CN213028986U - Liquid immersion type cooling cabinet - Google Patents
Liquid immersion type cooling cabinet Download PDFInfo
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- CN213028986U CN213028986U CN202021496265.2U CN202021496265U CN213028986U CN 213028986 U CN213028986 U CN 213028986U CN 202021496265 U CN202021496265 U CN 202021496265U CN 213028986 U CN213028986 U CN 213028986U
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- case
- fin
- baffle
- threaded column
- temperature display
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Abstract
The utility model provides a liquid submergence formula cooling rack, include: a case, a baffle plate and a hinge; a baffle is arranged at the rear part of the case, and the case is connected with the baffle through a hinge; the bolt is arranged at the upper part of the baffle; the temperature display is arranged at the top of the case, and a switching power supply is arranged at the upper part of the temperature display; the temperature probe is arranged in the case and is electrically connected with the temperature display; the first fins are arranged at the rear part of the case and connected with the case in a welding mode; the threaded column is arranged at the rear part of the first fin and is connected with the first fin in a welding mode; through the improvement to current device, it is good, the temperature is convenient for control to have the radiating effect, convenient to use's advantage to effectual solution the utility model discloses the problem that proposes in background art one with not enough.
Description
Technical Field
The utility model relates to a rack cooling technology field, more specifically the theory that says so especially relates to a liquid submergence formula cooling rack.
Background
In the heat dissipation process of the cabinet, heat is dissipated through the heat dissipation fins and the fan, the heat dissipation efficiency is low, a water cooling technology is derived along with the development of the technology, and meanwhile, the immersed cooling cabinet plays a role in cooling by injecting pure water into the sealed cabinet.
The existing immersed cooling cabinet is inconvenient to control the water temperature inside the cabinet when in use, and is not favorable for heat dissipation after pure water is heated up.
In view of this, research and improvement are made to solve the existing problems, and a liquid immersion type cooling cabinet is provided, which aims to achieve the purposes of solving the problems and improving the practical value through the technology.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a liquid submergence formula cooling rack to current submergence formula cooling rack who proposes in solving above-mentioned background art, when using, it is convenient inadequately to the inside temperature control of rack, and the pure water heaies up the back, is unfavorable for radiating problem and not enough.
In order to achieve the above object, the present invention provides a liquid immersion type cooling cabinet, which is achieved by the following specific technical means:
a liquid submersion cooling cabinet comprising: the device comprises a case, a baffle, a hinge, a bolt, a temperature display, a switching power supply, a temperature probe, a first fin, a threaded column, a semiconductor refrigeration sheet, a second fin, a cooling fan, a nut, a turbine fan and a bracket; a baffle is arranged at the rear part of the case, and the case is connected with the baffle through a hinge; the bolt is arranged at the upper part of the baffle; the temperature display is arranged at the top of the case, and a switching power supply is arranged at the upper part of the temperature display; the temperature probe is arranged in the case and is electrically connected with the temperature display; the first fins are arranged at the rear part of the case and connected with the case in a welding mode; the threaded column is arranged at the rear part of the first fin and is connected with the first fin in a welding mode; the semiconductor refrigerating piece is arranged on one side of the first fin, and the semiconductor refrigerating piece is connected with the threaded column in a penetrating mode; the second fin is arranged on one side of the semiconductor refrigerating sheet and is connected with the threaded column in a penetrating manner; the radiating fan is arranged on one side of the second fins and is connected with the threaded column in a penetrating manner; the turbine fan is arranged in the case and connected with the case through a support.
As a further optimization of the technical scheme, the utility model relates to a liquid submergence formula cooling rack machine case is rectangle box form structure, and the rear portion of machine case is provided with a trapezoidal form recess.
As a further optimization of this technical scheme, the utility model relates to a liquid submergence formula cooling rack the baffle is the otter board form, and the upper portion of baffle is detained with the son of bolt and is connected, and the box setting of bolt is at the rear portion of quick-witted case.
As a further optimization of this technical scheme, the utility model relates to a liquid submergence formula cooling rack the leaf of first fin and second fin all is vertical setting.
As the further optimization of this technical scheme, the utility model relates to a liquid submergence formula cooling rack the refrigeration face of semiconductor refrigeration piece contacts with first fin, and the cooling surface of semiconductor refrigeration piece contacts with second fin.
Because of above-mentioned technical scheme's application, compared with the prior art, the utility model have the following advantage:
1. the utility model relates to a liquid submergence formula cooling rack, through the refrigeration face and the contact of first fin with the semiconductor refrigeration piece, the turbofan sets up in the lower part of first fin, and the piece leaf of first fin is vertical setting in the inside of quick-witted case, and the turbofan has better circulation in the piece leaf when driving water and flowing, has improved the radiating efficiency of quick-witted incasement portion pure water.
