CN219321318U

CN219321318U - Quick transfer device after silicon chip corrosion

Info

Publication number: CN219321318U
Application number: CN202320180865.5U
Authority: CN
Inventors: 王云飞; 贾世杰; 袁大飞; 李天兵; 董知悦; 魏守冲
Original assignee: Panshi Innovation Jiangsu Electronic Equipment Co ltd
Current assignee: Panshi Innovation Jiangsu Electronic Equipment Co ltd
Priority date: 2023-02-10
Filing date: 2023-02-10
Publication date: 2023-07-07
Anticipated expiration: 2033-02-10

Abstract

The utility model relates to a rapid transfer device after corrosion of a silicon wafer, which comprises a corrosion groove and a water groove positioned at one side of the corrosion groove; a power driving mechanism is arranged between the corrosion tank and the water tank and comprises a power output mechanism and a turnover swinging box, and the power output mechanism is in driving connection with the turnover swinging box through a transmission mechanism; the bottom of the turnover swinging box is provided with a silicon wafer to be transported, and the power output mechanism drives the silicon wafer to be transported positioned at the bottom of the turnover swinging box to do turnover motion through a transmission mechanism, so that the silicon wafer to be transported is transported from the corrosion tank to the water tank. The silicon wafer cleaning device has the advantages of reasonable structural design, reliable and stable operation and the like, can realize extremely rapid transfer of the silicon wafer between the groove bodies, ensures that the transfer time is in a specified range, and can clean the silicon wafer in all directions.

Description

Quick transfer device after silicon chip corrosion

Technical Field

The utility model relates to the technical field of semiconductor silicon wafer acid corrosion, in particular to a rapid transfer device after silicon wafer corrosion.

Background

In the traditional silicon wafer acid corrosion cleaning process, after the silicon wafer acid corrosion process is completed, the silicon wafer needs to be transferred into a cleaning water tank for cleaning in a very short time, if the transfer time exceeds the specified time, the surface layer of the silicon wafer is oxidized, and economic loss is caused. The utility model is proposed based on the research background, and aims to provide a rapid transfer device for a silicon wafer after corrosion, so as to meet the requirements of stable and reliable transfer process.

Disclosure of Invention

Aiming at the defects existing in the silicon wafer acid corrosion cleaning process, the utility model aims at: the device has the advantages of reasonable structural design, reliable and stable operation and the like, can realize extremely rapid transfer of the silicon wafers among the groove bodies, ensures that the transfer time is in a specified range, and can clean the silicon wafers in all directions.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

a rapid transfer device after silicon wafer corrosion comprises a corrosion groove and a water groove positioned at one side of the corrosion groove; a power driving mechanism is arranged between the corrosion tank and the water tank and comprises a power output mechanism and a turnover swinging box, and the power output mechanism is in driving connection with the turnover swinging box through a transmission mechanism; the bottom of the turnover swinging box is provided with a silicon wafer to be transported, and the power output mechanism drives the silicon wafer to be transported positioned at the bottom of the turnover swinging box to do turnover motion through a transmission mechanism, so that the silicon wafer to be transported is transported from the corrosion tank to the water tank.

As a further optimization of the scheme, the power output mechanism comprises a mounting seat, a driving motor fixedly arranged on the mounting seat, a driving gear positioned on an output shaft of the driving motor and a driven gear meshed with the driving gear, wherein a rotating shaft through which the driven gear passes is rotatably arranged on the mounting seat, one end of the rotating shaft is connected with the driven gear, and the other end of the rotating shaft is connected with the transmission mechanism.

As a further optimization of the scheme, the transmission mechanism comprises a swing arm, the overturning swinging box comprises an inverted U-shaped overturning swinging frame, at least one of the left side arm and the right side arm of the overturning swinging frame is provided with a sliding plate, one end of the swing arm is in spline connection with the rotating shaft, the other end of the swing arm is in hinged connection with the sliding plate, and the overturning swinging frame can be driven to do circular motion around the rotating shaft when the swing arm rotates.

As further optimization of the scheme, a silicon wafer placing corrosion cage is arranged at the notch of the overturning swinging frame.

As a further optimization of the above scheme, the number of the power output mechanisms is two, and the power output mechanisms are symmetrically arranged between the corrosion tank and the water tank.

As further optimization of the scheme, the top of the sliding plate is also provided with a limiting arm support for limiting the movement stroke of the sliding plate.

