CN205052051U - Thermal module is mixed to forced air cooling, water -cooling based on semiconductor refrigeration - Google Patents

Abstract

The utility model discloses an air-cooled and water-cooled mixed heat dissipation module based on semiconductor refrigeration, comprising a frame, a heat dissipation component, a gear quantitative pump, a water inlet and outlet temperature sensor, a water inlet and outlet self-locking liquid flow joint, a guide overflow valve, and a power supply module Wait. The self-locking liquid flow joint of the water inlet is connected with the water inlet of the cooling assembly, and a water inlet temperature sensor is also arranged on the self-locking liquid flow joint of the water inlet. The self-locking liquid flow joint of the water outlet, the water outlet temperature sensor is arranged on the self-locking liquid flow joint of the water outlet; the guide type overflow valve is connected in parallel on the gear quantitative pump. The air-cooled and water-cooled hybrid heat dissipation module can provide cooling water lower than the ambient temperature, and can work normally in strong vibration and shock, complex electromagnetic interference, high temperature, and hot and humid environments. Improved heat dissipation.

Description

An air-cooled, water-cooled hybrid cooling module based on semiconductor refrigeration

technical field

The utility model belongs to the field of anti-harsh environment electronic equipment, in particular to an air-cooled and water-cooled hybrid cooling module based on semiconductor refrigeration.

Background technique

With the rapid development of microelectronics technology and large-scale integrated circuit technology, while the functions of electronic equipment are constantly enriched and the performance is continuously improved, the power consumption and heat per unit volume of electronic equipment are also greatly increased. At present, industrial control electronic equipment and reinforced electronic equipment used in harsh environments generally adopt forced air cooling technology. Restricted by factors, air-cooled heat dissipation electronic equipment generally has a small heat dissipation capacity, and is only suitable for devices with small heating power density and large heat dissipation space.

Semiconductor refrigeration technology has no mechanical transmission part, no liquid and gas working medium, and the refrigeration parameters are not affected by the direction of space and gravity. It can work reliably in strong vibration environments, and has fast action speed, long service life and easy control; , which can make the refrigerator change from the cooling state to the heating working state, and has two functions of cooling and heating.

As a relatively mature heat dissipation technology, liquid cooling technology has been widely used in the heat dissipation system of automobiles and high-performance commercial servers, such as IBM's Aquasar water-cooled supercomputer, HP's XW9400 water-cooled workstation electronic equipment heat dissipation system, etc. After continuous development and improvement, liquid cooling technology has been continuously applied in the field of high-performance electronic equipment and anti-harsh environment electronic equipment. The heat dissipation capacity of water-cooled electronic equipment is 3 to 5 times higher than that of air-cooled systems.

Existing water-cooled electronic equipment is mostly used in large-scale electronic equipment systems or in the field of high-end servers. Although the heat dissipation capacity is much higher than that of air-cooled electronic equipment, based on the safety and reliability of water-cooled electronic equipment, the existing water-cooled electronic equipment is generally There are disadvantages such as complex structure, large volume, poor maintainability, low reliability, and weak environmental adaptability, which limit the application field and scope of use of water-cooled and heat-dissipating electronic equipment.

Utility model content

The technical problem solved by the utility model is to provide an air-cooled and water-cooled hybrid cooling module based on semiconductor refrigeration.

The technical solution to realize the purpose of this utility model is: an air-cooled and water-cooled hybrid heat dissipation module based on semiconductor refrigeration, including a water inlet self-locking liquid flow joint, a water inlet temperature sensor, a heat dissipation component, a gear quantitative pump, a frame, and a power supply module , guide overflow valve, water outlet temperature sensor, water outlet self-locking liquid flow joint, the water inlet self-locking liquid flow joint is connected with the water inlet of the heat dissipation assembly, and the water inlet self-locking liquid flow joint is also set the water inlet temperature The sensor, the water outlet of the heat dissipation component is connected to the gear quantitative pump, and the other end of the gear quantitative pump is connected to the self-locking liquid flow joint of the water outlet, and the water outlet temperature sensor is set on the self-locking liquid flow joint of the water outlet; An overflow valve, one end of the pilot overflow valve is connected to the water outlet of the cooling assembly, and the other end of the pilot overflow valve is connected to the self-locking liquid flow joint of the water outlet; the power module is located on one side of the frame.

