CN219286373U - Silicon wafer sucking disc assembly and non-contact conveying device - Google Patents
Silicon wafer sucking disc assembly and non-contact conveying device Download PDFInfo
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- CN219286373U CN219286373U CN202320360703.XU CN202320360703U CN219286373U CN 219286373 U CN219286373 U CN 219286373U CN 202320360703 U CN202320360703 U CN 202320360703U CN 219286373 U CN219286373 U CN 219286373U
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 100
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 100
- 239000010703 silicon Substances 0.000 title claims abstract description 100
- 230000005540 biological transmission Effects 0.000 claims description 17
- 235000012431 wafers Nutrition 0.000 abstract description 87
- 238000001179 sorption measurement Methods 0.000 abstract description 12
- 238000004519 manufacturing process Methods 0.000 abstract description 11
- 241000251468 Actinopterygii Species 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 230000007246 mechanism Effects 0.000 description 4
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model provides a silicon wafer sucker assembly and a non-contact conveying device, and relates to the technical field of silicon wafers. The silicon wafer sucker assembly comprises a cover body and a fan body; the fan body is movably arranged on the cover body, the fan body is used for generating air flow, and the cover body is provided with a through hole so as to adsorb the silicon chip through the through hole and the air flow generated by the fan body. Through being provided with the through-hole at the lid to make the fan produce the air current of high-speed flow, with the differential pressure that forms in the lid both sides, thereby realize contactless adsorption silicon chip, ensure that the silicon chip is not polluted or the fish tail in the transportation, and then improve production efficiency and silicon chip utilization ratio.
Description
Technical Field
The utility model relates to the technical field of silicon wafers, in particular to a silicon wafer sucker assembly and a non-contact conveying device.
Background
The clamping and conveying of the silicon wafer are an important link in the semiconductor production process, and influence the reliability of the silicon wafer. Traditional contact silicon wafer conveying generally adopts a mechanical mechanism such as clamping jaws to clamp or adopts a belt to convey, but adopts the mechanical mechanism to clamp or adopts the belt to convey, so that the silicon wafer is inevitably polluted or scratched, and even damaged, thereby seriously affecting the surface quality of the silicon wafer and reducing the production efficiency and the silicon wafer utilization rate.
Disclosure of Invention
The utility model aims to provide a silicon wafer sucking disc assembly and a non-contact conveying device, which can realize non-contact sucking of a silicon wafer and avoid pollution or scratch of the silicon wafer in the conveying process.
Embodiments of the present utility model are implemented as follows:
in a first aspect, the utility model provides a silicon wafer chuck assembly, which is applied to the field of silicon wafer conveying and comprises a cover body and a fan body;
the fan body is movably arranged on the cover body, the fan body is used for generating air flow, and the cover body is provided with a through hole so as to adsorb the silicon chip through the through hole and the air flow generated by the fan body.
In the above embodiment, through the through hole arranged on the cover body and the fan body generates high-speed flowing air flow so as to form air pressure difference at two sides of the cover body, the non-contact adsorption of the silicon wafer can be realized by controlling the rotating speed of the fan body, the silicon wafer is ensured not to be polluted or scratched in the conveying process, and the production efficiency and the silicon wafer utilization rate are further improved.
In an alternative embodiment, the number of the through holes includes a plurality, and the plurality of through holes are uniformly provided on the cover body.
In the above embodiment, the plurality of through holes are uniformly formed in the cover body, so as to ensure that the air pressure difference formed at two sides of the cover body is more stable, thereby stably adsorbing the silicon wafer, ensuring that the silicon wafer and the cover body keep a distance while the silicon wafer is sucked up, and realizing non-contact adsorption.
In an optional embodiment, the cover body is circular, and the plurality of through holes are annularly arranged at the center of the cover body.
In the above embodiment, by arranging the circular cover body, the airflow formed by the fan body can be more uniform, and meanwhile, the plurality of through holes are uniformly arranged on the circular cover body, so that the stability of the air pressure difference formed by two sides of the cover body can be further increased.
In an alternative embodiment, the fan body comprises a transmission part and a plurality of fan blades, and the fan blades are annularly arranged on the transmission part.
