CN219301137U

CN219301137U - Cooling mechanism for integrated circuit semiconductor processing

Info

Publication number: CN219301137U
Application number: CN202320823288.7U
Authority: CN
Inventors: 刘盛华; 张涛; 李悦; 张友玲
Original assignee: Shanghai Beixin Integrated Circuit Technology Co ltd
Current assignee: Shanghai Beixin Integrated Circuit Technology Co ltd
Priority date: 2023-04-12
Filing date: 2023-04-12
Publication date: 2023-07-04
Anticipated expiration: 2033-04-12

Abstract

The utility model relates to a cooling mechanism for integrated circuit semiconductor processing, which comprises a cooler, wherein the cooler comprises a cooling box and a refrigerating box, one side of the cooling box is provided with a water inlet pipe and a water outlet pipe, one sides of the water inlet pipe and the water outlet pipe are respectively provided with a connecting pipe, a heat insulation layer is arranged in the cooling box, a vent pipe is arranged in the cooling box, one side of the refrigerating box is provided with an air pump, one end of the air pump is provided with an air inlet pipe, the other end of the air pump is provided with an air outlet pipe, the air inlet pipe is communicated with the vent pipe, an air outlet plate is arranged in the refrigerating box, an air supply pipe is arranged on the air outlet pipe, the air supply pipe is provided with a plurality of air outlet pipes and is communicated with the air outlet plate through the air supply pipe, a clamping device is arranged in the refrigerating box, cooling water is circulated in the cooling box, air in the vent pipe is cooled, and the cooled air is fed into the refrigerating box through the air pump, the air inlet pipe, the air outlet pipe and the air outlet plate are arranged, and the cooled.

Description

Cooling mechanism for integrated circuit semiconductor processing

Technical Field

The utility model relates to the technical field of semiconductor processing, in particular to a cooling mechanism for integrated circuit semiconductor processing.

Background

The integrated circuit is a miniature electronic device or component, and adopts a certain process to interconnect the elements and wiring of transistors, diodes, resistors, capacitors, inductors and the like required in a circuit together, and make them into a miniature structure with the required circuit function by making them into a small piece or pieces of semiconductor wafer or dielectric substrate and then packaging them into a tube shell, in which all the elements are structurally formed into a whole, so that the electronic element can be greatly moved toward microminiaturization, low power consumption and high reliability.

Disclosure of Invention

(one) solving the technical problems

The utility model provides a cooling mechanism for integrated circuit semiconductor processing, which aims at solving the technical problems in the prior art.

(II) technical scheme

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a cooling mechanism for integrated circuit semiconductor processing, includes the cooler, the cooler includes cooling tank and refrigeration case, one side of cooling tank is equipped with inlet tube and outlet pipe, one side of inlet tube and outlet pipe all is equipped with the connecting pipe, be equipped with sealing device between connecting pipe and inlet tube and the outlet pipe, be equipped with the heat preservation in the cooling tank, be equipped with the breather pipe in the cooling tank, the breather pipe spirals and sets up in the cooling tank, refrigeration case one side is equipped with the air pump, air pump one end is equipped with the intake pipe, and the other end is equipped with the outlet duct, intake pipe and breather pipe intercommunication, be equipped with the board of giving vent to anger in the refrigeration case, be equipped with the gas supply pipe on the outlet duct, the gas supply pipe be provided with a plurality of just the outlet duct communicates with the board of giving vent to anger through setting up inlet tube and outlet pipe, circulate cooling water in the cooling tank, and then cool down for the air in the breather pipe, send into the refrigeration case through setting up aspiration pump, intake pipe, outlet pipe, gas supply pipe and the board after cooling down the cold air to the refrigeration piece.

Preferably, the sealing device comprises a fixing protrusion, the fixing protrusion is fixedly arranged on the connecting pipe, the upper end edge of the lower end edge of the fixing protrusion gradually bulges, the upper end of the connecting pipe is fixedly provided with a limiting protrusion, a rubber layer is arranged inside the water inlet pipe, the rubber layer is matched with the shape of the connecting pipe, the rubber layer extends to the outer edge of the pipe orifice of the water inlet pipe, and the connecting tightness between the connecting pipe and the water inlet pipe is improved by arranging the fixing protrusion, the limiting protrusion and the rubber layer, so that the water leakage phenomenon at the joint of the connecting pipe and the water inlet pipe is prevented.

