CN219310285U

CN219310285U - High heat energy soldering equipment

Info

Publication number: CN219310285U
Application number: CN202320085314.0U
Authority: CN
Inventors: 李海锋; 秦富科
Original assignee: Quick Intelligent Equipment Co ltd
Current assignee: Quick Intelligent Equipment Co ltd
Priority date: 2023-01-30
Filing date: 2023-01-30
Publication date: 2023-07-07
Anticipated expiration: 2033-01-30

Abstract

The utility model relates to high heat energy soldering equipment, which comprises an equipment main body, wherein an injection valve assembly, a tin furnace assembly and a motion platform mechanism are arranged on the equipment main body, the motion platform mechanism comprises a base plate capable of moving along the Y-axis direction, an upper base plate capable of moving along the Z-axis direction and a positioning carrier assembly capable of moving along the X-axis direction, the base plate is arranged on the equipment main body, the positioning carrier assembly is arranged on the upper base plate and used for placing a circuit board, the upper base plate is positioned above the base plate and connected with the base plate through a Z-axis driving assembly, and the injection valve assembly and the tin furnace assembly are sequentially arranged along the moving direction of the positioning carrier assembly and are fixed on the equipment main body. The utility model mainly aims to provide the high-heat-energy soldering equipment which is more compact in structure, more flexible and accurate in control of the circuit board and good in soldering effect.

Description

High heat energy soldering equipment

Technical Field

The utility model relates to welding equipment, in particular to high-heat-energy soldering equipment.

Background

With the increasing popularity of the application of the tabletop soldering iron welding process, domestic manufacturers are more and more, competition is more and more vigorous, and the requirement on welding quality is higher and more. However, the soldering iron welding process is insufficient in heat capacity and needs to be used for welding on the back surface of the circuit board, and special welding tools are needed, so that when customers need higher efficiency and better welding quality or products to be welded are more in variety, a certain technical bottleneck is encountered by using the soldering iron welding process. And the service life of the soldering tip of the soldering iron is low, the cost is increased after the soldering tip is replaced, and the soldering quality is also affected to a certain extent. Therefore, when a lot of clients meet related demands, a soldering process is replaced by a selective soldering process, but the selective soldering equipment in the current market is generally high in cost, and the soldering is carried out in a mode that a tin furnace assembly is moved and a circuit board is fixed, so that the movement is not flexible and the precision is low. In addition, the angle of the spraying soldering flux is fixed, so that the requirements on the installation precision and the machining precision of parts are higher.

Disclosure of Invention

In order to overcome the defects of the prior art, the utility model aims to provide the high-heat-energy soldering equipment which is more compact in structure, more flexible and accurate in control of the circuit board and good in soldering effect.

In order to solve the problems, the technical scheme adopted by the utility model is as follows:

the utility model provides a high heat energy soldering equipment, includes the equipment main part, be equipped with injection valve subassembly, tin stove subassembly and motion platform mechanism in the equipment main part, motion platform mechanism includes the base plate that can follow Y axle direction removal, can follow the last base plate that Z axle direction removed and can follow the location carrier subassembly that X axle direction removed, the base plate is installed on the equipment main part, location carrier subassembly is installed and is used for placing the circuit board on last base plate, the upper base plate is located the base plate top and is connected with the base plate through Z axle drive assembly, injection valve subassembly and tin stove subassembly are arranged in proper order and are fixed in the equipment main part along the direction of movement of location carrier subassembly, injection valve subassembly includes the angularly adjustable nozzle, the nozzle passes through angle adjustment mechanism and installs in the equipment main part.

Further, the base plate is arranged on the Y-axis guide rail on the equipment main body along the Y-axis direction through the sliding block in a sliding manner, the positioning carrier assembly is arranged on the X-axis guide rail on the upper base plate along the X-axis direction through the sliding block in a sliding manner, the Z-axis driving assembly comprises a screw rod arranged along the Z-axis, one end of the screw rod is rotatably connected with the upper base plate, the other end of the screw rod penetrates through a hole correspondingly formed in the base plate and then is in driving connection with the driving motor, the hole correspondingly formed in the base plate is an internal threaded hole, and the base plate is sleeved on the outer side of the screw rod through the internal threaded hole in a threaded manner.

