CN219303413U

CN219303413U - Resistor with upper surface heat sink

Info

Publication number: CN219303413U
Application number: CN202223339953.XU
Authority: CN
Inventors: 李万顺; 董洪涛; 黄晶; 沙学堃
Original assignee: Dalian Songyin Technology Co ltd
Current assignee: Dalian Songyin Technology Co ltd
Priority date: 2022-12-12
Filing date: 2022-12-12
Publication date: 2023-07-04
Anticipated expiration: 2032-12-12

Abstract

The utility model belongs to the technical field of resistors, and discloses a resistor with an upper surface heat dissipation device. According to the utility model, the resistor main body is taken as the device main body, the heat conducting shell wraps and covers the outer side of the top of the resistor main body, the heat generated by the resistor main body is rapidly led out through the high-efficiency heat conducting shell, the contact area between the outer part of the resistor main body and air is increased through the radiating fins, and rapid heat dissipation is realized, so that the device has good heat dissipation performance, the advantage of stable operation is ensured, and the problem that the heat dissipation performance of the existing resistor is insufficient because the electric energy consumes a lot of watts due to the working characteristics of the device in the prior art is solved.

Description

Resistor with upper surface heat sink

Technical Field

The utility model relates to the technical field of resistors, in particular to a resistor with an upper surface heat dissipation device.

Background

A resistor, which is conventionally called a resistance (hereinafter, a resistor is collectively called a resistance without any particular description), is a resistance which is a resistance of an object to passage of current, and a resistor is a device which blocks current, but the existing resistor has the following disadvantages;

the resistor in the prior art consumes a lot of watt of electric energy due to the working characteristics, and most of the electric energy is converted into heat consumption, so that the heat dissipation performance of the current resistor is insufficient.

Disclosure of Invention

In view of the problems in the prior art, an object of the present utility model is to provide a resistor with an upper surface heat sink, so as to solve the problem that the existing resistor consumes a lot of watt of electric energy, which is mostly converted into heat consumption, so that the heat dissipation performance of the existing resistor is insufficient.

In order to solve the problems, the utility model adopts the following technical scheme.

The resistor with the upper surface heat dissipation device comprises a resistor main body, pins are welded at two ends of the resistor main body, the outer side of the resistor main body is sleeved on a heat conduction shell, and heat dissipation fins which are arranged at equal intervals are arranged on the outer side of the heat conduction shell;

the heat conduction device comprises a heat conduction shell, wherein a plurality of arc-shaped through grooves are formed in the heat conduction shell, guide hole groups which are arranged at equal intervals are formed in the heat conduction shell, and the arc-shaped through grooves are communicated with the guide hole groups.

As a further description of the above technical solution: the bottom of the heat conduction shell is provided with an opening.

As a further description of the above technical solution: the outer sides of the guide hole groups are communicated with gaps between the adjacent radiating fins.

As a further description of the above technical solution: the bottom of the heat conduction shell is fixedly connected with two bottom blocks.

Compared with the prior art, the utility model has the advantages that:

according to the scheme, the resistor main body is used as the device main body, the heat conduction shell wraps and covers the outer side of the top of the resistor main body, heat generated by the resistor main body is rapidly led out through the efficient heat conduction shell, the contact area between the outside of the resistor main body and air is increased through the radiating fins, rapid heat dissipation is achieved, and therefore the device has the advantages of being good in heat dissipation performance and guaranteeing stable operation.

Drawings

FIG. 1 is a schematic cross-sectional elevation view of the present utility model;

FIG. 2 is a schematic side sectional view of the present utility model;

FIG. 3 is a schematic top view of the present utility model;

fig. 4 is a schematic partial front perspective view of the present utility model.

The reference numerals in the figures illustrate:

1. a resistor body; 2. pins; 3. a thermally conductive housing; 31. an opening; 32. a guide hole group; 33. arc through grooves; 4. a heat radiation fin; 5. a bottom block.

Detailed Description

The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model;

referring to fig. 1 to 4, the resistor with the upper surface heat dissipation device of the present utility model includes a resistor main body 1, two ends of the resistor main body 1 are welded with pins 2, the outer side of the resistor main body 1 is sleeved on a heat conducting shell 3, and heat dissipation fins 4 arranged equidistantly are arranged on the outer side of the heat conducting shell 3.

