CN219371059U - Packaging structure for COB circuit - Google Patents

Abstract

The utility model discloses a packaging structure for a COB circuit, which comprises a PCB circuit substrate, wherein a reflecting layer is arranged at the top of the PCB circuit substrate, a packaging transparent layer is arranged at the top of the reflecting layer, an electrode layer is arranged in the packaging transparent layer, a flip LED blue light chip is arranged on the outer side of the electrode layer, a positive white fluorescent powder mixture is arranged on one side of the flip LED blue light chip, a warm white fluorescent powder mixture is arranged on the other side of the positive white fluorescent powder mixture, a fluorescent powder wrapping layer is arranged on one side of the warm white fluorescent powder mixture, and a silica gel wrapping layer is arranged on the other side of the fluorescent powder wrapping layer. According to the utility model, through the flip LED blue light chip and the PCB circuit substrate, the same area light controllable technology can be directly realized by matching with warm white fluorescent powder mixing, positive white fluorescent powder mixing and the use of a reflecting layer, the pure light color can be ensured, the wafer level packaging can be realized, the multi-color gamut can be realized, and different white lights can be prepared on the same integrated circuit PCB substrate by adopting coating.

Description

Packaging structure for COB circuit

Technical Field

The utility model relates to the technical field of circuit packaging, in particular to a packaging structure for a COB circuit.

Background

The packaging is a process of assembling an integrated circuit into a chip end product, namely simply placing an integrated circuit bare chip produced by a foundry on a substrate with a bearing function, leading out a pipe pin, and then fixedly packaging the pipe pin into a whole, wherein the COB packaging is a chip-on-board packaging, and is a technology for solving the problem of heat dissipation of an LED. The bare chip is adhered to the interconnection substrate by conductive or non-conductive adhesive, and then wire bonding is carried out to realize the electrical connection, if the bare chip is directly exposed in the air, COB encapsulation is easy to be polluted or damaged by people, the function of the chip is affected or destroyed, and then the chip and the bonding wire are encapsulated by the adhesive. This form of packaging is also known as soft encapsulation and often requires the use of white light coating for packaging during COB circuit packaging.

The existing COB circuit still has more defects in packaging white light coating, for example, the LED packaging technology is to place chips on a PCB substrate and make yellow fluorescent powder on all points of a dam to excite white light, and the LED packaging technology has the problems of impure light color, single color gamut and low luminous efficiency.

Disclosure of Invention

The present utility model is directed to a packaging structure for COB circuits, which solves the above-mentioned problems of the related art.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a packaging structure for in COB circuit, includes PCB circuit substrate, PCB circuit substrate's top is equipped with the reflection stratum, the top of reflection stratum is equipped with the encapsulation transparent layer, the inside of encapsulation transparent layer is equipped with the electrode layer, and is the bonding between electrode layer and the PCB circuit substrate, the outside of electrode layer is equipped with flip-chip LED blue light chip, one side of flip-chip LED blue light chip is equipped with positive white phosphor powder and mixes, the opposite side that positive white phosphor powder mixes is equipped with warm white phosphor powder and mixes, one side that warm white phosphor powder mixes is equipped with the phosphor powder parcel layer, the opposite side of phosphor powder parcel layer is equipped with the silica gel parcel layer.

Preferably, the flip LED blue light chips are uniformly distributed on the PCB circuit substrate, and the interval between the adjacent flip LED blue light chips is 0.5mm.

Preferably, one surface of the reflecting layer is attached to one surface of the PCB circuit substrate, and the flip LED blue light chip is located on the side surface of the reflecting layer.

Preferably, the electrode layer is positioned at the bottom of the flip LED blue light chip.

Preferably, the flip LED blue light chip comprises an epitaxial substrate, an N-type epitaxial layer, a light-emitting layer and a P-type epitaxial layer, so that the PCB circuit substrate is arranged on the bottom surface of the flip LED blue light chip epitaxial layer.

Compared with the prior art, the utility model has the beneficial effects that:

according to the utility model, through the flip LED blue light chip and the PCB circuit substrate, the same area light controllable technology can be directly realized by matching with the warm white fluorescent powder mixing, the positive white fluorescent powder mixing and the use of the reflecting layer, the pure light color can be ensured, the wafer level packaging can be realized, the multi-color gamut is realized, in other words, different white lights can be prepared on the same integrated circuit PCB substrate by adopting coating, the multi-field use scene can be realized, and the LED devices with different power levels can be provided by adopting a coating type packaging mode.

Drawings

FIG. 1 is a schematic view of the overall outside structure of the present utility model;

fig. 2 is a schematic diagram of the overall internal structure of the present utility model.