2. The utility model relates to a liquid submergence formula cooling rack is provided with a trapezoidal recess through the rear portion at quick-witted case, and first fin, semiconductor refrigeration piece, second fin, radiator fan are located the middle part of trapezoidal recess, and when radiator fan dispelled the heat to second fin, the air can be followed upper portion and lower part and flowed in, has good circulation, and the radiating efficiency is better, and the switching power supply of simultaneous control semiconductor refrigeration piece and radiator fan installs on the upper portion of quick-witted case, is convenient for control.
3. The utility model discloses a to the improvement of current device, it is good to have the radiating effect, the temperature is convenient for control, convenient to use's advantage to effectual solution the utility model discloses the problem that proposes in background art one with not enough.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this application, are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. In the drawings:
fig. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of a half-section structure of the present invention;
FIG. 3 is a schematic view of a half-section axial-measurement structure of the present invention;
fig. 4 is a schematic view of point a of the present invention;
fig. 5 is a schematic diagram of point B of the present invention.
In the figure: the device comprises a case 1, a baffle 2, a hinge 3, a plug 4, a temperature display 5, a switching power supply 6, a temperature probe 7, a first fin 8, a threaded column 9, a semiconductor refrigeration piece 10, a second fin 11, a cooling fan 12, a nut 13, a turbine fan 14 and a support 15.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
It is to be noted that, in the description of the present invention, "a plurality" means two or more unless otherwise specified; the terms "upper", "lower", "left", "right", "inner", "outer", "front", "rear", "head", "tail", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are merely for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.
Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
Meanwhile, in the description of the present invention, unless otherwise explicitly specified or limited, the terms "connected" and "connected" should be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; the connection can be mechanical connection or electrical connection; may be directly connected or indirectly connected through an intermediate. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1 to 5, the present invention provides a specific technical implementation of a liquid immersion type cooling cabinet:
a liquid submersion cooling cabinet comprising: the device comprises a case 1, a baffle 2, a hinge 3, a bolt 4, a temperature display 5, a switching power supply 6, a temperature probe 7, a first fin 8, a threaded column 9, a semiconductor refrigeration piece 10, a second fin 11, a cooling fan 12, a nut 13, a turbine fan 14 and a bracket 15; a baffle 2 is arranged at the rear part of the case 1, and the case 1 is connected with the baffle 2 through a hinge 3; the bolt 4 is arranged at the upper part of the baffle 2; the temperature display 5 is arranged at the top of the case 1, and the upper part of the temperature display 5 is provided with a switching power supply 6; the temperature probe 7 is arranged inside the case 1, and the temperature probe 7 is electrically connected with the temperature display 5; the first fin 8 is arranged at the rear part of the case 1, and the first fin 8 is connected with the case 1 in a welding mode; the threaded column 9 is arranged at the rear part of the first fin 8, and the threaded column 9 is connected with the first fin 8 in a welding mode; the semiconductor refrigeration piece 10 is arranged on one side of the first fin 8, and the semiconductor refrigeration piece 10 is connected with the threaded column 9 in a penetrating mode; the second fin 11 is arranged on one side of the semiconductor refrigerating sheet 10, and the second fin 11 is connected with the threaded column 9 in a penetrating manner; the heat radiation fan 12 is arranged at one side of the second fins 11, and the heat radiation fan 12 is connected with the threaded column 9 in a penetrating way; the turbine fan 14 is disposed inside the cabinet 1, and the turbine fan 14 is connected to the cabinet 1 by a bracket 15.
Specifically, the case 1 is a rectangular case-shaped structure, and a trapezoidal groove is formed in the rear portion of the case 1 and used for mounting the first fins 8, the threaded column 9, the semiconductor refrigeration piece 10, the second fins 11, the cooling fan 12 and the nuts 13, and meanwhile, the ventilation is facilitated, and the heat dissipation of the second fins 11 is facilitated.
Specifically, baffle 2 is otter board form, and the upper portion of baffle 2 is buckled with the son of bolt 4 and is connected, and the box setting of bolt 4 is in the rear portion of quick-witted case 1 for fixed baffle 2.
Specifically, the blades of the first fin 8 and the second fin 11 are longitudinally arranged, so that pure water and air can flow in the middle holes of the blades of the first fin 8 and the second fin 11 conveniently.
Specifically, the refrigerating surface of the semiconductor refrigerating sheet 10 is in contact with the first fins 8, and the radiating surface of the semiconductor refrigerating sheet 10 is in contact with the second fins 11, so as to cool the pure water inside the case 1.
The method comprises the following specific implementation steps:
when the device is used, components are arranged in the case 1, pure water is injected, then the semiconductor refrigerating sheet 10 is started through the switching power supply 6 to work, the temperature of the first fin 8 is reduced to cool the pure water in the case 1, the temperature of the second fin 11 is raised, heat dissipation is carried out through the heat dissipation fan 12, the first fin 8 and the fin of the second fin 11 are longitudinally arranged, the turbine fan 14 drives the pure water to flow upwards to cool the first fin 8, meanwhile, when air enters the groove at the rear part of the case 1 through the upper part and the lower part of the baffle 2, the air can conveniently flow in the fin of the second fin 11 to take away heat, the temperature probe 7 is used for monitoring the temperature of the pure water and displaying through the temperature display 5, the switching power supply 6 is arranged outside the case 1, the semiconductor refrigerating sheet 10, the heat dissipation fan 12 and the turbine fan 14 can be started in advance to cool the case when the device is not in use, the utility model is suitable for use in high temperature summer, and improves the convenience of use.
