CN219275551U - Table plate structure and thinning machine - Google Patents

Abstract

The utility model relates to the technical field of wafer production, in particular to a table plate structure and a thinning machine. The table plate structure comprises a chassis, wherein the chassis is provided with a vacuum connecting hole; an outer wall ring; the adjusting unit comprises a spacer ring and an adjusting ring, the spacer ring is arranged on the chassis, and the spacer ring is provided with a matched through hole; the vacuum connecting hole is positioned in the middle of the isolating ring; the adjusting ring is sleeved on the peripheral wall of the isolating ring, and the inner wall of the adjusting ring is provided with an adjusting through hole; the adjusting ring is rotatably connected so that the adjusting through holes are communicated or staggered with the matching through holes; when the adjusting units are a plurality of, the adjacent adjusting units are mutually sleeved. Therefore, the effect of adsorbing wafers with multiple sizes can be achieved under the condition of not disassembling and assembling hardware or modifying software.

Description

Table plate structure and thinning machine

Technical Field

The utility model relates to the technical field of wafer production, in particular to a table plate structure and a thinning machine.

Background

The current mainstream wafer thinning technology is that a wafer is adsorbed on a table to spin, and a grinding wheel reversely spins and is fed at a certain speed to perform grinding thinning.

The wafer is fixed on the table by vacuum adsorption, the table is generally composed of two parts, and the substrate part is made of solid ceramic materials and plays roles of providing a platform and bearing the pressure of a grinding spindle; the vacuum adsorption part is made of porous materials, and the wafer is subjected to vacuum adsorption through water or air, so that the wafer is stably adsorbed and attached to the table.

Wafers of different sizes need to correspond to vacuum adsorption areas of different sizes. The vacuum area is too large, so that the vacuum negative pressure is insufficient, and the wafer cannot be firmly adsorbed on the table plate, so that abnormality or error reporting is caused; too small a vacuum area can result in failure of the wafer edge to fully adsorb, and gaps can enter particles to cause cracking or scratching.

At present, the thinned table disc is divided into a single-size table disc and a multi-size universal table disc. The vacuum adsorption area of a single-size table can not be changed, only one cavity is formed in the bottom of the table for water inlet and outlet to adsorb vacuum, and the table can not be compatible with wafers of various sizes. The multi-size universal table plate is provided with a multi-layer vacuum adsorption area, the bottom of the table plate is provided with a plurality of holes, the equipment software system can realize the adsorption of multi-size wafers by entering and exiting water through the holes in different areas, but the table plate needs the main body of the equipment and the software to execute the adsorption of the multi-hole and multi-area, otherwise, the vacuum adsorption of the multi-size wafers cannot be realized.

The thinning equipment only supports a single-size tray, the bottom of the tray generally has a single water inlet, multi-region adsorption cannot be carried out, if the size of an adapted wafer is to be switched, the whole tray needs to be removed, the tray with a new size is replaced, the angle of the new tray is readjusted, and the tray can be used after repairing. The steps are extremely complicated, the time consumption is long, the production process is seriously delayed, and the size switching can not be frequently carried out.

Disclosure of Invention

The utility model aims to provide a table plate structure and a thinning machine, which can achieve the effect of adsorbing wafers with multiple sizes without disassembling and assembling hardware or modifying software.

Embodiments of the utility model may be implemented as follows:

in a first aspect, the present utility model provides a tray table structure comprising:

the chassis is provided with a vacuum connecting hole;

an outer wall ring; the outer wall ring is arranged on the chassis;

the adjusting unit comprises a spacer ring and an adjusting ring, the spacer ring is arranged on the chassis, and the spacer ring is provided with a matching through hole penetrating radially; the vacuum connecting hole is positioned in the middle of the isolating ring;

the adjusting ring is sleeved on the peripheral wall of the isolating ring, and the inner wall of the adjusting ring is provided with an adjusting through hole penetrating radially; the adjusting ring is rotatably connected with the isolating ring so that the adjusting through hole is communicated with or staggered from the matching through hole;

along the radial direction of the chassis, the adjusting unit at the center is enclosed to form a central adsorption space, and the adjusting unit at the outer side is enclosed with the outer wall to form an annular outer wall adsorption space;

when the adjusting units are multiple, the adjacent adjusting units are sleeved with each other, and the adjacent adjusting units are enclosed to form an annular adjusting adsorption space.

