CN219246381U - Heat pipe heat dissipation type M.2 solid state disk - Google Patents
Heat pipe heat dissipation type M.2 solid state disk Download PDFInfo
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- CN219246381U CN219246381U CN202320135547.7U CN202320135547U CN219246381U CN 219246381 U CN219246381 U CN 219246381U CN 202320135547 U CN202320135547 U CN 202320135547U CN 219246381 U CN219246381 U CN 219246381U
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- 239000007787 solid Substances 0.000 title claims abstract description 54
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 50
- 239000000758 substrate Substances 0.000 claims abstract description 62
- 238000009423 ventilation Methods 0.000 claims abstract description 45
- 230000000149 penetrating effect Effects 0.000 claims abstract description 7
- 238000009825 accumulation Methods 0.000 abstract description 5
- 239000007788 liquid Substances 0.000 description 8
- 238000001704 evaporation Methods 0.000 description 4
- 238000001816 cooling Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a heat pipe radiating type M.2 solid state disk, which relates to the technical field of M.2 solid state disks and comprises an M.2 solid state disk, a radiating substrate and fins which are sequentially arranged from bottom to top; the heat pipe comprises an upper heat pipe, a lower heat pipe and a heat pipe connecting part which enables the upper heat pipe to be communicated with the lower heat pipe, an embedded groove which penetrates through the rear end face to the front end face is formed in the heat radiating substrate, mounting holes are formed in the fins, the upper heat pipe is arranged in the embedded groove, the lower heat pipe is fixedly arranged in the mounting holes in a penetrating mode, a plurality of fins are provided with ventilation gaps which correspond to each other, the fins are provided with ventilation grooves which extend along the length direction of the heat radiating substrate through the arrangement of the ventilation gaps, the ventilation grooves are matched with the heat radiating substrate and the fins, air channels are formed among the fins through the ventilation grooves, the fins can receive airflows in different directions, heat dissipation of the M.2 solid state hard disk can be better achieved, heat accumulation can be avoided, and the service life of the M.2 solid state hard disk can be guaranteed.
Description
Technical Field
The utility model relates to the technical field of M.2 solid state disks, in particular to a heat pipe radiating type M.2 solid state disk.
Background
According to the 'Chinese utility model patent with application number of CN 201921068293.1', in recent years, along with the rapid development of Internet technology, particularly the continuous breakthrough of key technologies such as big data and cloud platform, the requirements on servers are continuously improved, and meanwhile, the requirements on the performance of server products, particularly the response speed of hard disks, and the like are increasingly higher. The solid state disk with the M.2 interface has the advantages of small volume, high response speed and the like, so that the solid state disk is more and more widely used.
In actual use, the heat productivity of the m.2 solid state disk is very high, and heat accumulation can be caused when heat dissipation is poor, so that various performances of the m.2 solid state disk are rapidly reduced, and the m.2 solid state disk can be dropped or even burnt out when the heat dissipation is poor.
In summary, in the prior art, the performances of the m.2 solid state disk may be rapidly reduced due to heat accumulation, even the m.2 solid state disk may be damaged, and the service life of the m.2 solid state disk may not be well ensured due to low heat dissipation efficiency.
Disclosure of Invention
The utility model aims to overcome the defects of the prior art and provides a technical scheme capable of solving the problems.
In order to achieve the above purpose, the present utility model provides the following technical solutions: a heat pipe radiating type M.2 solid state disk comprises an M.2 solid state disk, a radiating substrate and fins which are sequentially arranged from bottom to top;
the heat pipe comprises an upper heat pipe, a lower heat pipe and a heat pipe connecting part for communicating the upper heat pipe with the lower heat pipe;
the M.2 solid state disk comprises an M.2 interface and a hard disk mounting port, and the radiating substrate comprises a front end face close to the hard disk mounting port and a rear end face away from the front end face;
an embedded groove penetrating from the rear end face to the front end face is formed in the heat dissipation substrate;
the fins are provided with mounting holes, the lower heat pipes are arranged in the embedded grooves, and the upper heat pipes are fixedly arranged in the mounting holes in a penetrating manner;
the fins are fixedly arranged on the heat-dissipating substrate and are provided with a plurality of fins along the length direction of the heat-dissipating substrate, the fins are provided with ventilation gaps corresponding to each other, and the fins are provided with ventilation grooves extending along the length direction of the heat-dissipating substrate through the arrangement of the ventilation gaps.
