CN219369814U - Wafer fixing mechanism of probe station - Google Patents

Abstract

The utility model provides a wafer fixing mechanism of a probe station, which comprises an objective table, wherein the objective table is provided with four linear tracks. The bottom of the object stage is provided with a fastening device, and the fastening device comprises a horizontal driving mechanism, a rotating plate, four moving parts and four sliding blocks. According to the wafer fixing device, one of the moving parts is driven by the horizontal driving mechanism, and the moving part drives the rotating plate to rotate, so that the other moving parts slide, and the sliding block is further driven to move along the linear track, so that the wafer fixing work is completed. The utility model has the advantages of exquisite design and simple and convenient operation, can ensure that the wafer to be detected arranged on the probe station is positioned at the accurate position, and can avoid the wafer from shifting in the detection process to influence the detection result. In addition, the device can be suitable for fixing wafers with different sizes, has strong inclusion and is more practical.

Description

Wafer fixing mechanism of probe station

Technical Field

The utility model relates to the technical field of semiconductor test equipment, in particular to a wafer fixing mechanism of a probe station.

Background

The probe station is one of important test equipment in the semiconductor industry, is widely applied to research and development of precise electric measurement of complex and high-speed devices, and aims to ensure quality and reliability and reduce research and development time and cost of a device manufacturing process. Firstly, placing a device to be measured on a probe stage (chuck) by a tester, and moving the device X-Y under the cooperation of a microscope to find the position to be detected; then the tester rotates the three-way knob of X-Y-Z on the probe seat to control the front probe (radio frequency or direct current probe) to precisely prick the tested point, so that the signal line is conducted with an external tester, and the tester can obtain the required electrical performance parameters.

A wafer is a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the wafer has a circular shape. In order to ensure the quality of the wafer, the wafer needs to be placed on a detection device after the wafer is processed, and different parts of the wafer are detected by using a probe. In the detection process, the wafer is directly placed on the workbench, so that sliding is easy to occur, on one hand, the detection result can be influenced, and on the other hand, the wafer is easy to damage.

Disclosure of Invention

The utility model aims to solve the defects in the prior art and provides a wafer fixing mechanism of a probe station.

In order to achieve the above purpose, the utility model adopts the following technical scheme: the utility model provides a probe platform wafer fixed establishment, includes the objective table, the objective table is square diaphragm structure, the objective table is equipped with four rectilinear track, four rectilinear track respectively by the four corners of objective table is offered to the center, four rectilinear track is intercommunication each other.

The bottom of the object stage is provided with a fastening device, and the fastening device comprises a horizontal driving mechanism, a rotating plate, four moving parts and four sliding blocks. The rotating plate is of a square transverse plate structure and is connected to the center of the bottom of the objective table through a rotating shaft; the four moving parts are respectively arranged at four right-angle ends of the rotating plate, the other ends of the four moving parts are respectively arranged in the four linear tracks in a penetrating way, and the top ends of the four moving parts are respectively fixedly connected with one sliding block; the four sliding blocks are positioned on the upper side surface of the objective table, the sliding blocks are provided with clamping concave surfaces, and the clamping concave surfaces face to the center of the objective table; the horizontal driving mechanism is electrically connected with one of the four moving parts, and the force application direction of the horizontal driving mechanism is consistent with the direction corresponding to the linear track.

According to the wafer fixing device, one of the moving parts is driven by the horizontal driving mechanism, and the moving part drives the rotating plate to rotate, so that the other moving parts slide, and the sliding block is further driven to move along the linear track, so that the wafer fixing work is completed. The utility model has the advantages of exquisite design and simple and convenient operation, can ensure that the wafer to be detected arranged on the probe station is positioned at the accurate position, and can avoid the wafer from shifting in the detection process to influence the detection result. In addition, the device can be suitable for fixing wafers with different sizes, has strong inclusion and is more practical.

Preferably, the moving part includes: the movable plate is arranged in the linear track in a penetrating mode, the outer end of the short side of the movable plate is connected with the bottom surface of the movable plate in a rotating mode through a rotating shaft, and the outer end of the long side of the movable plate is connected with the right angle of the movable plate in a rotating mode through the rotating shaft.

Preferably, the horizontal driving device comprises an air cylinder and a push rod, wherein the output end of the air cylinder is electrically connected with the push rod, and the other end of the push rod is fixedly connected with the bottom of one of the four moving plates. The design is exquisite, only need through the drive one the motion board just can realize four the motion of opening and shutting of motion board, energy-conservation is high-efficient.

Preferably, a pressure sensor is arranged on the inner side surface of the sliding block, and the pressure sensor is electrically connected with the input control end of the air cylinder. By setting the pressure threshold, the wafer to be tested is prevented from being damaged due to excessive extrusion.

Preferably, the sliding block is of an L-shaped structure, and the lengths of two right-angle sides of the sliding block are the same, so that stress points for fixing the wafer are increased, and pressure damage to the wafer is reduced.

