CN219248202U - Vacuum adsorption device for printed circuit board - Google Patents
Vacuum adsorption device for printed circuit board Download PDFInfo
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- CN219248202U CN219248202U CN202320084312.XU CN202320084312U CN219248202U CN 219248202 U CN219248202 U CN 219248202U CN 202320084312 U CN202320084312 U CN 202320084312U CN 219248202 U CN219248202 U CN 219248202U
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Abstract
The utility model discloses a vacuum adsorption device for a printed circuit board, and relates to the technical field of vacuum adsorption. The device comprises: the device comprises a carrier plate assembly, an air dividing block, a plurality of platform adsorption joints, a plurality of dust collecting pipes and a brushless fan assembly; the brushless fan assembly is connected with the air dividing blocks, the air dividing blocks are also connected with each platform adsorption joint through the dust collecting pipes respectively, and the platform adsorption joints are arranged on the bottom surface of the carrier plate assembly; when the printed circuit boards with different sizes are carried by the carrier plate assembly, the printed circuit boards are vacuum adsorbed by the platform adsorption connector which is covered at present. The utility model can reduce the complexity of gas circuit and electric control, reduce the vacuum adsorption cost of the printed circuit board and realize good vacuum adsorption effect.
Description
Technical Field
The utility model relates to the technical field of vacuum adsorption, in particular to a vacuum adsorption device for a printed circuit board.
Background
At present, in a semi-automatic PCB (printed circuit board) processing flow, the first step is to manually put a PCB circuit board with a corresponding size onto a device carrier, but the adsorption capacity of a large-size PCB board platform is often poor, and some parts of the board surface cannot be completely attached to the carrier, so that errors can occur during processing.
At present, the PCB circuit board commonly used in the market is small in size and large in size, and the adsorption purpose is generally achieved through vacuum gas circuit partition control. By adopting the existing adsorption means, the gas path and the electrical control are more complicated.
Disclosure of Invention
In order to solve at least one of the problems mentioned in the background art, the utility model provides a vacuum adsorption device for a printed circuit board, which can reduce the complexity of gas circuit and electrical control, reduce the vacuum adsorption cost of the printed circuit board, and realize a good vacuum adsorption effect.
The specific technical scheme provided by the embodiment of the utility model is as follows:
in a first aspect, there is provided a vacuum suction device for a printed circuit board, comprising:
the device comprises a carrier plate assembly, an air dividing block, a plurality of platform adsorption joints, a plurality of dust collecting pipes and a brushless fan assembly;
the brushless fan assembly is connected with the air dividing blocks, the air dividing blocks are also connected with each platform adsorption joint through the dust collecting pipes respectively, and the platform adsorption joints are arranged on the bottom surface of the carrier plate assembly;
when the printed circuit boards with different sizes are carried by the carrier plate assembly, the printed circuit boards are vacuum adsorbed by the platform adsorption connector which is covered at present.
Further, the device further comprises a three-piece type ball valve assembly, the brushless fan assembly is connected with the three-piece type ball valve assembly, and the three-piece type ball valve assembly is connected with the air dividing block through the dust collecting pipe.
Further, the brushless fan assembly comprises a brushless fan, a first connecting port and an exhaust port.
Further, the three-piece ball valve assembly comprises a three-piece ball valve, a second connector and a third connector, wherein the first connector is connected with the second connector, and the third connector is connected with the air dividing block through the dust collecting pipe.
Further, the three-piece ball valve assembly further comprises a filter, one end of the filter is connected with the second connecting port, and the other end of the filter is connected with the three-piece ball valve.
Further, the brushless fan assembly further comprises a residual pressure release valve, and the residual pressure release valve is connected with the brushless fan.
Further, the brushless fan assembly further comprises a muffler.
Furthermore, a pressure gauge is further arranged on one side of the carrier plate assembly.
Further, the number of the adsorption joints of the platform is four.
Further, two platform adsorption joints are arranged at one side of the center of the carrier plate assembly, and the other two platform adsorption joints are arranged at one side or two sides close to the edge of the carrier plate assembly.
The embodiment of the utility model has the following beneficial effects:
according to the vacuum adsorption device for the printed circuit board, provided by the embodiment of the utility model, the PCB printed circuit boards with different sizes can be subjected to vacuum adsorption according to the arrangement of adsorption joints of different platforms, the complexity of gas circuits and electric control can be reduced, the vacuum adsorption cost of the PCB is reduced, and meanwhile, a good vacuum adsorption effect can be realized for the PCB with large size.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 shows a schematic structural diagram of a vacuum adsorption device for a printed circuit board according to an embodiment of the present utility model;
FIG. 2 illustrates a schematic diagram of a airless brush assembly and a three-piece ball valve in accordance with one embodiment of the present utility model;
FIG. 3 shows a schematic bottom structural view of a carrier plate assembly according to one embodiment of the utility model;
reference numerals: 1. a carrier plate assembly; 11. a pressure gauge; 2. dividing air blocks; 3. a platform adsorption joint; 4. a dust collecting pipe; 5. a brushless fan assembly; 51. a brushless fan; 52. a first connection port; 53. an exhaust port; 54. a residual pressure release valve; 55. a muffler; 6. a three-piece ball valve assembly; 61. three-piece ball valve; 62. a second connection port; 63. a third connection port; 64. and (3) a filter.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the present utility model more apparent, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are only some embodiments of the present utility model, not all embodiments of the present utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
It should be understood that throughout this specification and the claims, unless the context clearly requires otherwise, the words "comprise", "comprising", and the like, are to be construed in an inclusive sense as opposed to an exclusive or exhaustive sense; that is, it is the meaning of "including but not limited to".