As a further optimization of the scheme, the hinge joint of the sliding plate and the swing arm is provided with the guide pin, the limiting arm support comprises a limiting frame body, and the left side and the right side of the limiting frame body are provided with limiting guide wheels in rolling fit with the guide pin.

As a further optimization of the above solution, the swing range of the swing arm is 0-180 °.

The rapid transfer device for the corroded silicon wafers has the following beneficial effects:

the structure design is reasonable, the driven gear is connected to the output shaft in the overturning swinging box, the rotation force transmitted by the driving gear is transmitted to the overturning swinging box, the overturning swinging box is embedded in the limiting arm frame, the sliding plate is lined in the sliding groove on the limiting guide wheel, and the overturning swinging box is ensured not to deviate left and right and front and back when sliding up and down in the limiting arm frame; the turnover swinging box performs circumferential displacement by taking the driven gear as the center, and meanwhile, the driving motor provides rotary power for the silicon wafer placing corrosion cage to drive the silicon wafer to rotate, so that the rotation, the up-and-down movement and the horizontal movement of the silicon wafer can be realized simultaneously, and the silicon wafer corrosion uniformity is ensured. The transfer route is accurate, quick and controllable, so that the silicon wafers can be transferred between the tank bodies very quickly, the transfer time is in a specified range, and the silicon wafers can be soaked and cleaned in all directions.

Drawings

FIG. 1 is a schematic view of a first view angle structure of a rapid transfer device after silicon wafer corrosion.

Fig. 2 is a schematic diagram of a second view angle structure of the rapid transfer device after silicon wafer etching according to the present utility model.

FIG. 3 is a schematic diagram of the working movement structure of the rapid transfer device after the silicon wafer is corroded.

Fig. 4 is a schematic structural view of a turnover swinging box of the rapid transfer device after the silicon wafer is corroded.

Fig. 5 is a schematic structural view of a limiting arm support of the rapid transfer device after silicon wafer corrosion.

In the above figures, the meaning of the individual reference numerals is as follows:

1. a driving motor; 2. a drive gear; 3. a driven gear; 4. turning over the swinging box; 5. limiting arm support; 6. a silicon wafer; 7. a corrosion groove; 8. a water tank; 4-1, placing a silicon wafer in a corrosion cage; 4-2, sliding plate; 4-3, turning over the swinging frame; 5-1, limiting the frame body; and 5-2, limiting the guide wheel.

Detailed Description

The rapid transfer device after the silicon wafer is corroded according to the utility model is described in detail below with reference to FIGS. 1 to 5.

A rapid transfer device after silicon wafer corrosion comprises a corrosion groove 7 and a water groove 8 positioned at one side of the corrosion groove; a power driving mechanism is arranged between the corrosion tank and the water tank and comprises a power output mechanism 1 and a turnover swinging box 4, and the power output mechanism is in driving connection with the turnover swinging box through a transmission mechanism; the bottom of the turnover swinging box is provided with a silicon wafer 6 to be transported, and the power output mechanism drives the silicon wafer to be transported positioned at the bottom of the turnover swinging box to do turnover motion through a transmission mechanism, so that the silicon wafer to be transported is transported from the corrosion tank to the water tank. The power output mechanism comprises a mounting seat, a driving motor 1 fixedly arranged on the mounting seat, a driving gear 2 positioned on an output shaft of the driving motor and a driven gear 3 meshed with the driving gear, wherein a rotating shaft through which the driven gear passes is rotatably arranged on the mounting seat, one end of the rotating shaft is connected with the driven gear, and the other end of the rotating shaft is connected with the transmission mechanism. The transmission mechanism comprises a swing arm, the overturning swinging box comprises an inverted U-shaped overturning swinging frame 4-3, a sliding plate 4-2 is arranged on at least one of the left side arm and the right side arm of the overturning swinging frame, one end of the swing arm is in spline connection with a rotating shaft, the other end of the swing arm is in hinged connection with the sliding plate, and the overturning swinging frame can be driven to do circular motion around the rotating shaft when the swing arm rotates. The notch of the turnover swinging frame is provided with a silicon wafer placing corrosion cage 4-1. The number of the power output mechanisms is two, and the power output mechanisms are symmetrically arranged between the corrosion groove and the water groove. The top of the sliding plate is also provided with a limiting arm support 5 for limiting the movement stroke of the sliding plate. The hinge joint of the sliding plate and the swing arm is provided with a guide pin, the limiting arm support comprises a limiting frame body 5-1, and the left side and the right side of the limiting frame body are provided with limiting guide wheels 5-2 in rolling fit with the guide pin. The swing range of the swing arm is 0-180 degrees.

