CN213160098U

CN213160098U - Adsorption equipment is handled to two cold buckets of semiconductor tail gas

Info

Publication number: CN213160098U
Application number: CN202021515685.0U
Authority: CN
Inventors: 崔汉博; 崔汉宽
Original assignee: Shaoxing Gaosheng Semiconductor Technology Co ltd
Current assignee: Shaoxing Gaosheng Semiconductor Technology Co ltd
Priority date: 2020-07-28
Filing date: 2020-07-28
Publication date: 2021-05-11
Anticipated expiration: 2030-07-28

Abstract

The utility model discloses an adsorption equipment is handled to two cold buckets of semiconductor tail gas, the power distribution box comprises a box body, the cold bucket of first cold bucket and second in the box, the top of first cold bucket is equipped with the gas collection bucket, through total intake pipe intercommunication between gas collection bucket and the first cold bucket, the top of gas collection bucket can be dismantled and is connected with a plurality of discharge, it is fixed through the ring flange with the box after the box is passed on the upper portion of discharge, the lower part of first cold bucket and the cold bucket of second is equipped with the gas guide mouth, two the gas guide mouth sets up relatively, two connect through communicating pipe between the gas guide mouth, the top of the cold bucket of second is equipped with the fan, through fan intake-tube connection between fan and the cold bucket of second, the fan drives through the motor of locating its top. The utility model discloses carry out twice filtration to tail gas for the filter effect is better.

Description

Adsorption equipment is handled to two cold buckets of semiconductor tail gas

Technical Field

The utility model belongs to the technical field of the tail gas treatment technique and specifically relates to a two cold buckets of semiconductor tail gas are handled adsorption equipment is related to.

Background

The semiconductor refers to a material having a conductivity between a conductor and an insulator at normal temperature. Semiconductors are used in the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting applications, high-power conversion, and the like. Such as diodes, are devices fabricated using semiconductors. Semiconductor importance is enormous from either a technological or economic point of view. Most of today's electronic products, such as computers, mobile phones or digital audio recorders, have a core unit closely related to semiconductors.

Contain a large amount of polluting gas and solid particle thing in the semiconductor industry tail gas, this tail gas just can reach the emission requirement after the processing of different steps, and traditional adsorption equipment only carries out once and adsorbs, and the adsorption effect is relatively poor to lack standby device, consequently when equipment breaks down, have to stop the operation, maintain equipment for work efficiency descends.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to overcome above-mentioned prior art not enough, provide a semiconductor tail gas double cooling bucket handles adsorption equipment.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

a semiconductor tail gas double-cooling barrel treatment adsorption device comprises a box body, wherein a first cooling barrel and a second cooling barrel are arranged in the box body, a gas collecting barrel is arranged above the first cooling barrel, the gas collecting barrel is communicated with the first cooling barrel through a main gas inlet pipe, a plurality of gas collecting pipes are detachably connected above the gas collecting barrel, the upper parts of the gas collecting pipes are fixed with the box body through a flange after penetrating through the box body, gas guide ports are arranged at the lower parts of the first cooling barrel and the second cooling barrel and are oppositely arranged, the two gas guide ports are connected through a communication pipe, a fan is arranged above the second cooling barrel, the fan is connected with the second cooling barrel through a fan gas inlet pipe, the fan is driven by a motor arranged above the fan, an air outlet pipe of the fan penetrates through the upper end of the box body and extends to the outside of the box body, spare barrels are arranged behind the first cooling barrel and the second cooling barrel, two the bottom of reserve bucket is through pipeline intercommunication each other under the reserve bucket, the middle part of pipeline is linked together with communicating pipe through reserve bucket house steward down, one the air inlet on reserve bucket upper portion is linked together through pipeline on the reserve bucket with total intake pipe, another the air inlet on reserve bucket upper portion is linked together through pipeline on the reserve bucket with the fan intake pipe.

The connecting part of the communicating pipe and the spare barrel header pipe is provided with a pneumatic valve, the connecting part of the main air inlet pipe and the spare barrel upper pipeline is provided with a pneumatic valve, and the connecting part of the spare barrel upper pipeline and the spare barrel upper pipeline is provided with a pneumatic valve.

The part of the main air inlet pipe, which is close to the first cold barrel, is provided with a manual valve, the part of the fan air inlet pipe, which is close to the second cold barrel, is provided with a manual valve, and the two ends of the pipeline under the standby barrel, which are close to the standby barrel, are provided with manual valves.

And the lower parts of the first cold barrel and the second cold barrel are provided with rollers.

The fan is relatively fixed with the box body through the mounting bracket.

Two the bottom of reserve bucket is equipped with reserve bucket base, reserve bucket base is fixed mutually with the inner wall of box.

The inside of first cold bucket all is equipped with two porous nets, two porous net locates the upper portion and the lower part of first cold bucket respectively, the adsorbent has been placed to the inside of first cold bucket, the adsorbent is located between two porous nets, the structure of second cold bucket is the same with first cold bucket.