The vacuum adsorption area of adjustment different positions can be realized to the platform dish structure of this scheme to the realization is to the absorption of multiple size's wafer. Specifically, the chassis of the table plate mechanism is used for supporting other components, and the vacuum connecting holes of the chassis are arranged on the chassis and can be connected with adsorption equipment such as a vacuum pump and the like. The table plate mechanism includes at least one adjustment unit and an outer wall ring. Along the radial direction of the chassis, the adjusting unit at the most center is provided with a central adsorption space for vacuum adsorption, and the adjusting unit at the most outside is surrounded with the outer wall to form an outer wall adsorption space for vacuum adsorption; and the adjacent regulating units are enclosed to form a regulating adsorption space for vacuum adsorption. The central adsorption space, the adjusting adsorption space and the outer wall adsorption space extend outwards in sequence along the radial direction, so that the adsorption space sleeved by multiple layers is formed. Because the radial dimensions of the plurality of adsorption spaces are different, wafers with different diameters can be adapted, and stable adsorption of the wafers is ensured. Further, when the vacuum equipment starts to work, the central adsorption space keeps vacuum adsorption; the relative positions of the adjusting ring and the isolating ring are adjusted, so that the adjusting through hole is communicated with the matching through hole, and the central adsorption space, the adjusting adsorption space and/or the outer wall adsorption space are communicated, namely, the central adsorption space, the adjusting adsorption space and/or the outer wall adsorption space can simultaneously maintain vacuum adsorption; and then the adjusting ring is rotated to stagger the adjusting through holes and the matched through holes, and the vacuum adsorption is stopped by adjusting the adsorption space and/or the outer wall adsorption space. The thinning equipment of the single-size table plate can be simply improved, and the effect of adsorbing wafers with various sizes can be achieved under the condition of not disassembling and assembling hardware or modifying software, so that the device has the advantages of being low in cost, good in adsorption effect and outstanding in economic benefit.

In an alternative embodiment, the middle part of the chassis is provided with a containing groove, and the outer wall ring and the adjusting unit are arranged in the containing groove;

and the upper surfaces of the outer wall ring and the adjusting unit are flush with the upper surface of the chassis.

In an alternative embodiment, the outer wall ring rests against the inner wall of the receiving recess.

In an alternative embodiment, the outer wall ring is rotatably fitted with the receiving recess.

In an alternative embodiment, the adjusting unit further comprises a manual lever arranged on the outer side wall of the adjusting ring;

the manual lever is configured to manipulate the adjustment ring to rotate in a circumferential direction so that the adjustment through hole and the fitting through hole are communicated or staggered.

In an alternative embodiment, the manual lever penetrates the adjacent adjusting unit, the outer wall ring and extends out of the chassis in sequence along the direction from the center of the chassis to the outer wall.

In an alternative embodiment, the chassis has a first gear and a second gear arranged in a circumferential direction thereon;

when the manual lever rotates to the first gear, the adjusting through hole of the adjusting unit is communicated with the matching through hole;

when the manual lever rotates to the second gear, the adjusting through hole and the matching through hole of the adjusting unit are staggered.

In an alternative embodiment, through holes are formed in the adjacent adjusting units and the outer wall ring along the radial direction of the chassis; the manual rod sequentially penetrates through the through holes, and the manual rod is in airtight fit with the through holes.

In an alternative embodiment, when the plurality of adjustment units is provided, the outer wall ring, the plurality of adjustment units are all maintained in a concentric arrangement.

In a second aspect, the present utility model provides a thinning machine comprising a table tray structure according to any of the preceding embodiments.