As a further scheme of the utility model: the ventilation notch comprises a first notch, a second notch and a third notch, a first ventilation groove, a second ventilation groove and a third ventilation groove which extend along the length direction of the radiating substrate are respectively formed on the fins through the first notch, the second notch and the third notch in an arrangement mode, the fins are transversely arranged on the radiating substrate along the width direction of the radiating substrate, and the upper heat pipe penetrates through the mounting holes along the length direction of the radiating substrate and is fixedly arranged in the mounting holes.
As a further scheme of the utility model: the heat pipe comprises a first heat pipe and a second heat pipe, the upper heat pipe and the lower heat pipe of the first heat pipe are respectively arranged in the first embedding groove and the first mounting hole, and the upper heat pipe and the lower heat pipe of the second heat pipe are respectively arranged in the second embedding groove and the second mounting hole.
As a further scheme of the utility model: the lower heat pipe is attached to the inner wall of the embedded groove, a heat conducting sleeve is formed on the inner wall of the mounting hole in an extending mode, and the upper heat pipe is attached to the inner wall of the heat conducting sleeve.
As a further scheme of the utility model: the heat conducting sleeves of the two adjacent fins are combined.
As a further scheme of the utility model: the heat dissipation substrate is fixedly arranged on the M.2 solid state disk, a heat conducting fin is arranged between the heat dissipation substrate and the M.2 solid state disk, and the fin is fixedly arranged on one surface of the heat dissipation substrate, which is away from the M.2 solid state disk.
As a further scheme of the utility model: the first heat pipe further comprises a first heat pipe connecting part, the second heat pipe further comprises a second heat pipe connecting part, and the first heat pipe connecting part and the second heat pipe connecting part are respectively close to one end of the M.2 interface.
Compared with the prior art, the utility model has the following beneficial effects: through the continuous circulation process of liquid and steam in the heat pipe, the heat pipe is matched with the heat radiating substrate and the fins, the heat of the M.2 solid state disk can be better radiated, an air channel can be generated between the fins through the ventilation groove, the fins can receive airflows in different directions, the heat of the M.2 solid state disk can be better radiated, heat accumulation can be avoided, and the service life of the M.2 solid state disk can be well guaranteed through efficient heat radiation.
Drawings
FIG. 1 is a perspective view of the structure of the present utility model;
FIG. 2 is another structural perspective view of the present utility model;
FIG. 3 is a top view of the present utility model;
FIG. 4 is a side view of the present utility model;
FIG. 5 is a cross-sectional view taken along the direction A-A in FIG. 4;
FIG. 6 is a partial view of reference number B in FIG. 5;
reference numerals and names in the drawings are as follows:
m.2 solid state disk-1, radiating substrate-2, fin-3, upper heat pipe-4, lower heat pipe-5, heat pipe connecting portion-6, hard disk mounting port-7, M.2 interface-8, front end face-9, rear end face-10, first notch-11, second notch-12, third notch-13, ventilation notch-14, first ventilation groove-15, second ventilation groove-16, third ventilation groove-17, embedding groove-18, mounting hole-19, heat conducting sleeve-20, heat conducting fin-21.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
In the prior art, a heat pipe consists of a pipe shell, a liquid suction core and an end cover, wherein the inside of the heat pipe is pumped into a negative pressure state, proper liquid is filled in the heat pipe, the liquid has low boiling point and is easy to volatilize, the pipe wall is provided with the liquid suction core which consists of capillary porous materials, one end of the heat pipe is a evaporating end, the other end of the heat pipe is a condensing end, the evaporating end is also called an evaporating section, the condensing end is also called a condensing section or a cooling section, and a pipe section between the evaporating section and the condensing section is a heat insulation section. When one end of the heat pipe is heated, the liquid in the capillary tube is quickly vaporized, the vapor flows to the other end under the power of thermal diffusion, and is condensed at the cold end to release heat, and the liquid flows back to the vaporization end along the porous material by capillary action, so that the circulation is not only performed until the temperatures at the two ends of the heat pipe are equal (at the moment, the thermal diffusion of the vapor is stopped), but also the circulation is quickly performed, and the heat can be continuously conducted.
Referring to fig. 1-6, a heat pipe heat dissipation type m.2 solid state disk includes an m.2 solid state disk 1, a heat dissipation substrate 2, and fins 3 sequentially arranged from bottom to top;
the heat pipe comprises an upper heat pipe 4, a lower heat pipe 5 and a heat pipe connecting part 6 for communicating the upper heat pipe 4 with the lower heat pipe 5;
the M.2 solid state disk 1 comprises an M.2 interface 8 and a hard disk mounting port 7, and the heat dissipation substrate 2 comprises a front end face 9 close to the hard disk mounting port 7 and a rear end face 10 away from the front end face 9;
an embedded groove 18 penetrating from the rear end surface 10 to the front end surface 9 is formed in the heat dissipation substrate 2;
the fins 3 are provided with mounting holes 19, the lower heat pipes 5 are arranged in the embedded grooves 18, and the upper heat pipes 4 are fixedly arranged in the mounting holes 19 in a penetrating manner;
the fins 3 are fixedly arranged on the heat dissipation substrate 2 and are provided with a plurality of fins along the length direction of the heat dissipation substrate 2, the fins 3 are provided with ventilation gaps 14 corresponding to each other, and the fins 3 are provided with ventilation grooves extending along the length direction of the heat dissipation substrate 2 through the arrangement of the ventilation gaps 14.
The working principle is that when the M.2 solid state disk 1 is in a working state, heat is generated, the generated heat can transfer the heat to the heat dissipation substrate 2 through heat conduction, the heat dissipation substrate 2 can transfer the heat to the lower heat pipe 5 and the fins 3 after receiving the heat, the lower heat pipe 5 transfers the heat to the upper heat pipe 4 through the heat pipe connecting part 6 after receiving the heat, the upper heat pipe 4 transfers the heat to the fins 3, and meanwhile the fins 3 take away the heat transferred by the heat dissipation substrate 2 and the heat pipes through air flow, so that the cooling effect is achieved.
Further, the fins 3 are provided with a plurality of ventilation gaps 14 on the heat dissipation substrate 2, the fins 3 are provided with ventilation grooves extending along the length direction of the heat dissipation substrate 2 through arrangement of the ventilation gaps 14, the ventilation grooves can enable the fins 3 to receive airflows in different directions, and the ventilation grooves can enable air channels to be formed among the fins 3, for example, when no ventilation grooves exist, only airflows on left and right sides can be received, airflows at front and rear ends are difficult to receive, and multiple air channels and multiple heat dissipation are difficult to form.
In summary, through the continuous circulation process of the liquid and the steam in the heat pipe, the heat dissipation substrate 2 and the fins 3 are matched, so that the heat dissipation of the M.2 solid state disk 1 can be better realized, the ventilation grooves can also enable air channels to be generated among the fins 3, the fins 3 can receive airflows in different directions, the heat dissipation of the M.2 solid state disk 1 can be better realized, the heat accumulation can be avoided, and the service life of the M.2 solid state disk 1 can be well guaranteed through efficient heat dissipation.
The utility model is a passive heat dissipation structure, does not need electric energy intervention, and has an energy-saving effect.
In the embodiment of the present utility model, the ventilation notch 14 includes a first notch 11, a second notch 12, and a third notch 13, and a first ventilation slot 15, a second ventilation slot 16, and a third ventilation slot 17 extending along the length direction of the heat dissipation substrate 2 are respectively formed on the plurality of fins 3 by arranging the first notch 11, the second notch 12, and the third notch 13, where the fins 3 are transversely disposed on the heat dissipation substrate 2 along the width direction of the heat dissipation substrate 2, and the upper heat pipe 4 penetrates through the plurality of mounting holes 19 along the length direction of the heat dissipation substrate 2 and is fixedly disposed in the plurality of mounting holes 19.
The fins 3 are provided with a first notch 11, a second notch 12 and a third notch 13, the fins 3 are transversely arranged on the radiating substrate 2 along the width direction of the radiating substrate 2, the first notch 11, the second notch 12 and the third notch 13 are respectively arranged on the fins 3 to form a first ventilation groove 15, a second ventilation groove 16 and a third ventilation groove 17 which extend along the length direction of the radiating substrate 2, and the fins 3 are provided with the first ventilation groove 15, the second ventilation groove 16 and the third ventilation groove 17, so that better ventilation among the fins 3 can have various air channels, and air flow can be in contact with the fins 3 in multiple aspects, thereby improving the radiating efficiency.