Preferably, the inner side surface of the sliding block is provided with a buffer rubber layer, so that the damage to the wafer in the working process is reduced, and the quality of the wafer is ensured.

Compared with the prior art, the utility model has the beneficial effects that:

1. according to the wafer fixing device, one of the moving parts is driven by the horizontal driving mechanism, and the moving part drives the rotating plate to rotate, so that the other moving parts slide, and the sliding block is further driven to move along the linear track, so that the wafer fixing work is completed. The utility model has the advantages of exquisite design and simple and convenient operation, can ensure that the wafer to be detected arranged on the probe station is positioned at the accurate position, and can avoid the wafer from shifting in the detection process to influence the detection result. In addition, the device can be suitable for fixing wafers with different sizes, has strong inclusion and is more practical.

2. The moving member of the present utility model includes: the reverse T-shaped movable plate and the 7-shaped connecting rod can realize the opening and closing movement of four movable plates by driving one movable plate through the cooperation with the rotating plate, and the energy conservation and high efficiency can be realized.

Drawings

FIG. 1 is a top view of embodiment 1 of the present utility model;

FIG. 2 is a partial schematic view of a fastening device according to embodiment 1 of the present utility model;

FIG. 3 is a schematic view showing the bottom structure of embodiment 1 of the present utility model;

FIG. 4 is a schematic view of a horizontal driving mechanism according to embodiment 1 of the present utility model;

description of the reference numerals: 1. an objective table; 2. a linear rail; 3. a horizontal driving mechanism; 4. a rotating plate; 5. a moving member; 6. a slide block; 7. a moving plate; 8. a connecting rod; 9. a cylinder; 10. a push rod.

Detailed Description

In order to make the present application solution better understood by those skilled in the art, the following description will be made in detail and with reference to the accompanying drawings in the embodiments of the present application, it is apparent that the described embodiments are only some embodiments of the present application, not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, shall fall within the scope of the present application.

It should be noted that, in the case of no conflict, the embodiments and features in the embodiments may be combined with each other. The present application will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.

Example 1:

as shown in fig. 1, a wafer fixing mechanism of a probe station includes an objective table 1, the objective table 1 is of a square transverse plate structure, the objective table 1 is provided with four linear tracks 2, the four linear tracks 2 are respectively arranged from four corners of the objective table 1 to the center, and the four linear tracks 2 are not communicated with each other.

As shown in fig. 1-4, a fastening device is arranged at the bottom of the object stage 1, and the fastening device comprises a horizontal driving mechanism 3, a rotating plate 4, four moving parts 5 and four sliding blocks 6. The rotating plate 4 is of a square transverse plate structure and is connected to the center of the bottom of the objective table 1 through a rotating shaft; the four moving parts 5 are respectively arranged at the four right-angle ends of the rotating plate 4, the other ends of the four moving parts 5 are respectively penetrated into the four linear tracks 2, and the top ends of the four moving parts are respectively fixedly connected with a sliding block 6; the four sliding blocks 6 are all positioned on the upper side surface of the objective table 1, the sliding blocks 6 are provided with clamping concave surfaces, and the clamping concave surfaces face the center of the objective table 1; the horizontal driving mechanism 3 is electrically connected with one of the four moving parts 5, and the force application direction of the horizontal driving mechanism is consistent with the direction of the corresponding linear track 2.

According to the wafer fixing device, one of the moving parts 5 is driven by the horizontal driving mechanism 3, the moving part 5 drives the rotating plate 4 to rotate, so that the other moving parts 5 slide, and the sliding block 6 is further driven to move along the linear track 2, so that the wafer fixing work is completed. The utility model has the advantages of exquisite design and simple and convenient operation, can ensure that the wafer to be detected arranged on the probe station is positioned at the accurate position, and can avoid the wafer from shifting in the detection process to influence the detection result. In addition, the device can be suitable for fixing wafers with different sizes, has strong inclusion and is more practical.

Preferably, the moving member 5 includes: the reverse T-shaped movable plate 7 and the 7-shaped connecting rod 8, the movable plate 7 is arranged in the linear track 2 in a penetrating mode, the outer end of the short side of the connecting rod 8 is rotationally connected with the bottom surface of the movable plate 7 through a rotating shaft, and the outer end of the long side of the connecting rod 8 is rotationally connected with the right angle of the rotating plate 4 through the rotating shaft.

In the embodiment, when the four sliders 6 are all located at the right angles corresponding to the stage 1, the state of the moving member 5 is shown in fig. 2, and at this time, the connecting lines at the two ends of the connecting rod 8 correspond to the linear rail 2, and the distance between the connection position of the moving plate 7 and the rotating plate 4 is the largest. When the moving plate 7 slides along the linear track 2 towards the center of the objective table 1, the rotating plate 4 rotates clockwise under the action of the connecting rod 8; when the moving plate 7 slides along the linear rail 2 toward the right-angle end of the stage 1, the rotating plate 4 rotates in the counterclockwise direction by the connecting rod 8.