It should also be appreciated that the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. Furthermore, in the description of the present utility model, unless otherwise indicated, the meaning of "a plurality" is two or more.
Example 1
The utility model provides a vacuum adsorption device for a printed circuit board, which comprises a carrier plate assembly 1, an air dividing block 2, a plurality of platform adsorption joints 3, a plurality of dust collecting pipes 4 and a brushless fan assembly 5, and is characterized in that referring to fig. 1 to 3.
The brushless fan assembly 5 is connected with the air dividing block 2, the air dividing block 2 is also connected with each platform adsorption joint 3 through a dust collecting pipe 4, and the platform adsorption joints 3 are arranged on the bottom surface of the carrier plate assembly 1; when the printed circuit boards with different sizes are carried by the carrier plate assembly 1, the printed circuit boards are vacuum absorbed by the front covered platform absorption joint 3.
Specifically, when the actual vacuum adsorption of the printed circuit board is performed, firstly, a product PCB is placed on the carrier plate assembly 1, then the brushless fan assembly 5 is controlled to be opened, the brushless fan 51 is opened, the brushless fan assembly 5 is finally connected with the air dividing block 2, the air dividing block 2 divides a vacuum air path, and the vacuum air path is respectively connected with each platform adsorption joint 3 through the dust collecting pipe 4. The air dividing block 2 is connected with how many platform adsorption joints 3, i.e. divided into how many paths, for example, the air dividing block 2 is connected with four platform adsorption joints 3, i.e. divided into four paths. The platform adsorption joint 3 is arranged on the bottom surface of the carrier plate assembly 1, and then the vacuum adsorption effect of the PCB borne on the carrier plate assembly 1 is realized by penetrating through the carrier plate assembly 1. It should be noted that, according to the arrangement of the adsorption joints 3 of different platforms, vacuum adsorption can be performed on the PCB printed circuit boards with different sizes; when the printed circuit boards with different sizes are carried by the carrier plate assembly 1, the printed circuit boards are vacuum absorbed by the front covered platform absorption joint 3. And the PCB printed circuit board is adsorbed on the carrier for processing, and after the processing is finished, the gas circuit is closed, so that the processed PCB can be taken out.
In some embodiments, the device further comprises a three-piece ball valve assembly 6, the brushless fan assembly 5 is connected with the three-piece ball valve assembly 6, and the three-piece ball valve assembly 6 is connected with the air dividing block 2 through the dust collecting pipe 4.
In some embodiments, the brushless fan assembly 5 includes a brushless fan 51, a first connection port 52, and an exhaust port 53.
In some embodiments, the three-piece ball valve assembly 6 includes a three-piece ball valve 61, a second connection port 62, and a third connection port 63, the first connection port 52 is connected to the second connection port 62, and the third connection port 63 is connected to the gas separation block 2 through the dust collecting pipe 4.
Specifically, referring to fig. 2, the brushless fan assembly 5 includes a brushless fan 51, a first connection port 52, and an exhaust port 53, and the apparatus further includes a three-piece ball valve assembly 6, and the three-piece ball valve assembly 6 includes a three-piece ball valve 61, a second connection port 62, and a third connection port 63. Wherein, the first connection port 52 of the brushless fan assembly 5 is connected with the second connection port 62 of the three-piece ball valve assembly 6, and the exhaust port 53 of the brushless fan assembly 5 is used for exhausting. The third connection port 63 of the three-piece ball valve assembly 6 is connected with the air dividing block 2 through the dust collecting pipe 4. Thus, when the brushless fan 51 works, the brushless fan is finally connected with the air dividing block 2 to divide the multi-channel air path. The three-piece ball valve 61 is convenient to control the opening and closing of the air passage, and after the machining is finished, the three-piece ball valve 61 can be closed through an electromagnetic valve, and the air passage is cut off at the moment. And after the processed PCB is taken out, when a new PCB to be processed is placed on the carrier plate assembly 1, the three-piece ball valve 61 is opened again, the air passage is opened, and vacuum adsorption is continued.
In some embodiments, the three-piece ball valve assembly 6 further includes a filter 64, one end of the filter 64 being connected to the second connection port 62, and the other end of the filter 64 being connected to the three-piece ball valve 61.
Specifically, the three-piece ball valve assembly 6 further includes a filter 64, and the filter 64 is used for filtering out some impurities adsorbed in the adsorption process, so as to improve the vacuum adsorption efficiency.