In the embodiment of the present utility model, the embedded groove 18 includes a first embedded groove 18 and a second embedded groove 18, the first embedded groove 18 and the second embedded groove 18 are symmetrically disposed on the heat dissipation substrate 2, the mounting hole 19 includes a first mounting hole 19 and a second mounting hole 19 on the fin 3, the heat pipe includes a first heat pipe and a second heat pipe, the upper heat pipe 4 and the lower heat pipe 5 of the first heat pipe are respectively disposed in the first embedded groove 18 and the first mounting hole 19, and the upper heat pipe 4 and the lower heat pipe 5 of the second heat pipe are respectively disposed in the second embedded groove 18 and the second mounting hole 19.
The upper heat pipe 4 and the lower heat pipe 5 of the first heat pipe are respectively arranged in the first embedded groove 18 and the first mounting hole 19, the upper heat pipe 4 and the lower heat pipe 5 of the second heat pipe are respectively arranged in the second embedded groove 18 and the second mounting hole 19, when the heat dissipation substrate 2 receives heat, the heat is respectively transferred to the first heat pipe and the second heat pipe in the first embedded groove 18 and the first embedded groove 18, the heat dissipation efficiency can be improved by the design of the first heat pipe and the second heat pipe, the upper heat pipe 4 in the first mounting hole 19 and the second mounting hole 19 can better transfer the heat to the fin 3 through heat transfer, and then the heat is taken away by air flow, so that the heat dissipation efficiency can be improved, and the temperature of the M.2 solid state disk 1 is ensured to be in an ideal state.
In the embodiment of the utility model, the lower heat pipe 5 is attached to the inner wall of the embedded groove 18, the inner wall of the mounting hole 19 is formed with a heat conducting sleeve 20 in an extending manner, and the upper heat pipe 4 is attached to the inner wall of the heat conducting sleeve 20.
The contact area between the upper heat pipe 4 and the heat conducting sleeve 20 can be increased by the inner wall bonding of the upper heat pipe 4 and the heat conducting sleeve 20, heat can be better transferred to the fins 3 by the inner wall bonding of the upper heat pipe 4 and the heat conducting sleeve 20 when the upper heat pipe 4 transfers heat, and then the fins 3 emit heat, when the working state of the M.2 solid state disk 1 generates heat, the heat radiating substrate 2 receives heat, the lower heat pipe 5 is bonded with the inner wall of the embedded groove 18, and the heat transfer efficiency of the heat radiating substrate 2 and the lower heat pipe 5 is higher.
In the embodiment of the present utility model, the heat conductive sleeves 20 of the two adjacent fins 3 are combined.
The contact area between the heat pipe and the fin 3 can be maximized, so that the heat radiation efficiency can be improved better.
In the embodiment of the utility model, the heat dissipation substrate 2 is fixedly arranged on the m.2 solid state disk 1, a heat conducting sheet 21 is arranged between the heat dissipation substrate 2 and the m.2 solid state disk 1, and the fins 3 are fixedly arranged on one surface of the heat dissipation substrate 2, which is away from the m.2 solid state disk 1.
The heat conducting fin 21 can enable the heat radiating substrate 2 to be more attached to the M.2 solid state disk 1, heat transfer efficiency between the M.2 solid state disk 1 and the heat radiating substrate 2 is higher, the fins 3 are fixedly arranged on one face, away from the M.2 solid state disk 1, of the heat radiating substrate 2, and when the heat radiating substrate 2 receives heat, the heat can be transferred onto the fins 3 better.
In the embodiment of the present utility model, the first heat pipe further includes a first heat pipe connection portion 6, the second heat pipe further includes a second heat pipe connection portion 6, and the first heat pipe connection portion 6 and the second heat pipe connection portion 6 are respectively close to one end of the m.2 interface 8.
Because the connection between the M.2 interface 8 and the computer motherboard is in an inserting state, the requirement on the reserved position is not high, and the first heat pipe connecting part 6 and the second heat pipe connecting part 6 are respectively close to one end of the M.2 interface 8, so that one end close to the hard disk mounting opening 7 can reserve space, the hard disk mounting opening 7 can be compatible with different fixed components, such as a butterfly screw, and the compatibility of the utility model is better.