The utility model has the advantages that: 1. the first cold barrel, the second cold barrel, the standby barrel and the connecting pipeline are arranged in the box body, and the air inlet and the air outlet are arranged above the box body, so that the overall structure is simpler; 2. the first cold barrel and the second cold barrel are arranged to filter the tail gas twice, so that the filtering effect is better; 3. when the first cold barrel or the second cold barrel breaks down, the spare barrel is opened through the cooperation of the manual valve and the pneumatic valve, so that tail gas treatment can be continued, and the treatment efficiency is improved; 4. the motor drives the fan to exhaust air, so that the gas running speed is accelerated, and the adsorption efficiency is improved.

Drawings

Fig. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic structural view of the present invention with the box body removed;

FIG. 3 is a schematic structural view of the novel box body back removing part in the experiment;

fig. 4 is a sectional view of the first cold tub or the second cold tub of the present invention.

In the figure: the device comprises a box body 1, a gas collecting pipe 2, a fan air inlet pipe 3, an electric box 4, a first cold barrel 5, a porous net 51, a gas collecting barrel 6, a pneumatic valve 7, a second cold barrel 8, a communicating pipe 9, a motor 10, a mounting bracket 11, a fan 12, a standby barrel lower pipeline 13, a standby barrel 14, a standby barrel upper pipeline 15, a standby barrel base 16, a roller 17, a standby barrel main pipe 18, a manual valve 19, a main air inlet pipe 20 and a gas guide port 21.

Detailed Description

The invention will be further described with reference to the accompanying drawings and specific embodiments:

as shown in fig. 1 to 4, the adsorption equipment for semiconductor tail gas double-cooling barrel treatment comprises a box body 1, wherein an electric box 4 is arranged on the inner side wall of the box body 1, a circuit board and a power line are arranged in the electric box, a first cooling barrel 5 and a second cooling barrel 8 are arranged in the box body 1, a gas collecting barrel 6 is arranged above the first cooling barrel 5, the gas collecting barrel 6 is communicated with the first cooling barrel 5 through a total air inlet pipe 20, a plurality of gas collecting pipes 2 are detachably connected above the gas collecting barrel 6, the upper parts of the gas collecting pipes 2 penetrate through the box body 1 and then are fixed with the box body 1 through a flange plate, gas guide ports 21 are arranged at the lower parts of the first cooling barrel 5 and the second cooling barrel 8, the two gas guide ports 21 are oppositely arranged, the two gas guide ports 21 are connected through a communicating pipe 9, a fan 12 is arranged above the second cooling barrel 8, and the fan 12 is connected with the second cooling barrel 8 through a, the fan 12 is driven by a motor 10 arranged above the fan 12, an air outlet pipe of the fan 12 penetrates through the upper end of the box body 1 and extends to the outside of the box body 1, spare barrels 14 are arranged behind the first cold barrel 5 and the second cold barrel 8, the bottoms of the two spare barrels 14 are mutually communicated through spare barrel lower pipelines 18, the middle parts of the spare barrel lower pipelines 13 are communicated with the communication pipe 9 through a spare barrel main pipe 18, an air inlet at the upper part of one spare barrel 14 is communicated with a main air inlet pipe 20 through a spare barrel upper pipeline 15, and an air inlet at the upper part of the other spare barrel 14 is communicated with a fan air inlet pipe 3 through a spare barrel upper pipeline 15;

semiconductor tail gas gets into gas collection bucket 6 from gas collecting pipe 2, once adsorbs in getting into first cold bucket 5 through total intake pipe 20, and the tail gas after preliminary absorption carries out the secondary through communicating pipe 9 entering second cold bucket 8 and adsorbs in, and the tail gas after finishing adsorbing is carried to the outside of box 1 after the suction of fan 12, and this structure makes tail gas carry out the secondary and adsorbs for tail gas adsorbs more thoroughly.

A pneumatic valve 7 is arranged at the joint of the communicating pipe 9 and the spare barrel main pipe 18, the pneumatic valve 7 is arranged at the joint of the main air inlet pipe 20 and the spare barrel upper pipeline 15, and the pneumatic valve 7 is arranged at the joint of the spare barrel upper pipeline 15 and the spare barrel upper pipeline 15;

a hand valve 19 is arranged at the part of the total air inlet pipe 20 close to the first cold barrel 5, a hand valve 19 is arranged at the part of the fan air inlet pipe 3 close to the second cold barrel 8, and hand valves 19 are arranged at the two ends of the spare barrel lower pipeline 13 close to the spare barrel 14;

when the first cold barrel 5 breaks down, the manual valve 19 on the main air inlet pipe 20 is closed, the main air inlet pipe 20 and the pneumatic valve 7 on the communication pipe 9 are arranged, so that tail gas enters the left standby barrel 14 after passing through the air collecting barrel 6 and then enters the second cold barrel 8 through the standby barrel lower pipeline 13, the standby barrel header pipe 18 and the communication pipe 9 for adsorption; after the second cold barrel 8 breaks down, the manual valve 19 on the air inlet pipe 3 of the fan is closed, and the pneumatic valve 7 on the communication pipe 9 is arranged, so that tail gas enters the spare barrel main pipe 18 and the spare barrel lower pipeline 13 after passing through the first cold barrel 5 and then enters the spare barrel 14 on the right side, and finally secondary adsorption is performed after the tail gas is sucked by the fan 12.