In summary, the following steps: according to the liquid immersion type cooling cabinet, the refrigerating surface of the semiconductor refrigerating sheet is in contact with the first fins, the turbine fan is arranged at the lower parts of the first fins, the fins of the first fins are longitudinally arranged inside the cabinet body, and the turbine fan has better circulation in the fins when driving water to flow, so that the heat dissipation efficiency of pure water inside the cabinet body is improved; through being provided with a trapezoidal recess at the rear portion of organism, and first fin, the semiconductor refrigeration piece, the second fin, radiator fan is located the middle part of trapezoidal recess, radiator fan is when the heat dissipation of second fin, the air can flow in from upper portion and lower part, good circulation has, the radiating efficiency is better, the switching power supply of simultaneous control semiconductor refrigeration piece and radiator fan installs on the upper portion of organism, be convenient for control, current submergence formula cooling rack has been solved, when using, it is not convenient enough to control the inside temperature of rack, after the pure water heaies up, be unfavorable for radiating problem.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. A liquid submersion cooling cabinet comprising: the device comprises a case (1), a baffle (2), a hinge (3), a bolt (4), a temperature display (5), a switching power supply (6), a temperature probe (7), a first fin (8), a threaded column (9), a semiconductor refrigeration sheet (10), a second fin (11), a cooling fan (12), a nut (13), a turbine fan (14) and a support (15); the method is characterized in that: a baffle (2) is arranged at the rear part of the case (1), and the case (1) is connected with the baffle (2) through a hinge (3); the bolt (4) is arranged at the upper part of the baffle (2); the temperature display (5) is arranged at the top of the case (1), and a switching power supply (6) is arranged at the upper part of the temperature display (5); the temperature probe (7) is arranged in the case (1), and the temperature probe (7) is electrically connected with the temperature display (5); the first fin (8) is arranged at the rear part of the case (1), and the first fin (8) is connected with the case (1) in a welding mode; the threaded column (9) is arranged at the rear part of the first fin (8), and the threaded column (9) is connected with the first fin (8) in a welding mode; the semiconductor refrigerating sheet (10) is arranged on one side of the first fin (8), and the semiconductor refrigerating sheet (10) is connected with the threaded column (9) in a penetrating mode; the second fin (11) is arranged on one side of the semiconductor refrigerating sheet (10), and the second fin (11) is connected with the threaded column (9) in a penetrating manner; the heat dissipation fan (12) is arranged on one side of the second fin (11), and the heat dissipation fan (12) is connected with the threaded column (9) in a penetrating manner; the turbine fan (14) is arranged inside the case (1), and the turbine fan (14) is connected with the case (1) through a support (15).
2. A liquid submersion cooling cabinet in accordance with claim 1, wherein: the case (1) is of a rectangular case-shaped structure, and a trapezoidal groove is formed in the rear portion of the case (1).
3. A liquid submersion cooling cabinet in accordance with claim 1, wherein: the baffle (2) is in a screen plate shape, the upper part of the baffle (2) is connected with the sub-buckle of the bolt (4), and the female buckle of the bolt (4) is arranged at the rear part of the case (1).
4. A liquid submersion cooling cabinet in accordance with claim 1, wherein: the blades of the first fin (8) and the second fin (11) are longitudinally arranged.
5. A liquid submersion cooling cabinet in accordance with claim 1, wherein: the refrigerating surface of the semiconductor refrigerating sheet (10) is in contact with the first fins (8), and the radiating surface of the semiconductor refrigerating sheet (10) is in contact with the second fins (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021496265.2U CN213028986U (en) | 2020-07-27 | 2020-07-27 | Liquid immersion type cooling cabinet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021496265.2U CN213028986U (en) | 2020-07-27 | 2020-07-27 | Liquid immersion type cooling cabinet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213028986U true CN213028986U (en) | 2021-04-20 |
Family
ID=75518596
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021496265.2U Expired - Fee Related CN213028986U (en) | 2020-07-27 | 2020-07-27 | Liquid immersion type cooling cabinet |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213028986U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI805200B (en) * | 2022-01-21 | 2023-06-11 | 新加坡商鴻運科股份有限公司 | Immersion cooling system |
-
2020
- 2020-07-27 CN CN202021496265.2U patent/CN213028986U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI805200B (en) * | 2022-01-21 | 2023-06-11 | 新加坡商鴻運科股份有限公司 | Immersion cooling system |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210420 Termination date: 20210727 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |