CN219356993U - A divide material sieving mechanism for high accuracy silicon chip vacuum coating equipment - Google Patents
A divide material sieving mechanism for high accuracy silicon chip vacuum coating equipment Download PDFInfo
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- CN219356993U CN219356993U CN202320424638.2U CN202320424638U CN219356993U CN 219356993 U CN219356993 U CN 219356993U CN 202320424638 U CN202320424638 U CN 202320424638U CN 219356993 U CN219356993 U CN 219356993U
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- material separation
- screening device
- coating equipment
- silicon chip
- vacuum coating
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model relates to the technical field of material separation and screening, in particular to a material separation and screening device for high-precision silicon wafer vacuum coating equipment, which comprises support columns arranged on two sides of a conveying pull belt, wherein a driving motor is arranged on the inner side of the conveying pull belt, a conveying belt is arranged on the surface of a driving end of the driving motor, a placing groove is formed in the surface of the conveying belt, and two mounting frames are arranged above the conveying pull belt. This a divide material sieving mechanism for high accuracy silicon chip vacuum coating equipment carries out high accuracy's detection to the silicon chip through the setting of vision detection camera and light filling lamp, and by translation actuating mechanism, lift cylinder and letter sorting suction nozzle cooperation use again, in carrying out automatic vacuum adsorption to problematic silicon chip and transferring the storage frame, vacuum adsorption can not harm the silicon chip, avoided the risk of damage silicon chip when the manual work is taken, reduced manufacturing cost, the device material loading, detect and steps such as letter sorting all adopt automated operation, improved the efficiency of dividing material screening greatly.
Description
Technical Field
The utility model relates to the technical field of material separation screening, in particular to a material separation screening device for high-precision silicon wafer vacuum coating equipment.
Background
The vacuum coating is mainly used for coating films which are required to be carried out under a higher vacuum degree, and particularly comprises various types, including vacuum ion evaporation, magnetron sputtering, MBE molecular beam epitaxy, PLD laser sputtering deposition and the like, the main thinking is that the vacuum coating is divided into evaporation and sputtering, the single-sided coating is generally carried out on the film coating of a flexible material by adopting a single mode, such as evaporation coating or sputtering coating, and the like, the evaporation coating is carried out on the film coating material by heating and gasifying the film coating material in a vacuum state to carry out deposition film forming, the film coating speed is high, the efficiency is high, the sputtering film coating is formed by sputtering material particles through glow discharge ionization gas to bombard the target material, the film coating stability is good, the uniformity is good, the film layer is compact, the vacuum film coating is widely applied to various fields, the silicon wafer is a main raw material for solar cell production, and the quality of the film coating directly determines the quality of cell printing in the subsequent process, thereby influencing the performance of the solar cell.
Therefore, the silicon wafers after coating are required to be sorted, defective silicon wafers with defects are removed, but at present, a lot of high-precision silicon wafer sorting and screening measures after coating are mainly based on semi-manual detection, so that the sorting and screening efficiency is low, and the high-precision silicon wafers and the silicon wafers which are unqualified but repairable in detection can be further damaged by manual taking and placing, so that the later use of the qualified high-precision silicon wafers is affected, the production cost is increased, and the like, and the high-efficiency requirement of industrial production is difficult to reach.
Disclosure of Invention
Aiming at the defects of the prior art, the utility model provides a material separating and screening device for high-precision silicon wafer vacuum coating equipment, which solves the problems in the prior art.
In order to achieve the above purpose, the utility model is realized by the following technical scheme: a divide material sieving mechanism for high accuracy silicon chip vacuum coating equipment, including installing the support column in the conveyer belt both sides, the inboard of conveyer belt is provided with driving motor, driving motor's drive end surface is provided with the conveyer belt, the standing groove has been seted up on the surface of conveyer belt, the top of conveyer belt is provided with two mounting brackets, visual detection camera set up in one of them on the mounting bracket, translation actuating mechanism set up in another on the mounting bracket, the drive end of translation actuating mechanism passes through the bolt and installs the lift cylinder, the drive end of lift cylinder is provided with the letter sorting suction nozzle, one side of conveyer belt is provided with the storage frame that is used for collecting the unqualified product.
Optionally, a protection cushion for improving the protection force on the silicon wafer is stuck in the placing groove.
Optionally, the bottom of vision detection camera is provided with the light filling lamp that improves the detection effect, and the response subassembly set up in on the letter sorting suction nozzle.