In some embodiments, the brushless fan assembly 5 further comprises a residual pressure release valve 54, the residual pressure release valve 54 being connected to the brushless fan 51.
In some embodiments, the brushless fan assembly 5 further comprises a muffler 55.
Specifically, the residual pressure release valve 54 functions as an air source switch. When the residual pressure release valve 54 is closed, the residual pressure in the pneumatic circuit can be released rapidly, and the operation safety is ensured. The muffler 55 can reduce noise during operation.
In some embodiments, a pressure gauge 11 is also provided on one side of the carrier plate assembly 1.
In some embodiments, the number of platform suction fittings 3 is four. Wherein, two platform adsorption joints 3 are arranged at one side of the center of the carrier plate assembly 1, and the other two platform adsorption joints 3 are arranged at one side or two sides close to the edge of the carrier plate assembly 1.
Specifically, referring to fig. 3, the platform adsorption joints 3 are disposed at the bottom of the carrier plate assembly 1, and the number of the platform adsorption joints 3 may be four. Wherein, two platform adsorption joints 3 may be disposed near the center of the carrier plate assembly 1, and the two platform adsorption joints 3 may be disposed on the same side as the center of the carrier plate assembly 1 or on opposite sides. The other two platform adsorption joints 3 can be arranged at positions close to the edges of the carrier plate assembly 1, namely, corners or corner points of the carrier plate assembly 1, and can also be arranged on the same side or opposite sides. It should be noted that the number of the platform suction connectors 3 may be four or other, but at least two. According to different actual service scenarios, the number of the platform adsorption joints 3 can also be adjusted so as to be suitable for more different large-size PCB printed circuit boards.
In this embodiment, according to the arrangement of different platform adsorption joints, vacuum adsorption can be performed on PCB printed circuit boards of different sizes, the complexity of gas circuit and electrical control can be reduced, the vacuum adsorption cost of the PCB is reduced, and simultaneously, good vacuum adsorption effect can be realized on PCB printed circuit boards of large sizes.
While preferred embodiments of the present utility model have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. It is therefore intended that the following claims be interpreted as including the preferred embodiment and all such alterations and modifications as fall within the scope of the embodiments of the utility model.
It will be apparent to those skilled in the art that various modifications and variations can be made to the present utility model without departing from the spirit or scope of the utility model. Thus, it is intended that the present utility model also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.
Claims (10)
1. A vacuum suction device for a printed circuit board, comprising:
the device comprises a carrier plate assembly, an air dividing block, a plurality of platform adsorption joints, a plurality of dust collecting pipes and a brushless fan assembly;
the brushless fan assembly is connected with the air dividing blocks, the air dividing blocks are also connected with each platform adsorption joint through the dust collecting pipes respectively, and the platform adsorption joints are arranged on the bottom surface of the carrier plate assembly;
when the printed circuit boards with different sizes are carried by the carrier plate assembly, the printed circuit boards are vacuum adsorbed by the platform adsorption connector which is covered at present.
2. The printed circuit board vacuum suction device of claim 1, further comprising a three-piece ball valve assembly, wherein the brushless fan assembly is connected to the three-piece ball valve assembly, and wherein the three-piece ball valve assembly is connected to the air distribution block through the dust collection tube.
3. The printed circuit board vacuum suction device of claim 2, wherein the brushless fan assembly comprises a brushless fan, a first connection port, and an exhaust port.
4. The vacuum suction device for a printed circuit board according to claim 3, wherein the three-piece ball valve assembly comprises a three-piece ball valve, a second connection port and a third connection port, the first connection port is connected with the second connection port, and the third connection port is connected with the air separation block through the dust collecting pipe.
5. The printed circuit board vacuum adsorption device of claim 4, wherein the three-piece ball valve assembly further comprises a filter, one end of the filter is connected to the second connection port, and the other end of the filter is connected to the three-piece ball valve.
6. The printed circuit board vacuum suction device of claim 3, wherein the brushless blower assembly further comprises a residual pressure release valve coupled to the brushless blower.
7. The printed circuit board vacuum suction device of claim 1, wherein the brushless fan assembly further comprises a muffler.
8. The vacuum suction device for a printed circuit board according to claim 1, wherein a pressure gauge is further provided at one side of the carrier plate assembly.
9. The vacuum suction device of claim 1, wherein the number of landing suction tabs is four.
10. The vacuum suction device of claim 9, wherein two platform suction connectors are disposed on a central side of the carrier assembly and two other platform suction connectors are disposed on one or both sides near an edge of the carrier assembly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320084312.XU CN219248202U (en) | 2023-01-29 | 2023-01-29 | Vacuum adsorption device for printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320084312.XU CN219248202U (en) | 2023-01-29 | 2023-01-29 | Vacuum adsorption device for printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219248202U true CN219248202U (en) | 2023-06-23 |
Family
ID=86838801
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320084312.XU Active CN219248202U (en) | 2023-01-29 | 2023-01-29 | Vacuum adsorption device for printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219248202U (en) |
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2023
- 2023-01-29 CN CN202320084312.XU patent/CN219248202U/en active Active
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