In the above embodiment, the driving part drives the transmission part to rotate around the axis, so as to drive the plurality of fan blades to rotate around the axis of the transmission part, thereby forming high-speed flowing air flow to adsorb the silicon wafer.
In an alternative embodiment, the fan blade is in the shape of a flat plate.
In the above embodiment, the fan blade is arranged in a flat plate shape, so that the transmission part drives the fan blade to form high-speed air flow, and the silicon wafer is adsorbed.
In an alternative embodiment, the fan blade is in the shape of a cambered surface.
In the above embodiment, the fan blade is set to be in a cambered surface shape, so that the transmission part drives the fan blade to form high-speed air flow, and the silicon wafer is adsorbed.
In an alternative embodiment, the silicon wafer chuck assembly further comprises a cover body, wherein the cover body is connected with the cover body and covers the fan body.
In the embodiment, the fan blade of the fan body is protected by arranging the cover body outside the fan body, so that the service life of the silicon wafer sucker assembly is prolonged.
In an alternative embodiment, the silicon wafer chuck assembly further comprises a driving member, and the driving member is in transmission connection with the fan body and is used for driving the fan body to rotate.
In the above embodiment, the rotational speed of the driving member is controlled to control the rotational speed of the fan body, thereby controlling the air flow rate formed in the cover body and the housing body. Therefore, the rotating speed of the driving piece can be adjusted according to the silicon wafers with different specifications, so that the silicon wafers with different specifications can be adsorbed in a non-contact mode through the silicon wafer sucking disc assembly.
In an alternative embodiment, the cover body is provided with a mounting hole, and the fan body is movably mounted in the mounting hole.
In the above embodiment, the mounting hole is disposed at the center of the cover body, so that the fan body is movably mounted at the center of the cover body and the center of the cavity surrounded by the cover body, so that under the condition that the fan body rotates and generates high-speed flowing air flow, the high-speed air flow formed by the fan body in the cavity surrounded by the cover body and the cover body is more stable, thereby realizing stable adsorption of the silicon wafer.
In a second aspect, the present utility model provides a non-contact conveyor comprising a silicon wafer chuck assembly according to any one of the preceding embodiments.
The silicon wafer sucker assembly and the non-contact conveying device provided by the embodiment of the utility model have the beneficial effects that: through being provided with the through-hole at the lid to make the fan produce the air current of high-speed flow, with the differential pressure that forms in the lid both sides, thereby realize contactless adsorption silicon chip, ensure that the silicon chip is not polluted or the fish tail in the transportation, and then improve production efficiency and silicon chip utilization ratio.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present utility model and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a silicon wafer chuck assembly according to an embodiment of the present utility model.
Icon: 10-a silicon wafer sucking disc component; 100-cover body; 110-a through hole; 120-mounting holes; 200-fan body; 210-a transmission part; 220-flabellum; 300-cover body.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments of the present utility model. The components of the embodiments of the present utility model generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the utility model, as presented in the figures, is not intended to limit the scope of the utility model, as claimed, but is merely representative of selected embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.
In the description of the present utility model, it should be noted that, directions or positional relationships indicated by terms such as "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., are directions or positional relationships based on those shown in the drawings, or are directions or positional relationships conventionally put in use of the inventive product, are merely for convenience of describing the present utility model and simplifying the description, and are not indicative or implying that the apparatus or element to be referred to must have a specific direction, be constructed and operated in a specific direction, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," "third," and the like are used merely to distinguish between descriptions and should not be construed as indicating or implying relative importance.
Furthermore, the terms "horizontal," "vertical," and the like do not denote a requirement that the component be absolutely horizontal or overhang, but rather may be slightly inclined. As "horizontal" merely means that its direction is more horizontal than "vertical", and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.
In the description of the present utility model, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
With the rapid development of the photovoltaic industry, the demand for high-quality silicon wafers is increasing, and the silicon wafer carrying device is becoming more important.