The beneficial effects of the embodiment of the utility model include, for example:

the table plate structure of the scheme comprises a chassis, an outer wall ring and at least one adjusting unit. The adjusting unit comprises a separation ring and an adjusting ring, the adjusting ring is rotatably connected with the separation ring so that the adjusting through holes are communicated or staggered with the matching through holes, and therefore the central adsorption space is communicated or separated from the adjusting adsorption space, and the adjusting adsorption space is communicated or separated from the outer wall adsorption space. The central adsorption space, the adjusting adsorption space and the outer wall adsorption space sequentially form adsorption spaces with sequentially increased diameters, so that the adsorption spaces with different diameters can be obtained to be matched with wafers with different diameters by adjusting the positions of the adjusting rings. It is also emphasized that when the adsorption space is adjusted to generate adsorption force, the central adsorption space continuously maintains the adsorption force; when the outer wall adsorption space generates adsorption force, the central adsorption space and the adjusting adsorption space continuously maintain the adsorption force, so that the radial directions of the adsorption spaces can generate continuous adsorption force, and the surface of the wafer is continuously and stably adsorbed. The tray structure can switch the thinning equipment which cannot be compatible with the adsorption of wafers with multiple sizes into a mode of the wafer size required to be appointed in a short time by a simple manual operation mode on the premise of not modifying the mechanical main body of the equipment and system software, and can be used when the size and the surface mounting state of a processed product are switched.

The thinning machine of this scheme can just can realize the absorption to the wafer of multiple size through the part of simple adjustment platform dish structure, avoids whole complex operation of changing the platform dish, reduces the required time of switching the size, reduces operating personnel and uses the degree of difficulty, improves the workable product scope of board.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present utility model and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic view of a tray table according to an embodiment of the present utility model;

FIG. 2 is a schematic view of a tray table according to another embodiment of the present utility model;

FIG. 3 is a schematic view of a tray table according to another embodiment of the present utility model;

fig. 4 is an assembly schematic diagram of a tray structure according to an embodiment of the present utility model.

Icon: 10-a tray structure; 11-a central adsorption space; 12-an outer wall adsorption space; 100-chassis; 101-vacuum connection holes; 110-accommodating grooves; 111-first gear; 112-second gear; 120-gear grooves; 200-an outer wall ring; 300-an adjusting unit; 310-isolating rings; 311-mating through holes; 320-adjusting ring; 321-adjusting the through holes; 330-a manual lever; 331-shaft; 332-handle; 400-through holes; 510-a circular cover disc; 520-annular cover disc.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments of the present utility model. The components of the embodiments of the present utility model generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the utility model, as presented in the figures, is not intended to limit the scope of the utility model, as claimed, but is merely representative of selected embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.

In the description of the present utility model, it should be noted that, if the terms "upper", "lower", "inner", "outer", and the like indicate an azimuth or a positional relationship based on the azimuth or the positional relationship shown in the drawings, or the azimuth or the positional relationship in which the inventive product is conventionally put in use, it is merely for convenience of describing the present utility model and simplifying the description, and it is not indicated or implied that the apparatus or element referred to must have a specific azimuth, be configured and operated in a specific azimuth, and thus it should not be construed as limiting the present utility model.

Furthermore, the terms "first," "second," and the like, if any, are used merely for distinguishing between descriptions and not for indicating or implying a relative importance.

It should be noted that the features of the embodiments of the present utility model may be combined with each other without conflict.

Referring to fig. 1 to 4, the present embodiment provides a table plate structure 10, which includes:

a chassis 100, the chassis 100 having a vacuum connection hole 101;

an outer wall ring 200; the outer wall ring 200 is provided on the chassis 100;

at least one adjusting unit 300, the adjusting unit 300 including a spacer 310 and an adjusting ring 320, the spacer 310 being disposed on the chassis 100, the spacer 310 having a fitting through hole 311 penetrating radially; the vacuum connection hole 101 is located in the middle of the spacer 310;

the adjusting ring 320 is sleeved on the outer peripheral wall of the isolating ring 310, and the inner wall of the adjusting ring 320 is provided with an adjusting through hole 321 which penetrates radially; the adjusting ring 320 is rotatably connected with the spacer ring 310 so that the adjusting through hole 321 is communicated with or staggered from the matching through hole 311;

along the radial direction of the chassis 100, the adjusting unit 300 at the center forms a central adsorption space 11, and the adjusting unit 300 at the outer side forms an annular outer wall adsorption space 12 with the outer wall ring 200;

when the adjusting units 300 are plural, adjacent adjusting units 300 are sleeved with each other, and annular adjusting adsorption spaces are formed by surrounding the adjacent adjusting units 300.