Optionally, one side of the other mounting frame is provided with a vacuum generating component for extracting vacuum, and the vacuum generating component is connected with the sorting suction nozzle through an air pipe.
Optionally, the inside sliding connection of accomodating the frame has the movable frame, the surface of movable frame is provided with the flexible glue cover.
Optionally, the hollow lid has been cup jointed at the top of accomodating the frame, the operation groove has been seted up to accomodate the side of frame.
The utility model provides a material separating and screening device for high-precision silicon wafer vacuum coating equipment, which has the following beneficial effects:
this a divide material sieving mechanism for high accuracy silicon chip vacuum coating equipment, through the setting of conveyer belt and conveyer belt, can be with the automatic conveying of high accuracy silicon chip behind the coating film, through the setting of visual inspection camera and light filling lamp, carry out high accuracy's detection to the silicon chip, by translation actuating mechanism again, lift cylinder and letter sorting suction nozzle cooperation use, carry out automatic vacuum adsorption to the silicon chip that has problems and transfer to accomodate in the frame, vacuum adsorption can not harm the silicon chip, the risk of damaging the silicon chip when having avoided the manual work to take, manufacturing cost has been reduced, the device material loading, detect and steps such as letter sorting all adopt automated operation, the efficiency of dividing material sieving has been improved greatly, when protecting the silicon chip better through the setting of protection cushion, convenient change, surface accumulation impurity when preventing the use.
Drawings
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is an enlarged schematic view of the structure of FIG. 1A according to the present utility model;
fig. 3 is a schematic view of a storage frame structure according to the present utility model.
In the figure: 1. conveying a pull belt; 2. a support column; 3. a driving motor; 4. a conveyor belt; 5. a placement groove; 6. a mounting frame; 7. a visual inspection camera; 8. a translational drive mechanism; 9. a lifting cylinder; 10. sorting suction nozzles; 11. a storage frame; 12. protecting the soft cushion; 13. a light supplementing lamp; 14. a moving rack; 15. a hollow cover; 16. an operation groove; 17. a vacuum generating assembly; 18. and an induction component.
Description of the embodiments
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.
Referring to fig. 1 to 3, the present utility model provides a technical solution: the utility model provides a divide material sieving mechanism for high accuracy silicon chip vacuum coating equipment, including installing the support column 2 in the both sides of carrying the stretching strap 1, the inboard of carrying the stretching strap 1 is provided with driving motor 3, driving motor 3's drive end surface is provided with conveyer belt 4, carry the silicon chip to carry out the conveying between the station through driving motor 3 drive conveyer belt 4, standing groove 5 has been seted up on the surface of conveyer belt 4, the inside of standing groove 5 is pasted and is had protection cushion 12 that improves the protection dynamics to the silicon chip, make the high accuracy silicon chip after the coating film place and carry on protection cushion 12;
the top of carrying the pull belt 1 is provided with two mounting brackets 6, visual inspection camera 7 sets up on one of them mounting bracket 6, the bottom of visual inspection camera 7 is provided with the light filling lamp 13 that improves the detection effect, carry out high accuracy's detection to the silicon chip through visual inspection camera 7, the silicon chip condition after the understanding coating film, translation actuating mechanism 8 sets up on another mounting bracket 6, the drive end of translation actuating mechanism 8 has lift cylinder 9 through the bolt mounting, the drive end of lift cylinder 9 is provided with letter sorting suction nozzle 10, through translation actuating mechanism 8 translation drive lift cylinder 9, pick up the silicon chip through lift cylinder 9 lift of letter sorting suction nozzle 10, sensing assembly 18 sets up on letter sorting suction nozzle 10, the precision when improving letter sorting suction nozzle 10 letter sorting through sensing assembly 18, prevent to damage the silicon chip surface, one side of another mounting bracket 6 is provided with the vacuum generating assembly 17 that is used for extracting vacuum, vacuum generating assembly 17 is connected with letter sorting suction nozzle 10 through the trachea, make letter sorting suction nozzle 10 absorb, one side of carrying the pull belt 1 is provided with the frame 11 that is used for collecting the disqualified product, the inside sliding connection of frame 11 has the removal frame 14, the convenient operation personnel take out the silicon chip, the removal frame 14 has the hollow operation frame 14, the top is equipped with the frame 15 that the hollow operation personnel has cup jointed the frame 11, the removal frame 15, the convenient operation personnel has cup-jointed the top is equipped with the frame 11.