Compared with the prior art, the present utility model has the following remarkable advantages: 1) The air-cooled and water-cooled hybrid heat dissipation modules of the present utility model all adopt modular design, with simple and compact structure, high reliability, good maintainability, and higher heat dissipation efficiency. High air-cooled, water-cooled hybrid heat dissipation technology replaces the traditional air-cooled heat dissipation technology, with high heat transfer coefficient and small temperature gradient, which improves the heat dissipation capacity of external water-cooled electronic equipment by 3 to 5 times; 2) The utility model adopts semiconductor-based Refrigeration technology can provide cooling water lower than the ambient temperature for external water-cooled electronic equipment, and the heat dissipation capacity can meet the heat dissipation application requirements of small high-performance electronic equipment or small servers.

Below in conjunction with accompanying drawing, the utility model is described in further detail.

Description of drawings

Figure 1 is a schematic diagram of an air-cooled and water-cooled hybrid heat dissipation module based on semiconductor refrigeration technology.

Figure 2 is a schematic diagram of the heat dissipation assembly. Among them, figure (a) is a bottom view, and figure (b) is a main view.

The meanings represented by the numbers in the figure are: 1- water inlet plane self-locking liquid flow joint, 2- water inlet temperature sensor, 3- heat dissipation component, 4- main quantitative pump, 5- frame, 6- power module, 7- Guide type overflow valve, 8-water outlet temperature sensor, 9-water outlet plane self-locking liquid flow joint, 11-semiconductor cooling plate, 12-water-cooled heat exchanger, 13-radiating fin, 14-fan assembly.

detailed description

Combined with the accompanying drawings, the air-cooled, water-cooled hybrid heat dissipation module of the utility model has simple structure, high reliability, and good maintainability. Liquid flow joint 1, water inlet temperature sensor 2, cooling assembly 3, gear quantitative pump 4, frame 5, power module 6, guide overflow valve 7, water outlet temperature sensor 8, water outlet self-locking liquid flow joint 9, all The water inlet self-locking liquid flow joint 1 is connected to the water inlet of the cooling assembly 3, and the water inlet temperature sensor 2 is also arranged on the water inlet self-locking liquid flow joint 1, and the water outlet of the cooling assembly 3 is connected to the gear quantitative pump 4, and the gear quantitative pump The other end of 4 is connected to the water outlet self-locking liquid flow joint 9, and the water outlet temperature sensor 8 is arranged on the water outlet self-locking liquid flow joint 9; the guide type overflow valve 7 is connected in parallel on the gear quantitative pump 4, and the guide type overflow valve 7 One end of the valve 7 is connected to the water outlet of the cooling assembly 3 , and the other end of the pilot overflow valve 7 is connected to the self-locking liquid flow joint 9 of the water outlet; the power module 6 is located on one side of the frame 5 .

Both the water inlet self-locking liquid flow joint 1 and the water outlet self-locking liquid flow joint 9 are located on the top of the frame 5 .

The frame 5 is made of high-strength aluminum alloy.

Conductive rubber strips are pressed and sealed between the frame 5 and the upper cover, the rear cover and the front panel.

The heat dissipation assembly 3 includes a semiconductor cooling plate 11, a water-cooled heat exchanger 12, a heat sink 13 and a fan assembly 14, the semiconductor cooling plate 11 is located at the bottom of the fan assembly 14, and the water-cooled heat exchanger 12 is located at the bottom of the semiconductor cooling plate 11 , the cooling fins 13 are located on the side of the fan assembly 14 .

The external water-cooled electronic equipment is connected to the water inlet self-locking liquid flow joint 1 of the air-cooled and water-cooled combined heat dissipation module through the liquid flow pipeline. The walls around the smooth water flow channel are forced convective heat exchange. The heat is conducted through the semiconductor cooling fin 11 and the heat sink 12. Finally, the fan assembly 13 dissipates the heat to the air through forced convective heat exchange with the air. The cooling water after the temperature is lowered goes out. Water outlet self-locking liquid flow connector 9, the liquid flow pipeline returns to the external water-cooled electronic equipment for recycling. The heat dissipation component 3 is a cooling water circulation heat dissipation device, which adopts air-cooled and water-cooled hybrid heat dissipation technology based on semiconductor refrigeration, and can provide cooling water lower than the ambient temperature for external water-cooled electronic equipment. The pilot relief valve 7 is connected between the water inlet and outlet of the pilot relief valve, and the overload protection pressure value can be adjusted. The utility model communicates with the external water-cooled electronic equipment through a pipeline with a flat fast self-locking liquid flow joint, so that fast locking and unlocking can be realized.