The platen structure 10 of the present embodiment can realize vacuum adsorption areas at different positions to realize adsorption of wafers of various sizes. Specifically, the chassis 100 of the platen mechanism is used for supporting other components, and the vacuum connection holes 101 thereof are provided in the chassis 100 so as to be connectable to an adsorption apparatus such as a vacuum pump. The table plate mechanism comprises at least one adjustment unit 300, and an outer wall ring 200. The central adjusting unit 300 has a central adsorption space 11 for vacuum adsorption along the radial direction of the base plate 100, and the outermost adjusting unit 300 is enclosed with the outer wall ring 200 to form an outer wall adsorption space 12 for vacuum adsorption; and a regulating adsorption space for vacuum adsorption is formed between adjacent regulating units 300. The central adsorption space 11, the adjusting adsorption space and the outer wall adsorption space 12 extend outwards in sequence along the radial direction, so that a multi-layer sleeved adsorption space is formed.

Further, when the vacuum equipment starts to operate, the central adsorption space 11 maintains vacuum adsorption; by adjusting the relative positions of the adjusting ring 320 and the spacer ring 310, the adjusting through hole 321 and the matching through hole 311 can be communicated, so that the central adsorption space 11, the adjusting adsorption space and/or the outer wall adsorption space 12 are communicated, that is, the central adsorption space 11, the adjusting adsorption space and/or the outer wall adsorption space 12 can simultaneously maintain vacuum adsorption; and then the adjusting ring 320 is rotated to adjust the stagger of the through hole 321 and the matching through hole 311, and the vacuum adsorption is stopped by adjusting the adsorption space and/or the outer wall adsorption space 12.

Since the central adsorption space 11, the adjustment adsorption space, and the outer wall adsorption space 12 sequentially form adsorption spaces with sequentially increased diameters, the positions of the adjustment rings 320 can be adjusted to obtain adsorption spaces with different diameters to match wafers with different diameters. It is also emphasized that the central adsorption space 11 continuously maintains the adsorption force when the adsorption force is generated by adjusting the adsorption space; when the outer wall adsorption space 12 generates adsorption force, the central adsorption space 11 and the adjusting adsorption space continuously maintain the adsorption force, so that the radial direction of each adsorption space can generate continuous adsorption force, and the surface of the wafer is continuously and stably adsorbed.

The thinning equipment of the single-size table plate can be simply improved, and the effect of adsorbing wafers with various sizes can be achieved under the condition of not disassembling and assembling hardware or modifying software.

Further, please refer to fig. 1-4 for more structural details of the platen structure 10.

When the number of the adjusting units 300 is plural, the outer wall ring 200 and the plurality of adjusting units 300 are concentrically arranged.

As can be seen from the figure, the tray structure 10 has only one adjusting unit 300, and the outer wall adsorption space 12 is the adjusting adsorption space.

The chassis 100 is cylindrical, and the vacuum connecting hole 101 is a circular hole arranged at the center of the chassis 100. The outer wall ring 200 is a cylindrical thin-walled ring. The spacer 310 is a cylindrical thin-walled ring, and the adjusting ring 320 is a cylindrical ring having a predetermined thickness. Specifically, the outer wall ring 200 and the spacer ring 310 have a thickness corresponding to that of the base plate 100 in the radial direction, and the adjusting ring 320 has a thickness greater than that of the spacer ring 310.

The chassis 100, the outer wall ring 200, the adjusting ring 320, the spacer ring 310, and the vacuum connection holes 101 all remain concentrically arranged.

Regarding the specific structure of the basin structure, those skilled in the art should be able to make reasonable selections and designs according to actual needs, and there is no specific limitation herein, and as an example, the chassis 100 may be square, the inner wall of the adjusting ring 320 may be circular, the outer wall may be square, etc. to adapt to different practical situations, and this is merely an example and not a limitation herein.

In the present embodiment, the spacer 310 is fixed on the chassis 100 to maintain the tightness between the central adsorption space 11 and the chassis 100. And adjusting ring 320 laminating is in the periphery wall of keeping apart, so can make the central adsorption space 11 can conveniently communicate with outer wall adsorption space 12 to avoid directly forming the adsorption area at isolating ring 310 and adjusting ring 320, ensure that central adsorption space 11, outer wall adsorption space 12 have the adsorption affinity that lasts stably.

Further, the number of the fitting through holes 311 and the adjusting through holes 321 are the same and correspond to each other one by one. Alternatively, in the present embodiment, the spacer ring 310 has two fitting through holes 311, and the two fitting through holes 311 are radially symmetrically arranged. The adjusting ring 320 has two adjusting through holes 321 thereon, and the two adjusting through holes 321 are also arranged symmetrically in the radial direction.

As can also be seen in fig. 1 and 2, the counter basin structure further comprises a circular cover plate 510 and an annular cover plate 520. Wherein the circular cover plate 510 is disposed above the inner wall of the spacer 310 to cover the central adsorption space 11, and the circular cover plate 510 is flush with the upper surface of the spacer 310;

an annular cover plate 520 is provided between the adjusting ring 320 and the outer wall ring 200 to cover the outer wall adsorption space 12, and the annular cover plate 520 is flush with the upper surface of the outer wall ring 200.

The material of the circular cover disk 510 and the annular cover disk 520 is porous ceramic material, and is permeable to water and air. The adsorption force in the vacuum region can be uniformly dispersed on the whole surface of the adsorption region through the cover plate (comprising the circular cover plate 510 and the annular cover plate 520, which are the same as the description below), so that stable adsorption of the wafer is facilitated.

The chassis 100, the outer wall ring 200 and the spacer ring 310 are made of dense, airtight and water permeable materials, so that good tightness between the central adsorption space 11 and the outer wall adsorption space 12 is ensured.

As can also be seen from fig. 2 and 3, the chassis 100 has a receiving groove 110 in the middle thereof, and the outer wall ring 200 and the adjusting unit 300 are both disposed in the receiving groove 110; and the upper surfaces of the outer wall ring 200 and the adjusting unit 300 are flush with the upper surface of the chassis 100. Such that the upper surface of the bottom plate 100, the upper surface of the outer wall ring 200, the upper surface of the annular cover plate 520, the upper surface of the adjusting ring 320, the upper surface of the spacer ring 310, and the upper surface of the circular cover plate 510 are all kept flush, thereby providing a flat placement surface for placement of the wafer.

The outer circumferential surface of the optional chassis 100, the inner sidewall of the receiving groove 110, the outer wall ring 200, the upper surface of the outer wall ring 200, the annular cover plate 520, the adjusting ring 320, the spacer ring 310, the vacuum connection hole 101, and the circular cover plate 510 are all kept concentrically arranged.

Optionally, the outer wall ring 200 abuts against the inner side wall of the accommodating recess 110. Avoiding directly forming the adsorption zone between the outer wall ring 200 and the inner side wall of the accommodating groove 110, ensuring that the central adsorption space 11 and the outer wall adsorption space 12 have continuous and stable adsorption force.

In the present embodiment of the present utility model, the outer wall ring 200 is rotatably fitted with the accommodating groove 110.

With continued reference to fig. 1 to 4, the adjusting unit 300 further includes a manual lever 330, and the manual lever 330 is disposed on an outer sidewall of the adjusting ring 320; the manual lever 330 is configured to manipulate the adjustment ring 320 to rotate in the circumferential direction such that the adjustment through hole 321 and the fitting through hole 311 are communicated or staggered. The adjusting ring 320 can be driven by rotating the manual lever 330 to communicate or shut off the central adsorption space 11 and the outer wall adsorption space 12.

Further, the manual lever 330 sequentially penetrates the adjacent adjusting unit 300, the outer wall ring 200 and extends out of the chassis 100 in a direction from the center of the chassis 100 to the outer wall.

Optionally, the chassis 100 has a first gear 111 and a second gear 112 arranged in the circumferential direction thereon; when the manual lever 330 is rotated to the first gear 111, the adjustment through hole 321 of the adjustment unit 300 communicates with the fitting through hole 311; when the manual lever 330 is rotated to the second gear 112, the adjustment through hole 321 and the fitting through hole 311 of the adjustment unit 300 are staggered.

In particular, as can be seen in fig. 3 and 4, in this embodiment, the manual lever 330 includes a lever body 331 and a handle 332. One end of the shaft 331 is connected to the adjusting ring 320, and the other end sequentially penetrates the outer wall ring 200 and the chassis 100 and then is connected to the handle 332. The inner sidewall of the receiving groove 110 has a gear groove 120 penetrating therethrough in the radial direction of the chassis 100, and the gear groove 120 extends to a preset position in the circumferential direction of the chassis 100.

