CN219248424U - High-efficiency power amplifier plug-in assembly for solid-state power source and power amplifier system - Google Patents
High-efficiency power amplifier plug-in assembly for solid-state power source and power amplifier system Download PDFInfo
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- CN219248424U CN219248424U CN202223227178.9U CN202223227178U CN219248424U CN 219248424 U CN219248424 U CN 219248424U CN 202223227178 U CN202223227178 U CN 202223227178U CN 219248424 U CN219248424 U CN 219248424U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D30/00—Reducing energy consumption in communication networks
- Y02D30/70—Reducing energy consumption in communication networks in wireless communication networks
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Abstract
The utility model discloses a high-efficiency power amplifier plug-in assembly for a solid-state power source and a power amplifier system, comprising: the cooling plate is provided with cooling flow passage groups on the front and back surfaces thereof, and the cooling flow passage groups are used for carrying out heat exchange cooling; the positioning frames are arranged along the peripheral side edges of the cooling plate and encircle a square frame; a front working part; and a back working part. The front working part and the back working part are respectively arranged on the front surface and the back surface of the cooling plate, so that the installation requirement of each plug-in on the cooling plate is met, and the heat dissipation of each plug-in is also facilitated. And meanwhile, the cooling plate is provided with a cooling flow passage group, and the cooling plate realizes heat exchange and cooling of the front working part and the back working part by utilizing the cooling flow passage group, so that the heat exchange requirement among all the plug-ins is ensured to the greatest extent. The purpose of meeting the rapid heat dissipation among the plug-ins is effectively achieved.
Description
Technical Field
The utility model relates to the technical field of solid-state power source power amplification, in particular to a high-efficiency power amplification plug-in assembly for a solid-state power source and a power amplification system.
Background
With the rapid development of electronic information technology, the manufacturing technology of solid-state semiconductor devices is continuously advanced, and the solid-state semiconductor devices are widely applied, such as mobile communication, radio, broadcast television, radar and other signals, and the solid-state semiconductor devices are utilized for power amplification. By virtue of the advantages of high quality, high reliability and the like of solid-state devices, the solid-state power source technology is rapidly developed, and the replacement of the traditional electron tube technology with the solid-state power source technology is a new trend.
When the solid-state power source works, other plug-ins and the power amplifier circuit are required to be used for matching output power, various plug-ins can emit a large amount of heat on and around the plug-ins along with long-time work of the output power, and in order to ensure the working effect of each plug-in, quick heat dissipation of each plug-in needs to be realized. Therefore, the design of the plug-in assembly capable of rapidly dissipating heat is designed.
Disclosure of Invention
The utility model aims to realize the design of a plug-in assembly capable of achieving rapid heat dissipation. The proposed high-efficiency power amplifier plug-in assembly for the solid-state power source and the power amplifier system.
In order to achieve the above purpose, the present utility model adopts the following technical scheme:
a high efficiency power amplifier card assembly for a solid state power source, comprising:
the cooling plate is provided with cooling flow passage groups on the front and back surfaces thereof, and the cooling flow passage groups are used for carrying out heat exchange cooling;
the positioning frames are arranged along the peripheral side edges of the cooling plate and encircle a square frame;
front face work portion, front face work portion sets up the front of cooling plate, front face work portion includes:
the distributor is arranged on the front surface of the cooling plate;
the two groups of power amplification modules are arranged on one side of the distributor and are oppositely arranged;
the two groups of circulators are arranged on one sides of the two groups of power amplifier modules, and the two groups of circulators are oppositely arranged;
the synthesizer is arranged on one side of the two groups of circulators, and the synthesizer is positioned on one side far away from the power amplifier module;
a back working portion provided on a back surface of the cooling plate, the back working portion including:
the monitoring unit is arranged on the cooling plate;
the pushing-stage power amplification unit is arranged on one side of the monitoring unit;
the current sampling unit is arranged at one side of the push-stage power amplification unit and is far away from the monitoring unit;
the two groups of negative pressure plates are arranged on one side of the current sampling unit and are oppositely arranged;
and the absorption load unit is arranged on one side of the negative pressure plate and is positioned far away from the current sampling unit.
