CN219267619U - Quick circulation system for wafer processing - Google Patents
Quick circulation system for wafer processing Download PDFInfo
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- CN219267619U CN219267619U CN202221705534.0U CN202221705534U CN219267619U CN 219267619 U CN219267619 U CN 219267619U CN 202221705534 U CN202221705534 U CN 202221705534U CN 219267619 U CN219267619 U CN 219267619U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The utility model relates to a rapid circulation system for wafer processing, which comprises an edge polishing machine, a pre-attachment cleaning machine, an attachment machine and a stripping machine, wherein a discharge port of the edge polishing machine is provided with a first conveying device for conveying polished wafers to the pre-attachment cleaning machine, the pre-attachment cleaning machine is connected with a first transfer manipulator for transferring the cleaned wafers to a nitrogen storage tank, a discharge port of the nitrogen storage tank is connected with a second conveying device for conveying the wafers stored in the nitrogen storage tank to the attachment machine, and a discharge port of the attachment machine is provided with a third conveying device for conveying the attached wafers to the stripping machine. The beneficial effects of the utility model are as follows: the transfer efficiency in the wafer processing process can be improved, the probability of clamping and waiting is reduced, the wafers can be stored through the nitrogen storage library when the clamping is more, the probability of oxidizing or polluting the wafers is further reduced, and the reliability in the transfer process is improved.
Description
Technical Field
The utility model relates to the technical field of wafer processing, in particular to a rapid circulation system for wafer processing.
Background
In a semiconductor manufacturing factory, the wafer processing process comprises the steps of edge polishing, cleaning before attaching, stripping, secondary cleaning and the like, in the prior art, after each part of processing is finished, the wafer is conveyed through a crown block, and the state of the wafer cannot be manually interfered because the wafer is suspended in the midair in the conveying process, so that a conveying system which runs on the ground and is convenient for interfering the running state of the wafer is required to be designed, and the wafer is conveyed rapidly.
Disclosure of Invention
In order to overcome at least part of the defects in the prior art, the embodiment of the utility model provides a rapid circulation system for wafer processing, which has the advantages of simple structure and convenience in use, and can improve the circulation efficiency in the wafer processing process.
The utility model relates to a rapid circulation system for wafer processing, which comprises an edge polishing machine, a pre-attachment cleaning machine, an attachment machine and a stripping machine, wherein a discharge port of the edge polishing machine is provided with a first conveying device for conveying polished wafers to the pre-attachment cleaning machine, the pre-attachment cleaning machine is connected with a first transfer manipulator for transferring cleaned wafers to a nitrogen storage tank, a discharge port of the nitrogen storage tank is connected with a second conveying device for conveying wafers stored in the nitrogen storage tank to the attachment machine, and a discharge port of the attachment machine is provided with a third conveying device for conveying attached wafers to the stripping machine;
the third conveying device comprises symmetrically arranged supporting frames, first conveying guide rails are arranged on the two supporting frames, sliding rods which move along the first conveying guide rails are connected to the first conveying guide rails, two ends of each sliding rod are respectively connected with different sliding rods of the first conveying guide rails, second conveying guide rails are connected to the sliding rods, sliding connectors are connected to the second conveying guide rails in a movable mode, and multi-shaft manipulators used for clamping wafers are connected to the sliding connectors.
Further, a temporary storage rack for temporarily storing the peeled wafer is arranged on one side of the support frame, and the temporary storage rack is connected with a conveying belt for conveying the wafer to the cleaning machine after peeling.
Further, the first conveying device comprises a first transfer trolley and a first transfer platform, the first transfer platform is connected to the first transfer trolley, and a storage area for storing wafers is connected to the first transfer platform.
Further, one side of the edge polishing machine is provided with a polishing feeding mechanism, the polishing feeding mechanism comprises a polishing feeding platform and a polishing feeding manipulator, the polishing feeding platform is used for transferring wafer raw materials to the edge polishing machine and/or conveying wafers polished by the edge polishing machine to a storage area of the first transfer table, the polishing feeding manipulator is connected to the polishing feeding platform, and the polishing feeding platform is provided with a polishing feeding area for storing the wafer raw materials.