In the present embodiment, both ends of the shift groove 120 in the circumferential direction are divided into corresponding first shift 111 and second shift 112. That is, when the shaft 331 of the manual lever 330 abuts against one end of the gear groove 120 in the circumferential direction, the manual lever 330 corresponds to the first gear 111; that is, when the shaft 331 of the manual lever 330 abuts on the other end of the gear groove 120 in the circumferential direction, the manual lever 330 corresponds to the second gear 112. The arrangement of the gear groove 120 can further facilitate the manual lever 330 to adjust the position of the adjusting ring 320, so that the central adsorption space 11 and the outer wall adsorption space 12 are communicated or separated, and wafers with different diameters are adsorbed.

Optionally, a leakage-proof device is further disposed in the gear slot 120, where the leakage-proof device is used to ensure that the chassis 100 is isolated from the outer layer, and ensure the sealing of the outer wall adsorption space 12. The leakage-proof device can also prevent water, gas and the like from leaking out of the outer wall adsorption space 12 from the pore beside the manual lever 330, and ensure that the rotation of the manual lever 330 does not affect the vacuum condition in the cavity.

It should be noted that, in the radial direction of the chassis 100, the adjacent adjusting units 300 and the outer wall ring 200 are provided with through holes 400; the manual rod 330 sequentially penetrates through the through holes 400, and the manual rod 330 is in airtight fit with the through holes 400.

In this embodiment, the outer wall ring 200 is provided with through holes 400, and the shaft 331 of the manual lever 330 extends into the gear groove 120 after passing through the through holes 400. And the shaft 331 is hermetically matched with the through hole 400 to ensure the tightness of the outer wall adsorption space 12.

In use, the vacuum connection holes 101 at the bottom of the chassis 100 are matched with the equipment pipeline positions. When the table is used, the table is fixed on the table base of the thinning machine, after finishing trimming and calibrating, the manual lever 330 is shifted to the first gear anticlockwise, and when the vacuum of the table is started, only the central adsorption space 11 is subjected to vacuum adsorption;

when the large-sized product is to be processed, the manual lever 330 is shifted clockwise to the second gear, and at this time, the central adsorption space 11 and the adjusting adsorption space are vacuum-adsorbed when the vacuum of the table is opened.

It should be noted that, this scheme can be according to the demand, and the absorption region of arbitrary size and quantity need only repeated setting main structure, only takes the double absorption region as the example to explain here. The switching device capable of being manually adjusted in this way, that is, the manual lever 330 is manually rotated to drive the isolating ring 310 to rotate, so that the two vacuum adsorption spaces are communicated or closed, the vacuum adsorption area range of the table is changed, and the effect of adsorbing wafers with multiple sizes is achieved under the condition that hardware is not dismounted or software is not modified.

In a second aspect, the present utility model provides a thinning machine comprising a table structure 10 according to any of the preceding embodiments. The tray structure 10 of the thinning machine can switch the thinning equipment which cannot be compatible with the adsorption of wafers with multiple sizes into a mode of the required designated wafer size in a short time in a simple manual operation mode on the premise of not modifying the mechanical main body of the machine equipment and system software, can be used when the size and the surface mounting state of a processed product are switched, avoids the complex operation of integrally replacing the tray, reduces the time required for switching the size, reduces the use difficulty of operators and improves the range of the processable product of the machine.

In summary, the embodiment of the utility model provides a table plate structure 10 and a thinning machine, which have at least the following advantages:

the central adsorption space 11, the adjusting adsorption space, and the outer wall adsorption space 12 of the platen structure 10 of this embodiment sequentially form adsorption spaces with sequentially increased diameters, so that by adjusting the positions of the adjusting rings 320, adsorption spaces with different diameters can be obtained to match wafers with different diameters. When the adsorption space is adjusted to generate adsorption force, the central adsorption space 11 continuously maintains the adsorption force; when the outer wall adsorption space 12 generates adsorption force, the central adsorption space 11 and the adjusting adsorption space continuously maintain the adsorption force, so that the radial direction of each adsorption space can generate continuous adsorption force, and the surface of the wafer is continuously and stably adsorbed. The tray structure 10 can switch the thinning equipment which cannot be compatible with the adsorption of wafers with multiple sizes into a mode of the wafer size required to be appointed in a short time by a simple manual operation mode on the premise of not modifying the mechanical main body of the equipment and system software, and can be used when the size and the surface mounting state of a processed product are switched.