The clamping and conveying of the silicon wafer are an important link in the semiconductor production process, and the reliability of the silicon wafer is greatly affected. Traditional contact silicon wafer conveying generally adopts a mechanical mechanism such as clamping jaws to clamp or adopts a belt to convey, but adopts the mechanical mechanism to clamp or adopts the belt to convey, so that the silicon wafer is inevitably polluted or scratched, and even damaged, thereby seriously affecting the surface quality of the silicon wafer and reducing the production efficiency and the silicon wafer utilization rate.
Based on the above problems, referring to fig. 1, the present utility model provides a silicon wafer chuck assembly 10, which is applied to the field of silicon wafer transportation, and combines the bernoulli principle to generate high-speed flowing gas between the silicon wafer chuck assembly 10 and a silicon wafer, so as to generate negative pressure to adsorb the silicon wafer, and further realize non-contact transportation of the silicon wafer, thereby avoiding the silicon wafer from being polluted or scratched in the transportation process, and improving the production efficiency and the silicon wafer utilization rate.
The silicon wafer chuck assembly 10 comprises a cover body 100, a fan body 200, a cover body 300 and a driving piece (not shown), wherein the fan body 200 is movably arranged on the cover body 100, the cover body 300 is connected with the cover body 100, and the driving piece is in transmission connection with the fan body 200 and is used for driving the fan body 200 to rotate.
In this embodiment, the cover 100 is provided with the through hole 110, and the driving piece drives the fan 200 to rotate, so that the fan 200 generates high-speed airflow to form air pressure difference at two sides of the cover 100, thereby realizing non-contact adsorption of the silicon wafer, ensuring that the silicon wafer is not polluted or scratched in the conveying process, and further improving the production efficiency and the silicon wafer utilization rate.
In addition, on the continuous conveying effect of the silicon wafer, the silicon wafer is sucked up through the silicon wafer sucking disc assembly 10 for adsorption and transportation relatively in a mode of jacking the silicon wafer from bottom to top, so that electrostatic pollution is avoided, and the silicon wafer is not easy to damage.
Alternatively, the driving member may be a motor.
The rotational speed of the motor may be controlled to control the rotational speed of the fan 200, thereby controlling the air flow rate formed in the cover 100 and the cover 300. Therefore, the rotation speed of the motor can be adjusted according to the silicon wafers with different specifications, so that the silicon wafers with different specifications can be adsorbed in a non-contact mode through the silicon wafer chuck assembly 10.
Further, the number of the through holes 110 includes a plurality of through holes 110 uniformly provided on the cover body 100.
In this embodiment, the plurality of through holes 110 are uniformly formed on the cover body 100, so as to ensure that the air pressure difference formed at two sides of the cover body 100 is more stable, thereby stably adsorbing the silicon wafer, ensuring that the silicon wafer and the cover body 100 keep a distance while the silicon wafer is sucked up, and realizing non-contact adsorption.
Specifically, the cover 100 is circular, the plurality of through holes 110 are annularly disposed at the center of the cover 100, and the plurality of through holes 110 are divergently and extend from the center of the cover 100.
Of course, in other embodiments of the present utility model, the plurality of through holes 110 are distributed in a multiple ring shape, in other words, in the case of taking the center of the cover 100 as the center, some of the through holes 110 are located on the same circumference, and other through holes 110 are located on another circumference, so as to form the through holes 110 distributed in multiple circles; furthermore, the plurality of through holes 110 between two adjacent circumferential lines may be alternately arranged.
In summary, the plurality of through holes 110 may take various forms, which are not particularly limited herein.
Further, the fan body 200 includes a transmission portion 210 and a plurality of fan blades 220, and the plurality of fan blades 220 are disposed around the transmission portion 210.
In this embodiment, the driving member is connected to the transmission portion 210, and the transmission portion 210 is cylindrical, and drives the transmission portion 210 to rotate around the axis through the driving member, so as to drive the plurality of fan blades 220 to rotate around the axis of the transmission portion 210, thereby forming an air flow flowing at a high speed, and realizing the adsorption of the silicon wafer.
It is understood that in some embodiments of the present utility model, the fan blade 220 may be flat, in other words, the fan blade 220 is a straight blade; in other embodiments of the present utility model, the fan blade 220 may also have a cambered surface, in other words, the fan blade 220 is a curved blade, which can be adjusted according to the specific requirements in practical applications, and is not limited herein.