In some alternative embodiments, the cooling flow path group includes:
the double cooling pipes are arranged on the front surface of the cooling plate;
a single cooling pipe provided on the back surface of the cooling plate;
the two feeding and discharging ends are arranged on one side of the cooling plate and are arranged side by side;
one end of the double cooling pipes and one end of the single cooling pipe are connected to one of the inlet and outlet ends, and the other end of the double cooling pipes and the other end of the single cooling pipe are connected to the other inlet and outlet end.
In some alternative embodiments, one of the two inlet and outlet ends is a water inlet end, and the other is a water outlet end;
wherein, the both ends of two cooling pipes with the single cooling pipe are in the reverse article font arrangement on advancing the row end.
In some alternative embodiments, the dual cooling tube and the single cooling tube are metallic.
In some alternative embodiments, the dual cooling tube and the single cooling tube are each copper tubes.
In some alternative embodiments, the positioning frame is detachably connected to the periphery of the cooling plate.
In some alternative embodiments, the front face working portion is detachably connected to the front face of the cooling plate;
the back working part is detachably connected with the back of the cooling plate.
The utility model provides a high-efficiency power amplification system for a solid-state power source in a second aspect, which is characterized in that the high-efficiency power amplification plug-in assembly for the solid-state power source in the first aspect is adopted.
The beneficial effects of the utility model are as follows:
in the embodiment of the utility model, the front working part and the back working part are respectively arranged on the front and the back of the cooling plate, so that the mounting requirement of each plug-in on the cooling plate is met, and the heat dissipation of each plug-in is also facilitated. And meanwhile, the cooling plate is provided with a cooling flow passage group, and the cooling plate realizes heat exchange and cooling of the front working part and the back working part by utilizing the cooling flow passage group, so that the heat exchange requirement among all the plug-ins is ensured to the greatest extent. The purpose of meeting the rapid heat dissipation among the plug-ins is effectively achieved.
Drawings
Fig. 1 is a schematic structural diagram (front direction) of a high-efficiency power amplifier assembly for a solid-state power source according to an embodiment of the present utility model;
fig. 2 is a schematic structural diagram (back direction) of a high-efficiency power amplifier module assembly for a solid-state power source according to an embodiment of the present utility model.
The labels in the figures are as follows:
1. a cooling plate;
11. a double cooling tube; 12. a feed end and a discharge end; 13. a positioning frame; 131. a handle; 14. a single cooling tube;
2. a dispenser; 3. a power amplifier module; 4. a circulator; 5. a synthesizer; 6. a monitoring unit;
7. a push-stage power amplifier unit; 8. a current sampling unit; 9. a negative pressure plate; 10. and an absorption load unit.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
It should be noted that all directional indicators (such as up, down, left, right, front, and rear … …) in the embodiments of the present utility model are merely used to explain the relative positional relationship, movement, etc. between the components in a particular posture (as shown in the drawings), and if the particular posture is changed, the directional indicator is changed accordingly.
In the present utility model, unless specifically stated and limited otherwise, the terms "connected," "affixed," and the like are to be construed broadly, and for example, "affixed" may be a fixed connection, a removable connection, or an integral body; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.
In addition, if there is a description of "first", "second", etc. in the embodiments of the present utility model, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and/or" as it appears throughout includes three parallel schemes, for example "A and/or B", including the A scheme, or the B scheme, or the scheme where A and B are satisfied simultaneously. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present utility model.