Further, one side of the pre-attachment cleaning machine is provided with a cleaning and feeding mechanism, the cleaning and feeding mechanism comprises a cleaning and feeding platform and a cleaning and feeding manipulator, the cleaning and feeding manipulator is used for transferring the wafer from the first transfer platform to the pre-attachment cleaning machine, and the cleaning and feeding manipulator is connected to the cleaning and feeding platform.
Further, the second conveying device comprises a second transfer trolley, a transfer platform, an attaching manipulator, a first storage area and a second storage area, wherein the first storage area and the second storage area are respectively arranged on two sides of the transfer platform, the attaching manipulator is arranged between the first storage area and the second storage area, and the transfer platform is connected with the second transfer trolley.
Further, the side of the stripping machine is connected with a stripping loading area and a stripping unloading area, the stripping loading area and the stripping unloading area are both positioned on the walking path of the multi-axis manipulator, and the stripping loading area and the stripping unloading area are both provided with a storage box for storing wafers.
Further, the attaching machine is arranged at the front side of the stripping machine, the number of the attaching machine and the number of the stripping machines are 2, the supporting frame is arranged between 2 attaching machines, and the attaching machine and the stripping machine are arranged along the central axis of the supporting frame in an axisymmetric mode.
The utility model has the advantages that: after polishing the wafer raw material by an edge polishing machine, conveying the wafer raw material to a pre-attachment cleaning machine for cleaning by a first conveying device, transferring the wafer raw material to a nitrogen storage tank for temporary storage by a first transfer manipulator after cleaning, transferring the wafer stored in the nitrogen storage tank to an attaching machine for attaching by a second conveying device when the attaching machine is in a standby state, transferring the attached wafer to a stripping machine by a third conveying device after the attaching machine finishes attaching the wafer, and removing the stripped wafer by the third conveying device after stripping the wafer;
the transfer efficiency in the wafer processing process can be improved, the probability of clamping and waiting is reduced, the wafers can be stored through the nitrogen storage library when the clamping is more, the probability of oxidizing or polluting the wafers is further reduced, and the reliability in the transfer process is improved.
The foregoing and other objects, features and advantages of the utility model will be apparent from the following more particular description of preferred embodiments, as illustrated in the accompanying drawings.
Drawings
In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic diagram of the overall structure of a rapid transit system for wafer processing.
Fig. 2 is a schematic structural view of the third conveying device.
Fig. 3 is a schematic structural view of the first conveying device.
Fig. 4 is a schematic structural view of the cleaning and feeding mechanism.
Fig. 5 is a schematic structural view of the second conveying device.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
A rapid circulation system for wafer processing in a preferred embodiment of the present utility model comprises an edge polisher 1, a pre-attachment cleaner 2, an attachment machine 3 and a stripper 4, wherein a discharge port of the edge polisher 1 is provided with a first conveying device 5 for conveying polished wafers to the pre-attachment cleaner, the pre-attachment cleaner 2 is connected with a first transfer manipulator (not shown) for transferring cleaned wafers to a nitrogen storage tank 6, a discharge port of the nitrogen storage tank 6 is connected with a second conveying device 7 for conveying wafers stored in the nitrogen storage tank 6 to the stripper 4, and a discharge port of the attachment machine 3 is provided with a third conveying device 8 for conveying attached wafers to the stripper 4; after polishing the wafer raw material by the edge polisher 1, the wafer raw material is transferred to the pre-attachment cleaning machine 2 by the first transfer device 5 to be cleaned, after cleaning, the wafer raw material is transferred to the nitrogen storage tank 6 by the first transfer manipulator (not shown) to be temporarily stored, when the attaching machine 3 is in a standby state, the wafer stored in the nitrogen storage tank 6 is transferred to the attaching machine 3 by the second transfer device 5 to be attached, after the attaching machine 3 completes attaching processing of the wafer, the attached wafer is transferred to the stripping machine 4 by the third transfer device 8, and after stripping processing of the wafer is completed, the stripped wafer is removed by the third transfer device 8.