In a further preferred aspect, the outside cover of connecting pipe and inlet tube is equipped with fixed pipe, the one end of fixed pipe is equipped with the draw-in groove, be equipped with the clamp on the draw-in groove, through setting up fixed pipe, seal the junction of connecting pipe and inlet tube, and then further prevent that inlet tube department from leaking, through setting up draw-in groove and clamp, be convenient for improve the joint strength of fixed pipe and inlet tube.

In a further preferred embodiment, the fixing tube is provided with a clamping protrusion, the water inlet tube is provided with a clamping groove matched with the clamping protrusion, and the relative position of the fixing tube and the water inlet tube is fixed by arranging the clamping protrusion and the clamping groove.

In a further preferred aspect, the clamping device comprises a U-shaped plate, a clamping spring is arranged inside the U-shaped plate, a clamping gasket is fixedly arranged on the clamping spring, ventilation holes are formed in the U-shaped plate and the clamping plate, the clamping spring and the clamping gasket are arranged, the clamping semiconductor wafer is convenient to cool, and ventilation and cooling areas are increased by the aid of the ventilation holes.

In a further preferred aspect, the rotating shaft is rotatably arranged in the refrigeration box, a rotating rod is arranged on the rotating shaft, the U-shaped plate is arranged on the rotating rod, a rotating motor is arranged on one side of the refrigeration box, and the clamping device and the semiconductor are driven to rotate through the rotating motor, the rotating rod and the rotating shaft, so that the cooling efficiency of the semiconductor is improved.

In a further preferred embodiment, the heat-insulating layer includes a polyurethane foam layer, a ceramic fiber cotton layer and a glass cotton layer, and the polyurethane foam layer, the ceramic fiber cotton layer and the glass cotton layer are provided so that the low temperature in the cooling box is not rapidly dissipated.

(III) beneficial effects

Compared with the prior art, the utility model provides a cooling mechanism for integrated circuit semiconductor processing, which has the following beneficial effects:

1. according to the utility model, the cooling water is circulated in the cooling box by arranging the water inlet pipe and the water outlet pipe, so that the air in the ventilation pipe is cooled, and the cooled cold air is sent into the cooling box by arranging the air suction pump, the air inlet pipe, the air outlet pipe, the air supply pipe and the air outlet plate, so that the semiconductor wafer is cooled.

2. According to the semiconductor cooling device, the U-shaped plate, the clamping springs and the clamping gaskets are arranged, so that the semiconductor wafer can be conveniently clamped for cooling, the ventilation and cooling area is increased through the ventilation holes, and the rotating motor, the rotating rod and the rotating shaft are arranged to drive the clamping device and the semiconductor to rotate, so that the cooling efficiency of the semiconductor is improved.

3. According to the utility model, the tightness of the connecting pipe, the water inlet pipe and the water outlet pipe is improved by arranging the fixing device, and the low temperature in the cooling box can not be quickly dispersed by arranging the polyurethane foam layer, the ceramic fiber cotton layer and the glass cotton layer.

Drawings

FIG. 1 is a schematic diagram showing the overall structure of a cooling mechanism for integrated circuit semiconductor processing according to the present utility model;

FIG. 2 is a schematic diagram of the fitting structure of the vent pipe, air pump, air inlet pipe, air outlet plate and air supply pipe in the present utility model;

FIG. 3 is a schematic cross-sectional view of a fixing device according to the present utility model;

FIG. 4 is a schematic view of the overall structure of the clamping device according to the present utility model;

fig. 5 is a schematic diagram of the mating structure of the polyurethane foam layer, the ceramic fiber cotton layer and the glass cotton layer in the present utility model.

In the figure: 1. a cooler; 2. a cooling box; 3. a refrigeration box; 4. a water inlet pipe; 5. a water outlet pipe; 6. a connecting pipe; 7. a heat preservation layer; 8. a vent pipe; 9. an air pump; 10. an air inlet pipe; 11. an air outlet pipe; 12. an air outlet plate; 13. an air supply pipe; 14. a fixing protrusion; 15. a limit protrusion; 16. a rubber layer; 17. a fixed tube; 18. a clamping groove; 19. a clamp; 20. the clamping bulge; 21. a clamping groove; 22. a U-shaped plate; 23. a clamping spring; 24. clamping the gasket; 25. a vent hole; 26. a rotating shaft; 27. a rotating lever; 28. a rotating motor; 29. a polyurethane foam layer; 30. a ceramic fiber cotton layer; 31. and a glass wool layer.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Example 1:

referring to fig. 1-5, a cooling mechanism for integrated circuit semiconductor processing comprises a cooler 1, wherein the cooler 1 comprises a cooling box 2 and a refrigerating box 3, one side of the cooling box 2 is provided with a water inlet pipe 4 and a water outlet pipe 5, one sides of the water inlet pipe 4 and the water outlet pipe 5 are respectively provided with a connecting pipe 6, sealing devices are arranged between the connecting pipes 6 and the water inlet pipe 4 and between the water inlet pipe 5 and the water outlet pipe 5, a semiconductor refrigerator is arranged in the cooling box 2, an insulating layer 7 is arranged in the cooling box 2, a vent pipe 8 is arranged in the cooling box 2, the vent pipe 8 is spirally arranged in the cooling box 2, one side of the refrigerating box 3 is provided with an air pump 9, one end of the air pump 9 is provided with an air inlet pipe 10, the other end of the air pump is provided with an air outlet pipe 11, the air inlet pipe 10 is communicated with the vent pipe 8, an air outlet plate 12 is arranged in the refrigerating box 3, an air supply pipe 13 is arranged on the air outlet pipe 11, the air supply pipe 13 is provided with a plurality of and outlet duct 11 communicates with the air outlet plate 12 through the air supply pipe 13, be equipped with clamping device in the refrigeration case 3, the heat preservation 7 includes polyurethane foam layer 29, ceramic fiber cotton layer 30 and glass cotton layer 31, when using, connecting pipe 6 passes through fixing device and connects inlet tube 4 and outlet pipe 5, carry out the circulation of cooling water, start air pump 9, the air enters into in the breather pipe 8, the cooling water cools down the air, the air passes through intake pipe 10, outlet duct 11 gets into in air supply pipe 13 and the air outlet plate 12, cool down the semiconductor chip through the cooling air, cooling effect and cooling efficiency have been improved, through setting up polyurethane foam layer 29, ceramic fiber cotton layer 30 and glass cotton layer 31, make the low temperature in the cooling case 2 can not scatter soon.

Referring to fig. 3, in this embodiment, the sealing device includes a fixing protrusion 14, the fixing protrusion 14 is fixedly disposed on the connecting pipe 6, the lower end edge of the fixing protrusion 14 gradually bulges along the upper end edge, a limiting protrusion 15 is fixedly disposed at the upper end of the connecting pipe 6, a rubber layer 16 is disposed inside the connecting pipe 4, the rubber layer 16 is adapted to the shape of the connecting pipe 6, the rubber layer 16 extends to the pipe opening outer edge of the water inlet pipe 4, a fixing pipe 17 is sleeved outside the connecting pipe 6 and the water inlet pipe 4, a clamping groove 18 is disposed at one end of the fixing pipe 17, a clamping hoop 19 is disposed on the clamping groove 18, a clamping protrusion 20 is disposed on the fixing pipe 17, and a clamping groove 21 matched with the clamping protrusion 20 is disposed on the water inlet pipe 4.

Referring to fig. 4, in this embodiment, the clamping device includes a U-shaped plate 22, a clamping spring 23 is disposed inside the U-shaped plate 22, a clamping pad 24 is fixedly disposed on the clamping spring 23, ventilation holes 25 are disposed on the U-shaped plate 22 and the clamping plate, a rotating shaft 26 is disposed in the refrigerating box 3, a rotating rod 27 is disposed on the rotating shaft 26, the U-shaped plate 22 is disposed on the rotating rod 27, a rotating motor 28 is disposed on one side of the refrigerating box 3, a semiconductor wafer is disposed between the clamping pads 24, the clamping pad 24 is tightly abutted against the semiconductor wafer through the clamping spring 23, and then the rotating motor 28 is driven, the rotating motor 28 drives the rotating shaft 26 and the rotating rod 27 to rotate, and further drives the semiconductor wafer to rotate, thereby improving cooling efficiency of the semiconductor wafer.

Example 2:

on the basis of embodiment 1, when in use, the semiconductor wafer is arranged between the clamping gaskets 24, the clamping gaskets 24 are tightly abutted against the semiconductor wafer through the clamping springs 23, then the rotating motor 28 is driven, the rotating motor 28 drives the rotating shaft 26 and the rotating rod 27 to rotate, the semiconductor wafer is driven to rotate, the connecting pipe 6 is connected with the water inlet pipe 4 and the water outlet pipe 5 through the fixing device, circulation of cooling water is carried out, the air pump 9 is started, air enters the ventilation pipe 8, the cooling water cools the air, the air enters the air supply pipe 13 and the air outlet plate 12 through the air inlet pipe 10 and the air outlet pipe 11, the semiconductor wafer is cooled through cold air, and the cooling effect and the cooling efficiency are improved.