Example 1
Referring to fig. 1-2, a high efficiency power amplifier card assembly for a solid state power source, the card assembly comprising: the cooling plate 1, the locating frame 13, the front face working part and the back face working part, all be provided with the cooling runner group on the front and the back of cooling plate 1, the cooling runner group is used for carrying out heat transfer cooling. The positioning frame 13 is disposed along the peripheral side edges of the cooling plate 1 to form a square frame shape, so that the front working portion and the back working portion can be positioned and installed. The front working portion is provided on the front face of the cooling plate 1, and includes: a distributor 2, two groups of power amplifier modules 3, two groups of circulators 4 and a synthesizer 5. The distributor 2 is arranged on the front surface of the cooling plate 1, and the distributor 2 is used for distributing the input power of the solid-state power source into a plurality of parts. The two groups of power amplification modules 3 are arranged on one side of the distributor 2, the two groups of power amplification modules 3 are arranged oppositely, and the power amplification modules 3 are used for amplifying the input power distributed by the distributor 2. The two groups of circulators 4 are arranged on one side of the two groups of power amplification modules 3, the two groups of circulators 4 are oppositely arranged, and the two circulators 4 are used for independently and mutually isolating the output power of the two power amplification modules 3. The synthesizer 5 is arranged at one side of the two groups of circulators 4, and the synthesizer 5 is positioned at one side far away from the power amplifier module 3. The back working portion is provided on the back surface of the cooling plate 1, and includes: the monitoring unit 6, the pushing-stage power amplification unit 7 and the current sampling unit 8; two sets of negative pressure plates 9; two sets of absorption load cells 10. The monitoring unit 6 is arranged on the cooling plate 1, and the monitoring unit 6 is used for monitoring the power amplification process. The pushing stage power amplification unit 7 is arranged on one side of the monitoring unit 6, and the pushing stage power amplification unit 7 is used for exciting the normal operation of the power amplification process. The current sampling unit 8 is arranged on one side of the push-stage power amplification unit 7, and is far away from the monitoring unit 6, and the current sampling unit 8 is used for monitoring current in the power amplification process. The two groups of negative pressure plates 9 are arranged on one side of the current sampling unit 8, the two groups of negative pressure plates 9 are oppositely arranged, and the two groups of negative pressure plates 9 are far away from the pushing-stage power amplification unit 7. The absorption load unit 10 is arranged on one side of the negative pressure plate 9, and the absorption load unit 10 is positioned far away from the current sampling unit 8. In this embodiment, the front working portion and the back working portion are respectively provided on the front and back surfaces of the cooling plate 1, so that the requirement of mounting each card on the cooling plate 1 is satisfied, and the heat dissipation of each card is facilitated. Meanwhile, a cooling flow passage set is arranged on the cooling plate 1, and the cooling plate 1 realizes heat exchange and cooling of the front working part and the back working part by utilizing the cooling flow passage set, so that the heat exchange requirement among all the plug-ins is ensured to the greatest extent. The purpose of meeting the rapid heat dissipation among the plug-ins is effectively achieved. In addition, it should be noted that, in this embodiment, the back working portion and the front working portion can implement normal operation of the power amplification process, and the connection relationship between each of the connectors in both the back working portion and the front working portion will not be described herein in detail.
In this embodiment, the cooling effect and arrangement of the cooling plate 1 are scientific. The cooling flow passage group on the cooling plate 1 includes: a double cooling tube 11, a single cooling tube 14 and two intake and exhaust ends 12. The front surface of the cooling plate 1 is provided with double cooling pipes 11, and the back surface of the cooling plate 1 is provided with single cooling pipes 14. Two inlet and outlet ends 12 are arranged on one side of the cooling plate 1, the two inlet and outlet ends 12 are arranged side by side, one end of the double cooling pipe 11 and one end of the single cooling pipe 14 are jointly connected to one inlet and outlet end 12, and the other end of the double cooling pipe 11 and the other end of the single cooling pipe 14 are jointly connected to the other inlet and outlet end 12. That is, in this embodiment, one of the two inlet and outlet ends 12 is a water inlet end, and the other is a water outlet end. The water inlet end is used for inputting liquid cooling water into the solid power source for cooling, and the water outlet end is used for discharging cooling water which has been subjected to heat exchange successfully. The double cooling pipe 11 and the single cooling pipe 14 share one water inlet end and one water outlet end. By butting one water inlet end of the water inlet and outlet ends 12, the double cooling pipes 11 and one end of the single cooling pipe 14 are simultaneously butted for inputting cooling water; by abutting one of the water discharge ends 12, the double cooling pipes 11 and one end of the single cooling pipe 14 are abutted simultaneously to output the cooling water which has exchanged heat.
In a possible embodiment, the two ends of the double cooling pipe 11 and the single cooling pipe 14 are arranged in an inverted-delta shape on the inlet and outlet end 12. I.e. the double cooling pipe 11 is above the single cooling pipe 14.
In one possible embodiment, the double cooling pipe 11 and the single cooling pipe 14 are made of metal, and the double cooling pipe 11 and the single cooling pipe 14 are made of copper pipes.
In this embodiment, the inserts between the front and rear working portions are maintained and replaced later for ease of maintenance. The positioning frame 13 is detachably connected with the periphery of the cooling plate 1. That is, the positioning frame 13 may be four positioning plates, which are detachably connected and disposed on the periphery of the cooling plate 1. The front working part is detachably connected with the front of the cooling plate 1. The back working part is detachably connected with the back of the cooling plate 1. Preferably, the four positioning plates are detachably connected and arranged on the periphery of the cooling plate 1 through bolts. The front working part is detachably connected with the front of the cooling plate 1 through bolts. The back working part is detachably connected with the back of the cooling plate 1 through bolts.