Specifically, the number of the fan blades 220 may be set to 8.
Further, the cover 300 is connected to the cover 100 and covers the outside of the fan 200.
In this embodiment, the cover 300 and the cover 100 are both circular, and the cover 300 is disposed outside the fan 200 to protect the fan blades 220 of the fan 200, so as to improve the service life of the silicon wafer chuck assembly 10.
Further, the cover 100 is provided with a mounting hole 120, and the fan 200 is movably mounted to the mounting hole 120.
In this embodiment, the mounting hole 120 is disposed at the center of the cover 100, so that the fan 200 is movably mounted at the center of the cover 100 and the center of the cavity surrounded by the cover 300, so that under the condition that the fan 200 rotates and generates high-speed airflow, the high-speed airflow formed by the fan 200 in the cavity surrounded by the cover 100 and the cover 300 is more stable, thereby realizing stable adsorption of the silicon wafer.
Further, the utility model also provides a non-contact conveying device (not shown), which comprises the silicon wafer sucker assembly 10 in the embodiment, and the silicon wafer can be conveyed in a non-contact manner through the silicon wafer sucker assembly 10, so that the silicon wafer is prevented from being polluted or scratched in the conveying process, and further the production efficiency and the silicon wafer utilization rate are improved. In addition, the silicon wafer is sucked up by the silicon wafer sucking disc assembly 10 for adsorption and transportation in a mode of jacking the silicon wafer from bottom to top, so that electrostatic pollution is avoided.
In summary, the present utility model provides a silicon wafer chuck assembly 10 and a non-contact conveying device, which can realize non-contact conveying of silicon wafers through the silicon wafer chuck assembly 10, so as to avoid pollution or scratch of the silicon wafers in the conveying process, and further improve the production efficiency and the silicon wafer utilization rate. In addition, the silicon wafer is sucked up by the silicon wafer sucking disc assembly 10 for adsorption and transportation in a mode of jacking the silicon wafer from bottom to top, so that electrostatic pollution is avoided.
The above description is only of the preferred embodiments of the present utility model and is not intended to limit the present utility model, but various modifications and variations can be made to the present utility model by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.
Claims (10)
1. The silicon wafer sucking disc component is applied to the field of silicon wafer conveying and is characterized by comprising a cover body and a fan body;
the fan body is movably arranged on the cover body, the fan body is used for generating air flow, and the cover body is provided with a through hole so as to adsorb the silicon chip through the through hole and the air flow generated by the fan body.
2. The wafer chuck assembly of claim 1 wherein the number of through holes comprises a plurality, the plurality of through holes being uniformly disposed on the cover.
3. The wafer chuck assembly of claim 2 wherein the cover is circular and the plurality of through holes are annularly disposed about a center of the cover.
4. The wafer chuck assembly of claim 1, wherein the fan body comprises a transmission portion and a plurality of blades, the plurality of blades being disposed around the transmission portion.
5. The wafer chuck assembly of claim 4 wherein said fan blades are flat.
6. The wafer chuck assembly of claim 5 wherein said blades are arcuate.
7. The wafer chuck assembly of claim 1 further comprising a housing, said housing being coupled to said cover and housing said fan.
8. The wafer chuck assembly of claim 1 further comprising a drive member drivingly connected to the fan for rotating the fan.
9. The wafer chuck assembly of claim 1 wherein the cover defines a mounting aperture, the fan being movably mounted to the mounting aperture.
10. A non-contact conveyor comprising a silicon wafer chuck assembly according to any one of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320360703.XU CN219286373U (en) | 2023-02-28 | 2023-02-28 | Silicon wafer sucking disc assembly and non-contact conveying device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320360703.XU CN219286373U (en) | 2023-02-28 | 2023-02-28 | Silicon wafer sucking disc assembly and non-contact conveying device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219286373U true CN219286373U (en) | 2023-06-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320360703.XU Active CN219286373U (en) | 2023-02-28 | 2023-02-28 | Silicon wafer sucking disc assembly and non-contact conveying device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219286373U (en) |
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- 2023-02-28 CN CN202320360703.XU patent/CN219286373U/en active Active
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