Further, the angle adjusting mechanism comprises a first adapter block, a second adapter block and a fixed block, the nozzle is arranged on the first adapter block, the first adapter block is arranged on the second adapter block and adjusts the deflection angle of the first adapter block in the X-axis direction through an adjusting component, and the second adapter block is arranged on the fixed block and adjusts the deflection angle of the second adapter block in the Y-axis direction through an adjusting component.

Further, the adjusting component between the first adapter block and the second adapter block comprises a mounting plate, adjusting screws and fastening screws, one ends of the fastening screws penetrate through threaded holes in the first adapter block through threads after the second adapter block is screwed in, the two mounting plates are fixedly connected to the second adapter block and are symmetrically arranged on two sides of the first adapter block by taking the fastening screws as centers, the adjusting screws are correspondingly arranged with the mounting plate, the adjusting screws are in threaded connection with the mounting plate, and one end of each adjusting screw is abutted to one side face of the corresponding adapter block.

Further, the adjusting component between the second adapter block and the fixed block comprises a mounting plate, adjusting screws and fastening screws, one ends of the fastening screws penetrate through the fixed block and then are screwed into threaded holes of the second adapter block, the mounting plate is provided with two, the two mounting plates are fixedly connected to the second adapter block and are symmetrically arranged on two sides of the first adapter block by taking the fastening screws as centers, the adjusting screws are correspondingly arranged with the mounting plate, the adjusting screws are in threaded connection with the mounting plate, and one end of each adjusting screw is abutted against two sides of the corresponding adapter block.

Further, the mounting plate is arranged on the outer side of the first adapter block or the second adapter block in a semi-encircling mode.

Further, the adjusting assembly further comprises fixing pins, the fixing pins and the fastening screws are distributed at intervals in parallel, and one end of each fixing pin penetrates through the second adapter block and then is rotatably connected to the first adapter block.

Further, the fixed block is fixedly connected to the supporting block, and the supporting block is fixedly installed on the equipment main body.

Further, the positioning carrier assembly comprises two carrier plates I placed at intervals in parallel and two carrier plates II placed at intervals in parallel, the two carrier plates I and the two carrier plates II are combined to form a rectangular installation frame for placing the circuit board, the two carrier plates I are respectively connected to the X-axis guide rail in a sliding mode through sliding blocks, the two carrier plates II are connected between the two carrier plates I, one carrier plate II is fixedly connected between the two carrier plates I, and the other carrier plate II is movably installed between the two carrier plates I along the length direction of the carrier plate I.

Further, the tin furnace assembly is fixedly arranged on the bottom plate, the bottom plate is connected to the movable guide rail in a sliding manner through the sliding block, the movable guide rail is fixed to the equipment main body, and a locking piece is connected between the bottom plate and the equipment main body and used for locking or unlocking the bottom plate.

Compared with the prior art, the utility model has the beneficial effects that: the structure of the motion platform mechanism is skillfully designed, so that the structure is more compact, and the space occupation is reduced; the control of the circuit board is more flexible and accurate; meanwhile, the nozzle of the injection valve assembly is provided with an angle-adjustable structure, and the nozzle is adjusted to be opposite to the area to be welded of the circuit board, so that the installation error of the injection valve assembly is compensated, and the requirement on machining precision is reduced.

Drawings

FIG. 1 is a perspective view of a high thermal energy soldering apparatus of the present utility model;

fig. 2 is a perspective view of a high thermal energy soldering apparatus (with the housing removed) of the present utility model;

fig. 3 is a front view of a high thermal energy soldering apparatus (with the housing removed) of the present utility model;

fig. 4 is another perspective view of a high thermal energy soldering apparatus (with the housing removed) of the present utility model;

FIG. 5 is a schematic view of a partial enlarged structure at A in FIG. 4;

FIG. 6 is a top view of a high thermal energy soldering apparatus (with the housing removed) of the present utility model;