Preferably, the horizontal driving device comprises an air cylinder 9 and a push rod 10, wherein the output end of the air cylinder 9 is electrically connected with the push rod 10, and the other end of the push rod 10 is fixedly connected to the bottom of one of the four moving plates 7. The design is exquisite, only need through driving a movable plate 7, just can realize the deciliter motion of four movable plates 7, energy-conserving high efficiency.

In the embodiment, an air cylinder 9 is used, one of the moving plates 7 is fixedly connected through a push rod 10, when the push rod 10 contracts or changes in depth, the push rod slides along the corresponding linear track 2, and the rotating plate 4 moves clockwise or anticlockwise, so that each sliding block 6 gathers towards the center or disperses towards the periphery.

Preferably, the slide block 6 is in an L-shaped structure, and the lengths of two right-angle sides of the slide block 6 are the same, so that stress points for fixing the wafer are increased, and pressure damage to the wafer is reduced.

Preferably, a pressure sensor is arranged on the inner side surface of the sliding block 6, and the pressure sensor is electrically connected with an input control end of the air cylinder 9. By setting the pressure threshold, the wafer to be tested is prevented from being damaged due to excessive extrusion.

In the embodiment, two independent pressure sensors are respectively arranged on the inner sides of the four sliding blocks 6 during implementation, eight pressure sensors are electrically connected with an input control end of the air cylinder 9, a pressure threshold is arranged at the control end, and a wafer exceeding the pressure threshold has damage risk. When the stress values of the eight pressure sensors simultaneously exceed the set threshold value, the cylinder is stopped. The eight pressure sensors can further ensure the stability of the fixed wafer, and in addition, the stress of the wafer can be monitored and analyzed on the one hand, and a certain protection effect is achieved on the other hand.

Preferably, the inner side surface of the sliding block 6 is provided with a buffer rubber layer, so that the damage to the wafer in the working process is reduced, and the quality of the wafer is ensured.

When the wafer fixing device is particularly used, a tester places a wafer in the center of the object stage 1, and then drives the push rod 10 to shrink through the air cylinder 9, so that the four sliding blocks 6 slide towards the center along the corresponding linear track 2, and the wafer is fixed. The testers can combine self experience observation and monitoring and alarming of the pressure sensor to brake the air cylinder 9, so that the wafer is fixed, and meanwhile, the damage to the wafer is reduced. After the test is completed, the push rod 10 is driven to extend through the air cylinder 9, so that the four sliding blocks 6 slide along the corresponding linear tracks 2 to the periphery, and the fixing can be released.

The foregoing is merely a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and variations may be made to the present application by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims (6)

1. The utility model provides a probe platform wafer fixed establishment, includes objective table, its characterized in that: the object stage is of a square transverse plate structure, the object stage is provided with four linear tracks, the four linear tracks are respectively formed from four corners of the object stage to the center, and the four linear tracks are not communicated with each other;

the bottom of the objective table is provided with a fastening device, and the fastening device comprises a horizontal driving mechanism, a rotating plate, four moving parts and four sliding blocks; the rotating plate is of a square transverse plate structure and is connected to the center of the bottom of the objective table through a rotating shaft; the four moving parts are respectively arranged at four right-angle ends of the rotating plate, the other ends of the four moving parts are respectively arranged in the four linear tracks in a penetrating way, and the top ends of the four moving parts are respectively fixedly connected with one sliding block; the four sliding blocks are positioned on the upper side surface of the objective table, the sliding blocks are provided with clamping concave surfaces, and the clamping concave surfaces face to the center of the objective table; the horizontal driving mechanism is electrically connected with one of the four moving parts, and the force application direction of the horizontal driving mechanism is consistent with the direction corresponding to the linear track.

2. The probe station wafer securing mechanism according to claim 1, wherein: the moving member includes: the movable plate is arranged in the linear track in a penetrating mode, the outer end of the short side of the movable plate is connected with the bottom surface of the movable plate in a rotating mode through a rotating shaft, and the outer end of the long side of the movable plate is connected with the right angle of the movable plate in a rotating mode through the rotating shaft.

3. The probe station wafer securing mechanism according to claim 2, wherein: the horizontal driving mechanism comprises an air cylinder and a push rod, the output end of the air cylinder is electrically connected with the push rod, and the other end of the push rod is fixedly connected to the bottom of one of the four movable plates.

4. A probe station wafer securing mechanism according to claim 3, wherein: the inner side surface of the sliding block is provided with a pressure sensor, and the pressure sensor is electrically connected with the input control end of the air cylinder.

5. The probe station wafer securing mechanism according to claim 1, wherein: the sliding block is of an L-shaped structure, and the lengths of two right-angle sides of the sliding block are the same.

6. The probe station wafer securing mechanism according to claim 1, wherein: the inner side surface of the sliding block is provided with a buffer rubber layer.