The air-cooled and water-cooled hybrid heat dissipation module based on semiconductor refrigeration technology, the frame is designed with an aluminum alloy sealed structure, the heat dissipation component is the channel through which the coolant flows and the place for heat exchange, and the cooling water is connected to the air-cooled, The water inlet self-locking liquid flow joint of the water-cooling hybrid cooling device is driven by the gear quantitative pump to exchange heat with the walls around the serpentine smooth water flow channel inside the water-cooling heat exchanger forcibly. The components dissipate heat to the air through forced convection heat exchange with the air, and the cooled cooling water flows back to the external water-cooled electronic equipment through the water outlet self-locking liquid flow joint and the liquid flow pipeline for recycling. The air-cooled and water-cooled hybrid heat dissipation module based on semiconductor refrigeration technology adopts semiconductor refrigeration technology to provide cooling water lower than the ambient temperature for external water-cooled electronic equipment. High heat transfer coefficient. The water inlet and outlet are equipped with flat fast self-locking input and output water-cooling joints.

The air-cooled and water-cooled hybrid heat dissipation module based on semiconductor refrigeration technology is equipped with a guide overflow valve inside, which is connected between the water inlet and outlet of the gear quantitative pump, which can effectively reduce the damage and leakage of the cooling channel of the air-cooled and water-cooled hybrid heat dissipation module when the pressure is overloaded. Risk, improve the reliability and stability of water-cooled air-cooled, water-cooled hybrid cooling modules. Using semiconductor refrigeration technology, it can provide cooling water lower than the ambient temperature for external water-cooled electronic equipment. The air-cooled and water-cooled hybrid heat dissipation module can be quickly locked and unlocked with the external water-cooled electronic equipment through the flat fast self-locking liquid flow joint. ” sound, the joint is automatically locked, and the liquid flow channel is automatically turned on. When the plug is pulled out, the joint is pushed along the axial direction and rotated, the joint pops up automatically, and the liquid flow channel is automatically sealed when the joint is disconnected. One of the key technologies for the maintainability of water-cooled hybrid radiators. The frame of the modular air-cooled and water-cooled hybrid cooling device is sealed with conductive rubber strips between the upper cover, the lower cover and the front panel, which can effectively realize waterproof, moisture-proof, dust-proof and electromagnetic shielding. Reliable work in harsh environments such as strong vibration and humidity.

Below in conjunction with embodiment the utility model is described in further detail:

Example 1

An air-cooled and water-cooled hybrid heat dissipation module based on semiconductor refrigeration technology, including a water inlet self-locking liquid flow joint 1, a water inlet temperature sensor 2, a heat dissipation component 3, a gear quantitative pump 4, a frame 5, a power module 6, a guide overflow Flow valve 7, water outlet temperature sensor 8, water outlet self-locking liquid flow joint 9, the water inlet self-locking liquid flow joint 1 is connected to the water inlet of the cooling assembly 3, and the water inlet self-locking liquid flow joint 1 is also provided with an inlet The water outlet temperature sensor 2, the water outlet of the cooling assembly 3 is connected to the gear quantitative pump 4, the other end of the gear quantitative pump 4 is connected to the water outlet self-locking liquid flow joint 9, and the water outlet self-locking liquid flow joint 9 is provided with a water outlet temperature sensor 8. The gear quantitative pump 4 is connected in parallel with the pilot overflow valve 7, one end of the pilot overflow valve 7 is connected to the water outlet of the cooling assembly 3, and the other end of the pilot overflow valve 7 is connected to the self-locking liquid flow joint of the water outlet 9; the power module 6 is located on one side of the frame 5. Both the water inlet self-locking liquid flow joint 1 and the water outlet self-locking liquid flow joint 9 are located on the top of the frame 5 . The frame 5 is made of high-strength aluminum alloy.

The heat dissipation assembly 3 includes a semiconductor cooling plate 11, a water-cooled heat exchanger 12, a heat sink 13 and a fan assembly 14, the semiconductor cooling plate 11 is located at the bottom of the fan assembly 14, and the water-cooled heat exchanger 12 is located at the bottom of the semiconductor cooling plate 11 , the cooling fins 13 are located on the side of the fan assembly 14 .