FIG. 7 is a perspective view of an injection valve assembly in a high thermal energy soldering apparatus according to the present utility model;

FIG. 8 is a perspective view of another view of the jet valve assembly of a high thermal energy soldering apparatus according to the present utility model;

1, an equipment main body; 11. a housing; 12. a frame; 2. an injection valve assembly; 21. a nozzle; 22. a first switching block; 23. a second switching block; 24. a fixed block; 25. a mounting plate; 26. an adjusting screw; 27. a fastening screw; 28. a fixing pin; 29. a support block; 3. a tin furnace assembly; 31. a bottom plate; 32. a moving guide rail; 33. a locking member; 4. a motion platform mechanism; 41. a Y-axis guide rail; 42. a substrate; 43. an upper substrate; 44. positioning a carrier assembly; 441. a first carrier plate; 442. a second carrier plate; 45. an X-axis guide rail; 46. a Z-axis drive assembly; 47. z-axis guide post.

Description of the embodiments

The utility model is described in further detail below with reference to the drawings and the detailed description.

In the description of the technical solution of the present utility model, some terms such as "front", "back", "upper", "lower", "top", "bottom", "inner", "outer" and the like are used for clearly describing technical features of the present utility model according to the orientation of the drawings of the present utility model.

Examples

As shown in fig. 1, 2, 3, 4 and 5, a high heat energy soldering apparatus of the present embodiment includes an apparatus main body 1, on which an injection valve assembly 2, a solder furnace assembly 3 and a moving platform mechanism 4 are provided on the apparatus main body 1, the moving platform mechanism 4 includes a base plate 42 movable in a Y-axis direction, an upper base plate 43 movable in a Z-axis direction and a positioning carrier assembly 44 movable in an X-axis direction, the base plate 42 is mounted on the apparatus main body 1, the positioning carrier assembly 44 is mounted on the upper base plate 43 for placing a circuit board, and the upper base plate 43 is located above the base plate 42 and connected with the base plate 42 through a Z-axis driving assembly 46.

Specifically, the substrate 42 is slidably connected to the Y-axis guide rail 41 arranged on the apparatus main body 1 in the Y-axis direction by a slider that moves the substrate 42 in the Y-axis direction when slid. The positioning carrier assembly 44 is slidably connected to an X-axis guide rail 45 disposed on the upper substrate 43 along the X-axis direction by a slider, and the slider can drive the positioning carrier assembly 44 to move along the X-axis direction when sliding. The driving mode of the sliding block is a structure in the prior art, for example, a belt driving mode, a cylinder driving mode, a gear rack driving mode or the like can be adopted. As shown in fig. 6, the Z-axis driving assembly 46 includes a screw rod disposed along the Z-axis, one end of the screw rod is rotatably connected with the upper substrate 43 through a bearing, the other end of the screw rod passes through a hole correspondingly formed in the substrate 42 and is then in driving connection with an output shaft of the driving motor, the hole correspondingly formed in the substrate 42 is an internal threaded hole, and the substrate 42 is sleeved on the outer side of the screw rod through the internal threaded hole. When the driving motor is started, the screw rod is driven to rotate through the output shaft, and the screw rod is in threaded connection with the substrate 42, and the substrate 42 is fixed in position in the Z-axis direction, so that the screw rod can also move along the axis of the screw rod while rotating, the upper substrate 43 connected with the screw rod is driven to move along the Z-axis, and the positioning carrier assembly 44 arranged on the upper substrate 43 is driven to move along the Z-axis. In order to prevent the movement track of the upper substrate 43 from being offset, in this embodiment, a Z-axis guiding post 47 is further connected between the substrate 42 and the upper substrate 43, the axis of the Z-axis guiding post 47 is parallel to the axis of the screw rod, one end of the Z-axis guiding post 47 is connected to the upper substrate 43, the other end of the Z-axis guiding post 47 passes through a through hole correspondingly formed in the substrate 42 and extends to the lower side of the substrate 42, and the Z-axis guiding post 47 is slidably matched with the through hole correspondingly formed in the substrate 42. When the upper substrate 43 moves, the Z-axis guide post 47 slides in the through hole of the substrate 42, which plays a guiding role on the upper substrate 43, and ensures that the upper substrate 43 moves stably without offset or tilting.

In the embodiment, the circuit board is arranged on the positioning carrier assembly 44, and the circuit board is subjected to position adjustment through the motion platform mechanism 4 which can be respectively moved and adjusted along the X, Y, Z shaft, so that the adjustment is flexible and the accuracy is high; and the base plate 42 and the upper base plate 43 are arranged up and down, and the Z-axis driving assembly 46 is arranged between the base plate 42 and the upper base plate 43, so that the overall structure is compact, the transverse size is reduced, and the occupied space is small.

The injection valve assembly 2 and the tin furnace assembly 3 are sequentially arranged and fixed on the apparatus body 1 in the moving direction of the positioning carrier assembly 44. As shown in fig. 7 and 8, the injection valve assembly 2 includes an angle-adjustable nozzle 21, the nozzle 21 is mounted on the apparatus main body 1 by an angle adjustment mechanism including a first adapter block 22, a second adapter block 23, and a fixed block 24, the nozzle 21 is mounted on the first adapter block 22, the first adapter block 22 is mounted on the second adapter block 23 and adjusts the tilt angle of the first adapter block 22 in the X-axis direction by an adjustment assembly, and the second adapter block 23 is mounted on the fixed block 24 and adjusts the tilt angle of the second adapter block 23 in the Y-axis direction by an adjustment assembly. The two adjustment assemblies are identical in construction, each of which comprises a mounting plate 25, an adjustment screw 26 and a tightening screw 27, which, in particular,

firstly, the second adapter block 23 comprises an upper connecting section and a lower connecting section;

the specific connection mode between the second adapter block 23 and the first adapter block 22 is as follows:

as shown in fig. 7, one end of the fastening screw 27 passes through the upper connecting section of the second adapter block 23 and is screwed into the threaded hole of the first adapter block 22, so that the first adapter block 22 can be fixed on the second adapter block 23 in a deflection adjustment manner in the X-axis direction. The two mounting plates 25 are provided, one ends of the two mounting plates 25 are respectively fixedly connected to the adapter block two 23, and the two mounting plates 25 are symmetrically arranged on two sides of the adapter block one 22 by taking the fastening screw 27 as a center.

The specific connection mode between the second switching block 23 and the fixed block 24 is as follows:

as shown in fig. 8, one end of the fastening screw 27 passes through the fixing block 24 and is screwed into a threaded hole of the lower connecting section of the second adapter block 23, so that the second adapter block 23 can be fixed on the fixing block 24 in a deflection adjustment manner in the Y-axis direction. The two mounting plates 25 are provided, one ends of the two mounting plates 25 are respectively fixedly connected to the fixed block 24, and the two mounting plates 25 are symmetrically arranged on two sides of the adapter block two 23 by taking the fastening screw 27 positioned on the fixed block 24 as a center. The adjusting screws 26 are arranged in one-to-one correspondence with the mounting plates 25, the adjusting screws 26 are in threaded connection with the mounting plates 25, one end part of each adjusting screw 26 is abutted against the side surface of the corresponding second adapting block 23, and the inclination angle of the second adapting block 23 in the Y-axis direction is adjusted by screwing the adjusting screws 26 which are positioned on the two sides of the second adapting block 23. In addition, the second adapter block 23 is arranged on one side of the first adapter block 22 in a semi-encircling manner and is fixed on the first adapter block 22 through the fastening screw 27, so that the stability of the first adapter block 22 in a constant position is improved, and effective adjustment is promoted.

The lower connecting section card of changeover portion two 23 is in fixed block 24, and fixed block 24 includes mounting panel 25, and mounting panel 25 has two, and two mounting panels 25 link firmly on fixed block 24 and use fastening screw 27 to arrange in the both sides of changeover portion two 23 as the center symmetry, and adjusting screw 26 and mounting panel 25 one-to-one set up, adjusting screw 26 threaded connection is on mounting panel 25 and adjusting screw 26 one end tip butt is in changeover portion two 23 sides. Also, since the fixing block 24 is arranged at one side of the second adapting block 23 in a semi-encircling manner and is fixed on the second adapting block 23 through the fastening screw 27, the stability of the second adapting block 23 at a constant position is improved, and effective adjustment is promoted. The fixed block 24 is fixedly connected to the supporting block 29, and the supporting block 29 is fixedly mounted on the apparatus main body 1.

Because of production and machining precision limitation and installation errors, after the injection valve assembly 2 is installed, the central axis of the nozzle 21 is not perpendicular to the circuit board, so that the soldering flux sprayed out of the nozzle 21 has a certain deflection angle, and the soldering area cannot be covered completely, and the soldering effect is affected. In order to avoid the above, the present embodiment adds an adjusting assembly to the injection valve assembly 2 for angular adjustment of the nozzle 21. Taking the adjustment of the second transfer block 23 as an example: in specific adjustment, the fastening screws 27 on the second adapting block 23 and the fixed block 24 are loosened, then the adjusting screws 26 on the mounting plates 25 on the two sides of the second adapting block 23 and the first adapting block 22 are screwed according to the deflection condition of the nozzle 21 until the nozzle 21 is adjusted to be opposite to the circuit board, and then the fastening screws 27 are tightened to fix the position of the nozzle 21.

In order to further improve the structural reliability of the adjusting assembly, the adjusting assembly of the embodiment is further provided with fixing pins 28, the fixing pins 28 and the fastening screws 27 are distributed on the same side at intervals in parallel, and one end of each fixing pin 28 penetrates through the second adapting block 23 or the second adapting block 24 and is rotatably connected to the first adapting block 22 or the second adapting block 23. When the angle of the nozzle 21 is adjusted, the fixing pin 28 is respectively connected between the first adapter block 22 and the second adapter block 23 and between the second adapter block 23 and the fixing block 24, and the positions of the first adapter block 22 and the second adapter block 23 are respectively limited in the axial direction, so that the first adapter block 22 or the second adapter block 23 is prevented from axially displacing along the fixing pin 28, and the function of pre-fixing the positions of the first adapter block 23 or the second adapter block 22 is achieved.

The positioning carrier assembly 44 includes two parallel and spaced-apart first carrier plates 441 and two parallel and spaced-apart second carrier plates 442, the two first carrier plates 441 and the two second carrier plates 442 are combined to form a rectangular mounting frame for placing the circuit board, the two first carrier plates 441 are slidably connected to the X-axis guide rail 45 through the sliding blocks, the two second carrier plates 442 are connected between the two first carrier plates 441, one of the two carrier plates 442 is fixedly connected between the two first carrier plates 441, and the other of the two carrier plates 442 is movably mounted between the two first carrier plates 441 along the length direction of the first carrier plate 441. Specifically, a plurality of threaded holes which are equally distributed at intervals are respectively formed in the first carrier plate 441 along the length direction, through holes are respectively formed in the two ends of the second movable carrier plate 442, and the through holes in the two ends of the second movable carrier plate 442 are fixedly connected with the corresponding threaded holes in the first carrier plate 441 through screws. When the position is adjusted, the screw is unscrewed firstly, then the position of the movable carrier plate II 442 is adjusted according to the size of the circuit board, and after the position is adjusted, the screw is threaded into the corresponding threaded hole in the carrier plate I441 after passing through the through hole at the end part of the carrier plate II 442. By adopting the structure, the circuit board with different sizes can be adapted, and the application range is wider.

The tin furnace component 3 is fixedly arranged on the bottom plate 31, the bottom plate 31 is slidably connected to the movable guide rail 32 through a sliding block, the movable guide rail 32 is fixed on the equipment main body 1, and a locking piece 33 is connected between the bottom plate 31 and the equipment main body 1 and used for locking or unlocking the bottom plate 31. The locking member 33 adopts a structure in the prior art, such as that corresponding threaded holes are formed on the bottom plate 31 and the device main body 1, and then the locking bolts sequentially penetrate through the two threaded holes and are screwed down, so that the position of the bottom plate 31 relative to the device main body 1 is fixed. With this structure, when the tin furnace assembly 3 needs to be maintained and inspected, the locking member 33 is used to release the bottom plate 31 so that it can slide freely, and then the bottom plate 31 is pulled to move along the moving rail 32 to a position where the edge of the apparatus main body 1 is convenient to operate, and after the inspection or maintenance is completed, the bottom plate 31 is pushed to drive the tin furnace assembly 3 to reset, and the locking member 33 is used to lock the position of the bottom plate 31, so that the tin furnace assembly 3 is fixed. With the structure, the tin furnace assembly 3 is convenient to repair and maintain.

The apparatus main body 1 of the present embodiment includes a frame 12 and a housing 11 that covers the outside of the frame 12, and components mounted on the apparatus main body 1, such as the injection valve assembly 2, the tin furnace assembly 3, and the moving platform mechanism 4 in the present embodiment, are mounted on the frame 12 of the apparatus main body 1.

When the spray valve assembly works, the circuit board is fixed on the positioning carrier assembly 44, then the circuit board is moved to the position corresponding to the spray valve assembly 2 through the moving platform mechanism 4, the area to be welded of the circuit board is opposite to the spray nozzle 21 of the spray valve assembly 2, if the angle of the spray nozzle 21 is inclined, the angle of the spray nozzle 21 is adjusted through the adjusting assembly until the spray nozzle 21 is opposite to the area to be welded. Then starting the injection valve assembly 2, and spraying the soldering flux from the nozzle 21 to coat the area to be soldered; after the coating is finished, the circuit board is moved to the position corresponding to the tin furnace assembly 3 through the moving platform mechanism 4, the tin furnace assembly 3 is started, the area to be welded of the circuit board is preheated through hot nitrogen, after the preheating is finished, the tin furnace assembly 3 performs tin spraying welding operation on the circuit board, and after the welding is finished, the moving platform mechanism 4 moves and resets the circuit board.

According to the high-heat-energy soldering equipment, the structure of the moving platform mechanism 4 is skillfully designed, so that the structure is more compact, and the space occupation is reduced; the control of the circuit board is more flexible and accurate; meanwhile, the nozzle 21 of the injection valve assembly 2 is provided with an angle-adjustable structure, and the nozzle 21 is adjusted to be opposite to the area to be welded of the circuit board, so that the installation error of the injection valve assembly 2 is compensated, and the requirement on machining precision is reduced.

It will be apparent to those skilled in the art from this disclosure that various other changes and modifications can be made which are within the scope of the utility model as defined in the appended claims.

Claims

1. A high thermal energy soldering apparatus, characterized in that: including equipment main part (1), be equipped with injection valve subassembly (2), tin stove subassembly (3) and motion platform mechanism (4) on equipment main part (1), motion platform mechanism (4) are including base plate (42) that can follow Y axle direction and upper substrate (43) that can follow Z axle direction and location carrier subassembly (44) that can follow X axle direction and remove, base plate (42) are installed on equipment main part (1), location carrier subassembly (44) are installed on upper substrate (43) and are used for placing the circuit board, upper substrate (43) are located base plate (42) top and are connected with base plate (42) through Z axle drive assembly (46), injection valve subassembly (2) and tin stove subassembly (3) are arranged in proper order and are fixed on equipment main part (1) along the direction of movement of location carrier subassembly (44), injection valve subassembly (2) are including angularly adjustable nozzle (21), nozzle (21) are installed on equipment main part (1) through angle adjustment mechanism.

2. A high thermal energy soldering apparatus according to claim 1, wherein: the base plate (42) is connected onto a Y-axis guide rail (41) which is arranged on the equipment main body (1) along the Y-axis direction through a sliding block in a sliding manner, the positioning carrier assembly (44) is connected onto an X-axis guide rail (45) which is arranged on the upper base plate (43) along the X-axis direction through a sliding block in a sliding manner, the Z-axis driving assembly (46) comprises a screw rod which is arranged along the Z-axis, one end of the screw rod is rotatably connected with the upper base plate (43), the other end of the screw rod penetrates through a hole which is correspondingly formed in the base plate (42) and is then connected with a driving motor in a driving manner, the hole which is correspondingly formed in the base plate (42) is an internal threaded hole, and the base plate (42) is sleeved on the outer side of the screw rod through the internal threaded hole.

3. A high thermal energy soldering apparatus according to claim 1 or 2, wherein: the angle adjusting mechanism comprises a first adapter block (22), a second adapter block (23) and a fixed block (24), wherein the nozzle (21) is arranged on the first adapter block (22), the first adapter block (22) is arranged on the second adapter block (23) and adjusts the deflection angle of the first adapter block (22) in the X-axis direction through an adjusting component, and the second adapter block (23) is arranged on the fixed block (24) and adjusts the deflection angle of the second adapter block (23) in the Y-axis direction through an adjusting component.

4. A high thermal energy soldering apparatus according to claim 3, wherein: the adjusting component between the first adapter block (22) and the second adapter block (23) comprises a mounting plate (25), adjusting screws (26) and fastening screws (27), one end of each fastening screw (27) penetrates through the threaded hole of the first adapter block (22) after penetrating through the second adapter block (23), the two mounting plates (25) are fixedly connected onto the second adapter block (23) and symmetrically arranged on two sides of the first adapter block (22) by taking the fastening screws (27) as centers, the adjusting screws (26) are correspondingly arranged with the mounting plates (25), and one end of each adjusting screw (26) is connected with the side face of the first adapter block (22) in a threaded mode.

5. A high thermal energy soldering apparatus according to claim 3, wherein: the adjusting component between the adapter block II (23) and the fixed block (24) comprises a mounting plate (25), adjusting screws (26) and fastening screws (27), one end of each fastening screw (27) penetrates through the threaded hole of the corresponding adapter block II (23) through the corresponding fixed block (24), the mounting plate (25) is provided with two threaded holes, the two mounting plates (25) are fixedly connected to the adapter block II (23) and symmetrically arranged on two sides of the adapter block I (22) by taking the fastening screws (27) as centers, the adjusting screws (26) are correspondingly arranged with the mounting plate (25), and one end of each adjusting screw (26) is connected to the mounting plate (25) in a threaded mode and is abutted to the side face of the adapter block II (23).

6. A high thermal energy soldering apparatus according to claim 4 or 5, wherein: the mounting plate (25) is arranged on the outer side of the first adapter block (22) or the second adapter block (23) in a semi-encircling mode.

7. A high thermal energy soldering apparatus according to claim 4, wherein: the adjusting assembly further comprises fixing pins (28), the fixing pins (28) and the fastening screws (27) are distributed at intervals in parallel, and one end of each fixing pin (28) penetrates through the second adapter block (23) and then is rotatably connected to the first adapter block (22).

8. A high thermal energy soldering apparatus according to claim 5, wherein: the fixed block (24) is fixedly connected to the supporting block (29), and the supporting block (29) is fixedly arranged on the equipment main body (1).

9. A high thermal energy soldering apparatus according to claim 2, wherein: the positioning carrier assembly (44) comprises two carrier plates I (441) placed at parallel intervals and two carrier plates II (442) placed at parallel intervals, the two carrier plates I (441) and the two carrier plates II (442) are combined to form a rectangular mounting frame for placing a circuit board, the two carrier plates I (441) are respectively connected onto an X-axis guide rail (45) through sliding blocks in a sliding mode, the two carrier plates II (442) are connected between the two carrier plates I (441), one carrier plate II (442) is fixedly connected between the two carrier plates I (441), and the other carrier plate II (442) is movably mounted between the two carrier plates I (441) along the length direction of the carrier plates I (441).

10. A high thermal energy soldering apparatus according to claim 1, wherein: the tin furnace assembly (3) is fixedly arranged on the bottom plate (31), the bottom plate (31) is connected to the movable guide rail (32) in a sliding mode through the sliding block, the movable guide rail (32) is fixed to the equipment main body (1), and a locking piece (33) is connected between the bottom plate (31) and the equipment main body (1) and used for locking or unlocking the bottom plate (31).