In this embodiment, in order to facilitate the assembly to be taken out, a handle 131 is further disposed on one side of the positioning frame 13.
Example two
The utility model provides a high-efficiency power amplification system for a solid-state power source, which adopts the high-efficiency power amplification plug-in assembly for the solid-state power source in the first embodiment.
The foregoing is only a preferred embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art, who is within the scope of the present utility model, should make equivalent substitutions or modifications according to the technical scheme of the present utility model and the inventive concept thereof, and should be covered by the scope of the present utility model.
Claims (8)
1. A high efficiency power amplifier card assembly for a solid state power source, comprising:
the cooling plate is provided with cooling flow passage groups on the front and back surfaces thereof, and the cooling flow passage groups are used for carrying out heat exchange cooling;
the positioning frames are arranged along the peripheral side edges of the cooling plate and encircle a square frame;
front face work portion, front face work portion sets up the front of cooling plate, front face work portion includes:
the distributor is arranged on the front surface of the cooling plate;
the two groups of power amplification modules are arranged on one side of the distributor and are oppositely arranged;
the two groups of circulators are arranged on one sides of the two groups of power amplifier modules, and the two groups of circulators are oppositely arranged;
the synthesizer is arranged on one side of the two groups of circulators, and the synthesizer is positioned on one side far away from the power amplifier module;
a back working portion provided on a back surface of the cooling plate, the back working portion including:
the monitoring unit is arranged on the cooling plate;
the pushing-stage power amplification unit is arranged on one side of the monitoring unit;
the current sampling unit is arranged at one side of the push-stage power amplification unit and is far away from the monitoring unit;
the two groups of negative pressure plates are arranged on one side of the current sampling unit and are oppositely arranged;
and the absorption load unit is arranged on one side of the negative pressure plate and is positioned far away from the current sampling unit.
2. The high efficiency power amplifier package assembly of claim 1, wherein said cooling flow path set comprises:
the double cooling pipes are arranged on the front surface of the cooling plate;
a single cooling pipe provided on the back surface of the cooling plate;
the two feeding and discharging ends are arranged on one side of the cooling plate and are arranged side by side;
one end of the double cooling pipes and one end of the single cooling pipe are connected to one of the inlet and outlet ends, and the other end of the double cooling pipes and the other end of the single cooling pipe are connected to the other inlet and outlet end.
3. The high efficiency power amplifier module assembly for a solid state power source of claim 2, wherein one of said two inlet and outlet ends is a water inlet end and the other is a water outlet end;
wherein, the both ends of two cooling pipes with the single cooling pipe are in the reverse article font arrangement on advancing the row end.
4. A high efficiency power amplifier package assembly as set out in claim 3, wherein said dual cooling tubes and said single cooling tube are metallic.
5. The high efficiency power amplifier package assembly as set out in claim 4, wherein said dual cooling tube and said single cooling tube are each copper tubes.
6. A high efficiency power amplifier module as set out in any of claims 1-5, wherein said positioning frame is removably connected to the periphery of said cooling plate.
7. The high efficiency power amplifier package assembly of claim 6, wherein,
the front working part is detachably connected with the front of the cooling plate;
the back working part is detachably connected with the back of the cooling plate.
8. A high efficiency power amplifier system for a solid state power source, characterized in that a high efficiency power amplifier plug-in assembly for a solid state power source as defined in any one of claims 1 to 7 is employed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202223227178.9U CN219248424U (en) | 2022-12-02 | 2022-12-02 | High-efficiency power amplifier plug-in assembly for solid-state power source and power amplifier system |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN202223227178.9U CN219248424U (en) | 2022-12-02 | 2022-12-02 | High-efficiency power amplifier plug-in assembly for solid-state power source and power amplifier system |
Publications (1)
Publication Number | Publication Date |
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CN219248424U true CN219248424U (en) | 2023-06-23 |
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CN202223227178.9U Active CN219248424U (en) | 2022-12-02 | 2022-12-02 | High-efficiency power amplifier plug-in assembly for solid-state power source and power amplifier system |
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CN (1) | CN219248424U (en) |
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2022
- 2022-12-02 CN CN202223227178.9U patent/CN219248424U/en active Active
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