The cooling water of the external water-cooled electronic equipment is connected to the water inlet self-locking liquid flow joint 1 of the air-cooled and water-cooled hybrid heat dissipation module through the liquid flow pipeline, and is driven by the gear quantitative pump 4 to connect with the serpentine smooth water flow channel inside the water-cooled heat exchanger 12 Forced convection heat exchange on the surrounding walls, the heat is conducted through the semiconductor cooling plate 11 and the heat sink 13, and finally the fan assembly 14 dissipates the heat into the air through forced convection heat exchange with the air, and the cooled cooling water passes through the water outlet and self-locking liquid Flow joint 9, the liquid flow pipeline returns to the external water-cooled electronic equipment for recycling. The modular air-cooled and water-cooled hybrid heat dissipation device is equipped with a guided overflow valve 7 inside, which is connected between the water inlet and outlet of the gear quantitative pump 4. The overload protection pressure value can be adjusted, which can effectively reduce the air-cooled and water-cooled hybrid heat dissipation module when the pressure is overloaded. The risk of damage to the cooling channel and liquid leakage improves the reliability and stability of the air-cooled and water-cooled hybrid cooling modules.

The air-cooled and water-cooled hybrid heat dissipation module is connected with the external water-cooled electronic equipment through a flat quick self-locking liquid flow joint and a liquid flow rubber hose, which can realize fast locking and unlocking with the cooling pump. When the air-cooled, water-cooled hybrid heat dissipation module is connected to the flat fast self-locking liquid flow connector, a "click" sound is heard, the connector is automatically locked, and the liquid flow channel is automatically turned on. When the plug is pulled out, along the axial direction Push the joint and rotate it, the joint pops out automatically, and the liquid flow channel is automatically sealed when the joint is disconnected.

The air-cooled and water-cooled mixed heat dissipation module based on the semiconductor refrigeration technology of the utility model replaces the traditional air-cooled heat dissipation technology with the air-cooled and water-cooled mixed heat dissipation technology with higher heat dissipation efficiency, effectively reducing the form of air-cooled heat dissipation and strengthening electronic equipment and air exchange. The equivalent thermal resistance in the heat stage can improve the heat dissipation efficiency, which can increase the heat dissipation capacity of external water-cooled electronic equipment by 3~5 times. The air-cooled and water-cooled hybrid heat dissipation modules adopt modular design, which is simple and compact in structure, high in reliability and good in maintainability. , the heat dissipation capacity can meet the heat dissipation requirements in the field of small high-performance electronic equipment.

Claims (5)

1. An air-cooled and water-cooled hybrid heat dissipation module based on semiconductor refrigeration, characterized in that it includes a water inlet self-locking liquid flow joint (1), a water inlet temperature sensor (2), a heat dissipation component (3), and a gear quantitative pump ( 4), frame (5), power module (6), guide overflow valve (7), water outlet temperature sensor (8), water outlet self-locking liquid flow joint (9), the water inlet self-locking liquid flow The joint (1) is connected to the water inlet of the heat dissipation assembly (3), and the water inlet self-locking liquid flow joint (1) is also equipped with a water inlet temperature sensor (2), and the water outlet of the heat dissipation assembly (3) is connected to the gear quantitative pump (4 ), the other end of the gear quantitative pump (4) is connected to the water outlet self-locking liquid flow joint (9), and the water outlet self-locking liquid flow joint (9) is provided with a water outlet temperature sensor (8); the gear quantitative pump (4 ) is connected in parallel with the pilot overflow valve (7), one end of the pilot overflow valve (7) is connected to the water outlet of the cooling assembly (3), and the other end of the pilot overflow valve (7) is self-locked with the water outlet The liquid flow joints (9) are connected; the power module (6) is located on one side of the frame (5). 2. The air-cooled and water-cooled hybrid heat dissipation module based on semiconductor refrigeration according to claim 1, characterized in that the water inlet self-locking liquid flow joint (1) and the water outlet self-locking liquid flow joint (9) are located on the frame ( 5) The top. 3. The air-cooled and water-cooled hybrid cooling module based on semiconductor refrigeration according to claim 1, characterized in that the frame (5) is made of high-strength aluminum alloy. 4. The air-cooled and water-cooled hybrid cooling module based on semiconductor refrigeration according to claim 3, characterized in that conductive rubber strips are pressed and sealed between the frame (5) and the upper cover, rear cover and front panel. 5. The air-cooled and water-cooled hybrid heat dissipation module based on semiconductor refrigeration according to claim 1, characterized in that the heat dissipation component (3) includes a semiconductor refrigeration sheet (11), a water-cooled heat exchanger (12), a heat sink (13 ) and fan assembly (14), the semiconductor cooling plate (11) is located at the bottom of the fan assembly (14), the water-cooled heat exchanger (12) is located at the bottom of the semiconductor cooling plate (11), and the heat sink (13) is located at the fan assembly (14) side.