Example 3:

on the basis of embodiment 2, when in use, through setting up fixed protrusion 14 and spacing protruding 15, be convenient for with the rubber layer 16 block of connecting pipe 6 with inlet tube 4, improved the connection leakproofness between connecting pipe 6 and the inlet tube 4, cover in connecting pipe 6 and the inlet tube 4 outside and establish fixed pipe 17, with the block protruding 20 block on joint groove 21, fix on draw-in groove 18 through clamp 19, further improve the leakproofness of connecting pipe 6 and inlet tube 4 through fixed pipe 17 to prevent that connecting pipe 6 and inlet tube 4 junction from leaking.

In all the above mentioned solutions, in which the connection between two components can be chosen according to the actual situation, a welded, bolt-and-nut-fitted connection, a bolt-or-screw connection or other known connection means, which are not described in detail herein, where reference is made to a written fixed connection, the preferred consideration is welding, although embodiments of the utility model have been shown and described, it will be understood by those skilled in the art that numerous variations, modifications, substitutions and alterations can be made to these embodiments without departing from the principle and spirit of the utility model, the scope of which is defined by the appended claims and their equivalents.

Claims

1. The utility model provides a cooling mechanism for integrated circuit semiconductor processing, includes cooler (1), its characterized in that: the cooler (1) comprises a cooling box (2) and a refrigerating box (3), one side of the cooling box (2) is provided with a water inlet pipe (4) and a water outlet pipe (5), one sides of the water inlet pipe (4) and the water outlet pipe (5) are respectively provided with a connecting pipe (6), sealing devices are arranged between the connecting pipes (6) and the water inlet pipe (4) and between the water outlet pipe (5), an insulating layer (7) is arranged in the cooling box (2), a vent pipe (8) is arranged in the cooling box (2), the vent pipe (8) is spirally arranged in the cooling box (2), one side of the refrigerating box (3) is provided with an air pump (9), one end of the air pump (9) is provided with an air inlet pipe (10), the other end of the air pump is provided with an air outlet pipe (11), the air outlet pipe (10) is communicated with the air outlet pipe (8), a plurality of air outlet pipes (13) are arranged in the refrigerating box (3), and the air outlet pipe (11) is communicated with the air outlet pipe (12) through the air outlet pipe (13), and the air outlet pipe (3) is internally provided with a clamping device.

2. The cooling mechanism for integrated circuit semiconductor processing of claim 1, wherein: the sealing device comprises a fixing protrusion (14), the fixing protrusion (14) is fixedly arranged on a connecting pipe (6), the upper end edge of the lower end edge of the fixing protrusion (14) gradually bulges, a limiting protrusion (15) is fixedly arranged at the upper end of the connecting pipe (6), a rubber layer (16) is arranged inside the water inlet pipe (4), the rubber layer (16) is matched with the shape of the connecting pipe (6), and the rubber layer (16) extends to the outer edge of a pipe orifice of the water inlet pipe (4).

3. A cooling mechanism for integrated circuit semiconductor processing as recited in claim 2, wherein: the outer side of connecting pipe (6) and inlet tube (4) cover is equipped with fixed pipe (17), the one end of fixed pipe (17) is equipped with draw-in groove (18), be equipped with clamp (19) on draw-in groove (18).

4. A cooling mechanism for integrated circuit semiconductor processing as recited in claim 3, wherein: the fixing pipe (17) is provided with a clamping protrusion (20), and the water inlet pipe (4) is provided with a clamping groove (21) matched with the clamping protrusion (20).

5. The cooling mechanism for integrated circuit semiconductor processing of claim 1, wherein: the clamping device comprises a U-shaped plate (22), a clamping spring (23) is arranged inside the U-shaped plate (22), a clamping gasket (24) is fixedly arranged on the clamping spring (23), and ventilation holes (25) are formed in the U-shaped plate (22) and the clamping plate.

6. The cooling mechanism for integrated circuit semiconductor processing of claim 5, wherein: the refrigerating box (3) is rotationally provided with a rotating shaft (26), a rotating rod (27) is arranged on the rotating shaft (26), the U-shaped plate (22) is arranged on the rotating rod (27), and a rotating motor (28) is arranged on one side of the refrigerating box (3).

7. The cooling mechanism for integrated circuit semiconductor processing of claim 1, wherein: the heat insulation layer (7) comprises a polyurethane foam layer (29), a ceramic fiber cotton layer (30) and a glass cotton layer (31).