The third conveyor 8 includes the support frame 81 that the symmetry set up, all is provided with first transport guide rail 82 on two support frames 81, be connected with on the first transport guide rail 82 along the slide bar 83 that first transport guide rail 82 removed, the both ends of slide bar 83 respectively with the difference first transport guide rail 82 sliding connection, be connected with second transport guide rail 84 on the slide bar 83, mobilizable being connected with sliding connection spare 85 on the second transport guide rail 84, be connected with the multiaxis manipulator 9 that is used for the centre gripping wafer on the sliding connection spare 85.
In the above embodiment, a temporary storage rack 811 for temporarily storing the peeled wafer is provided on one side of the support frame 81, and a conveyor 812 for conveying the wafer to the post-peeling cleaning machine is connected to the temporary storage rack 811. In actual implementation, the multi-axis robot is used not only to transfer the attached wafer to the stripper 4, but also to move the stripped wafer to the temporary storage rack 811, and then to carry it to the post-stripping cleaning machine for cleaning by the conveyor 812 provided on the temporary storage rack 811.
In the above embodiment, the first conveying device 5 includes a first transfer cart 51 and a first transfer table 52, the first transfer table 52 is connected to the first transfer cart 51, and a storage area 53 for storing wafers is connected to the first transfer table 52. One side of the edge polishing machine 1 is provided with a polishing feeding mechanism 11, the polishing feeding mechanism 11 comprises a polishing feeding platform 111 and a polishing feeding manipulator 112 for transferring wafer raw materials to the edge polishing machine 1 and/or conveying wafers polished by the edge polishing machine 1 to a storage area of the first transfer platform 52, the polishing feeding manipulator 112 is connected to the polishing feeding platform 111, and a polishing feeding area 113 for storing the wafer raw materials is arranged on the polishing feeding platform 111.
With the above embodiment, when the edge polisher 1 completes processing the wafer, the wafer is transported to the storage area 53 on the first transfer stage 52 by the polishing feed robot 113, and then transported to the pre-attachment cleaner 2 side by the first transfer cart 51.
In the above embodiment, the cleaning and feeding mechanism 21 is disposed on one side of the pre-attachment cleaning machine 2, and the cleaning and feeding mechanism 21 includes a cleaning and feeding platform 211 and a cleaning and feeding manipulator 212 for transferring the wafer from the first transfer platform 52 to the pre-attachment cleaning machine, and the cleaning and feeding manipulator 212 is connected to the cleaning and feeding platform 211. When the first transfer cart 51 transfers the wafer to one side of the pre-attachment cleaning machine, the wafer on the first transfer cart is transferred to the pre-attachment cleaning machine 2 by the cleaning loading mechanism 21, and after the cleaning is completed, the wafer is transferred to the nitrogen gas storage library 6 by the first transfer robot 212 for storage.
In the above embodiment, the second conveying device 7 includes a second transfer cart 71, a transfer platform 72, an attaching manipulator 73, a first storage area 74 and a second storage area 75, the first storage area 74 and the second storage area 75 are respectively disposed on two sides of the transfer platform, the attaching manipulator 73 is disposed between the first storage area 74 and the second storage area 75, and the transfer platform 72 is connected to the second transfer cart 71.
In the above embodiment, the side surface of the stripper 4 is connected with a stripping loading area 41 and a stripping unloading area 42, the stripping loading area 41 and the stripping unloading area 42 are both located on the travelling path of the multi-axis manipulator 9, and the stripping loading area 41 and the stripping unloading area 42 are both provided with a storage box for storing wafers.
In the above embodiment, the attaching machine 3 is disposed at the front side of the peeling machine 4, the number of the attaching machines 3 and the peeling machines 4 is 2, the supporting frame 81 is disposed between 2 attaching machines, and the attaching machines 3 and the peeling machines 4 are disposed along the central axis of the supporting frame 81 as axisymmetric.
The principles and embodiments of the present utility model have been described in detail with reference to specific examples, which are provided to facilitate understanding of the method and core ideas of the present utility model; meanwhile, as those skilled in the art will have variations in the specific embodiments and application scope in accordance with the ideas of the present utility model, the present description should not be construed as limiting the present utility model in view of the above.
