A kind of device and method that keeps pan
Technical field
The present invention relates to mechanical field, be specifically related to a kind of device and method that keeps pan.
Background technology
When this speech of pan used in this article, it represented polytype tabular base material, for example semiconductor wafer, CD or flat-panel monitor etc.It is pin chuck, bernoulli gripper etc. that wafer chuck is used maximum in the field.The chuck that utilizes bernoulli principle that wafer is fixing in being the U.S. Patent application of US4903717, application number is disclosed.Wafer utilizes bernoulli principle and is maintained on the carrier, rotates with carrier.Realize radial location by the clamping element that is distributed in the wafer circumference.This chuck has determined manipulator to grasp wafer from the top of wafer, thereby has limited the form of arm end effector, and produces pollution in upper wafer surface easily.
Just there are not the problems referred to above in wafer, pan used carriers in the process of preparation such as some other pan such as CD also exist above-mentioned can only be from this pan of top extracting, thereby make the pan upper surface be easy to generate pollution problems.
Summary of the invention
The purpose of this invention is to provide a kind of device and method that keeps pan, utilize the present invention after pan is fixing, can grasp pan, and keep the cleaning of pan upper surface effectively and not contaminated from the pan lower surface.
For achieving the above object, the present invention adopts following technical scheme:
A kind of device that keeps pan is characterized in that,
Described carrier is provided with the projecting member that is used for the axial restraint pan, and described projecting member makes pan lower surface and the carrier upper surface after fixing produce the space all around, and described space is used for manipulator and grasps described pan from the pan lower surface;
Described carrier edge is distributed with several clamping elements, is used for radially fixedly pan.
Preferably, described carrier upper surface periphery is provided with the inflatable mouth that is connected with source of the gas, and gas blows to the outside of the lower surface of described pan by inflatable mouth, and the process liquid that air pressure makes the pan upper surface can be along the marginal flow of pan to the pan lower surface.
Preferably, described pan is a wafer, described projecting member is the protrusion sucker that is used to adsorb wafer, and described carrier is rotary carrier, and described protrusion sucker produces wafer lower surface and carrier upper surface all around space moves up and down for manipulator and grasps described wafer from the crystal lower surface.
Preferably, described gas source is an inert gas source, and described inflatable mouth is pore or endless groove.
Preferably, described protrusion sucker is a vacuum cup, and described clamping element is stiffener or the element that fixes described pan by rotation or inclination.
Preferably, the inflatable mouth that described carrier upper surface periphery is provided with is at least a week, and described inflatable mouth evenly distributes.
Preferably, described clamping element number is at least 3, and described clamping element evenly distributes along carrier edge.
The present invention also provides a kind of method that keeps pan, in this method:
By being arranged on the projecting member axial restraint pan on the carrier;
Clamping element by being distributed in carrier edge is fixing pan radially;
Make pan lower surface and carrier upper surface after fixing produce the space all around by projecting member, described space is used for grasping described pan from the pan lower surface.
Preferably, the inflatable mouth of this method by being arranged on carrier upper surface periphery to described pan outside uninterrupted air blowing of lower surface, the process liquid that air pressure makes the pan surface can be along the marginal flow of pan to the pan lower surface.
Utilize the device and method of maintenance pan provided by the invention,, after pan is fixing, can grasp pan, and keep the cleaning of pan upper surface effectively and not contaminated from the pan lower surface by Design of Mechanical Structure.
Description of drawings
Fig. 1 is the structure drawing of device that keeps pan in the embodiment of the invention;
Fig. 2 is the vertical view that keeps carrier in the device of pan in the embodiment of the invention;
Among the figure: the device that 1, keeps pan; 2, carrier; 3, clamping element; 4, protrude sucker; 5, inflatable mouth; 6, manipulator; W, wafer; The upper surface of W1, wafer; The lower surface of W2, wafer; The upper surface of Ws, carrier; S, distance.
Embodiment
The device and method of the maintenance pan that the present invention proposes is described as follows in conjunction with the accompanying drawings and embodiments.
Embodiment 1
Present embodiment is that wafer is an example with the pan, the upper surface of wafer and the lower surface of wafer are expressed as W1 and W2 respectively, as shown in Figure 1, the device 1 of this maintenance pan comprises carrier 2, carrier 2 is provided with the protrusion sucker that is used for the axial restraint wafer, this protrudes the sucker 4 preferred vacuum cups that adopt, can certainly adopt the sucker of other fixed wafer form, protruding sucker 4 makes the lower surface W 2 of the wafer after fixing and carrier 2 upper surfaces produce the space all around, even the lower surface W of wafer 2 keeps certain distance S with the upper surface Ws of carrier, the space that is produced moves up and down for manipulator, and the space that enough moves up and down is arranged when guaranteeing manipulator 6 loading and unloading wafer W; The edge distribution of carrier 2 has at least three clamping elements 3, be used for radially fixed wafer, clamping element 3 can be the element that passes through to rotate or tilt to fix described pan of stiffener, the outer rim that rotation or inclination certain angle by clamping element 3 comes holding chip realizes the regular and radial location to wafer; Carrier 2 is the rotary type carrier, by after protruding sucker 4 axial restraints, clamping element 3 and radially fixing wafer W, drive wafer W, protrude sucker 4 and and carrier 2 rotate together.
The inflatable mouth that the upper surface Ws periphery of carrier is provided with is at least a week, and described inflatable mouth evenly distributes, and the arrangement form of inflatable mouth is not limited thereto certainly, also can adopt non-homogeneous and poised for battle distribution mode.As shown in Figure 2, all be distributed with all inflatable mouths 5 (hole or endless groove) around the upper surface Ws of carrier, inflatable mouth 5 can adopt various forms of gas passages, as adopt pore or endless groove, inflatable mouth 5 communicates with inert gas source, inert gas is by these inflatable mouth 5 continual outsides that blow to the lower surface of wafer during technology, can not cause the pollution to wafer along the marginal flow of wafer W to chip back surface (do not want clean zone) to guarantee the process liquid in the cleaning process.In the present embodiment, as shown in Figure 2, the number of clamping element 3 preferably adopts 4, certainly, can design the number of clamping element 3 according to actual needs.
In the present embodiment in the method for holding plate-like article, by being arranged on the protrusion sucker 4 axial restraint wafer W on the carrier 2; Clamping element 3 by being distributed in carrier 2 edges is fixed wafer W radially; Make the lower surface W 1 of the wafer after fixing and the upper surface Ws of carrier produce the space all around by protruding sucker 4, this space is used for moving up and down from wafer lower surface extracting wafer W for manipulator; The inflatable mouth 5 of the upper surface Ws periphery by being arranged on carrier to wafer outside uninterrupted air blowing of lower surface, air pressure makes the process liquid that produces in the wafer cleaning process can be along the marginal flow of wafer to the wafer lower surface.
Pan described in the present invention is not limited to the above wafer that provides, and also can be other plane disk shaped part.
Above execution mode only is used to illustrate the present invention; and be not limitation of the present invention; the those of ordinary skill in relevant technologies field; under the situation that does not break away from the spirit and scope of the present invention; can also make various variations and modification; therefore all technical schemes that are equal to also belong to category of the present invention, and scope of patent protection of the present invention should be defined by the claims.