The working process of the rapid transfer device after silicon wafer corrosion is as follows:

1) And (3) silicon wafer corrosion: firstly, placing a silicon wafer 6 to be transported in a silicon wafer placing corrosion cage 4-1, and turning the silicon wafer placing corrosion cage 4-1 into a corrosion groove 7 for corrosion by controlling a power output mechanism;

2) After corrosion is completed, the power output mechanism 1 drives the driving gear 2 to rotate, then drives the driven gear 3 to rotate, drives the connected overturning swinging box 4 to displace, and the limiting arm support 5 limits the overturning swinging box 4 to displace and rotate for half a circle according to a formulated route until the silicon wafer enters the water tank to carry out omnibearing soaking and cleaning on the silicon wafer.

In the utility model, the types of the driving motors can be selected according to actual design and use requirements, the direct current motors or the alternating current motors can be selected, and the materials or the length and the types of other components can be selected according to the actual design and use requirements, so that the description is omitted.

The previous description of the embodiments is provided to facilitate a person of ordinary skill in the art in order to make and use the present utility model. It will be apparent to those skilled in the art that various modifications can be readily made to these embodiments and the generic principles described herein may be applied to other embodiments without the use of the inventive faculty. Therefore, the present utility model is not limited to the embodiments described herein, and those skilled in the art, based on the present disclosure, should make improvements and modifications without departing from the scope of the present utility model.

Claims

1. A quick transfer device after silicon chip corrosion, its characterized in that: the device comprises an etching tank (7) and a water tank (8) positioned at one side of the etching tank; a power driving mechanism is arranged between the corrosion tank and the water tank and comprises a power output mechanism and a turnover swinging box (4), and the power output mechanism is in driving connection with the turnover swinging box through a transmission mechanism; the bottom of the turnover swinging box is provided with a silicon wafer (6) to be transported, and the power output mechanism drives the silicon wafer to be transported positioned at the bottom of the turnover swinging box to do turnover motion through a transmission mechanism, so that the silicon wafer to be transported is transported from the corrosion groove to the water groove.

2. The rapid transfer device after silicon wafer etching according to claim 1, wherein: the power output mechanism comprises a mounting seat, a driving motor (1) fixedly arranged on the mounting seat, a driving gear (2) positioned on an output shaft of the driving motor and a driven gear (3) meshed with the driving gear, wherein a rotating shaft through which the driven gear passes is rotatably arranged on the mounting seat, one end of the rotating shaft is connected with the driven gear, and the other end of the rotating shaft is connected with the transmission mechanism.

3. The rapid transfer device after silicon wafer etching according to claim 2, wherein: the transmission mechanism comprises a swing arm, the overturning swinging box comprises an inverted U-shaped overturning swinging frame (4-3), at least one of the left side arm and the right side arm of the overturning swinging frame is provided with a sliding plate (4-2), one end of the swing arm is in spline connection with a rotating shaft, the other end of the swing arm is in hinged connection with the sliding plate, and the overturning swinging frame can be driven to do circular motion around the rotating shaft when the swing arm rotates.

4. A post-etch rapid transfer device for silicon wafers as set forth in claim 3 wherein: a silicon wafer placing corrosion cage (4-1) is arranged at the notch of the overturning swinging frame.

5. A rapid transport device for etched silicon wafers according to any one of claims 1 to 4, wherein: the number of the power output mechanisms is two, and the power output mechanisms are symmetrically arranged between the corrosion groove and the water groove.

6. A post-etch rapid transport apparatus for silicon wafers as set forth in claim 3 or 4 wherein: the top of the sliding plate is also provided with a limiting arm support (5) for limiting the movement stroke of the sliding plate.

7. The rapid transport device after silicon wafer etching according to claim 6, wherein: the hinge joint of the sliding plate and the swing arm is provided with a guide pin, the limiting arm support comprises a limiting frame body (5-1), and the left side and the right side of the limiting frame body are provided with limiting guide wheels (5-2) in rolling fit with the guide pin.

8. A post-etch rapid transfer device for silicon wafers as set forth in claim 3 wherein: the swing range of the swing arm is 0-180 degrees.