Claims (8)
1. The utility model provides a wafer processing is with quick circulation system which characterized in that: the device comprises an edge polishing machine, a pre-attachment cleaning machine, an attachment machine and a stripping machine, wherein a discharge port of the edge polishing machine is provided with a first conveying device for conveying polished wafers to the pre-attachment cleaning machine, the pre-attachment cleaning machine is connected with a first transfer manipulator for transferring cleaned wafers to a nitrogen storage tank, a discharge port of the nitrogen storage tank is connected with a second conveying device for conveying wafers stored in the nitrogen storage tank to the attachment machine, and a discharge port of the attachment machine is provided with a third conveying device for conveying attached wafers to the stripping machine;
the third conveying device comprises symmetrically arranged supporting frames, first conveying guide rails are arranged on the two supporting frames, sliding rods which move along the first conveying guide rails are connected to the first conveying guide rails, two ends of each sliding rod are respectively connected with different sliding rods of the first conveying guide rails, second conveying guide rails are connected to the sliding rods, sliding connectors are connected to the second conveying guide rails in a movable mode, and multi-shaft manipulators used for clamping wafers are connected to the sliding connectors.
2. The rapid circulation system for wafer processing according to claim 1, wherein: one side of the supporting frame is provided with a temporary storage frame for temporarily storing stripped wafers, and the temporary storage frame is connected with a conveying belt for conveying the wafers to a cleaning machine after stripping.
3. The rapid circulation system for wafer processing according to claim 1, wherein: the first conveying device comprises a first transfer trolley and a first transfer platform, the first transfer platform is connected to the first transfer trolley, and a storage area for storing wafers is connected to the first transfer platform.
4. The rapid circulation system for wafer processing according to claim 3, wherein: one side of edge polishing machine is provided with polishing feed mechanism, polishing feed mechanism includes the polishing feed platform and is used for with the wafer raw materials transfer extremely the edge polishing machine and/or will be passed through the wafer that the edge polishing machine polished is carried to polishing feed manipulator in the storage area of first transfer station, polishing feed manipulator connects on the polishing feed platform, be provided with the polishing feed area that is used for depositing the wafer raw materials on the polishing feed platform.
5. The rapid transit system for wafer processing of claim 4, wherein: one side of the cleaning machine before attaching is provided with a cleaning and feeding mechanism, the cleaning and feeding mechanism comprises a cleaning and feeding platform and a cleaning and feeding manipulator, the cleaning and feeding manipulator is used for transferring the wafer from the first transfer platform to the cleaning and feeding manipulator of the cleaning machine before attaching, and the cleaning and feeding manipulator is connected to the cleaning and feeding platform.
6. The rapid circulation system for wafer processing according to claim 1, wherein: the second conveying device comprises a second transfer trolley, a transfer platform, an attaching manipulator, a first storage area and a second storage area, wherein the first storage area and the second storage area are respectively arranged on two sides of the transfer platform, the attaching manipulator is arranged between the first storage area and the second storage area, and the transfer platform is connected with the second transfer trolley.
7. The rapid circulation system for wafer processing according to claim 1, wherein: the side of the stripping machine is connected with a stripping feeding area and a stripping discharging area, the stripping feeding area and the stripping discharging area are both positioned on the running path of the multi-axis manipulator, and the stripping feeding area and the stripping discharging area are both provided with a storage box for storing wafers.
8. The rapid circulation system for wafer processing according to claim 1, wherein: the attaching machine is arranged on the front side of the stripping machine, the number of the attaching machines and the number of the stripping machines are 2, the supporting frames are arranged between the 2 attaching machines, and the attaching machines and the stripping machines are arranged along the central axis of the supporting frames in an axisymmetric mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221705534.0U CN219267619U (en) | 2022-07-04 | 2022-07-04 | Quick circulation system for wafer processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221705534.0U CN219267619U (en) | 2022-07-04 | 2022-07-04 | Quick circulation system for wafer processing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219267619U true CN219267619U (en) | 2023-06-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221705534.0U Active CN219267619U (en) | 2022-07-04 | 2022-07-04 | Quick circulation system for wafer processing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219267619U (en) |
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2022
- 2022-07-04 CN CN202221705534.0U patent/CN219267619U/en active Active
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