It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present utility model may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (7)
1. The heat pipe radiating type M.2 solid state disk is characterized by comprising an M.2 solid state disk, a radiating substrate and fins which are sequentially arranged from bottom to top;
the heat pipe comprises an upper heat pipe, a lower heat pipe and a heat pipe connecting part for communicating the upper heat pipe with the lower heat pipe;
the M.2 solid state disk comprises an M.2 interface and a hard disk mounting port, and the radiating substrate comprises a front end face close to the hard disk mounting port and a rear end face away from the front end face;
an embedded groove penetrating from the rear end face to the front end face is formed in the heat dissipation substrate;
the fins are provided with mounting holes, the lower heat pipes are arranged in the embedded grooves, and the upper heat pipes are fixedly arranged in the mounting holes in a penetrating manner;
the fins are fixedly arranged on the heat-dissipating substrate and are provided with a plurality of fins along the length direction of the heat-dissipating substrate, the fins are provided with ventilation gaps corresponding to each other, and the fins are provided with ventilation grooves extending along the length direction of the heat-dissipating substrate through the arrangement of the ventilation gaps.
2. The heat pipe heat dissipation type m.2 solid state disk of claim 1, wherein the ventilation notch comprises a first notch, a second notch and a third notch, the first ventilation groove, the second ventilation groove and the third ventilation groove extending along the length direction of the heat dissipation substrate are respectively formed on the fins through the first notch, the second notch and the third notch, the fins are transversely arranged on the heat dissipation substrate along the width direction of the heat dissipation substrate, and the upper heat pipe penetrates through the plurality of mounting holes along the length direction of the heat dissipation substrate and is fixedly arranged in the plurality of mounting holes.
3. The heat pipe heat dissipation type m.2 solid state disk of claim 1, wherein the embedded groove comprises a first embedded groove and a second embedded groove, the first embedded groove and the second embedded groove are symmetrically arranged on the heat dissipation substrate, the mounting hole comprises a first mounting hole and a second mounting hole on the fin, the heat pipe comprises a first heat pipe and a second heat pipe, the upper heat pipe and the lower heat pipe of the first heat pipe are respectively arranged in the first embedded groove and the first mounting hole, and the upper heat pipe and the lower heat pipe of the second heat pipe are respectively arranged in the second embedded groove and the second mounting hole.
4. The heat pipe heat dissipation type m.2 solid state disk of claim 1, wherein the lower heat pipe is attached to an inner wall of the embedded groove, a heat conducting sleeve is formed on an inner wall of the mounting hole in an extending mode, and the upper heat pipe is attached to an inner wall of the heat conducting sleeve.
5. The heat pipe heat dissipation type m.2 solid state disk of claim 4, wherein the heat conducting sleeves of two adjacent fins are combined.
6. The heat pipe radiating type M.2 solid state disk of claim 1, wherein the radiating substrate is fixedly arranged on the M.2 solid state disk, a heat conducting fin is arranged between the radiating substrate and the M.2 solid state disk, and the fin is fixedly arranged on one surface of the radiating substrate, which is away from the M.2 solid state disk.
7. The heat dissipation type m.2 solid state disk of claim 3, wherein the first heat pipe further comprises a first heat pipe connecting portion, the second heat pipe further comprises a second heat pipe connecting portion, and the first heat pipe connecting portion and the second heat pipe connecting portion are respectively close to one end of the m.2 interface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320135547.7U CN219246381U (en) | 2023-02-07 | 2023-02-07 | Heat pipe heat dissipation type M.2 solid state disk |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320135547.7U CN219246381U (en) | 2023-02-07 | 2023-02-07 | Heat pipe heat dissipation type M.2 solid state disk |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219246381U true CN219246381U (en) | 2023-06-23 |
Family
ID=86840232
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320135547.7U Active CN219246381U (en) | 2023-02-07 | 2023-02-07 | Heat pipe heat dissipation type M.2 solid state disk |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219246381U (en) |
-
2023
- 2023-02-07 CN CN202320135547.7U patent/CN219246381U/en active Active
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Address after: Room 501, Building 4, No. 3 Yongtai Road, Tangxia Town, Dongguan City, Guangdong Province, 523000 Patentee after: Huiju Storage Technology (Dongguan) Co.,Ltd. Country or region after: China Address before: 523000 Building 1, No. 7, Keyuan fifth road, Tangxia Town, Dongguan City, Guangdong Province Patentee before: Huiju Electric Technology (Dongguan) Industrial Co.,Ltd. Country or region before: China |