses leakage sound structure, it is characterised in that：Described damping layer is elasticity
The damping layer of material.
3. bone conduction earphone according to claim 1 suppresses leakage sound structure, it is characterised in that：The damping layer be rubber,
One in TPR, TPX, TPV, TPO, TPU, TPEE, TPE, SEBS, SBS, SIS, TPSIV, PVC, PU, silica gel, sheet metal, paper
Kind is a variety of.
4. bone conduction earphone according to claim 1 suppresses leakage sound structure, it is characterised in that：The main body of the damping layer is
Planar structure, can there are convex groove or perforation in planar structure.
5. bone conduction earphone according to claim 1 suppresses leakage sound structure, it is characterised in that：The damping layer outer ledge
With the cage connection, the damping layer center or non-edge position are connected with the bone-conduction speaker, make the bone
Conduction speaker is hung on the housing by the damping layer.
6. bone conduction earphone according to claim 1 suppresses leakage sound structure, it is characterised in that：Described shell is U-shaped outer
Shell, the damping layer are located at U-shaped opening.
7. bone conduction earphone according to claim 1 suppresses leakage sound structure, it is characterised in that：The bone-conduction speaker by
Shake piece and connector of bone-conduction speaker transducer, bone-conduction speaker is formed；The bone-conduction speaker piece that shakes subtracts with described
The layer that shakes connects.
8. bone conduction earphone according to claim 7 suppresses leakage sound structure, it is characterised in that：The bone-conduction speaker shakes
Piece passes through damping layer.
9. bone conduction earphone according to claim 7 suppresses leakage sound structure, it is characterised in that：The bone-conduction speaker shakes
Piece is in the inside of damping layer.
10. bone conduction earphone according to claim 7 suppresses leakage sound structure, it is characterised in that：The bone-conduction speaker
The piece that shakes is in the inside of damping layer, and the bone-conduction speaker piece that shakes is connected with damping layer using physical bond mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720946277.2U CN206948584U (en) | 2017-07-31 | 2017-07-31 | A kind of bone conduction earphone suppresses leakage sound structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720946277.2U CN206948584U (en) | 2017-07-31 | 2017-07-31 | A kind of bone conduction earphone suppresses leakage sound structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206948584U true CN206948584U (en) | 2018-01-30 |
Family
ID=61370744
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720946277.2U Active CN206948584U (en) | 2017-07-31 | 2017-07-31 | A kind of bone conduction earphone suppresses leakage sound structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206948584U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107222805A (en) * | 2017-07-31 | 2017-09-29 | 深圳市微运动信息科技有限公司 | A kind of bone conduction earphone suppresses leakage sound structure |
| CN109121038A (en) * | 2018-08-30 | 2019-01-01 | Oppo广东移动通信有限公司 | It is a kind of to inhibit to leak the wearable device of sound, inhibit leakage sound method and storage medium |
-
2017
- 2017-07-31 CN CN201720946277.2U patent/CN206948584U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107222805A (en) * | 2017-07-31 | 2017-09-29 | 深圳市微运动信息科技有限公司 | A kind of bone conduction earphone suppresses leakage sound structure |
| CN109121038A (en) * | 2018-08-30 | 2019-01-01 | Oppo广东移动通信有限公司 | It is a kind of to inhibit to leak the wearable device of sound, inhibit leakage sound method and storage medium |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107222805A (en) | A kind of bone conduction earphone suppresses leakage sound structure | |
| US8325963B2 (en) | Bone-conduction microphone built-in headset | |
| JP4861079B2 (en) | Bone conduction receiver | |
| JP4548783B2 (en) | headphone | |
| US8005249B2 (en) | Ear canal signal converting method, ear canal transducer and headset | |
| CN109889937A (en) | With the earphone for meeting ergonomics cushion and its meet ergonomics cushion | |
| WO2016046810A2 (en) | Wearable audio device | |
| JP2015023495A (en) | Earphone microphone | |
| JP7020398B2 (en) | Wearable device | |
| JP2014166241A (en) | Vibration-electricity conversion device, and electric type vibration amplification device using the same | |
| JP6660402B2 (en) | Protective helmet | |
| CN206948584U (en) | A kind of bone conduction earphone suppresses leakage sound structure | |
| CN102883253A (en) | Piezoelectric ceramic bone conduction vibrator | |
| JP4310477B2 (en) | Noise reduction device | |
| CN112333598A (en) | Earmuff and head-mounted bone conduction earphone | |
| CN207083204U (en) | A kind of bone passes microphone and its earphone | |
| CN115250395A (en) | Acoustic input-output device | |
| CN207783077U (en) | The piezoelectric type osophone structure and piezoelectric type osophone of leakproof sound | |
| CN202143194U (en) | Vacuum earphone | |
| CN205545774U (en) | Earphone earmuff and be equipped with earphone of this earmuff | |
| CN210431877U (en) | Bone conduction oscillator with frequency-reducing and noise-reducing functions | |
| CN202713575U (en) | Vacuum sound-proof earphone | |
| CN116762364A (en) | Acoustic input-output device | |
| CN203369437U (en) | Anti-noise helmet for examination through large-sized diagnostic device | |
| CN219420975U (en) | Microphone and electronic device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |