CN219304168U

CN219304168U - Semiconductor solid-state laser

Info

Publication number: CN219304168U
Application number: CN202223578725.8U
Authority: CN
Inventors: 邹伶俐
Original assignee: Hunan Radium Technology Co ltd
Current assignee: Hunan Radium Technology Co ltd
Priority date: 2022-12-31
Filing date: 2022-12-31
Publication date: 2023-07-04
Anticipated expiration: 2032-12-31

Abstract

The utility model discloses a semiconductor solid-state laser, which comprises a main machine box and a laser head movably arranged on the top of the main machine box, wherein an opening is arranged on the upper end surface of the main machine box, a heat radiation plate is arranged in the opening in a sealing way, a round fin radiator is fixedly arranged on the heat radiation plate, a heat radiation fan is fixedly arranged at the upper end of the round fin radiator, a plurality of heat radiation fins are uniformly and fixedly arranged on the lower end surface of the laser head, the laser head is fixedly connected with the outer wall of the main machine box through a gooseneck, and a water cooling conduction assembly is arranged among the round fin radiator, the inside of the main machine box and the plurality of heat radiation fins. The utility model effectively dissipates heat to the main case and the laser head on the premise of ensuring the sealing of the main case, and limits the position of the laser head with a simple structure, thereby facilitating the movement and positioning operation.

Description

Semiconductor solid-state laser

Technical Field

The utility model relates to the technical field related to semiconductor lasers, in particular to a semiconductor solid-state laser.

Background

The solid-state laser is a laser using a solid laser material as a working substance, and the semiconductor laser is a laser using a semiconductor material as a working substance, and is often involved in the industrial field and the military field because of its functions such as energy and guiding. The existing laser device is especially high-power laser emitter when using, can give off a large amount of heat when using because of its power is high, consequently can dispel the heat to the laser instrument body when using to guarantee the normal operating of inside laser circuit, but when using the laser head, general laser head hardly fixes, and the heat dissipation of laser head adopts natural heat dissipation more, leads to the radiating effect not good, and the laser head of present laser device uses all comparatively trouble, and the while is inconvenient to fix a position, can produce the damage condition because of the temperature influence after the live time is longer moreover.

For this reason, we propose a semiconductor solid-state laser to solve the above-mentioned problems.

Disclosure of Invention

The utility model aims to solve the defects in the prior art and provides a semiconductor solid-state laser.

In order to achieve the above purpose, the present utility model adopts the following technical scheme:

the utility model provides a semiconductor solid-state laser, includes mainframe box and activity setting laser head on the mainframe box top, the mainframe box up end is provided with the opening, sealed being provided with the heating panel in the opening, fixed circular fin radiator that is provided with on the heating panel, circular fin radiator upper end fixed mounting has radiator fan, the laser head lower terminal surface is evenly fixed to be provided with a plurality of radiator fins, the laser head passes through gooseneck and mainframe box outer wall fixed connection, circular fin radiator, mainframe box inside and a plurality of radiator fins between be provided with the water-cooling conduction subassembly.

Preferably, the water-cooling conduction assembly comprises a liquid guide pipe, the liquid guide pipe sequentially penetrates through the round fin radiator, the plurality of radiating fins and the main case, the liquid guide pipe is fixedly connected with a circulating water pump and a small water tank, and the circulating water pump and the small water tank are fixedly arranged on the main case.

Preferably, the liquid guide pipe passes through the heat dissipation fins in a serpentine arrangement, the liquid guide pipe is uniformly distributed in the main case, and the liquid guide pipe passes through the circular fin radiator in a spiral arrangement.

Preferably, two handles are symmetrically and fixedly arranged on the rear wall of the main case, and grid plate cooling fins are fixedly arranged on the rear wall of the main case.

Preferably, the upper end face of the main case is fixedly provided with a placement platform, and the laser head is provided with a limiting piece corresponding to the placement platform.

Preferably, the limiting piece comprises a telescopic rod vertically arranged on one side of the laser head, a locating pin for limiting the telescopic rod to stretch out and draw back is arranged on the telescopic rod, the upper end of the telescopic rod is fixedly connected with the side wall of the laser head, and the lower end of the telescopic rod is coaxially and fixedly connected with a supporting disc.

Compared with the prior art, the utility model has the beneficial effects that: the circular fin radiator and the grid plate radiating fins arranged on the rear wall are fixedly arranged on the top of the main case, so that a certain radiating effect can be achieved on the main case, and the radiating fan is further arranged on the circular fin radiator to assist in radiating effect; in order to further radiate the laser head and the inside of the main case, a liquid guide pipe is arranged in the circular fin radiator, the plurality of radiating fins and the main case, heat is transmitted to the position of the circular fin radiator through circulation action, and then the effect of the radiating fan is matched to ensure sufficient radiation; when the laser head moves, can support the place platform through supporting the dish and guarantee the laser head level, the telescopic link is flexible to be used for controlling the vertical height of laser head, changes to support a dish position and can change the laser head position, simultaneously through gooseneck restriction position, this laser head can break away from place platform work, and whole suitability is higher.

Drawings

Fig. 1 is a schematic perspective view of the present utility model.

Fig. 2 is a schematic perspective view of another view of the present utility model.

Fig. 3 is a schematic elevational view of the present utility model.

In the figure:

1 main case, 2 laser head, 3 round fin radiator, 4 radiator fan, 5 radiator fin, 6 gooseneck, 7 catheter, 8 circulating water pump, 9 small-size water tank, 10 handle, 11 grid tray fin, 12 placing platform, 13 telescopic link, 14 locating pin, 15 support the dish.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.

A semiconductor solid state laser as shown with reference to figures 1-3, comprising:

the laser head device comprises a main case 1 and a laser head 2 movably arranged on the top of the main case 1, wherein the main case 1 and the laser head 2 are both provided with an opening at the upper end surface of the main case 1, a heat radiation plate is arranged in the opening in a sealing manner, a round fin radiator 3 is fixedly arranged on the heat radiation plate, the structure can play a certain role in radiating the main case 1, but the heat radiation is uneven, the heat radiation effect is poor, a heat radiation fan 4 is fixedly arranged at the upper end of the round fin radiator 3 in order to increase the heat radiation effect, and a heat radiation structure is also arranged for the laser head 2, so that a plurality of heat radiation fins 5 are uniformly and fixedly arranged on the lower end surface of the laser head 2, the laser head 2 is fixedly connected with the outer wall of the main case 1 through a gooseneck 6, and the gooseneck 6 plays a limiting role on the laser head 2;

in order to fully ensure the heat dissipation effect, a water-cooling conduction assembly is arranged inside the circular fin radiator 3, the main case 1 and among the plurality of heat dissipation fins 5, the water-cooling conduction assembly comprises a liquid guide pipe 7, the liquid guide pipe 7 sequentially penetrates through the circular fin radiator 3, the plurality of heat dissipation fins 5 and the main case 1, a circulating water pump 8 and a small water tank 9 are fixedly connected to the liquid guide pipe 7, the circulating water pump 8 and the small water tank 9 are fixedly arranged on the main case 1, heat can be gathered to the position of the circular fin radiator 3 through the operation of the circulating water pump 8, and the full heat dissipation effect is achieved through the effect of the heat dissipation fan 4; in order to increase the heat conduction rate, a structure is provided that the liquid guide pipe 7 passes through the heat dissipation fins 5 in a serpentine arrangement, the liquid guide pipe 7 is uniformly distributed inside the main case 1, and the liquid guide pipe 7 passes through the circular fin radiator 3 in a spiral arrangement.

Two handles 10 are symmetrically and fixedly arranged on the rear wall of the mainframe box 1, grid plate radiating fins 11 are fixedly arranged on the rear wall of the mainframe box 1, and the whole mainframe box 1 is convenient to use.

In order to better and more conveniently use the laser head 2, the laser head 2 should have the function of vertically moving up and down and back and forth, for this purpose, a placing platform 12 is fixedly arranged on the upper end surface of the mainframe 1, and a limiting piece corresponding to the placing platform 12 is arranged on the laser head 2; the locating part includes the telescopic link 13 of vertical setting in laser head 2 one side, be provided with the locating pin 14 that restrict its flexible on the telescopic link 13, telescopic link 13 upper end and laser head 2 lateral wall fixed connection, the coaxial fixedly connected with of telescopic link 13 lower extreme supports dish 15, can vertically place laser head 2 on place platform 12 through supporting dish 15, telescopic link 13 and locating pin 14 can control laser head 2's vertical height, can drive laser head 2 and remove under the circumstances that laser head 2 is horizontal is guaranteed to chassis 15, laser head 2 can break away from place platform 12 and use.

The foregoing is only a preferred embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art, who is within the scope of the present utility model, should make equivalent substitutions or modifications according to the technical scheme of the present utility model and the inventive concept thereof, and should be covered by the scope of the present utility model.

Claims

1. The utility model provides a semiconductor solid-state laser, its characterized in that includes mainframe box (1) and activity setting laser head (2) on mainframe box (1) top, mainframe box (1) up end is provided with the opening, the sealed heating panel that is provided with in the opening, fixed circular fin radiator (3) that are provided with on the heating panel, circular fin radiator (3) upper end fixed mounting has radiator fan (4), laser head (2) lower terminal surface evenly fixes and is provided with a plurality of radiator fins (5), laser head (2) are through gooseneck (6) and mainframe box (1) outer wall fixed connection, be provided with water-cooling conduction subassembly between circular fin radiator (3), mainframe box (1) inside and a plurality of radiator fins (5).

2. The semiconductor solid-state laser according to claim 1, wherein the water-cooling conduction assembly comprises a liquid guide tube (7), the liquid guide tube (7) sequentially penetrates through the round fin radiator (3), the plurality of radiating fins (5) and the main case (1), a circulating water pump (8) and a small water tank (9) are fixedly connected to the liquid guide tube (7), and the circulating water pump (8) and the small water tank (9) are fixedly arranged on the main case (1).

3. A semiconductor solid state laser according to claim 2, characterized in that the liquid guiding tube (7) is arranged in a serpentine shape through a plurality of heat dissipation fins (5), the liquid guiding tube (7) is uniformly distributed inside the mainframe (1), and the liquid guiding tube (7) is arranged in a spiral shape through the circular fin heat sink (3).

4. A semiconductor solid-state laser according to claim 1, characterized in that two handles (10) are symmetrically and fixedly arranged on the rear wall of the mainframe box (1), and grid plate cooling fins (11) are fixedly arranged on the rear wall of the mainframe box (1).

5. The semiconductor solid-state laser according to claim 1, wherein a placement platform (12) is fixedly arranged on the upper end face of the main case (1), and a limiting piece corresponding to the placement platform (12) is arranged on the laser head (2).

6. The semiconductor solid-state laser according to claim 5, wherein the limiting piece comprises a telescopic rod (13) vertically arranged on one side of the laser head (2), a positioning pin (14) for limiting the telescopic rod (13) to stretch out and draw back is arranged on the telescopic rod, the upper end of the telescopic rod (13) is fixedly connected with the side wall of the laser head (2), and a supporting disc (15) is coaxially and fixedly connected with the lower end of the telescopic rod (13).