The thinning machine of this embodiment can just realize the absorption to the wafer of multiple size through the part of simple adjustment platform dish structure 10, avoids whole complex operation of changing the platform dish, reduces the required time of switching the size, reduces operating personnel's use degree of difficulty, improves the workable product scope of board.

The present utility model is not limited to the above embodiments, and any changes or substitutions that can be easily understood by those skilled in the art within the technical scope of the present utility model are intended to be included in the scope of the present utility model. Therefore, the protection scope of the utility model is subject to the protection scope of the claims.

Claims (10)

1. A tray table structure, comprising:

-a chassis (100), the chassis (100) having a vacuum connection hole (101);

an outer wall ring (200); the outer wall ring (200) is arranged on the chassis (100);

at least one adjusting unit (300), wherein the adjusting unit (300) comprises a separation ring (310) and an adjusting ring (320), the separation ring (310) is arranged on the chassis (100), and the separation ring (310) is provided with a matching through hole (311) penetrating radially; the vacuum connecting hole (101) is positioned in the middle of the isolating ring (310);

the adjusting ring (320) is sleeved on the outer peripheral wall of the isolating ring (310), and an adjusting through hole (321) penetrating radially is formed in the inner wall of the adjusting ring (320); the adjusting ring (320) is rotatably connected with the isolating ring (310) so as to enable the adjusting through hole (321) and the matching through hole (311) to be communicated or staggered;

along the radial direction of the chassis (100), the adjusting unit (300) at the most center is enclosed to form a central adsorption space (11), and the adjusting unit (300) at the most outside is enclosed with the outer wall ring (200) to form an annular outer wall adsorption space (12);

when the plurality of the adjusting units (300) are arranged, the adjacent adjusting units (300) are sleeved with each other, and annular adjusting adsorption spaces are formed by surrounding the adjacent adjusting units (300).

2. A platen structure as claimed in claim 1, wherein:

the middle part of the chassis (100) is provided with a containing groove (110), and the outer wall ring (200) and the adjusting unit (300) are arranged in the containing groove (110); and the upper surfaces of the outer wall ring (200) and the adjusting unit (300) are flush with the upper surface of the chassis (100).

3. A platen structure as claimed in claim 2, wherein:

the outer wall ring (200) is abutted against the inner wall of the accommodating groove (110).

4. A platen structure as claimed in claim 2, wherein:

the outer wall ring (200) is rotatably fitted with the accommodating groove (110).

5. A platen structure as claimed in claim 1, wherein:

the adjusting unit (300) further comprises a manual lever (330), the manual lever (330) being arranged on the outer side wall of the adjusting ring (320);

the manual lever (330) is configured to manipulate the adjustment ring (320) to rotate in a circumferential direction so that the adjustment through hole (321) and the fitting through hole (311) communicate or are staggered.

6. The tray table structure according to claim 5, wherein:

the manual lever (330) sequentially penetrates through the adjacent adjusting units (300), the outer wall ring (200) and extends out of the chassis (100) along the direction from the center of the chassis (100) to the outer wall.

7. The tray table structure according to claim 6, wherein:

the chassis (100) has a first gear (111) and a second gear (112) arranged in the circumferential direction thereon;

when the manual lever (330) rotates to the first gear (111), the adjusting through hole (321) of the adjusting unit (300) is communicated with the matching through hole (311);

when the manual lever (330) rotates to the second gear (112), the adjusting through hole (321) and the matching through hole (311) of the adjusting unit (300) are staggered.

8. The tray table structure according to claim 6, wherein:

along the radial direction of the chassis (100), through holes (400) are formed in the adjacent adjusting units (300) and the outer wall ring (200); the manual rod (330) sequentially penetrates through the through holes (400), and the manual rod (330) is in airtight fit with the through holes (400).

9. A platen structure as claimed in claim 1, wherein:

when the plurality of adjusting units (300) is provided, the outer wall ring (200) and the plurality of adjusting units (300) are all arranged concentrically.

10. The utility model provides a attenuate machine which characterized in that:

the thinning machine comprising the platen structure of any one of claims 1-9.

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