The lower parts of the first cold barrel 5 and the second cold barrel 8 are provided with rollers 17, so that the push is facilitated.

The fan 12 is relatively fixed with the box body 1 through the mounting bracket 11, so that the fan 12 is more stable during operation.

Two spare barrel bases 16 are arranged at the bottoms of the spare barrels 14, and the spare barrel bases 16 are fixed with the inner wall of the box body 1, so that the spare barrels 14 are more reliably mounted.

The inside of first cold bucket 5 all is equipped with two porous nets 31, two porous nets 31 are located the upper portion and the lower part of first cold bucket 5 respectively, the adsorbent has been placed to the inside of first cold bucket 5, and the adsorbent can select the conventional material on the market according to the needs of adsorbed gas, the adsorbent is located between two porous nets 31, the structure of second cold bucket 8 is the same with first cold bucket 5.

The above description is only for the preferred embodiment of the present invention, and is not intended to limit the present invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included within the protection scope of the present invention.

Claims

1. The utility model provides an adsorption equipment is handled to two cold buckets of semiconductor tail gas, includes box (1), its characterized in that: a first cold barrel (5) and a second cold barrel (8) are arranged in the box body (1), a gas collecting barrel (6) is arranged above the first cold barrel (5), the gas collecting barrel (6) is communicated with the first cold barrel (5) through a total air inlet pipe (20), a plurality of gas collecting pipes (2) are detachably connected above the gas collecting barrel (6), the upper parts of the gas collecting pipes (2) penetrate through the box body (1) and are fixed with the box body (1) through flange plates, gas guide ports (21) are arranged at the lower parts of the first cold barrel (5) and the second cold barrel (8), the two gas guide ports (21) are oppositely arranged, the two gas guide ports (21) are connected through a communicating pipe (9), a fan (12) is arranged above the second cold barrel (8), the fan (12) is connected with the second cold barrel (8) through a fan air inlet pipe (3), and the fan (12) is driven through a motor (10) arranged above the fan, the air-out pipe of fan (12) passes the outside that the upper end of box (1) extended to box (1), the rear of the cold bucket of first cold bucket (5) and second (8) all is equipped with reserve bucket (14), two the bottom of reserve bucket (14) is through reserve bucket pipeline (13) intercommunication each other, the middle part of reserve bucket pipeline (13) is linked together through reserve bucket house steward (18) and communicating pipe (9), one the air inlet and total intake pipe (20) on reserve bucket (14) upper portion are linked together through reserve bucket upper tube (15), another the air inlet and fan intake pipe (3) on reserve bucket (14) upper portion are linked together through reserve bucket upper tube (15).

2. The semiconductor tail gas double-cooling-barrel treatment adsorption equipment as claimed in claim 1, characterized in that: the connecting part of the communicating pipe (9) and the spare barrel header pipe (18) is provided with an air-operated valve (7), the connecting part of the main air inlet pipe (20) and the spare barrel upper pipeline (15) is provided with the air-operated valve (7), and the connecting part of the spare barrel upper pipeline (15) and the spare barrel upper pipeline (15) is provided with the air-operated valve (7).

3. The semiconductor tail gas double-cooling-barrel treatment adsorption equipment as claimed in claim 1, characterized in that: the part of the total air inlet pipe (20) close to the first cold barrel (5) is provided with a manual valve (19), the part of the fan air inlet pipe (3) close to the second cold barrel (8) is provided with a manual valve (19), and two ends of the spare barrel lower pipeline (13) close to the spare barrel (14) are provided with manual valves (19).

4. The semiconductor tail gas double-cooling-barrel treatment adsorption equipment as claimed in claim 1, characterized in that: the lower parts of the first cold barrel (5) and the second cold barrel (8) are provided with rollers (17).

5. The semiconductor tail gas double-cooling-barrel treatment adsorption equipment as claimed in claim 1, characterized in that: the fan (12) is relatively fixed with the box body (1) through the mounting bracket (11).

6. The semiconductor tail gas double-cooling-barrel treatment adsorption equipment as claimed in claim 1, characterized in that: the bottom of two spare barrels (14) is provided with a spare barrel base (16), and the spare barrel base (16) is fixed with the inner wall of the box body (1).

7. The semiconductor tail gas double-cooling-barrel treatment adsorption equipment as claimed in claim 1, characterized in that: the inside of first cold bucket (5) all is equipped with two porous nets (31), two the upper portion and the lower part of first cold bucket (5) are located respectively to porous net (31), the adsorbent has been placed to the inside of first cold bucket (5), the adsorbent is located between two porous nets (31), the structure of second cold bucket (8) is the same with first cold bucket (5).