In the utility model, the working steps of the device are as follows:
after high-precision silicon wafer coating, the silicon wafer is placed on a protection cushion 12 of the conveyor belt 4, and the conveyor belt 4 is driven to move with the silicon wafer by a driving motor 3;
when the silicon wafer moves to the position of the first mounting frame 6, the vision detection camera 7 carries out high-precision vision detection on the passing silicon wafer;
when a problem is detected, the translation driving mechanism 8 is matched with the lifting cylinder 9, so that the sorting suction nozzle 10 adsorbs the transferred unqualified silicon wafers, the lifting cylinder 9 drives the sorting suction nozzle 10 to ascend, the sorting suction nozzle 10 moves above the storage frame 11 with the unqualified silicon wafers through the translation driving mechanism 8, the unqualified silicon wafers are thrown into the storage frame 11, and the qualified silicon wafers are conveyed to the tail end through the conveying belt 4;
when the storage frame 11 is fully stored, the hollow cover 15 is opened, an operator can take out the movable frame 14 with the whole silicon wafer through the operation groove 16, repair or recoating is performed, and then the empty movable frame 14 is placed in the storage frame 11.
The foregoing is only a preferred embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art, who is within the scope of the present utility model, should make equivalent substitutions or modifications according to the technical scheme of the present utility model and the inventive concept thereof, and should be covered by the scope of the present utility model.
Claims (6)
1. A divide material sieving mechanism for high accuracy silicon chip vacuum coating equipment, including installing support column (2) in carrying stretching strap (1) both sides, its characterized in that: the utility model discloses a conveyer belt, including conveyer belt (1), driving motor (3), conveyer belt (4) are provided with on the drive end surface of driving motor (3), standing groove (5) have been seted up on the surface of conveyer belt (4), the top of conveyer belt (1) is provided with two mounting brackets (6), vision detection camera (7) set up in one of them on mounting bracket (6), translation actuating mechanism (8) set up in another on mounting bracket (6), lift cylinder (9) are installed through the bolt to the drive end of translation actuating mechanism (8), the drive end of lift cylinder (9) is provided with letter sorting suction nozzle (10), one side of conveyer belt (1) is provided with and is used for collecting frame (11) of disqualified products.
2. The material separation and screening device for the high-precision silicon wafer vacuum coating equipment according to claim 1, wherein the material separation and screening device is characterized in that: a protection soft cushion (12) for improving the protection force on the silicon wafer is stuck in the placing groove (5).
3. The material separation and screening device for the high-precision silicon wafer vacuum coating equipment according to claim 1, wherein the material separation and screening device is characterized in that: the bottom of vision detection camera (7) is provided with light filling lamp (13) that improves the detection effect, and response subassembly (18) set up in on letter sorting suction nozzle (10).
4. The material separation and screening device for the high-precision silicon wafer vacuum coating equipment according to claim 1, wherein the material separation and screening device is characterized in that: one side of the other mounting frame (6) is provided with a vacuum generating component (17) for extracting vacuum, and the vacuum generating component (17) is connected with the sorting suction nozzle (10) through an air pipe.
5. The material separation and screening device for the high-precision silicon wafer vacuum coating equipment according to claim 1, wherein the material separation and screening device is characterized in that: the inside sliding connection of accomodating frame (11) has movable frame (14), the surface of movable frame (14) is provided with the flexible glue cover.
6. The material separation and screening device for the high-precision silicon wafer vacuum coating equipment according to claim 1, wherein the material separation and screening device is characterized in that: the top of the storage frame (11) is sleeved with a hollow cover (15), and the side surface of the storage frame (11) is provided with an operation groove (16).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320424638.2U CN219356993U (en) | 2023-03-08 | 2023-03-08 | A divide material sieving mechanism for high accuracy silicon chip vacuum coating equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320424638.2U CN219356993U (en) | 2023-03-08 | 2023-03-08 | A divide material sieving mechanism for high accuracy silicon chip vacuum coating equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219356993U true CN219356993U (en) | 2023-07-18 |
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ID=87140182
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320424638.2U Active CN219356993U (en) | 2023-03-08 | 2023-03-08 | A divide material sieving mechanism for high accuracy silicon chip vacuum coating equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219356993U (en) |
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2023
- 2023-03-08 CN CN202320424638.2U patent/CN219356993U/en active Active
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