In the figure: 1. a PCB circuit substrate; 2. flip-chip LED blue light chip; 3. mixing warm white fluorescent powder; 4. mixing the white fluorescent powder; 5. a reflective layer; 6. packaging the transparent layer; 7. a fluorescent powder coating layer; 8. a silica gel wrapping layer; 9. an electrode layer.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

In the description of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific direction, be configured and operated in the specific direction, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "provided," "connected," and the like are to be construed broadly, and may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

Referring to fig. 1-2, an embodiment of the present utility model is provided: the utility model provides a packaging structure for in COB circuit, including PCB circuit substrate 1, the top of PCB circuit substrate 1 is equipped with reflector layer 5, the top of reflector layer 5 is equipped with encapsulation transparent layer 6, the inside of encapsulation transparent layer 6 is equipped with electrode layer 9, and be the bonding between electrode layer 9 and the PCB circuit substrate 1, electrode layer 9's outside is equipped with flip-chip LED blue light chip 2, one side of flip-chip LED blue light chip 2 is equipped with positive white phosphor powder and mixes 4, the opposite side of positive white phosphor powder mixes 4 is equipped with warm white phosphor powder and mixes 3, one side of warm white phosphor powder mix 3 is equipped with phosphor powder parcel layer 7, the opposite side of phosphor powder parcel layer 7 is equipped with silica gel parcel layer 8.

Further, the flip LED blue light chips 2 are located on the PCB circuit substrate 1 and are evenly distributed, the distance between every two adjacent flip LED blue light chips 2 is 0.5mm, the PCB circuit substrate 1 is etched to be the same as the electrode layer 9 of the flip LED blue light chips 2 in size, array arrangement circuit combination is made, and luminous flux output is increased.

Further, one face of the reflecting layer 5 is attached to one face of the PCB circuit substrate 1, the flip LED blue light chip 2 is located on the side face of the reflecting layer 5, light output is increased, the flip LED blue light chip 2 is wrapped, the light emitting range is controlled in the coating layer, and other LED light emitting colors are not interfered during operation.

Further, an electrode layer 9 is located at the bottom of the flip-chip LED blue chip 2.

Further, the flip LED blue light chip 2 comprises an epitaxial substrate, an N-type epitaxial layer, a light-emitting layer and a P-type epitaxial layer, so that the PCB circuit substrate 1 is arranged on the bottom surface of the epitaxial layer of the flip LED blue light chip 2, the contact area between the packaging transparent layer 6 and the white LED and the warm white LED is increased, the packaging transparent layer 6 and the flip LED blue light chip 2 are firmer, and the packaging structure of the product has higher sealing performance.

Working principle: before the device is used, a user firstly detects the device, uses the device after confirming that no problem exists, etches the PCB circuit substrate 1, makes array arrangement circuit combination as same as the electrode layer 9 of the flip LED blue light chip 2, coats tin paste on the circuit position of the electrode layer 9 of the flip LED blue light chip 2 correspondingly etched to bind the circuit position of the electrode layer 9 of the PCB circuit substrate 1, carries out electrifying operation, places the flip LED blue light chip 2 bound to the circuit substrate, uses a coated steel mesh with a window to carry out image verification, confirms the color position of a luminous point of a product, introduces the debugged normal white fluorescent powder mixed 4 silica gel coating layer 8 onto the coated window, carries out coating operation, carries out coating test, toasts and cures the circuit, coats the same piece of PCB circuit substrate 1, introduces the coated steel mesh with the window for secondary use, carries out secondary coating operation, carries out coating and curing the color position of the debugged warm white fluorescent powder mixed 3 silica gel coating layer 8, adds the coated layer 6 on the coated layer, and forms a transparent fluorescent powder coated layer 5 in the coated window, and can be used for curing the LED coated white fluorescent powder coated circuit to obtain a cured coating circuit.

It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present utility model may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims (5)

1. The utility model provides a packaging structure for in COB circuit, includes PCB circuit substrate (1), its characterized in that: the top of PCB circuit substrate (1) is equipped with reflection stratum (5), the top of reflection stratum (5) is equipped with encapsulation transparent layer (6), the inside of encapsulation transparent layer (6) is equipped with electrode layer (9), and bonds between electrode layer (9) and PCB circuit substrate (1), the outside of electrode layer (9) is equipped with flip-chip LED blue light chip (2), one side of flip-chip LED blue light chip (2) is equipped with positive white phosphor powder and mixes (4), the opposite side that positive white phosphor powder mixes (4) is equipped with warm white phosphor powder and mixes (3), one side that warm white phosphor powder mixes (3) is equipped with phosphor powder parcel layer (7), the opposite side of phosphor powder parcel layer (7) is equipped with silica gel parcel layer (8).

2. The package structure for use in COB circuits of claim 1, wherein: the flip LED blue light chips (2) are uniformly distributed on the PCB circuit substrate (1), and the interval between the adjacent flip LED blue light chips (2) is 0.5mm.

3. The package structure for use in COB circuits of claim 1, wherein: one surface of the reflecting layer (5) is attached to one surface of the PCB circuit substrate (1), and the flip LED blue light chip (2) is located on the side surface of the reflecting layer (5).

4. The package structure for use in COB circuits of claim 1, wherein: the electrode layer (9) is positioned at the bottom of the flip LED blue light chip (2).

5. The package structure for use in COB circuits of claim 1, wherein: the flip LED blue light chip (2) comprises an epitaxial substrate, an N-type epitaxial layer, a light-emitting layer and a P-type epitaxial layer, so that the PCB circuit substrate (1) is arranged on the bottom surface of the epitaxial layer of the flip LED blue light chip (2).