According to the utility model, the resistor main body 1 is taken as a device main body, the heat conduction shell 3 wraps and covers the outer side of the top of the resistor main body 1, so that the heat generated by the resistor main body 1 is rapidly led out by the high-efficiency heat conduction shell 3, the contact area between the outer part of the heat conduction shell and air is increased by the heat dissipation fins 4, and rapid heat dissipation is realized, so that the device has good heat dissipation performance, the advantage of stable operation is ensured, and the problem that the heat dissipation performance of the current resistor is insufficient because of the working characteristics of the device in the prior art, the electric energy is required to consume a lot of watts and is converted into heat consumption is solved.

Please refer to fig. 2 and fig. 4, wherein: the bottom of the heat conductive housing 3 is provided with an opening 31.

In the present utility model, the bottom of the resistor main body 1 is exposed to the air through the opening 31, and the concentrated heat dissipation of the top surface is achieved.

Please refer to fig. 1 and 2, wherein: a plurality of arc through grooves 33 are formed in the heat conducting shell 3, guide hole groups 32 are formed in the heat conducting shell 3 in an equidistance mode, and the arc through grooves 33 are communicated with the guide hole groups 32.

According to the utility model, the arc-shaped through groove 33 is matched with the guide hole group 32, so that air in the arc-shaped through groove 33 is heated and is emitted upwards through the guide hole group 32, then negative pressure is generated in the arc-shaped through groove 33, and cold air at the bottom enters the arc-shaped through groove 33, thereby realizing air circulation flow and increasing the heat dissipation efficiency of the device.

Please refer to fig. 2, 3 and 4, wherein: the outside of the guide hole group 32 communicates with the gaps between the adjacent heat radiating fins 4.

In the utility model, the outer sides of the guide hole groups 32 are communicated with the gaps between the adjacent radiating fins 4, and the air flowing out of the guide hole groups 32 flows out through the gaps between the radiating fins 4 to drive the air between the gaps to flow, so that the radiating efficiency of the device is enhanced.

Please refer to fig. 1, 2 and 3, wherein: the bottom of the heat conducting shell 3 is fixedly connected with two bottom blocks 5.

In the utility model, a certain gap is kept between the bottom of the resistor main body 1 and the mounted circuit board through the two bottom blocks 5, so that air can smoothly enter the bottom, and air circulation is realized.

Working principle: when the device is used, firstly, the resistor main body 1 is used as a device main body, the heat conduction shell 3 wraps and covers the outer side of the top of the resistor main body 1, the heat generated by the resistor main body 1 is rapidly led out through the efficient heat conduction shell 3, the contact area between the outer part of the heat conduction shell and air is increased through the radiating fins 4, rapid heat dissipation is achieved, the air inside the arc-shaped through groove 33 is heated and is upwards emitted through the guide hole group 32 through the cooperation of the arc-shaped through groove 33 and the guide hole group 32, then negative pressure is generated inside the arc-shaped through groove 33, and cold air at the bottom enters the inside of the arc-shaped through groove 33, so that air circulation flow is achieved, the heat dissipation efficiency of the device is improved, and therefore the device has good heat dissipation performance, and the purpose of stable work is guaranteed.

The above description is only of the preferred embodiments of the present utility model; the scope of the utility model is not limited in this respect. Any person skilled in the art, within the technical scope of the present disclosure, may apply to the present utility model, and the technical solution and the improvement thereof are all covered by the protection scope of the present utility model.

Claims

1. Resistor with upper surface heat sink, comprising a resistor body (1), characterized in that: pins (2) are welded at two ends of the resistor main body (1), the outer side of the resistor main body (1) is sleeved on the heat conducting shell (3), and radiating fins (4) which are arranged at equal intervals are arranged at the outer side of the heat conducting shell (3);

a plurality of arc-shaped through grooves (33) are formed in the heat conducting shell (3), guide hole groups (32) which are arranged at equal intervals are formed in the heat conducting shell (3), and the arc-shaped through grooves (33) are communicated with the guide hole groups (32).

2. The resistor with upper surface heat sink of claim 1, wherein: an opening (31) is formed in the bottom of the heat conducting shell (3).

3. The resistor with upper surface heat sink of claim 1, wherein: the outer sides of the guide hole groups (32) are communicated with gaps between the adjacent radiating fins (4).

4. The resistor with upper surface heat sink of claim 1, wherein: the bottom of the heat conduction shell (3) is fixedly connected with two bottom blocks (5).